JPH102773A - Thermal air flow meter - Google Patents

Thermal air flow meter

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Publication number
JPH102773A
JPH102773A JP8157901A JP15790196A JPH102773A JP H102773 A JPH102773 A JP H102773A JP 8157901 A JP8157901 A JP 8157901A JP 15790196 A JP15790196 A JP 15790196A JP H102773 A JPH102773 A JP H102773A
Authority
JP
Japan
Prior art keywords
air flow
temperature
heating resistor
resistor
measuring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8157901A
Other languages
Japanese (ja)
Inventor
Masamichi Yamada
雅通 山田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP8157901A priority Critical patent/JPH102773A/en
Publication of JPH102773A publication Critical patent/JPH102773A/en
Pending legal-status Critical Current

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Abstract

(57)【要約】 【課題】空気流量計測のダイナミックレンジおよびノイ
ズを改善し、耐塵埃信頼性および温度特性の優れた熱式
空気流量計を提供する。 【解決手段】発熱抵抗体4a,4bおよび空気流の方向
と流量を計測する測温抵抗体5,6を、各々半導体基板
2に形成した空洞3a,3b上の電気絶縁体10に形成
し、空気温度測温抵抗体7は空気流に突き出す様に半導
体基板2上に形成し、また、空気流9に対して電気絶縁
体10は開口部がなく、計測有効面積の大きい空洞3b
上に流量計測のための発熱抵抗体4bを形成した測定素
子1とし、測定素子1の測温抵抗体5,6からの流量信
号と発熱抵抗体4bの流量信号をともに出力し平均化処
理する。
(57) [Object] To provide a thermal air flow meter which improves the dynamic range and noise of air flow measurement, and is excellent in dust resistance reliability and temperature characteristics. A heating resistor (4a, 4b) and a temperature measuring resistor (5, 6) for measuring the direction and flow rate of an air flow are formed in an electrical insulator (10) on cavities (3a, 3b) formed in a semiconductor substrate (2), respectively. The air temperature measuring resistor 7 is formed on the semiconductor substrate 2 so as to protrude into the air flow, and the electric insulator 10 has no opening for the air flow 9 and has a cavity 3b having a large effective measuring area.
The heating element 4b for measuring the flow rate is formed on the measuring element 1, and the flow rate signals from the temperature measuring resistors 5 and 6 of the measuring element 1 and the flow rate signal of the heating resistor 4b are both output and averaged. .

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、熱式空気流量計に
係り、特に内燃機関の吸入空気量を測定するのに好適な
熱式空気流量計に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thermal air flow meter, and more particularly to a thermal air flow meter suitable for measuring an intake air amount of an internal combustion engine.

【0002】[0002]

【従来の技術】従来より自動車などの内燃機関の電子制
御燃料噴射装置に設けられ吸入空気量を測定する空気流
量計として、熱式のものが質量空気量を直接検知できる
ため主流となってきている。この中で特に、半導体マイ
クロマシニング技術により製造された空気流量計が、コ
ストが低減でき且つ低電力で駆動することが出来るため
注目されてきた。このような従来の半導体基板を用いた
熱式空気流量計としては、例えば、特開昭60−142268号
公報および特開平7−174600 号公報等に開示されてい
る。これら公報に記載の技術は、製造コストはある程度
低減されているが、吸入空気量の測定に際して、流量計
測レンジが狭い,ノイズが大きい,耐塵埃信頼性が十分
でない等の問題があった。
2. Description of the Related Art Conventionally, as an air flow meter which is provided in an electronically controlled fuel injection device of an internal combustion engine of an automobile or the like and measures an intake air amount, a thermal air flow meter can directly detect a mass air amount and has become mainstream. I have. Among them, an air flow meter manufactured by a semiconductor micromachining technique has attracted particular attention because it can reduce cost and can be driven with low power. Such a conventional thermal air flow meter using a semiconductor substrate is disclosed in, for example, JP-A-60-142268 and JP-A-7-174600. Although the techniques described in these publications have reduced manufacturing costs to some extent, there have been problems in measuring the intake air amount, such as a narrow flow rate measurement range, large noise, and insufficient dust resistance reliability.

【0003】[0003]

【発明が解決しようとする課題】従来技術には次のよう
な課題がある。特開昭60−142268号公報に記載の従来技
術を図7を参照し説明する。図7は従来の熱式空気流量
計の測定素子の平面図であり、前記公報に記載の第2図
である。図で、1が熱式空気流量計の測定素子で、シリ
コン等の半導体基板を異方性エッチングにより形成した
空洞23a,23b,23cを架橋する電気絶縁膜からな
る2本の橋24aと24bを有し、空気の流れの上流側
が橋24a,下流側が橋24bとなっている。2本の橋
24aと24bとの間の開口した空洞23cを挟んで発
熱抵抗体4を配置し、これらの橋24a,24bには発
熱抵抗体4の側部に各々測温抵抗体5,6が配置され、
更に、電気絶縁膜の空洞23aの上流側の一部に空気温
度を測定する空気温度測温抵抗体7を配設している。
又、空洞23a,23bおよび23cは、電気絶縁膜の
開口部を利用して半導体基板を異方性エッチングするた
め、電気絶縁膜の橋24a,24b下で連続した一体の
空洞となっている。
The prior art has the following problems. The prior art described in Japanese Patent Application Laid-Open No. Sho 60-142268 will be described with reference to FIG. FIG. 7 is a plan view of a measuring element of a conventional thermal air flow meter, and is a second diagram described in the above-mentioned publication. In the figure, 1 is a measuring element of a thermal air flow meter, and two bridges 24a and 24b made of an electric insulating film bridging the cavities 23a, 23b and 23c formed by anisotropic etching of a semiconductor substrate such as silicon. The upstream side of the air flow is a bridge 24a, and the downstream side is a bridge 24b. The heating resistor 4 is arranged with an open cavity 23c between the two bridges 24a and 24b, and these bridges 24a and 24b are respectively connected to the temperature measuring resistors 5 and 6 on the sides of the heating resistor 4. Is placed,
Further, an air temperature measuring resistor 7 for measuring the air temperature is provided in a part of the electrical insulating film on the upstream side of the cavity 23a.
Further, the cavities 23a, 23b and 23c are continuous and integrated cavities under the bridges 24a and 24b of the electric insulating film because the semiconductor substrate is anisotropically etched using the opening of the electric insulating film.

【0004】この空気流量計では、空気温度測温抵抗体
7により定められる空気温度よりも一定温度高い温度と
なるように発熱抵抗体4が加熱駆動される。空気流量
は、空気の熱運搬効果を利用して、流路の上流側測温体
6と下流側測温体5との間に生じる温度差から計測され
る。
In this air flow meter, the heating resistor 4 is driven to be heated to a temperature higher than the air temperature determined by the air temperature measuring resistor 7 by a certain temperature. The air flow rate is measured from the temperature difference generated between the upstream temperature measuring element 6 and the downstream temperature measuring element 5 of the flow channel by utilizing the heat transport effect of air.

【0005】図8は従来の熱式空気流量計の他の例の説
明図であり、測定素子の平面図となっている。測定素子
1は、従来例と同じように半導体基板2上に電気絶縁膜
10を形成し、公知のホトリソグラフィ技術により電気
絶縁体10の23d,23eの部分をエッチングし、更
に、この開口部23d,23eから半導体基板2を異方
性エッチングして空洞23d,23eを形成する。この
空洞23dと23eは、前記の従来例と同じように電気
絶縁膜の橋24下で連続した一体の空洞を形成してい
る。この従来例では、橋24上に発熱抵抗体4とこれに
近接して測温抵抗体6が空気流の上流側に配設され、さ
らに、空気温度測温抵抗体7が測定素子1の最上流に配
設される。
FIG. 8 is an explanatory view of another example of a conventional thermal air flow meter, and is a plan view of a measuring element. In the measuring element 1, the electric insulating film 10 is formed on the semiconductor substrate 2 in the same manner as in the conventional example, and the portions 23d and 23e of the electric insulator 10 are etched by a known photolithography technique. , 23e, the semiconductor substrate 2 is anisotropically etched to form cavities 23d, 23e. The cavities 23d and 23e form a continuous integral cavity under the bridge 24 of the electric insulating film, as in the above-described conventional example. In this conventional example, the heating resistor 4 and the temperature measuring resistor 6 are disposed on the bridge 24 in the vicinity of the heating resistor 4 on the upstream side of the air flow. Installed upstream.

【0006】この空気流量計では、空気温度測温抵抗体
7で検知される空気温度より測温抵抗体6が一定温度高
くなるように発熱抵抗体4を加熱(傍熱)駆動する。空
気流量は、空気の流量が増加するに従い冷却される測温
抵抗体6を傍熱する発熱抵抗体4に流す加熱電流から計
測する。
In this air flow meter, the heating resistor 4 is heated (indirectly heated) so that the temperature of the temperature measuring resistor 6 becomes higher than the air temperature detected by the air temperature measuring resistor 7 by a certain temperature. The air flow rate is measured from a heating current flowing through the heating resistor 4 that indirectly heats the temperature measuring resistor 6 that is cooled as the air flow rate increases.

【0007】このように構成された従来例では、例えば
図7の測定素子では、特開平7−174600号公報の明細書
の項目(0012)に記載されているように、空気流量
が大流速域で出力変化が小さく、直線性が悪くなり、計
測可能な流速レンジが狭くなる問題がある。これを改善
したのが図8に示した測定素子だが、この従来例では、
空気の流れの方向が検知出来ないという問題がある。更
には、図7,図8の両方の従来例に共通する問題とし
て、空気流量を計測する上で重要な空気流と接する検出
有効面積(この従来例では測温抵抗体5,6の空気流に
接する面付)が小さいことにより出力ノイズが大きいこ
と、また、空気流に接する測定素子の表面に空洞23
a,23b,23c,23d,23eが開口しており、
自動車等の過酷な条件で使用される場合、開口部に塵埃
等が蓄積し長期間に渡って信頼性の高い計測が出来ない
等がある。
In the conventional example configured as described above, for example, in the measuring element of FIG. 7, as described in the item (0012) of the specification of Japanese Patent Application Laid-Open No. However, there is a problem that the output change is small, the linearity is deteriorated, and the measurable flow velocity range is narrowed. This is improved by the measuring element shown in FIG. 8, but in this conventional example,
There is a problem that the direction of the air flow cannot be detected. Further, as a problem common to both of the conventional examples shown in FIGS. 7 and 8, a detection effective area in contact with an air flow which is important in measuring an air flow rate (the air flow of the resistance temperature detectors 5 and 6 in this conventional example). Is small, the output noise is large, and the surface of the measuring element in contact with the airflow has a cavity 23.
a, 23b, 23c, 23d, 23e are open,
When used under severe conditions such as in automobiles, dust and the like accumulate in the openings, and highly reliable measurement cannot be performed over a long period of time.

【0008】本発明の目的は、従来技術の課題を解決し
た流量計測のダイナミックレンジが広く、出力ノイズが
小さく、耐塵埃信頼性の高い熱式空気流量計を提供する
ことにある。
It is an object of the present invention to provide a thermal air flow meter which solves the problems of the prior art, has a wide dynamic range for flow measurement, has low output noise, and has high dust resistance reliability.

【0009】[0009]

【課題を解決するための手段】目的を達成するため、本
発明は上面に電気絶縁膜を有し前記電気絶縁膜境界面よ
り下面に至る第一および第二の空洞を有する半導体基板
と、前記第一の空洞上の電気絶縁膜上に形成された第一
の発熱抵抗体と、前記第一の空洞上の電気絶縁膜上であ
って前記第一の発熱抵抗体を中心に近接して被測定流体
の上下流方向に対称に形成された一対の測温抵抗体と、
前記第二の空洞上の電気絶縁膜上に形成された第二の発
熱抵抗体と、前記第一および第二の空洞部以外の前記電
気絶縁膜上に形成された流体温度測温抵抗体とからなる
測定素子と、前記第一および第二の発熱抵抗体と前記流
体温度測温抵抗体の温度差を一定に保つ制御手段と、前
記一対の測温抵抗体の温度差より被測定流体の流れ方向
を検知する手段と、前記一対の測温抵抗体の温度差およ
び前記第二の発熱抵抗体に流す電流値より被測定流体の
流量を検知する手段より構成したこと、また、前記第一
および第二の発熱抵抗体は前記電気絶縁膜上で電気的に
直列接続するように構成したこと、更には、前記一対の
測温抵抗体の温度差および前記第二の発熱抵抗体に流す
電流値より各々独立した被測定流体の流量を検知および
出力する手段で構成したこと、あるいは、前記一対の測
温抵抗体の温度差および前記第二の発熱抵抗体に流す電
流値より各々被測定流体の流量を検出し、かつ、得られ
た各々の流量値から平均化処理した流量値を出力する手
段で構成したこと、このなかで、前記第一の発熱抵抗体
の電気抵抗を第二の発熱抵抗体の電気抵抗より小さく
し、更には、前記第一の空洞を第二の空洞より小さく形
成した。
According to the present invention, there is provided a semiconductor substrate having an electric insulating film on an upper surface and having first and second cavities extending from a boundary surface of the electric insulating film to a lower surface; A first heating resistor formed on the electrical insulating film on the first cavity; and a first heating resistor on the electrical insulating film on the first cavity and close to the first heating resistor. A pair of resistance temperature detectors formed symmetrically in the upstream and downstream directions of the measurement fluid,
A second heating resistor formed on the electric insulating film on the second cavity, and a fluid temperature measuring resistor formed on the electric insulating film other than the first and second cavities; And a control means for keeping the temperature difference between the first and second heat generating resistors and the fluid temperature measuring resistor constant, and measuring the temperature of the fluid to be measured based on the temperature difference between the pair of temperature measuring resistors. Means for detecting the flow direction, and means for detecting the flow rate of the fluid to be measured from the temperature difference between the pair of resistance temperature detectors and the value of the current flowing through the second heating resistor; and And the second heating resistor is configured to be electrically connected in series on the electric insulating film, and furthermore, a temperature difference between the pair of temperature measuring resistors and a current flowing through the second heating resistor. Means for detecting and outputting the flow rate of the fluid to be measured independent of Or the flow rate of the fluid to be measured is detected from the temperature difference between the pair of resistance temperature detectors and the current value flowing through the second heating resistor, and averaged from each of the obtained flow rate values. It is configured by means for outputting the processed flow rate value, in which the electric resistance of the first heating resistor is made smaller than the electric resistance of the second heating resistor, and further, the first cavity is It was formed smaller than the second cavity.

【0010】[0010]

【発明の実施の形態】以下、本発明の実施例について、
図面を参照して説明する。
BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described.
This will be described with reference to the drawings.

【0011】図1は本発明の実施例の熱式空気流量計の
測定素子1を示す平面図、図2は、図1の測定素子1の
A−A′およびB−B′断面図である。
FIG. 1 is a plan view showing a measuring element 1 of a thermal air flow meter according to an embodiment of the present invention, and FIG. 2 is a sectional view of the measuring element 1 taken along line AA 'and BB' of FIG. .

【0012】図1,図2で、測定素子1は、シリコン等
の半導体基板2,半導体基板2の下面より異方性エッチ
ングにより電気絶縁膜10a,10bの境界面まで形成
された第一の空洞3aおよび第二の空洞3b,電気絶縁
膜10a上に形成された第一の発熱抵抗体4a,第二の
発熱抵抗体4b,第一の発熱抵抗体4aの近くに空気流
9に対して上下流に各々配置された測温抵抗体6および
5、空気温度を計測するための空気温度測温抵抗体7,
測定素子1の信号を外部回路と接続するための端子電極
8,各抵抗体を保護するための電気絶縁膜10bよりな
る。
In FIG. 1 and FIG. 2, a measuring element 1 is a first cavity formed by anisotropic etching from a lower surface of a semiconductor substrate 2 such as silicon to a boundary surface between electric insulating films 10a and 10b. 3a, the second cavity 3b, the first heating resistor 4a, the second heating resistor 4b and the first heating resistor 4a formed on the electric insulating film 10a. Temperature measuring resistors 6 and 5 arranged downstream respectively, air temperature measuring resistors 7 for measuring air temperature,
It comprises a terminal electrode 8 for connecting a signal of the measuring element 1 to an external circuit, and an electric insulating film 10b for protecting each resistor.

【0013】ここで、第一の空洞3aおよび抵抗体4
a,5,6は、第二の空洞3bおよび抵抗体4bに対し
て十分小さく形成され、且つ第一の発熱抵抗体4aは第
二の発熱抵抗体4bに対して十分小さい電気抵抗値に設
定される。第一の発熱抵抗体4aと第二の発熱抵抗体4
bは、電気的に直列接続されている。主に空気流9に接
する面積(検出有効面積)が広く且つ抵抗値が大きい第
二の発熱抵抗体4bの温度が、空気流9の流路先端に配
置された空気温度測温抵抗体7の温度より一定温度高く
なるように制御されている。これに伴って、第一の発熱
抵抗体4aも空気温度測温抵抗体7に対して一定温度高
く設定される。
Here, the first cavity 3a and the resistor 4
a, 5 and 6 are formed sufficiently small with respect to the second cavity 3b and the resistor 4b, and the first heating resistor 4a is set to a sufficiently small electric resistance value with respect to the second heating resistor 4b. Is done. First heating resistor 4a and second heating resistor 4
b is electrically connected in series. The temperature of the second heat generating resistor 4b having a large area (detection effective area) mainly in contact with the air flow 9 and a large resistance value is determined by the temperature of the air temperature measuring resistor 7 arranged at the flow path end of the air flow 9. The temperature is controlled to be higher than the temperature by a certain value. Along with this, the first heating resistor 4 a is also set at a certain temperature higher than the air temperature measuring resistor 7.

【0014】空気流9の方向は、第一の発熱抵抗体4a
に対して対称に形成された測温抵抗体5および6の温度
(抵抗値)を比較することにより検知される。つまり、
第一の発熱抵抗体4aにより傍熱された測温抵抗体5,
6は空気流が零のときは同じ温度を示し、図1の空気流
9の方向(順流)ではおもに上流側に配置された測温抵
抗体6の方が下流側に配置された測温抵抗体5より空気
流9による冷却効果が大きいため、上流側の測温抵抗体
6の温度が測温抵抗体5の温度より低い値となる。一
方、空気流が図1の方向と反対(逆流)のときには、こ
んどは下流側の測温抵抗体5の温度の方が上流側の測温
抵抗体6の温度より低くなる。このように、測温抵抗体
5,6の温度(抵抗値)を比較することにより空気流9
の方向が検知できる。
The direction of the air flow 9 is determined by the first heating resistor 4a.
Is detected by comparing the temperatures (resistance values) of the resistance temperature detectors 5 and 6 formed symmetrically with respect to. That is,
Temperature measuring resistor 5 indirectly heated by first heating resistor 4a
Numeral 6 indicates the same temperature when the air flow is zero. In the direction (forward flow) of the air flow 9 in FIG. 1, the temperature measuring resistor 6 arranged mainly on the upstream side has the temperature measuring resistor arranged on the downstream side. Since the cooling effect of the airflow 9 is greater than that of the body 5, the temperature of the temperature measuring resistor 6 on the upstream side becomes lower than the temperature of the temperature measuring resistor 5. On the other hand, when the air flow is opposite to the direction of FIG. 1 (reverse flow), the temperature of the downstream temperature measuring resistor 5 becomes lower than the temperature of the upstream temperature measuring resistor 6. As described above, by comparing the temperatures (resistance values) of the resistance temperature detectors 5 and 6, the air flow 9 is determined.
Direction can be detected.

【0015】一方、空気流量の計測は、測温抵抗体5,
6の温度差が空気流量の増大に対して大きくなることを
利用して、温度差より空気流の方向と空気流量を同時に
計測する。更に、従来例の問題点であった流量計測時の
ダイナミックレンジを拡大し、ノイズを低減するため
に、従来例に較べて検出有効面積の広い第二の発熱抵抗
体4bを、空気温度測温抵抗体7より一定温度高く直熱
駆動し、空気流量の増大に伴い増加する加熱電流値より
計測する。第二の加熱抵抗体4bにより計測される空気
流量は、検出有効面積を大きく形成しているため、空気
流量信号が大きく取り出せ、また、空気流の局所的な乱
れに対して平均的な出力になるため、ノイズに強く且つ
ダイナミックレンジが広くとれる構成となっている。こ
のように、測温抵抗体5,6の温度差および検出有効面
積の広い第二の発熱抵抗体4bの空気流量信号を各々好
適な空気流領域で利用することにより、ダイナミックレ
ンジが広く且つノイズの少ない空気流量計測が可能とな
る。
On the other hand, the measurement of air flow rate
The direction of the air flow and the air flow rate are simultaneously measured based on the temperature difference by utilizing the fact that the temperature difference 6 becomes larger as the air flow rate increases. Further, in order to expand the dynamic range at the time of flow rate measurement, which is a problem of the conventional example, and to reduce noise, the second heating resistor 4b having a larger effective detection area as compared with the conventional example is connected to the air temperature measuring device. Direct heating is performed at a certain temperature higher than that of the resistor 7, and measurement is performed based on a heating current value that increases with an increase in the air flow rate. Since the air flow rate measured by the second heating resistor 4b has a large detection effective area, a large air flow rate signal can be taken out, and an average output can be obtained for local turbulence in the air flow. Therefore, the configuration is strong against noise and a wide dynamic range can be obtained. As described above, by utilizing the temperature difference between the temperature measuring resistors 5 and 6 and the air flow rate signal of the second heating resistor 4b having a wide detection effective area in a suitable air flow region, the dynamic range is wide and the noise is wide. It is possible to measure the air flow rate with less.

【0016】また、図1では、第一の発熱抵抗体4aと
第二の発熱抵抗体4bを直列接続しているが、場合によ
っては、端子電極8が多くなる繁雑さはあるが、並列接
続とし発熱抵抗体4aおよび4bを各々独立に駆動(こ
の場合、空気温度測温抵抗体7を2個構成とする)し信
号を取り出した後に外部回路による信号を平均化処理す
る構成としてもと同様な効果が得られる。更に、空気温
度測定抵抗体7は、図1に示す様に、基板2の先端に位
置し空気流9の流路に突き出て配置されており、空気流
9が順流または逆流のいずれの場合でも発熱抵抗体4
a,4bの加熱された空気流の影響を受けないように配
置されており、精度の高い空気流量の計測が可能となっ
ている。
In FIG. 1, the first heating resistor 4a and the second heating resistor 4b are connected in series. In some cases, the number of terminal electrodes 8 increases, but the connection is made in parallel. The heating resistors 4a and 4b are independently driven (in this case, two air temperature measuring resistors 7 are configured), and a signal is taken out, and then a signal from an external circuit is averaged. Effects can be obtained. Further, as shown in FIG. 1, the air temperature measuring resistor 7 is located at the tip of the substrate 2 and is arranged so as to protrude into the flow path of the air flow 9. Heating resistor 4
They are arranged so as not to be affected by the heated airflows a and 4b, and can measure the airflow rate with high accuracy.

【0017】図3は、図1の測定素子1を実装した熱式
空気流量計の実施例を示す断面図である。例えば、自動
車等の内燃機関の吸気通路に実装した熱式空気流量計の
実施例を示す断面図である。熱式空気流量計は、図のよ
うに、測定素子1と支持体13と外部回路14とを含み
構成される。そして吸気通路11の内部にある副通路1
2に測定素子1が配置される。外部回路14は支持体1
3を介して測定素子1の端子電極8に電気的に接続され
ている。ここで、通常では吸入空気は9で示された方向
に流れており、ある内燃機関の条件によって9とは逆の
方向(逆流)に吸入空気が流れる。
FIG. 3 is a sectional view showing an embodiment of a thermal air flow meter on which the measuring element 1 of FIG. 1 is mounted. For example, it is a cross-sectional view showing an embodiment of a thermal air flow meter mounted in an intake passage of an internal combustion engine such as an automobile. As shown in the figure, the thermal air flow meter includes a measuring element 1, a support 13, and an external circuit 14. And the sub-passage 1 inside the intake passage 11
The measuring element 1 is arranged at 2. The external circuit 14 is the support 1
3 is electrically connected to the terminal electrode 8 of the measuring element 1. Here, the intake air normally flows in the direction indicated by 9, and the intake air flows in the opposite direction (backflow) to 9 depending on the condition of a certain internal combustion engine.

【0018】図4は図3の測定素子1および支持体13
の拡大図である。又、図5は、図4のC−C′およびD
−D′断面図である。図4および図5に見るように、測
定素子1は、支持体13b上に空気温度測温抵抗体7の
表裏面が空気流9に直接晒されるように固定され、更
に、アルミナ等の電気絶縁基板上に端子電極15および
信号処理回路が形成された外部回路14が、同じく支持
体13b上に固定される。この測定素子1と外部回路1
4は、端子電極8および15間を金線16等のワイヤボ
ンディングにより電気的に接続された後、前記の金線1
6,電極端子8,15や外部回路14を保護するために
支持体13aにより密封保護される。
FIG. 4 shows the measuring element 1 and the support 13 of FIG.
FIG. FIG. 5 is a cross-sectional view taken along lines CC ′ and D
It is -D 'sectional drawing. As shown in FIGS. 4 and 5, the measuring element 1 is fixed on a support 13b such that the front and back surfaces of an air temperature measuring resistor 7 are directly exposed to an air flow 9, and furthermore, an electrical insulating material such as alumina is used. An external circuit 14 having a terminal electrode 15 and a signal processing circuit formed on a substrate is similarly fixed on a support 13b. This measuring element 1 and external circuit 1
Reference numeral 4 denotes a state in which the terminal electrodes 8 and 15 are electrically connected to each other by wire bonding using a gold wire 16 or the like.
6. In order to protect the electrode terminals 8, 15 and the external circuit 14, they are hermetically protected by the support 13a.

【0019】このように実装された測定素子1は、図
4,図5に見るように、第一の空洞3aおよび第二の空
洞3bは下面が支持体13bにより、また、上面は電気
絶縁体10により、空気流9に対してほぼ隔離されてい
る。従って、した従来例のように空洞が空気流に開口部
を持たないため、自動車等の内燃機関の空気流量を計測
する際に問題となる塵埃等が、空洞あるいは開口部に蓄
積することがなく信頼性の高い計測が可能となる。
As shown in FIGS. 4 and 5, the measuring element 1 thus mounted has a first cavity 3a and a second cavity 3b each having a lower surface provided by a support 13b and an upper surface provided by an electric insulator. Due to 10 it is substantially isolated from the air flow 9. Therefore, unlike the conventional example, since the cavity has no opening in the air flow, dust and the like which are problematic when measuring the air flow rate of an internal combustion engine such as an automobile do not accumulate in the cavity or the opening. Reliable measurement becomes possible.

【0020】また、自動車等の内燃機関では、内燃機関
の熱により図3に示す吸気通路11および支持体13の
温度が上昇し、この熱が測定素子1に伝熱して空気流量
の計測に誤差を生じさせ温度特性を悪くすることがあ
る。これに対して、本実施例では、図4に示す様に、空
気温度測温抵抗体7を支持体13より最も遠い場所に配
置し、更に、支持体13から突き出して配置したことに
より、空気流9により表裏面ともに晒され放熱が十分さ
れるため、吸気通路11および支持体13の温度上昇に
よる影響を殆ど受けない温度特性の優れた構成となって
いる。
In an internal combustion engine of an automobile or the like, the temperature of the intake passage 11 and the support 13 shown in FIG. 3 rises due to the heat of the internal combustion engine, and this heat is transmitted to the measuring element 1 to cause an error in the measurement of the air flow rate. May be caused to deteriorate the temperature characteristics. On the other hand, in the present embodiment, as shown in FIG. 4, the air temperature measuring resistor 7 is disposed at a position farthest from the support 13 and further protrudes from the support 13 so that the air temperature Since the front and back surfaces are exposed by the flow 9 and the heat is sufficiently released, the configuration is excellent in the temperature characteristic which is hardly affected by the temperature rise of the intake passage 11 and the support 13.

【0021】更には、図5のD−D′断面図に示したよ
うに、空気流9に対して支持体13bの先端形状を流線型
にしたことにより、空気流9が測定素子1に至った位置
でも空気流の乱れがなく一様に流れるため更にノイズの
少ない計測が可能となる。
Further, as shown in the sectional view along the line DD 'in FIG. 5, the tip of the support 13b is made streamlined with respect to the air flow 9, so that the air flow 9 reaches the measuring element 1. Even at the position, since the air flow is uniform without any turbulence, measurement with less noise is possible.

【0022】次に、図6を参照し、本発明の実施例の動
作について説明する。図6は、図1の測定素子1の抵抗
体4a,4b,5,6,7と信号処理のための外部回路
14を示したものである。図中、17は、空気流量の絶
対値を計測するためのブリッジ回路で構成された駆動回
路、18は、空気流の方向(順流か逆流)および空気流
量を計測するためのブリッジ回路で構成された駆動回
路、19は、駆動回路17より得られた空気流量に対応
する信号出力Aに、駆動回路18より得られる空気流の
方向信号Eによりプラス(順流)又はマイナス(逆流)
に変換した出力信号Fを得るための切り換え回路、20
は電源、21a,21b,21c,21dはブリッジ回路
を構成する抵抗、22a,22bは差動増幅噐である。
Next, the operation of the embodiment of the present invention will be described with reference to FIG. FIG. 6 shows the resistors 4a, 4b, 5, 6, and 7 of the measuring element 1 of FIG. 1 and an external circuit 14 for signal processing. In the figure, reference numeral 17 denotes a drive circuit formed by a bridge circuit for measuring the absolute value of the air flow, and 18 denotes a drive circuit formed by a bridge circuit for measuring the direction of the air flow (forward or reverse flow) and the air flow. The driving circuit 19 adds (forward) or minus (backflow) to the signal output A corresponding to the air flow rate obtained from the driving circuit 17 by the direction signal E of the air flow obtained from the driving circuit 18.
Switching circuit for obtaining an output signal F converted to
Is a power supply, 21a, 21b, 21c and 21d are resistors constituting a bridge circuit, and 22a and 22b are differential amplifiers.

【0023】駆動回路17,18は、それぞれ独立した
回路である。電源20に接続された駆動回路17は、空
気流量を計測するための第二の発熱抵抗体4bと一定温
度に測温抵抗体5,6を傍熱するための第一の発熱抵抗
体4aを直列接続し、更に空気温度測温抵抗体7,抵抗
21a,21bからなるブリッジ回路である。このブリ
ッジ中点の電位差が零になるように差動増幅噐22aに
よって発熱抵抗体4a,4bに流れる加熱電流を調整す
るように構成されている。この構成により、発熱抵抗体
4bの温度(抵抗値)は空気温度に対応する空気温度測
温抵抗体7の温度(抵抗値)より設定されたある一定値
(例えば150℃)高く制御される。このとき、発熱抵
抗体4bによる空気流量に対応する信号は図中A点の電
位(加熱電流に対応)である。
The driving circuits 17 and 18 are independent circuits. The drive circuit 17 connected to the power supply 20 includes a second heating resistor 4b for measuring the air flow and a first heating resistor 4a for indirectly heating the temperature measuring resistors 5 and 6 to a constant temperature. This is a bridge circuit which is connected in series and further includes an air temperature measuring resistor 7 and resistors 21a and 21b. The differential amplifier 22a adjusts the heating current flowing through the heating resistors 4a and 4b so that the potential difference at the bridge midpoint becomes zero. With this configuration, the temperature (resistance value) of the heating resistor 4b is controlled to be higher than the temperature (resistance value) of the air temperature measuring resistor 7 corresponding to the air temperature by a certain fixed value (for example, 150 ° C.). At this time, the signal corresponding to the air flow rate by the heating resistor 4b is the potential at point A in the drawing (corresponding to the heating current).

【0024】一方、駆動回路18は、外部からの電源電
圧(Vref)と接続されており、測温抵抗体5,6および
抵抗21c,21dよりなるブリッジ回路である。測温
抵抗体5および6は空気流量が零の時、同一の抵抗値に
なるよう(この場合、C点の電位は0.5Vref となる)
に設定されている。前述のように、空気流9が順流のと
きは、上流に位置する測温抵抗体6がより冷却され温度
(抵抗値)が下がり一方下流に位置する測温抵抗体5は
温度(抵抗値)が上昇するので、C点の電位は0.5Vre
f より下がる。一方、空気流9が逆流の時には、順流の
時と逆の動作となりC点の電位は0.5Vref より大きく
なる。また、このときのC点の電位(測温抵抗体5,6
の温度差に対応)は、空気流量が増大するに連れて温度
差が大きくなる空気流量と対応しており、C点の基準電
位(0.5Vref )からのずれ量として空気流量が計測さ
れる。従って、C点の電位から空気流9の方向とともに
空気流量が検知され、所定の値に設定されたブリッジ回
路のD点の電位と差動増幅噐22bにより増幅された出
力信号Eとして出力される。
On the other hand, the drive circuit 18 is connected to an external power supply voltage (Vref), and is a bridge circuit composed of the temperature measuring resistors 5 and 6 and the resistors 21c and 21d. The resistance temperature detectors 5 and 6 have the same resistance value when the air flow rate is zero (in this case, the potential at the point C becomes 0.5 Vref).
Is set to As described above, when the air flow 9 is in the forward flow, the temperature measuring resistor 6 located upstream is further cooled and the temperature (resistance value) decreases, while the temperature measuring resistor 5 located downstream is heated (resistance value). Rises, the potential at point C becomes 0.5 Vre
lower than f. On the other hand, when the air flow 9 flows backward, the operation is the reverse of that when the air flow 9 flows forward, and the potential at the point C becomes larger than 0.5 Vref. At this time, the potential at point C (resistance temperature detectors 5, 6)
(Corresponding to the temperature difference) corresponds to the air flow rate at which the temperature difference increases as the air flow rate increases, and the air flow rate is measured as the amount of deviation from the reference potential (0.5 Vref) at point C. . Accordingly, the air flow rate is detected together with the direction of the air flow 9 from the potential at the point C, and is output as the potential at the point D of the bridge circuit set to a predetermined value and the output signal E amplified by the differential amplifier 22b. .

【0025】駆動回路17の出力Aと駆動回路18の出
力Eとから、切り換え回路19により、空気流の方向を
加味した空気流量信号Fが出力される。従って、図6の
構成では、空気流の方向を加味した空気流量信号は、第
二の発熱抵抗体4bに関連した信号Fおよび測温抵抗体
5,6に関連した信号Eとして、各々出力されることに
なる。
The switching circuit 19 outputs an air flow signal F considering the direction of the air flow from the output A of the driving circuit 17 and the output E of the driving circuit 18. Therefore, in the configuration of FIG. 6, the air flow rate signal taking into account the direction of the air flow is output as the signal F related to the second heating resistor 4b and the signal E related to the temperature measuring resistors 5 and 6, respectively. Will be.

【0026】図6の構成は、種々の適応形態が可能であ
り、図6の構成に限定するものではない。例えば、前述
のように、発熱抵抗体4a,4bを並列接続としたとき
には、駆動回路17は第一の発熱抵抗体4a,第二の発
熱抵抗体4bと2個の空気温度測温抵抗体7よりなる各
々独立した2個の駆動回路となる。また、図6には記載
しなかったが、出力信号FおよびEの空気流量から出力
ノイズを低減するために平均化処理をする回路を更に図
6の回路に追加する構成にすることも可能である。ここ
で、平均化処理としては、出力信号FおよびEを単純平
均しても、あるいは、検出有効面積の広い第二の発熱抵
抗体4bの出力信号Fに重きをおいた加重平均でも、あ
るいは、空気流領域により出力信号FおよびEを選択す
る方法でも良い。いずれの場合でも、流量計測でダイナ
ミックレンジおよびノイズが改善する。
The configuration shown in FIG. 6 can be applied in various forms, and is not limited to the configuration shown in FIG. For example, as described above, when the heating resistors 4a and 4b are connected in parallel, the driving circuit 17 includes the first heating resistor 4a, the second heating resistor 4b, and the two air temperature measuring resistors 7. Thus, two independent driving circuits are formed. Although not shown in FIG. 6, a circuit for performing an averaging process to reduce output noise from the air flow rates of the output signals F and E may be further added to the circuit of FIG. is there. Here, as the averaging process, a simple average of the output signals F and E, a weighted average in which the output signal F of the second heating resistor 4b having a large effective detection area is weighted, or A method of selecting the output signals F and E according to the airflow region may be used. In either case, the dynamic range and noise are improved in the flow measurement.

【0027】次に、本発明の熱式空気流量計の測定素子
の具体例について、図1,図2を参照して説明する。ま
ず、シリコン半導体基板2上に電気絶縁体10aとして
二酸化ケイ素,窒化ケイ素等を約0.5μ の厚さで熱酸
化あるいはCVD等の方法で形成する、更に、抵抗体4
a,4b,5,6,7として白金を約0.2μ の厚さで
スパッタ等の方法で形成後、公知のホトリソグラフィ技
術によりレジストを所定の形状に形成した後イオンミリ
ング等の方法により白金をパターニングする。次に、端
子電極8を金メッキ等で形成した後、端子電極8以外の
部分を保護膜として電気絶縁体10bを先と同様に約
0.5μ の厚さに形成する。最後に、シリコン基板2の
裏面より二酸化ケイ素等をマスク材として、異方性エッ
チングすることにより空洞3a,3bを形成し、チップ
に切断することにより測定素子1が得られる。
Next, a specific example of the measuring element of the thermal air flow meter of the present invention will be described with reference to FIGS. First, silicon dioxide, silicon nitride or the like is formed as an electrical insulator 10a on the silicon semiconductor substrate 2 to a thickness of about 0.5 μm by a method such as thermal oxidation or CVD.
a, 4b, 5, 6 and 7, platinum is formed to a thickness of about 0.2 μm by a method such as sputtering, a resist is formed in a predetermined shape by a known photolithography technique, and then platinum is formed by a method such as ion milling. Is patterned. Next, after the terminal electrode 8 is formed by gold plating or the like, the portion other than the terminal electrode 8 is formed as a protective film, and the electric insulator 10b is formed to a thickness of about 0.5 μm as before. Finally, the cavities 3a and 3b are formed by anisotropic etching from the back surface of the silicon substrate 2 using silicon dioxide or the like as a mask material, and cut into chips to obtain the measuring element 1.

【0028】ここで、空洞3aは、従来例の検出有効面
積(約0.2mm×1mm:特開平7−174600号公報の明細書
(0028)項に記載)より小さく形成し、一方、空洞
3bは、1mm×2mmの計測有効面積とし従来例の約10
倍の大きさにした。このことにより、空洞3b上の第二
の発熱抵抗体4bの空気流量信号のダイナミックレンジ
およびノイズが従来例に比較して大幅に改善した。この
ように空洞3bを大きくした場合でも、測定素子1の大
きさは約2.5mm×5mm で、従来例(約3mm×3mm:特
開平7−174600 号公報(0028)項に記載)の約1.
4 倍に過ぎなく、また、従来例のように空気流9に晒
される開口部がないことにより耐塵埃信頼性が向上し
た。
Here, the cavity 3a is formed smaller than the detection effective area of the conventional example (about 0.2 mm × 1 mm: described in the specification (0028) of JP-A-7-174600), while the cavity 3b is formed. Is about 1 mm x 2 mm and the effective area is about 10
Doubled the size. As a result, the dynamic range and noise of the air flow rate signal of the second heating resistor 4b on the cavity 3b are greatly improved as compared with the conventional example. Even when the cavity 3b is enlarged as described above, the size of the measuring element 1 is about 2.5 mm × 5 mm, which is about 3 mm × 3 mm, which is about 3 mm × 3 mm described in the paragraph (0028) of JP-A-7-174600. 1.
Only four times, and because there is no opening exposed to the airflow 9 as in the conventional example, the reliability of dust resistance is improved.

【0029】[0029]

【発明の効果】本発明によれば、二つの発熱抵抗体4
a,4bおよび空気流の方向と流量を計測する測温抵抗
体5,6を各々半導体基板に形成した空洞3a,3b上
の電気絶縁体10に形成し、且つ、検出有効面積の大き
い空洞3b上に流量計測のための発熱抵抗体4bを形成
し、更に測温抵抗体5,6からの流量信号と発熱抵抗体
4bの流量信号をともに出力し平均化処理するようにし
たことにより、空気流量の計測時のダイナミックレンジ
およびノイズの改善が図られ、また、空気流9に対して
開口部がない構成になっているため、耐塵埃信頼性が向
上し、更には、空気温度測温抵抗体7を空気流に突き出
す構成としたことにより、温度特性の改善が図られた熱
式空気流量計が提供できる。
According to the present invention, two heating resistors 4 are provided.
a, 4b and temperature measuring resistors 5, 6 for measuring the direction and flow rate of air flow are formed in the electric insulator 10 on the cavities 3a, 3b formed in the semiconductor substrate, respectively, and the cavity 3b having a large effective detection area. The heating resistor 4b for measuring the flow rate is formed on the upper side, and the flow rate signal from the temperature measuring resistors 5 and 6 and the flow rate signal of the heating resistor 4b are both output and averaged, so that the air is obtained. The dynamic range and noise at the time of measuring the flow rate are improved, and since there is no opening for the air flow 9, the reliability of dust resistance is improved. By adopting a configuration in which the body 7 protrudes into the air flow, a thermal air flow meter with improved temperature characteristics can be provided.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の実施例による熱式空気流量計の測定素
子の平面図。
FIG. 1 is a plan view of a measuring element of a thermal air flow meter according to an embodiment of the present invention.

【図2】図1の測定素子のA−A′およびB−B′断面
図。
FIG. 2 is a sectional view taken along line AA ′ and line BB ′ of the measuring element of FIG. 1;

【図3】図1の測定素子を実装した熱式空気流量計の断
面図。
FIG. 3 is a cross-sectional view of a thermal air flowmeter on which the measuring element of FIG. 1 is mounted.

【図4】図3の測定素子部の平面図。FIG. 4 is a plan view of the measuring element unit of FIG. 3;

【図5】図4のC−C′およびD−D′の断面図。FIG. 5 is a cross-sectional view taken along CC ′ and DD ′ in FIG. 4;

【図6】抵抗体4a,4b,5,6,7と外部回路14
の電気回路図。
FIG. 6 shows resistors 4a, 4b, 5, 6, 7 and an external circuit 14.
FIG.

【図7】従来の熱式空気流量計の測定素子の平面図。FIG. 7 is a plan view of a measuring element of a conventional thermal air flow meter.

【図8】従来の熱式空気流量計の測定素子の平面図。FIG. 8 is a plan view of a measuring element of a conventional thermal air flow meter.

【符号の説明】[Explanation of symbols]

1…測定素子、2…半導体基板、3a,3b…空洞、
4,4a,4b…発熱抵抗体、5,6…測温抵抗体、7
…空気温度測温抵抗体、8…端子電極、9…空気流。
1 ... measuring element, 2 ... semiconductor substrate, 3a, 3b ... cavity,
4, 4a, 4b: heating resistor, 5, 6, temperature measuring resistor, 7
... air temperature measuring resistor, 8 ... terminal electrode, 9 ... air flow.

Claims (6)

【特許請求の範囲】[Claims] 【請求項1】上面に電気絶縁膜を有し前記電気絶縁膜境
界面より下面に至る第一および第二の空洞を有する半導
体基板と、前記第一の空洞上の電気絶縁膜上に形成され
た第一の発熱抵抗体と、前記第一の空洞上の電気絶縁膜
上であって前記第一の発熱抵抗体を中心に近接して被測
定流体の上下流方向に対称に形成された一対の測温抵抗
体と、前記第二の空洞上の電気絶縁膜上に形成された第
二の発熱抵抗体と、前記第一および前記第二の空洞部以
外の前記電気絶縁膜上に形成された流体温度測温抵抗体
とからなる測定素子と、前記第一および前記第二の発熱
抵抗体と前記流体温度測温抵抗体の温度差を一定に保つ
制御手段と、前記一対の測温抵抗体の温度差より被測定
流体の流れ方向を検知する手段と、前記一対の測温抵抗
体の温度差および前記第二の発熱抵抗体に流す電流値よ
り被測定流体の流量を検知する手段よりなることを特徴
とする熱式空気流量計。
1. A semiconductor substrate having an electric insulating film on an upper surface and having first and second cavities extending from a boundary surface of the electric insulating film to a lower surface, and formed on the electric insulating film on the first cavity. A first heating resistor, and a pair formed on the electrical insulating film on the first cavity and symmetrically formed in the upstream and downstream directions of the fluid to be measured close to the center of the first heating resistor. A temperature measuring resistor, a second heating resistor formed on the electric insulating film on the second cavity, and formed on the electric insulating film other than the first and second cavities. A measuring element comprising a fluid temperature measuring resistor, a control means for keeping a temperature difference between the first and second heating resistors and the fluid temperature measuring resistor constant, and the pair of temperature measuring resistors. Means for detecting the flow direction of the fluid to be measured from the temperature difference of the body, and the temperature difference between the pair of resistance temperature detectors and Serial second thermal air flow meter, characterized in that it consists of means for detecting the flow rate of the fluid to be measured from the value of the current flowing in the heating resistor.
【請求項2】請求項1において、前記第一および前記第
二の発熱抵抗体が前記電気絶縁膜上で電気的に直列接続
されている熱式空気流量計。
2. The thermal air flowmeter according to claim 1, wherein said first and second heating resistors are electrically connected in series on said electrical insulating film.
【請求項3】請求項1または2において、前記一対の測
温抵抗体の温度差および前記第二の発熱抵抗体に流す電
流値より各々独立した前記被測定流体の流量を検知およ
び出力する手段を設けた熱式空気流量計。
3. A means for detecting and outputting a flow rate of the fluid to be measured, which is independent of a temperature difference between the pair of temperature measuring resistors and a current value flowing through the second heating resistor, respectively. Thermal air flow meter equipped with.
【請求項4】請求項1または2において、前記一対の測
温抵抗体の温度差および前記第二の発熱抵抗体に流す電
流値より各々被測定流体の流量を検出し、かつ、得られ
た各々の流量値から平均化処理した流量値を出力する手
段を設けた熱式空気流量計。
4. The method according to claim 1, wherein a flow rate of the fluid to be measured is detected and obtained from a temperature difference between the pair of temperature measuring resistors and a current value flowing through the second heating resistor. A thermal air flow meter provided with a means for outputting a flow value averaged from each flow value.
【請求項5】請求項1,2,3または4において、前記
第一の発熱抵抗体の電気抵抗を第二の発熱抵抗体の電気
抵抗より小さくした熱式空気流量計。
5. The thermal air flow meter according to claim 1, wherein the electric resistance of the first heating resistor is smaller than the electric resistance of the second heating resistor.
【請求項6】請求項1,2,3,4または5において、
前記第一の空洞を第二の空洞より小さく形成した熱式空
気流量計。
6. The method of claim 1, 2, 3, 4, or 5,
A thermal air flowmeter wherein the first cavity is formed smaller than the second cavity.
JP8157901A 1996-06-19 1996-06-19 Thermal air flow meter Pending JPH102773A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8157901A JPH102773A (en) 1996-06-19 1996-06-19 Thermal air flow meter

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8157901A JPH102773A (en) 1996-06-19 1996-06-19 Thermal air flow meter

Publications (1)

Publication Number Publication Date
JPH102773A true JPH102773A (en) 1998-01-06

Family

ID=15659912

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8157901A Pending JPH102773A (en) 1996-06-19 1996-06-19 Thermal air flow meter

Country Status (1)

Country Link
JP (1) JPH102773A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000275075A (en) * 1999-03-23 2000-10-06 Mitsubishi Electric Corp Thermal flow sensor
US6679114B2 (en) 2001-05-24 2004-01-20 Mitsubishi Denki Kabushiki Kaisha Thermosensitive flow rate sensor
US6799456B2 (en) 2003-02-26 2004-10-05 Ckd Corporation Thermal flow sensor
JP2011122879A (en) * 2009-12-09 2011-06-23 Denso Corp Air flow rate measuring device
CN102128655A (en) * 2010-12-08 2011-07-20 苏州谷之道软件科技有限公司 Automotive hot film air flow micro-electromechanical systems (MEMS) sensor with primary and secondary double cavity structure
GB2495777A (en) * 2011-10-21 2013-04-24 Agilent Technologies Inc Flow sensor stabilisation by adjusting temperature gradient

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000275075A (en) * 1999-03-23 2000-10-06 Mitsubishi Electric Corp Thermal flow sensor
US6679114B2 (en) 2001-05-24 2004-01-20 Mitsubishi Denki Kabushiki Kaisha Thermosensitive flow rate sensor
US6799456B2 (en) 2003-02-26 2004-10-05 Ckd Corporation Thermal flow sensor
JP2011122879A (en) * 2009-12-09 2011-06-23 Denso Corp Air flow rate measuring device
CN102128655A (en) * 2010-12-08 2011-07-20 苏州谷之道软件科技有限公司 Automotive hot film air flow micro-electromechanical systems (MEMS) sensor with primary and secondary double cavity structure
GB2495777A (en) * 2011-10-21 2013-04-24 Agilent Technologies Inc Flow sensor stabilisation by adjusting temperature gradient
GB2495777B (en) * 2011-10-21 2018-10-31 Agilent Technologies Inc Sensor stabilization by adjusting temperature gradient

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