JPH10272731A - Base for printed-wiring board - Google Patents
Base for printed-wiring boardInfo
- Publication number
- JPH10272731A JPH10272731A JP9493097A JP9493097A JPH10272731A JP H10272731 A JPH10272731 A JP H10272731A JP 9493097 A JP9493097 A JP 9493097A JP 9493097 A JP9493097 A JP 9493097A JP H10272731 A JPH10272731 A JP H10272731A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- resin layer
- molecular weight
- average molecular
- conductive metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920005989 resin Polymers 0.000 claims abstract description 43
- 239000011347 resin Substances 0.000 claims abstract description 43
- 229910052751 metal Inorganic materials 0.000 claims abstract description 36
- 239000002184 metal Substances 0.000 claims abstract description 36
- 239000004640 Melamine resin Substances 0.000 claims abstract description 23
- 229920000877 Melamine resin Polymers 0.000 claims abstract description 23
- 150000007974 melamines Chemical class 0.000 claims abstract description 23
- 239000011888 foil Substances 0.000 claims abstract description 21
- 229920001225 polyester resin Polymers 0.000 claims abstract description 20
- 239000004645 polyester resin Substances 0.000 claims abstract description 20
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 10
- 239000000758 substrate Substances 0.000 claims description 16
- 239000011353 cycloaliphatic epoxy resin Substances 0.000 claims description 8
- 230000000903 blocking effect Effects 0.000 abstract description 14
- 238000005530 etching Methods 0.000 abstract description 13
- 239000003822 epoxy resin Substances 0.000 abstract description 10
- 229920000647 polyepoxide Polymers 0.000 abstract description 10
- 239000003960 organic solvent Substances 0.000 abstract description 5
- 238000004140 cleaning Methods 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 42
- 238000012360 testing method Methods 0.000 description 11
- 239000000463 material Substances 0.000 description 8
- 239000002904 solvent Substances 0.000 description 7
- 238000004080 punching Methods 0.000 description 6
- 238000010030 laminating Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 238000004132 cross linking Methods 0.000 description 4
- 238000005406 washing Methods 0.000 description 4
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000000049 pigment Substances 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- GLROGUSVUGSGPO-UHFFFAOYSA-N bis(3-methyl-7-oxabicyclo[4.1.0]heptan-4-yl) hexanedioate Chemical compound C1C2OC2CC(C)C1OC(=O)CCCCC(=O)OC1CC2OC2CC1C GLROGUSVUGSGPO-UHFFFAOYSA-N 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000003085 diluting agent Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000007788 roughening Methods 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- GRWFFFOEIHGUBG-UHFFFAOYSA-N 3,4-Epoxy-6-methylcyclohexylmethyl-3,4-epoxy-6-methylcyclo-hexanecarboxylate Chemical compound C1C2OC2CC(C)C1C(=O)OCC1CC2OC2CC1C GRWFFFOEIHGUBG-UHFFFAOYSA-N 0.000 description 1
- OECTYKWYRCHAKR-UHFFFAOYSA-N 4-vinylcyclohexene dioxide Chemical compound C1OC1C1CC2OC2CC1 OECTYKWYRCHAKR-UHFFFAOYSA-N 0.000 description 1
- 229910000976 Electrical steel Inorganic materials 0.000 description 1
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004606 Fillers/Extenders Substances 0.000 description 1
- 229910001335 Galvanized steel Inorganic materials 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical compound [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 238000007766 curtain coating Methods 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000007607 die coating method Methods 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 239000008397 galvanized steel Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- FBAFATDZDUQKNH-UHFFFAOYSA-M iron chloride Chemical compound [Cl-].[Fe] FBAFATDZDUQKNH-UHFFFAOYSA-M 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- -1 methyl ethyl Chemical group 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 230000003449 preventive effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000000935 solvent evaporation Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、導電性金属箔積層時の
耐熱ブロッキング性、回路パタ−ン作成時の耐エッチン
グ性およびエッチング作業後の耐溶剤性に優れ、打ち抜
き加工で切断端面に微小クラックの発生しないプリント
配線基板用基材に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is excellent in heat blocking resistance when laminating a conductive metal foil, etching resistance when forming a circuit pattern, and solvent resistance after an etching operation. The present invention relates to a printed wiring board base material free from cracks.
【０００２】[0002]
【従来技術】ＶＴＲ、ビデオカメラ、小型電算機のフロ
ッピ−ディスク駆動装置などのように電磁波の発信や放
熱を伴う小型モ−タ−を搭載する家電製品のプリント配
線基板の基材には電磁シ−ルド性、放熱性、強度等を考
慮して金属板が用いられている。このような金属系基材
によるプリント配線基板の製造は、金属板自身が導電性
を有するため、金属板の片側にガラス繊維にエポキシ樹
脂などの絶縁性樹脂を含浸させたプリプレグや接着剤層
を積層して、絶縁層を形成し、その上に導電性金属箔を
積層する方法により行われている。これらの絶縁層、導
電性金属箔の金属板への積層は加熱圧着法により同時に
行っているが、生産性を向上させるため、導電性金属箔
同士が合わさるように段重ねにして、数セットを同時に
積層している。2. Description of the Related Art A base material of a printed wiring board of a home electric appliance having a small motor that emits and emits electromagnetic waves such as a VTR, a video camera, a floppy disk drive of a small computer, etc. -A metal plate is used in consideration of solderability, heat dissipation, strength and the like. When manufacturing a printed wiring board using such a metal-based base material, a prepreg or an adhesive layer in which glass fiber is impregnated with an insulating resin such as an epoxy resin on one side of the metal plate is used because the metal plate itself has conductivity. It is performed by a method of laminating, forming an insulating layer, and laminating a conductive metal foil thereon. These insulating layers and the conductive metal foil are laminated on the metal plate at the same time by the heat compression method, but in order to improve the productivity, the conductive metal foils are stacked step by step so that the conductive metal foils are joined together, and several sets are formed. Laminated at the same time.
【０００３】また、基板へのプリント配線は、基板の導
電性金属箔に回路パタ−ンを作成した後、その金属箔の
不用部分をエッチング除去する方法で行っているが、基
板の基材が金属系であると、導電性金属箔積層面の反対
面は金属板が露出しているため、導電性金属箔のエッチ
ングの際に金属板が同時にエッチングされてしまう。こ
のため、反対面には耐エッチング性を有する有機樹脂
層、例えば、エポキシ樹脂の層をコ−ティングで予め設
けていた。しかし、これらの有機樹脂層の場合、導電性
金属箔積層の際の加熱圧着は段重ねした状態で１５０〜
２００℃で５０〜２００ｋｇ／ｃｍ2に加圧して、１〜
５時間と高温、高圧下で行われるので、有機樹脂層同士
が融着し、ブロッキングを起こし、また、エッチング後
の塩化メチレンやアセトンのような有機溶剤洗浄で溶解
されるという問題があった。Further, printed wiring on a substrate is performed by a method of forming a circuit pattern on a conductive metal foil of the substrate and then etching and removing unnecessary portions of the metal foil. When the conductive metal foil is metal, the metal plate is exposed at the same time as the conductive metal foil is etched because the metal plate is exposed on the surface opposite to the conductive metal foil laminated surface. Therefore, an organic resin layer having etching resistance, for example, an epoxy resin layer is provided on the opposite surface by coating in advance. However, in the case of these organic resin layers, the thermocompression bonding at the time of laminating the conductive metal foil is 150 to
At 200 ° C, pressurize to 50-200 kg / cm 2 ,
Since it is performed at a high temperature and a high pressure for 5 hours, there is a problem that the organic resin layers are fused to each other, causing blocking, and dissolved by washing with an organic solvent such as methylene chloride or acetone after etching.
【０００４】そこで、基板裏面に有機樹脂層を設ける場
合、基板裏面に要求される特性である耐熱ブロッキング
性、耐エッチング性および耐溶剤性を調和させるため
に、有機樹脂層に例えばポリエステル樹脂１００重量部
に硬化剤を５０〜１５０重量部と多量に添加して、硬度
と架橋密度とを高める方法が採用されている。しかし、
有機樹脂層は絶縁層や導電性金属箔の加熱圧着の際に再
加熱されるため、形成時よりガラス転移温度（Ｔｇ）は
高くなり、減衰（ｔａｎδ)も減少し、加工性に乏しく
なっている。また、架橋分子量も増加しているため、硬
度も高くなっている。Therefore, when an organic resin layer is provided on the back surface of the substrate, the organic resin layer may be made of, for example, 100% by weight of polyester resin in order to balance the properties required for the back surface of the substrate, such as heat blocking resistance, etching resistance and solvent resistance. A method of increasing the hardness and the crosslink density by adding a hardening agent in a large amount to 50 to 150 parts by weight to a part is adopted. But,
Since the organic resin layer is reheated when the insulating layer or the conductive metal foil is heated and pressed, the glass transition temperature (Tg) is higher than the time of formation, the attenuation (tan δ) is reduced, and the workability is poor. I have. Further, since the cross-linking molecular weight is also increased, the hardness is also increased.
【０００５】ところで、プリント配線基板は、回路形成
後、機器への組み込みのために必要形状にプレス機で打
ち抜くが、基板裏面の有機樹脂層が上述のように加工性
に乏しく、硬くなっていると、打ち抜きの際の加工衝撃
により切断端面に微小クラックが発生し、これが機器に
組み込み後に欠落して、機器の性能に悪影響を及ぼす懸
念があった。[0005] By the way, the printed wiring board is punched out by a press into a required shape for incorporation into a device after circuit formation. However, the organic resin layer on the back surface of the board is poor in workability and hard as described above. In this case, there is a concern that minute cracks are generated on the cut end surface due to the processing impact at the time of punching, and these cracks are dropped after being incorporated into the device, which adversely affects the performance of the device.
【０００６】[0006]
【発明が解決しようとする課題】そこで、本発明は、硬
化剤を多量に添加しても、導電性金属箔積層面の反対面
に設けた有機樹脂層の耐熱ブロッキング性、耐エッチン
グ性および耐溶剤性を調和させ、打ち抜きの際の加工衝
撃で切断端面に微小クラックが発生しないプリント配線
基板用基材を提供するものである。Accordingly, the present invention provides an organic resin layer provided on a surface opposite to a conductive metal foil lamination surface even when a large amount of a curing agent is added. It is an object of the present invention to provide a substrate for a printed wiring board in which solvent properties are harmonized and micro cracks do not occur on a cut end surface due to a processing impact at the time of punching.
【０００７】[0007]
【課題を解決するための手段】本発明は、基材の導電性
金属箔積層面の反対面に、数平均分子量が６０００以下
のポリエステル樹脂に対して、数平均分子量が３５０〜
８５０である軟質成分の環状脂肪族型エポキシ樹脂６〜
２５重量％と、ブチル化メラミン樹脂およびメチル化メ
ラミン樹脂が前者／後者＝９５／５〜７０／３０の割合
からなる硬化剤１０〜２０重量％とが添加されたポリエ
ステル樹脂層を焼付硬化により５〜３０μｍ設けた。According to the present invention, the number average molecular weight of a polyester resin having a number average molecular weight of 6,000 or less is 350 to
850 is a soft component cycloaliphatic epoxy resin,
The polyester resin layer to which 25% by weight and 10-20% by weight of a curing agent having a ratio of 95/5 to 70/30 of a butylated melamine resin and a methylated melamine resin are added is cured by baking. ３０30 μm.
【０００８】[0008]
【作用】本発明者らは、低分子量ポリエステル樹脂に硬
化剤としてブチル化メラミン樹脂とメチル化メラミン樹
脂とを複合添加する際、軟質成分として、数平均分子量
が３５０〜８５０である環状脂肪族型エポキシ樹脂を添
加すると、硬化剤を多量に添加しなくても、耐熱ブロッ
キング性、耐エッチング性および耐溶剤性を調和させる
ことができ、しかも、加工性をも改善できることを見出
した。The present inventors have found that when a butylated melamine resin and a methylated melamine resin are added as a curing agent to a low-molecular-weight polyester resin in combination, a cyclic aliphatic type resin having a number average molecular weight of 350 to 850 is used as a soft component. It has been found that when an epoxy resin is added, heat blocking properties, etching resistance, and solvent resistance can be harmonized and processability can be improved without adding a large amount of a curing agent.
【０００９】本発明では、低分子量ポリエステル樹脂と
して、数平均分子量が６０００以下のものを用いる。こ
れより数平均分子量の大きいものを使用すると、架橋密
度が低くなり、耐熱ブロッキング性が低下し、また、有
機溶剤洗浄で樹脂層が溶解する。In the present invention, a low molecular weight polyester resin having a number average molecular weight of 6000 or less is used. If a polymer having a larger number average molecular weight than this is used, the crosslink density is reduced, the heat blocking resistance is reduced, and the resin layer is dissolved by washing with an organic solvent.
【００１０】硬化剤のブチル化メラミン樹脂とメチル化
メラミン樹脂とは、前者／後者＝９５／５〜７０／３０
の割合でポリエステル樹脂に添加する。樹脂層焼付けの
際にブチル化メラミン樹脂は殆どが自己縮合することに
よって樹脂層硬度を増大させる。一方、メチル化メラミ
ン樹脂はポリエステル樹脂と相溶し易く、樹脂層の架橋
密度を大きくする。そのため、ブチル化メラミン樹脂／
メチル化メラミン樹脂比が９５／５より大きいと、樹脂
層硬度は高くなるものの樹脂層が架橋されないため、導
電性金属箔積層後の有機溶剤洗浄で樹脂層が溶解され
る。また、ブチル化メラミン樹脂／メチル化メラミン樹
脂比が７０／３０より小さいと、架橋密度が高く、有機
溶剤洗浄で樹脂層は溶解されないが、樹脂層硬度が低い
ため、ブロッキングを起こす。本発明ではこれらを調和
させるため、ブチル化メラミン樹脂とメチル化メラミン
樹脂とを上記のような割合で添加する。The butylated melamine resin and the methylated melamine resin as curing agents are the former / the latter = 95/5 to 70/30.
To the polyester resin. Most of the butylated melamine resin undergoes self-condensation during baking of the resin layer, thereby increasing the resin layer hardness. On the other hand, the methylated melamine resin is easily compatible with the polyester resin, and increases the crosslink density of the resin layer. Therefore, butylated melamine resin /
When the methylated melamine resin ratio is greater than 95/5, the resin layer hardness is increased, but the resin layer is not cross-linked. Therefore, the resin layer is dissolved by washing with an organic solvent after laminating the conductive metal foil. When the ratio of the butylated melamine resin / methylated melamine resin is smaller than 70/30, the crosslinking density is high and the resin layer is not dissolved by washing with an organic solvent, but the resin layer has low hardness, so that blocking occurs. In the present invention, in order to harmonize these, a butylated melamine resin and a methylated melamine resin are added at the above ratio.
【００１１】ポリエステル樹脂へのブチル化メラミン樹
脂とメチル化メラミン樹脂の添加は、ポリエステル樹脂
に対して両者の合計が１０〜２０重量％になるようにす
る。添加量が１０重量％未満であると、樹脂層の硬度が
低いため、導電性金属箔の加熱圧着の際に樹脂層がブロ
ッキングを起こし、２０重量％を超えると、樹脂層の硬
度が高くなり過ぎ、後述の軟質成分を添加しても、打ち
抜き加工の際、切断端面に微小クラックが発生する。The addition of the butylated melamine resin and the methylated melamine resin to the polyester resin is such that the total of both is 10 to 20% by weight based on the polyester resin. When the addition amount is less than 10% by weight, the hardness of the resin layer is low, so that the resin layer causes blocking at the time of thermocompression bonding of the conductive metal foil, and when it exceeds 20% by weight, the hardness of the resin layer becomes high. Even if a soft component described later is added, microcracks are generated on the cut end surface during punching.
【００１２】軟質成分の環状脂肪族型エポキシ樹脂は、
数平均分子量が３５０〜８５０であるものを用いる。数
平均分子量が３５０未満のものは樹脂粘度が高いため、
添加後ポリエステル樹脂粘度が上昇し、希釈のために低
粘度のエポキシ系希釈剤を添加しなければならない。し
かし、このような希釈剤は反応性であるため、架橋反応
の停止剤として作用し、硬化剤による樹脂層の架橋密度
を低下させる。一方、数平均分子量が８５０より大きい
ものを用いると、ポリエステル樹脂との相溶性が低下
し、希釈作用が減少してしまうため、樹脂層の軟質化効
果が極めて小さくなってしまう。The cycloaliphatic epoxy resin as a soft component is
Those having a number average molecular weight of 350 to 850 are used. Those having a number average molecular weight of less than 350 have a high resin viscosity,
After the addition, the viscosity of the polyester resin increases, and a low-viscosity epoxy-based diluent must be added for dilution. However, since such a diluent is reactive, it acts as a terminator for a cross-linking reaction, and lowers the cross-link density of the resin layer by the curing agent. On the other hand, when a resin having a number average molecular weight of more than 850 is used, the compatibility with the polyester resin is reduced and the diluting action is reduced, so that the softening effect of the resin layer is extremely reduced.
【００１３】軟質成分として、環状脂肪族型エポキシ樹
脂を使用するのは、環がすべて飽和結合であるため、可
撓性を有するからである。環に不飽和結合を有する芳香
族型のものは環の可撓性が劣るため、添加しても樹脂層
を軟質化できない。環状脂肪族型エポキシ樹脂として
は、３,４−エポキシシクロヘキシルオキシラン、ビス
（３,４−エポキシ−６−メチルシクロヘキシル）アジ
ペ−ト、３,４−エポキシ−６−メチルシクロヘキシル
メチル−３,４−エポキシ−６−メチルシクロヘキサン
カルボキシレ−トなどが挙げられる。The reason why the cycloaliphatic epoxy resin is used as the soft component is that all the rings are saturated bonds and therefore have flexibility. The aromatic type having an unsaturated bond in the ring is inferior in the flexibility of the ring, so that the addition thereof cannot soften the resin layer. Examples of the cycloaliphatic epoxy resin include 3,4-epoxycyclohexyloxirane, bis (3,4-epoxy-6-methylcyclohexyl) adipate, and 3,4-epoxy-6-methylcyclohexylmethyl-3,4- Epoxy-6-methylcyclohexanecarboxylate and the like.
【００１４】環状脂肪族型エポキシ樹脂の添加は、ポリ
エステル樹脂に対して６〜２５重量％にする。６重量％
未満では添加による軟質化効果が不十分で、２５重量％
を超えると、耐溶剤性が低下する。[0014] The cycloaliphatic epoxy resin is added in an amount of 6 to 25% by weight based on the polyester resin. 6% by weight
If less than 25% by weight, the softening effect of the addition is insufficient.
If it exceeds, the solvent resistance will decrease.
【００１５】基材の導電性金属箔積層面の反対面に積層
する熱硬化型樹脂層の厚みは、５〜３０μｍにする。厚
みが５μｍ未満であると、樹脂層の架橋密度、硬度を高
くしても、導電性金属箔のエッチング工程における耐エ
ッチング性に劣る。また、厚みが３０μｍを超えると、
焼付硬化の際に溶剤蒸発によるフクレが発生し易くな
る。基材への樹脂層形成はロ−ルコ−ト法、スプレ−
法、カ−テンフロ−コ−ト法、ダイコ−ト法などによれ
ばよい。The thickness of the thermosetting resin layer laminated on the surface of the substrate opposite to the surface on which the conductive metal foil is laminated is 5 to 30 μm. When the thickness is less than 5 μm, the etching resistance in the etching step of the conductive metal foil is inferior even if the crosslinking density and hardness of the resin layer are increased. When the thickness exceeds 30 μm,
During bake hardening, blisters due to solvent evaporation are likely to occur. The resin layer is formed on the base material by roll coating, spraying
Method, curtain coating method, die coating method and the like.
【００１６】本発明に使用する金属基材としては、剛
性、導電性および熱伝導性を持つものであれば良く、例
えば、溶融亜鉛めっき鋼板、電気亜鉛めっき鋼板、溶融
アルミニウムめっき鋼板、真空蒸着亜鉛めっき鋼板、珪
素鋼板、ステンレス鋼板、アルミニウム板などを使用で
きる。金属基材の厚みは０.３〜１.６ｍｍであることが
好ましい。この金属基材に対して、通常脱脂処理や化成
処理などの前処理を施すが、これらの前処理は金属基材
の表面状態によって省略することができる。また、金属
基材に熱硬化型樹脂層を設ける前に、基材との密着性を
増すためにプライマ−層を形成してもよい。このプライ
マ−層には必要に応じて防錆顔料、着色顔料、体質顔料
などを配合してもよい。The metal substrate used in the present invention may be any material having rigidity, electrical conductivity, and thermal conductivity. A plated steel sheet, a silicon steel sheet, a stainless steel sheet, an aluminum sheet, or the like can be used. The thickness of the metal substrate is preferably from 0.3 to 1.6 mm. This metal substrate is usually subjected to a pretreatment such as a degreasing treatment or a chemical conversion treatment, and these pretreatments can be omitted depending on the surface condition of the metal substrate. Before providing the thermosetting resin layer on the metal substrate, a primer layer may be formed to increase the adhesion to the substrate. The primer layer may contain a rust preventive pigment, a coloring pigment, an extender pigment or the like, if necessary.
【００１７】[0017]
【実施例】溶融亜鉛めっき鋼板（板厚０.５ｍｍ、目付
量４５ｇ／ｍ2）に塗布型クロメ−ト処理を施して、エ
ポキシ樹脂系プライマ−を乾燥塗膜厚で５μｍになるよ
うに塗装し、焼付した後、その上に、環状脂肪族型エポ
キシ樹脂およびブチル化メラミン樹脂、メチル化メラミ
ン樹脂の両硬化剤を添加したポリエステル樹脂またはエ
ポキシ樹脂を塗装し、焼付けた。表１に樹脂層の組成と
膜厚を示す。また、得られた基材に対して次の性能試験
を実施した結果を表２に示す。EXAMPLE A hot-dip galvanized steel sheet (sheet thickness: 0.5 mm, basis weight: 45 g / m 2 ) was subjected to coating-type chromate treatment, and an epoxy resin-based primer was applied to a dry coating thickness of 5 μm. Then, after baking, a polyester resin or epoxy resin to which both a cycloaliphatic epoxy resin, a butylated melamine resin, and a methylated melamine resin were added was applied and baked. Table 1 shows the composition and thickness of the resin layer. Table 2 shows the results of performing the following performance tests on the obtained base materials.
【００１８】（１）耐熱ブロッキング性試験 基材の樹脂層同士を重ね合わせて、加圧力１００ｋｇ/
ｃｍ2、温度１８０℃で２時間加熱圧着し、ブロッキン
グが発生しないものを記号○で、ブロッキングが発生し
たものを記号×で評価した。 （２）耐エッチング性試験 耐熱ブロッキング性試験でブロッキングの発生しない試
験片を１０％塩化鉄溶液に浸漬し、樹脂層にピンホ−ル
が発生しないものを記号○で、ピンホ−ルが発生したも
のを記号×で評価した。(1) Heat blocking test The resin layers of the base material were superposed on each other, and a pressure of 100 kg /
cm 2, and 2 hours thermocompression bonding at a temperature 180 ° C., what blocking does not occur symbols ○ and were evaluated what blocking occurs by the symbol ×. (2) Etching resistance test A test piece free from blocking in the heat blocking test was immersed in a 10% iron chloride solution. Was evaluated with the symbol x.
【００１９】（３）耐衝撃加工性試験（打ち抜き加工試
験） 耐エッチング性試験でピンホ−ルの発生しない試験片を
打ち抜き速度１５ｃｍ／秒でプレス機により打ち抜き径
５ｍｍに打ち抜き加工し、樹脂層に微小クラックが発生
しないものを記号○で、微小クラックが発生したものを
記号×で評価した。 （４）耐溶剤性試験 耐衝撃加工性試験で微小クラックが発生しない試験片を
メチルエチルケトン含浸フェルトで摩擦した。摩擦はフ
ェルトに３ｋｇの荷重をかけて、２００回行い、樹脂層
の溶解、荒れのいずれもが発生しないものを記号○で、
樹脂層の溶解、荒れのいずれか一方または両方が生じた
ものを記号×で評価した。(3) Impact resistance test (punching test) A test piece free from pinholes in the etching resistance test was punched out at a punching speed of 15 cm / sec by a press machine to a punching diameter of 5 mm to form a resin layer. Samples in which microcracks did not occur were evaluated with the symbol ○, and those in which microcracks occurred were evaluated with the symbol x. (4) Solvent resistance test A test piece that did not generate microcracks in the impact resistance test was rubbed with methyl ethyl ketone-impregnated felt. The friction was performed 200 times by applying a load of 3 kg to the felt, and the symbol ○ indicates that neither the melting nor the roughening of the resin layer occurred.
One or both of dissolution and roughening of the resin layer were evaluated by the symbol x.
【００２０】[0020]
【表１】 （注１）主成分樹脂のＡはポリエステル樹脂で、Ｂはエ
ポキシ樹脂である。 （注２）エポキシ樹脂のＣはビス（３,４−エポキシ−
６−メチルシクロヘキシル）アジペ−トで、Ｄはエピク
ロルヒドリン・ビスフェノ−ルＡ型エポキシ樹脂であ
る。 （注３）硬化剤の添加量はポリエステル樹脂またはエポ
キシ樹脂に対する重量％である。[Table 1] (Note 1) A of the main component resin is a polyester resin, and B is an epoxy resin. (Note 2) C in the epoxy resin is bis (3,4-epoxy-
6-methylcyclohexyl) adipate, wherein D is an epichlorohydrin bisphenol A type epoxy resin. (Note 3) The addition amount of the curing agent is% by weight based on the polyester resin or epoxy resin.
【００２１】[0021]
【表２】 [Table 2]
【００２２】[0022]
【発明の効果】以上のように、本発明の基材の導電性金
属箔積層面と反対面に設けた樹脂層は、ポリエステル樹
脂に環状脂肪族型エポキシ樹脂を添加して、ブチル化メ
ラミン樹脂とメチル化メラミン樹脂の添加量を減少させ
ることなく樹脂層の耐熱ブロッキング性、耐エッチング
性および耐溶剤性を調和させるとともに、樹脂層の加工
性も高めたものであるので、打ち抜き加工で切断端面に
微小クラックが発生しない。As described above, the resin layer provided on the surface opposite to the conductive metal foil lamination surface of the base material of the present invention is obtained by adding a cycloaliphatic epoxy resin to a polyester resin, The heat resistance blocking properties, etching resistance and solvent resistance of the resin layer are harmonized without reducing the amount of addition of the methylated melamine resin, and the workability of the resin layer is enhanced. No minute cracks occur
───────────────────────────────────────────────────── フロントページの続き (72)発明者 輿石 謙二 千葉県市川市高谷新町７番地の１ 日新製 鋼株式会社技術研究所塗装複合材料研究部 内 ──────────────────────────────────────────────────の Continuing from the front page (72) Inventor Kenji Koshiishi 1 at Nisshin Steel Engineering Co., Ltd., Painted Composites Research Dept.
Claims (1)
を順次積層してなるプリント配線基板に使用する金属板
基材において、該基材の導電性金属箔積層面の反対面
に、数平均分子量が６０００以下のポリエステル樹脂に
対して、数平均分子量が３５０〜８５０である軟質成分
の環状脂肪族型エポキシ樹脂６〜２５重量％と、ブチル
化メラミン樹脂およびメチル化メラミン樹脂が前者／後
者＝９５／５〜７０／３０の割合からなる硬化剤１０〜
２０重量％とが添加されたポリエステル樹脂層を焼付硬
化により５〜３０μｍ設けたことを特徴とするプリント
配線基板用基材。1. A metal plate substrate used for a printed wiring board in which a resin insulating layer and a conductive metal foil are sequentially laminated on the surface of the substrate, wherein a surface of the substrate opposite to the conductive metal foil laminated surface is For a polyester resin having a number average molecular weight of 6000 or less, a cycloaliphatic epoxy resin of a soft component having a number average molecular weight of 350 to 850, 6 to 25% by weight, and a butylated melamine resin and a methylated melamine resin. The latter is a curing agent having a ratio of 95/5 to 70/30.
A substrate for a printed wiring board, wherein a polyester resin layer to which 20% by weight is added is provided by baking and hardening in an amount of 5 to 30 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9493097A JP3113606B2 (en) | 1997-03-28 | 1997-03-28 | Substrate for printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9493097A JP3113606B2 (en) | 1997-03-28 | 1997-03-28 | Substrate for printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH10272731A true JPH10272731A (en) | 1998-10-13 |
| JP3113606B2 JP3113606B2 (en) | 2000-12-04 |
Family
ID=14123695
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9493097A Expired - Fee Related JP3113606B2 (en) | 1997-03-28 | 1997-03-28 | Substrate for printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3113606B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003003375A (en) * | 2001-06-19 | 2003-01-08 | Unitika Glass Fiber Co Ltd | Glass fiber woven fabric fraying-preventing and fixing agent and glass fiber woven fabric whose fraying is prevented |
| WO2017095332A1 (en) * | 2015-11-30 | 2017-06-08 | Linxens Holding | Method of manufacturing a laminated substrate for smart cards |
-
1997
- 1997-03-28 JP JP9493097A patent/JP3113606B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003003375A (en) * | 2001-06-19 | 2003-01-08 | Unitika Glass Fiber Co Ltd | Glass fiber woven fabric fraying-preventing and fixing agent and glass fiber woven fabric whose fraying is prevented |
| WO2017095332A1 (en) * | 2015-11-30 | 2017-06-08 | Linxens Holding | Method of manufacturing a laminated substrate for smart cards |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3113606B2 (en) | 2000-12-04 |
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