JPH10272700A5 - - Google Patents
Info
- Publication number
- JPH10272700A5 JPH10272700A5 JP1997080462A JP8046297A JPH10272700A5 JP H10272700 A5 JPH10272700 A5 JP H10272700A5 JP 1997080462 A JP1997080462 A JP 1997080462A JP 8046297 A JP8046297 A JP 8046297A JP H10272700 A5 JPH10272700 A5 JP H10272700A5
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- wiring board
- printed wiring
- layer
- protected
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Description
【００１９】
弱粘着層１２は、弱い粘着力で銅箔に貼着される層で、粘着性、耐熱性、耐薬品性、離型性に優れた樹脂で構成される。粘着力は通常の粘着剤に比べかなり弱いことが好ましい。具体的には、通常の粘着剤の剥離強度は４００〜１０００gf／25mm幅程度であるが、本発明の弱粘着層は剥離強度（JIS Z-0237）が１００gf／25mm幅以下で、好適には１〜２０gf／25mm幅とする。このような範囲とすることにより、導体パターン形成工程において銅箔から剥離することなく銅箔を保護することができ、しかも熱プレス後、銅箔表面に残ることなく容易に剥離することができる。[0019]
The weak adhesive layer 12 is a layer that is attached to the copper foil with weak adhesive strength and is made of a resin that has excellent adhesiveness, heat resistance, chemical resistance, and mold releasability. It is preferable that the adhesive strength be significantly weaker than that of ordinary adhesives. Specifically, while the peel strength of ordinary adhesives is approximately 400 to 1000 gf/25 mm width, the weak adhesive layer of the present invention has a peel strength (JIS Z-0237) of 100 gf/25 mm width or less, preferably 1 to 20 gf/25 mm width. By setting the peel strength within this range, the copper foil can be protected without peeling from the copper foil during the conductor pattern formation process, and further, it can be easily peeled off without remaining on the copper foil surface after hot pressing.
【００３９】
この多層プリント配線板製造用シートを用い、実施例１と同様に４層の多層プリント配線板を作製したところ、現像液、エッチング液、剥離液に侵されることなく、銅箔の保護ができた。しかし、ポリオレフィンフィルムに耐熱性がないために熱プレスによる積層時に熱による変形を起こしてしまった。[0039]
Using this sheet for manufacturing a multilayer printed wiring board, a four-layer printed wiring board was produced in the same manner as in Example 1. The copper foil was protected without being affected by the developer, etching solution, or stripping solution. However, because the polyolefin film lacked heat resistance, deformation due to heat occurred during lamination by hot pressing.
【００４２】
この多層プリント配線板製造用シートを用い、実施例１と同様に４層の多層プリント配線板を作製したところ、現像液、エッチング液、剥離液に侵されることなく、銅箔の保護ができた。しかし、熱プレスによる積層時、スルーホール部分からプリプレグがはみ出し、後工程で修正する問題が発生した。[0042]
Using this sheet for manufacturing a multilayer printed wiring board, a four-layer printed wiring board was produced in the same manner as in Example 1. The copper foil was protected from the developer, etching solution, and stripping solution. However, during lamination by hot pressing, the prepreg protruded from the through-hole area, which was a problem that had to be corrected in a later process.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8046297A JP3962119B2 (en) | 1997-03-31 | 1997-03-31 | Multilayer printed wiring board manufacturing sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8046297A JP3962119B2 (en) | 1997-03-31 | 1997-03-31 | Multilayer printed wiring board manufacturing sheet |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPH10272700A JPH10272700A (en) | 1998-10-13 |
| JPH10272700A5 true JPH10272700A5 (en) | 2005-02-10 |
| JP3962119B2 JP3962119B2 (en) | 2007-08-22 |
Family
ID=13718935
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8046297A Expired - Fee Related JP3962119B2 (en) | 1997-03-31 | 1997-03-31 | Multilayer printed wiring board manufacturing sheet |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3962119B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4997677B2 (en) * | 2001-09-25 | 2012-08-08 | 東レ株式会社 | Composite molded body |
| JP6690153B2 (en) * | 2015-08-12 | 2020-04-28 | 大日本印刷株式会社 | Method for manufacturing laminated body |
| JP6422586B2 (en) | 2015-09-04 | 2018-11-14 | タツタ電線株式会社 | Manufacturing method of printed wiring board, printed wiring board protective film and sheet-like laminate used in the method |
| CN111343803A (en) * | 2019-12-30 | 2020-06-26 | 广德新三联电子有限公司 | Manufacturing process of new energy automobile power control multilayer board |
-
1997
- 1997-03-31 JP JP8046297A patent/JP3962119B2/en not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP1347475A4 (en) | Laminated circuit board and production method for electronic part, and laminated electronic part | |
| TW200427389A (en) | Copper-clad laminate for multilayer printed wiring board, multilayer printed wiring board and manufacturing method thereof | |
| CA2338670A1 (en) | Resin/copper/metal laminate and method of producing same | |
| EP0404177A3 (en) | Transfer sheet for making printed-wiring board by injection molding and method for producing same | |
| EP1056320A3 (en) | Copper foil for printed wiring board | |
| CN108369832B (en) | Method of manufacturing a printed circuit board | |
| JPH04127492A (en) | Material for printed wiring, manufacture thereof and printed wiring board | |
| JP3698863B2 (en) | Bonding material for single-sided metal-clad laminate production | |
| JP2721570B2 (en) | Multi-layer flexible printed wiring board | |
| JPH0964514A (en) | Manufacturing method of printed wiring board | |
| JP2008294102A (en) | Wiring board manufacturing method | |
| JP3200052B2 (en) | Transfer film for printed wiring board, printed wiring board obtained using the same, and method of manufacturing the same | |
| JP3071722B2 (en) | Method for manufacturing multilayer printed wiring board | |
| JP2002353619A5 (en) | ||
| JP3962119B2 (en) | Multilayer printed wiring board manufacturing sheet | |
| JPS60169190A (en) | Method of forming cover array | |
| JPH0682924B2 (en) | Manufacturing method of composite substrate | |
| JPH045888A (en) | Printed wiring board | |
| JP2003101193A5 (en) | ||
| JP3280604B2 (en) | Method of manufacturing metal-clad laminate, method of manufacturing printed wiring board, and method of manufacturing multilayer board | |
| JP2003160770A (en) | Adhesive tape with metal foil for circuit formation and method of manufacturing circuit board | |
| JPH02128500A (en) | Manufacture of flexible printed wiring board | |
| CN106068681B (en) | Electrically functional thin-film composite structures for application to substrates | |
| JPH0717165Y2 (en) | Flexible circuit board carrier tape | |
| JP3943735B2 (en) | Manufacturing method of build-up type multilayer printed wiring board |