JPH1027552A - Plasma display panel sealing structure - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a PDP(plasma display panel) which reduces the thermal distortion for a glass substrate material, by making it possible to bond at a relatively low temperature. SOLUTION: In a PDP which comprises a front side plate 1 having electrodes 4 for discharge on a board; a rear side plate 2 having an electrode 5 for address and partition walls 7 for discharge space forming; and joining member 8 to joint by opposing the front side plate and the rear side plate; the peripheries of the front side plate 1 and the rear side plate 2 are sealed and adhered closely by a material which comprises a thermoplastic resin with the fluid starting temperature 100 deg.C to 450 deg.C, so as to bond the both plates. The bonding material is composed by mixing 5 to 60wt.% of a ceramics fine powder or a magnetic body powder to the above thermoplastic resin. A vacuum grease 11 is applied on the surface of the thermoplastic resin. Side walls are provided so as to surround the partition wall group, and the thermoplastic resin is filled on the outer peripheries of the side walls to bond them.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plasma display panel (hereinafter, simply referred to as "PDP") of a flat display device used for a color TV, a personal computer, a word processor, and the like. It is about structure.

[0002]

2. Description of the Related Art Conventionally, as shown in FIG. In this figure, reference numeral 1 denotes a front plate, on which a discharge electrode is formed on a glass substrate to form a display electrode 4 and is covered with a dielectric material 9 for insulation. Reference numeral 2 denotes a back plate, on which address electrodes 5 are formed and partition walls 7 forming discharge spaces (cells) 6 are formed.

[0003] Reference numeral 8 denotes a joining member to which the present invention is applied.
PDP by the front plate 1, the back plate 2 and the joining member 8
Is formed. In the discharge space 6, Ne + Xe (0.
1%) Penning mixed gas is filled at a gas pressure of about 300 Torr, and the phosphors (R, G,
B) (not shown) is stably emitted by ultraviolet light generated by plasma generated between display electrodes.

[0004] The back plate 2 is provided with an exhaust hole 3 for exhausting the inside of the cell after panel bonding and filling it with a Penning mixed gas of Ne + Xe (0.1%), and a glass tube and a getter tube for removing impurity gas. (Not shown) is connected.

[0005] In this figure, a lead material which is close to the thermal expansion coefficient of glass used as a substrate material of a panel as a bonding material used for sealing adhesion bonding, has no gas release in a high temperature atmosphere, and has a high barrier property against electricity and various gases. So-called low-melting glass such as glass is used. These are made into a paste and applied to a desired portion by a printing method or a dispenser to a predetermined thickness.
After drying for one minute, the front plate 1 and the rear plate 2 are aligned and 3
The binder in the paste is pre-fired at 80 ° C. Then fix it with a clip or the like, raise the temperature to a high
Hold for 1 minute and melt bond.

At this time, usually, MgO (not shown) of the secondary electron emitting material formed on the discharge space surface of front plate 1 is used.
Is simultaneously performed at 350 ° C. in the cooling process, and unnecessary gas is exhausted from a glass exhaust pipe connected to an exhaust hole 3 provided in the back plate 2, and a reduced pressure gas such as Ne + Xe
(0.1%) of a Penning mixed gas was sealed in the panel.

[0007]

However, there are the following problems when PDP bonding is performed using a conventional low-melting glass or the like. The joining process must be performed at a high temperature of 430 ° C. or more, and thermal strain is applied to the glass substrate of the panel substrate material, which causes a dimensional change and a displacement of the PDP.

In addition, expensive parts of the high-temperature furnace used for processing at the high temperature and the various parts and jigs constituting the equipment necessary for the bonding must also be made of expensive heat-resistant materials. Was desired.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and an object of the present invention is to provide a bonding structure which is simple in bonding method, can be applied to a large-screen PDP, and can be bonded at a relatively low temperature. And

[0010]

According to the present invention, the following constitution is employed to solve the above-mentioned problems.

A front plate having a discharge electrode on a substrate, a back plate having an address electrode and having a partition for forming a discharge space, and a joining member for joining the front plate and the back plate while facing each other; The sealing structure of the plasma display panel, wherein the periphery of the front plate and the back plate is sealed and adhered by a thermoplastic resin material having a flow start temperature of 100 ° C. to 450 ° C.

Further, a side wall is provided around the front plate and the back plate so as to surround the partition wall group, and a sealing material of the thermoplastic resin is filled around the side wall to join the plasma display panel. Stop structure.

[0013]

BEST MODE FOR CARRYING OUT THE INVENTION As a material used for bonding a PDP according to the present invention, a high-molecular thermoplastic resin which emits a small amount of gas due to its composition is selected, and particularly at 400 ° C. in consideration of reactivation of MgO.
The purpose of joining can be achieved by using a thermoplastic resin which is less thermally decomposed even when left at a high temperature, for example, a polysulfone or a polyetheretherketone (PEEK) as a main component.

Further, a reduced pressure gas in the panel, for example, Ne +
In order to prevent moisture from penetrating into the Xe (0.1%) Penning mixed gas from the outside, as a method to increase reliability, heat-resistant grease is applied to the outside air contact part after joining, so that PDP emission stable for a long time Can be secured.

By filling and joining the above-mentioned resin between multiple side walls that can be formed in the same step as the formation of the partition walls, a sealing structure with even lower gas permeability can be obtained.

Further, a joining member including a ceramic fine powder, a magnetic material, and a metal wire material in the above-mentioned thermoplastic polymer material such as PEEK may be used.

Furthermore, in order to absorb the difference in thermal expansion between the metal wire and the glass substrate, a wave-shaped metal wire coated with the above-mentioned PEEK material in a thick film can be used.

Since a thermoplastic resin such as PEEK is used as a material for panel joining, a material having a wide flow start temperature (100 ° C. to 450 ° C.) and a high gas barrier property can be obtained by adjusting the molecular weight and blending other thermoplastic resins. Can be obtained. Further, since the thermoplastic resin does not contain additives such as a catalyst and a plasticizer, there is no gas release after curing unlike the epoxy adhesive. The flow start temperature referred to here is a melt index test (ASTM D 132
This is the temperature obtained according to 8).

Such a bonding material is applied linearly to the bonding surface between the front panel and the back panel of the PDP with a predetermined width, and
In a predetermined bonding step, the bonding surfaces are opposed to each other and are bonded by heating at a predetermined temperature. The time required for the joining may be several seconds to several tens of seconds excluding the heating time. Since the stress due to heat shrinkage due to cooling after hardening has an elastic coefficient about one order of magnitude smaller than that of the glass of the panel substrate, it is possible to absorb the stress in the elastic region of the bonding material.

Further, when a joining member in which the above-mentioned thermoplastic resin is previously coated with a thick film on a metal wire is used, it is shaped in a wave shape so that the stress dimensional change generated at the time of thermal expansion and contraction can be measured by a wavy deformation behavior. Can be absorbed.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

1 and 2 show one embodiment of the present invention, and show a plan view of a back plate and a partial sectional view of a PDP. In these figures, as in the conventional example of FIG. 6, reference numeral 2 denotes a back plate on which address electrodes 5 are formed and partition walls 7 forming discharge spaces 6 are formed. Is formed.

Embodiment 1 A back plate 2 has a height equivalent to a partition wall (width 0.10 mm, height 0.2 mm) forming a cell to be a light emitting surface, a width of 1 mm, and a low melting point lead. A side wall 10 made of glass was provided on the outer peripheral portion as shown in FIG. 1, and a predetermined amount of a bonding material was applied around the periphery. Solvent dispersion type bonding material such as ST
When AYSTK383L (manufactured by Techno Alpha) is used, it has an initial viscosity of about 200,000 cps, is dried at about 130 ° C. for 20 minutes after application, and after sufficiently evaporating the solvent, is aligned with the front plate.

FIG. 2 is a partial cross-sectional view showing a state where the front plate 1 and the rear plate 2 are aligned, left under an atmosphere of a joining temperature of 230 ° C. for 10 minutes, and melted by applying a load of about 5 kg from above. is there. The bonding material 8 used in the present embodiment is applied to the outside of the side wall 10. In addition, the bonding area can be increased by spreading the bonding material 8 on the contact surface between the side wall 10 and the front plate 1.

Then, after cooling to 150 ° C., the load was released to complete the joining. At this time, the front plate 1 and the back plate 2 may be fixed with a clip or the like in order to prevent a displacement. In the conventional joining method using lead glass at 430 ° C. or more, the spring property of the clip is reduced, and Reuse was limited to about twice, and wasted in terms of cost and resources,
Since the joining operation at a temperature of 300 ° C. or less has been made possible, it can be reused many times.

Also, after the joining is completed, vacuum grease or the like 11 is applied with a predetermined thickness to the surface of the joining material on the outside air side.
Further higher gas barrier properties can be obtained.

Further, the side walls may be provided in a double or multiple manner, and the side walls may be filled with the bonding material and bonded.

Embodiment 2 In order to obtain a higher gas barrier property as a sealing adhesion bonding material, 5 to 60 wt% of glass fine powder, for example, 2
0 wt% was blended and used as a joining material. In this case, since the material viscosity increased in proportion to the increase in the compounding amount, the material was heated to 80 ° C. and applied to the back plate 2. After the application, the coating was dried at about 130 ° C. for 40 minutes, and the solvent was sufficiently vaporized.

The pressure at the time of bonding was twice as heavy as that of Embodiment 1, but the heating temperature of the bonding atmosphere was the same.

Embodiment 3 After the surface of the electrode at the joint between the front plate 1 and the back plate 2 is sufficiently insulated with a dielectric or the like, 5 to 60 wt% of magnetic fine powder is substituted for glass fine powder, for example, 20 wt%. % Of the sheet-like joining material was used. PEEK (melting point: 340 ° C.), a high melting point material, was used as the thermoplastic resin.

PEEK is a gas barrier polymer material having a high degree of packing due to the configuration of a crystalline (crystallinity of about 32%) polymer.

As a method of heating the bonding material, internal heating of the bonding material utilizing the eddy current loss of the magnetic material was used. By doing so, the time required for heating and cooling the bonding material could be significantly reduced.

The joining temperature by electromagnetic induction heating was set at about 360 degrees.

Embodiment 4 As shown in FIG. 3, in consideration of workability and automation of joining, a mat made of a thin metal wire such as iron is sufficiently impregnated with the joining material used in the first embodiment in the mesh of the thin metal wire. After the drying, the joining member 12 was formed into a film having a predetermined thickness (here, 0.25 mm in thickness) and punched into a frame having a width of 5 mm.

Since the joining member 12 is a magnetic material, it can be moved by a magnet and is disposed at a predetermined position on the back plate. Then, the joining member 12 is combined with the front plate and pressurized in the same manner as in the third embodiment to perform induction heating joining.
The joining temperature by induction heating was set to around 360 degrees.

Embodiment 5 As shown in FIG. 1, a continuous side wall 10 having a width of 1 mm is formed on the back plate 2 on which the partition wall 7 is formed so as to surround the partition wall 7, and further around the side wall 10 as shown in FIG. A side wall 14 with a notch 13 was provided partially.

A predetermined amount of a sealing adhesive material was applied between the side walls, dried, and heated and joined. The continuous side wall 10 has a role as a weir for restricting resin flow toward the partition wall when the joining material is heated and melted, and the notched side wall 14 has a role to easily flow excess resin to the outside.

FIG. 5 is a partial sectional view of the joined panel. The side wall 14 also serves as a positioning member when the joining material formed in a linear shape is temporarily fixed to the back plate.

The heating temperature of the bonding atmosphere is the same as in the first embodiment.

[0040]

As described above, since the PDP according to the present invention can be joined at a relatively low temperature as described above, it is possible to reduce the thermal strain on the glass substrate material.

Further, the present invention can also be used for bonding a glass tube for vacuum evacuation, a getter tube for adsorbing impure gas, etc. in a panel having a conventional structure to a back plate.

In addition, since the bonding process is performed at a low temperature, panel bonding can be performed in a Ne + Xe (0.1%) Penning mixed gas chamber, and three-dimensional obstacles occur in connection between the conventional panel and a signal drive circuit. This eliminates the need for a vacuum evacuation glass tube, an impurity gas adsorption getter tube, and the like, and makes it possible to realize an extremely flat panel. Also, by using a joining member in which a metal wire is coated with a thick film,
In addition to improving the gas barrier properties, it has become possible to employ a heating method that is excellent in joining productivity, such as an electromagnetic induction heating method.

Further, since the thermoplastic resin is used as the joining material, the panel can be easily divided by heating to the joining temperature with respect to defects inside the panel found after assembling the panel, for example, deficiency of the phosphor. Also, the defect part can be fixed.

[Brief description of the drawings]

FIG. 1 is a plan view of a back plate showing one embodiment of the present invention.

FIG. 2 is a sectional view showing an embodiment of the present invention.

FIG. 3 is a perspective view showing a joining member according to one embodiment of the present invention.

FIG. 4 is a plan view of a back plate showing one embodiment of the present invention.

FIG. 5 is a sectional view showing an embodiment of the present invention.

FIG. 6 is a sectional view showing a conventional example of a PDP.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Front plate 2 Back plate 3 Exhaust hole 4 Display electrode 5 Address electrode 6 Discharge space 7 Partition wall 8 Joining member 9 Dielectric 10 Side wall 12 Joining member 13 Notch 14 Notched side wall

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Yoshihiro Kato 292 Yoshida-cho, Totsuka-ku, Yokohama-shi, Kanagawa Prefecture Inside the Visual Information Media Division of Hitachi, Ltd.

Claims (7)

[Claims] A front plate having a discharge electrode on a substrate;
A plasma display panel comprising: a back plate having an address electrode and a partition for forming a discharge space; and a joining member for joining the front plate and the back plate so as to face each other. A sealing structure for a plasma display panel, wherein a periphery of the front plate and the back plate are sealed and adhered to each other with a material made of a thermoplastic resin having a temperature of ℃. 2. The plasma display panel according to claim 1, wherein the sealing and bonding material has a flow start temperature of 100 ° C. to 4 ° C.
A sealing structure for a plasma display panel, wherein a ceramic fine powder or a magnetic substance powder is blended in a thermoplastic resin at 50 ° C. in an amount of 5 to 60 wt%. 3. The plasma display panel according to claim 1, wherein the bonding material that seals the periphery of the front plate and the back plate is:
A sealing structure for a plasma display panel, which is a metal linear body coated and formed with a thermoplastic resin having a flow start temperature of 100 ° C. to 450 ° C. 4. A front plate having a discharge electrode on a substrate;
A plasma display panel comprising: a back plate having an address electrode and a partition for forming a discharge space; and a joining member for joining the front plate and the back plate so as to face each other. A side wall formed so as to surround the group of partition walls provided on the face plate and having a thickness equal to and higher than the width of the partition wall and made of the same material as the partition walls, and a flow start temperature of 100 ° C. to 450 ° C. What is claimed is: 1. A sealing structure for a plasma display panel, comprising: a member filled with a thermoplastic resin and joined. 5. A front plate having a discharge electrode on a substrate;
A plasma display panel comprising: a back plate having an address electrode and a partition for forming a discharge space; and a joining member that joins the front plate and the back plate so as to face each other. Providing a side wall formed so as to surround the group of partition walls, being thicker and equal in height to the partition wall width and made of the same material as the partition walls, providing a notched side wall having a cutout opening around the side wall; Flow start temperature 100 between the side wall and the notched side wall
A sealing structure for a plasma display panel, characterized by filling and joining a thermoplastic resin at a temperature of from 450C to 450C. 6. The sealing structure for a plasma display panel according to claim 4, wherein the filled and bonded flow start temperature is from 100 ° C. to 45 °.
A sealing structure for a plasma display panel, wherein vacuum grease is applied to a surface of a thermoplastic resin at 0 ° C. 7. A front plate having a discharge electrode on a substrate,
A plasma display panel comprising: a back plate having an address electrode and a partition for forming a discharge space; and a joining member for joining the front plate and the back plate so as to face each other. Double or multiple side walls are formed so as to surround the partition group and are thicker and equal in height than the partition width, and are made of the same material as the partition walls, and a flow start temperature is provided between the double or multiple side walls. 100 ℃
A sealing structure for a plasma display panel, characterized by filling and joining a thermoplastic resin at a temperature of from 450 ° C. to 450 ° C.