JPH10277732A - Ultrasonic soldering method - Google Patents
Ultrasonic soldering methodInfo
- Publication number
- JPH10277732A JPH10277732A JP10393397A JP10393397A JPH10277732A JP H10277732 A JPH10277732 A JP H10277732A JP 10393397 A JP10393397 A JP 10393397A JP 10393397 A JP10393397 A JP 10393397A JP H10277732 A JPH10277732 A JP H10277732A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- joint
- members
- joining
- ultrasonic soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
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- Molten Solder (AREA)
Abstract
(57)【要約】
【課題】 継手端部からはんだが漏れず、大型部品にも
安価なコストで適用できる超音波はんだ付方法を提供す
る。
【解決手段】 複数の部材同士３，４を当接させて加圧
し、部材３，４に超音波を印加しながら部材３，４の接
合部にはんだ５を供給し、浸透および充填させることに
より、部材３，４を接合する超音波はんだ付方法におい
て、上記部材３，４の接合部の一部にはんだ５の浸透防
止処理を施すことによりはんだ５が不必要な部位に流入
しないようにするとともに、接合部の上部からはんだ５
を供給することを特徴とする超音波はんだ付方法。
(57) [Problem] To provide an ultrasonic soldering method in which solder does not leak from a joint end portion and can be applied to large parts at low cost. SOLUTION: A plurality of members 3 and 4 are brought into contact with each other and pressurized, and while applying ultrasonic waves to the members 3 and 4, a solder 5 is supplied to a joint portion of the members 3 and 4, and the solder 5 is permeated and filled. In the ultrasonic soldering method for joining the members 3 and 4, the solder 5 is prevented from flowing into unnecessary portions by performing a penetration preventing treatment of the solder 5 on a part of the joint portion of the members 3 and 4. And solder 5 from the top of the joint
Ultrasonic soldering method, characterized in that:
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、超音波はんだ付方
法に関し、さらに詳しくは、四輪自動車用インテークマ
ニホールド等の部材の接合に適用する超音波はんだ付方
法に関する。The present invention relates to an ultrasonic soldering method, and more particularly, to an ultrasonic soldering method applied to joining members such as an intake manifold for a four-wheeled vehicle.
【０００２】[0002]
【従来の技術】超音波はんだ付は、はんだ付の際に印加
される超音波が引き起こすキャビテーションの作用によ
り接合材表面の安定な酸化物を破壊し、フラックスなし
ではんだ付けする技術である。従来、例えばパイプ同士
の接合では、予め、超音波はんだ付またはメッキによ
り、接合する２つのパイプにはんだを形成させる。この
パイプ１０１，１０２を図５に示すように加圧しながら
超音波を印加することにより接合を行っている。この方
法では、超音波の作用により接合部表面１０３の酸化物
を破壊すると同時に接合部１０４にはんだ１０５を浸透
させている。2. Description of the Related Art Ultrasonic soldering is a technique in which a stable oxide on the surface of a bonding material is broken by the action of cavitation caused by ultrasonic waves applied during soldering, and soldering is performed without flux. Conventionally, for example, in joining pipes, solder is previously formed on two joining pipes by ultrasonic soldering or plating. As shown in FIG. 5, the pipes 101 and 102 are joined by applying ultrasonic waves while applying pressure. In this method, the oxide on the joint surface 103 is destroyed by the action of ultrasonic waves, and at the same time, the solder 105 permeates the joint 104.
【０００３】また、特開昭５２−２８４４５号公報に
は、超音波はんだ付により鉄パイプとアルミニウムパイ
プを接合する方法が知られている。この方法では、片端
にろう材の被覆を有するアルミニウムパイプと鉄パイプ
の端部同士を組み合わせ、この端部を加熱して超音波を
印加することにより接合するパイプ間の継手にはんだを
供給し浸透させている。さらに、特開昭５１−３１６５
５号公報の技術は、部材表面等のはんだによる濡れが不
必要な部位に粘土粉または耐火物粉末を塗布し、被はん
だ接合物を溶融はんだ浴に浸漬してはんだ付けするもの
である。[0003] Also, Japanese Patent Application Laid-Open No. 52-28445 discloses a method of joining an iron pipe and an aluminum pipe by ultrasonic soldering. In this method, the ends of an aluminum pipe and an iron pipe having a brazing material coating on one end are combined, and the end is heated and ultrasonic waves are applied to supply solder to the joint between the pipes to be joined and to penetrate the joint. Let me. Further, JP-A-51-3165
The technique disclosed in Japanese Patent Application Laid-Open No. 5 (1999) -1995 applies a clay powder or a refractory powder to a portion such as a member surface which does not require wetting by solder, and immerses a soldered joint in a molten solder bath for soldering.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、上記従
来の超音波はんだ付方法において、超音波の作用は強力
なため、図６からわかるように、加圧しているにもかか
わらずはんだが僅かな隙間に浸透して継手端部からはん
だが漏れてしまうことがあった。たとえ、接合部が完全
に密着していてもパイプを浸食しながらはんだが浸透し
た。また、特開昭５２−２８４４５号公報の方法では、
浸透作用が強力で、しばしば継目からはんだが漏れてし
まうため、接合強度の低下を招くばかりでなく、接合部
の耐食性、気密性、さらにはパイプ内部の平滑性に悪影
響を及ぼすという問題があった。However, in the above-mentioned conventional ultrasonic soldering method, since the action of ultrasonic waves is strong, as shown in FIG. And the solder leaked from the end of the joint. Even though the joints were completely adhered, the solder penetrated while eroding the pipe. In the method disclosed in Japanese Patent Application Laid-Open No. 52-28445,
The penetration effect is strong, and the solder often leaks from the seam, which not only causes a decrease in joint strength, but also has a problem of adversely affecting the corrosion resistance, airtightness, and even the smoothness of the inside of the pipe at the joint. .
【０００５】さらに、特開昭５１−３１６５５号公報の
方法では、部品表面がはんだ付されるだけであるため、
強度の必要な部品や浸漬の困難な大型部品には適用でき
なかった。また、浸漬による接合であるため粘土粉や耐
火物粉末の塗布量を多くしなければならずコストが高か
った。特にパイプ同士の接合では、強力な超音波の作用
ではんだが接合部の下端まで浸透し、パイプ内面側に漏
れてしまう問題があった。はんだがパイプ内面側に漏れ
ると、十分な強度や耐食性が得られず、パイプ内面側の
平滑性や気密性も保てなくなるおそれがあった。Further, in the method disclosed in Japanese Patent Application Laid-Open No. S51-31655, only the surface of the component is soldered.
It cannot be applied to parts requiring strength or large parts that are difficult to immerse. In addition, since the joining is performed by immersion, the amount of clay powder or refractory powder to be applied must be increased, resulting in high cost. In particular, in the joining of pipes, there was a problem that the solder penetrated to the lower end of the joining portion by the action of strong ultrasonic waves and leaked to the inner surface of the pipe. If the solder leaks to the inner surface of the pipe, sufficient strength and corrosion resistance cannot be obtained, and the smoothness and airtightness of the inner surface of the pipe may not be maintained.
【０００６】本発明は、上記事情に鑑みてなされたもの
で、はんだが不必要な部位にはんだが漏れず、大型部品
にも安価なコストで適用できる超音波はんだ付方法を提
供することにある。The present invention has been made in view of the above circumstances, and it is an object of the present invention to provide an ultrasonic soldering method which does not leak solder to portions where solder is unnecessary and can be applied to large parts at low cost. .
【０００７】[0007]
【課題を解決するための手段】本発明は、上記目的を解
決するためになされたものであり、その要旨は、複数の
部材同士を当接させて加圧し、部材に超音波を印加しな
がら部材の接合部にはんだを供給し、浸透および充填さ
せることにより、部材を接合する超音波はんだ付方法に
おいて、上記部材の接合部の一部にはんだの浸透防止処
理を施すことによりはんだが不必要な部位に流入しない
ようにするとともに、接合部の上部からはんだを供給す
ることを特徴とする超音波はんだ付方法である。ここ
で、接合部の一部とは、部材の接合部全体でなく、例え
ば接合部下端など、はんだ付される部材の接合に寄与す
る部分の一部を意味する。SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned object, and the gist of the present invention is that a plurality of members are brought into contact with each other and pressurized, and ultrasonic waves are applied to the members. In the ultrasonic soldering method of joining members by supplying, permeating and filling solder at the joints of the members, the solder is unnecessary by performing a solder penetration preventing process on a part of the joints of the members. An ultrasonic soldering method characterized in that solder is supplied from an upper part of a joint portion while preventing the metal from flowing into an important part. Here, the part of the joint means not the entire joint of the member but a part of a part contributing to the joint of the member to be soldered, such as the lower end of the joint.
【０００８】[0008]
【発明の実施の形態】以下に図面を参照しながら、本発
明に係る超音波はんだ付方法を二本のパイプを接合する
場合を例に詳細に説明するが、本発明は、平板同士、段
差のある平板接合部と平板、その他の形状の部材の接合
にも同様に適用される。本発明は、超音波はんだ付を用
いた部材の接合において、部材の接合端部に表面処理を
施すことによって接合部へのはんだの浸透を制御し、良
好な接合部を安定して得る技術である。つまり、接合前
に、予め、接合端部にはんだの浸透を妨げる浸透防止処
理を施し、はんだ付と接合を同時にまたは順番に行うこ
とによって接合時のはんだの浸透を制御し、漏れのない
良好な接合部を安定して形成させる。部材がパイプの場
合、パイプ内面側へのはんだの漏れは、パイプ内面側に
粘土粉や耐火物粉末を塗布しても防止できない。また、
接合部を粘土粉や耐火物粉末で塞いでしまうと、はんだ
の漏れは防げるが、十分な接合強度が得られなくなるお
それがある。したがって、パイプの接合では、接合部へ
のはんだの浸透を制御する必要がある。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An ultrasonic soldering method according to the present invention will be described in detail below with reference to the drawings by taking a case of joining two pipes as an example. The same applies to the joining of a flat plate joint with a flat plate and members of other shapes. The present invention is a technology for joining a member using ultrasonic soldering, in which a surface treatment is performed on a joint end of the member to control the penetration of solder into the joint, thereby stably obtaining a good joint. is there. In other words, before joining, beforehand, the joint end is subjected to a penetration preventing process that prevents solder penetration, and soldering and joining are performed simultaneously or sequentially to control solder penetration at the time of joining. The joint is formed stably. When the member is a pipe, the leakage of solder to the pipe inner surface cannot be prevented by applying clay powder or refractory powder to the pipe inner surface. Also,
If the joint is closed with clay powder or refractory powder, solder leakage can be prevented, but sufficient joint strength may not be obtained. Therefore, in joining the pipes, it is necessary to control the penetration of the solder into the joint.
【０００９】具体的には、接合部下端に浸透防止処理を
施し、はんだと母材との反応による浸透を防ぐと同時に
はんだを部材であるパイプから切り離し、浸透防止剤が
断熱材として作用するため母材からはんだへの熱供給を
制限してはんだの流動性を落とし、パイプ内側へのはん
だの漏れを防止している。したがって、用いる浸透防止
処理剤としては、高温でもはんだと反応せず、はんだを
良くはじくものが好ましい。そのようなものとして、酸
化物粉、炭化物粉、窒化物粉、固体潤滑剤が考えられ
る。特に、炭素系コーティング剤（実施例、Ｃ：４２ｗ
ｔ％、ＳｉＯ2 ：２２ｗｔ％）が適している。パイプの
接合部の間隙については、０．１ｍｍ以下でも可能であ
るが、浸透を可能にするためとパイプの真円度や加工精
度等の寸法公差を許容するため０．５ｍｍ以上が好まし
い。また、浸透防止の点から３ｍｍ以下が好ましい。Specifically, the lower end of the joint is subjected to a permeation prevention treatment to prevent permeation due to the reaction between the solder and the base material, and at the same time, separates the solder from the pipe as a member, so that the permeation preventing agent acts as a heat insulating material. The heat supply from the base material to the solder is restricted to reduce the flowability of the solder and prevent the solder from leaking into the inside of the pipe. Therefore, it is preferable that the permeation preventive agent used does not react with the solder even at a high temperature and repels the solder well. Such materials include oxide powder, carbide powder, nitride powder, and solid lubricant. Particularly, a carbon-based coating agent (Example, C: 42w)
(t%, SiO 2 : 22 wt%) is suitable. The gap between the joints of the pipes can be 0.1 mm or less, but is preferably 0.5 mm or more in order to allow penetration and allow dimensional tolerances such as roundness and processing accuracy of the pipes. Further, it is preferably 3 mm or less from the viewpoint of preventing penetration.
【００１０】次いで、図１〜図３に沿って、本発明によ
る超音波はんだ付方法の流れを説明する。まず、図１に
示すようにはんだを浸透させたくない部位である接合端
部１，２に浸透防止処理を施す。この図においては、２
つのパイプ３，４にそれぞれ処理を施しているが、一方
のパイプのみの処理でも問題ない。この浸透防止処理
は、はんだ付温度ではんだと反応しない、つまり濡れな
い部位を上記接合端部１，２に形成させるものである。
具体的には、以下の４種類の浸透防止処理剤を水、アル
コール、有機溶剤などを媒体として浸漬、スプレー、は
け塗りなどの方法で上記接合端部１，２に塗布するか、
または以下の浸透防止処理剤を用いた塗型剤、耐火物材
料、離型剤を上記接合端部１，２に塗布する。 1)酸化物粉（Ａｌ2 Ｏ3 、ＢａＯ、ＢｅＯ、ＣａＯ、Ｃ
ｅＯ2 、Ｃｒ2 Ｏ3 、ＦｅＯ、Ｆｅ2 Ｏ3 、ＭｇＯ、Ｍ
ｎＯ、ＮｉＯ、ＳｉＯ2 、ＳｎＯ2 、ＳｒＯ、Ｔｈ
Ｏ2 、ＴｉＯ2 、ＵＯ2 、ＺｎＯ、ＺｒＯ2 など） 2)炭化物粉（Ｃ、Ｂｅ2 Ｃ、Ｂ4 Ｃ、ＣａＣ2 、Ｃｒ3
Ｃ2 、ＮｂＣ、Ｈ5 Ｃ、Ｆｅ3 Ｃ、Ｍｏ2 Ｃ、ＳｉＣ、
ＴａＣ、ＴｈＣ2 、ＴｉＣ、ＷＣ、ＵＣ2 、ＶＣ、Ｚｒ
Ｃなど） 3)窒化物粉（Ｓｉ3 Ｎ4 、ＢＮなど） 4)固体潤滑剤（ＢＮ、Ｃ、ＭｏＳ2 など）Next, the flow of the ultrasonic soldering method according to the present invention will be described with reference to FIGS. First, as shown in FIG. 1, a penetration preventing process is performed on the joining end portions 1 and 2 which are portions where the solder does not want to penetrate. In this figure, 2
Although the processing is performed on each of the three pipes 3 and 4, processing with only one of the pipes does not cause any problem. This permeation prevention processing is to form a portion that does not react with the solder at the soldering temperature, that is, a portion that does not wet at the joining ends 1 and 2.
Specifically, the following four types of permeation preventive agents are immersed in water, alcohol, an organic solvent, or the like as a medium, sprayed, brushed, or the like, applied to the bonding ends 1 and 2,
Alternatively, a coating agent, a refractory material, and a release agent using the following anti-permeation treatment agent are applied to the joining ends 1 and 2. 1) Oxide powder (Al 2 O 3 , BaO, BeO, CaO, C
eO 2 , Cr 2 O 3 , FeO, Fe 2 O 3 , MgO, M
nO, NiO, SiO 2 , SnO 2 , SrO, Th
O 2 , TiO 2 , UO 2 , ZnO, ZrO 2, etc. 2) Carbide powder (C, Be 2 C, B 4 C, CaC 2 , Cr 3)
C 2 , NbC, H 5 C, Fe 3 C, Mo 2 C, SiC,
TaC, ThC 2 , TiC, WC, UC 2 , VC, Zr
C) 3) Nitride powder (Si 3 N 4 , BN, etc.) 4) Solid lubricant (BN, C, MoS 2 etc.)
【００１１】上記浸透防止処理剤のうち、2)炭化物粉が
特に効果が高く、媒体としては取扱いが容易である水が
好ましい。また、パイプがアルミニウムなどの場合は、
アルマイト処理やベーマイト処理などにより、アルミニ
ウム表面に酸化膜を形成させる方法も可能である。各浸
透防止処理膜の膜厚は１μｍ〜１ｍｍが好ましい。１μ
ｍよりも薄いと、超音波接合のとき破壊されてしまうお
それがあり、１ｍｍよりも厚いと、浸透防止処理膜の強
度不足からこの膜の表面が壊れてしまうおそれがあるか
らである。Among the above permeation preventive agents, 2) carbide powder is particularly effective, and as a medium, water which is easy to handle is preferable. If the pipe is made of aluminum,
A method of forming an oxide film on the aluminum surface by alumite treatment, boehmite treatment, or the like is also possible. The thickness of each permeation prevention treatment film is preferably 1 μm to 1 mm. 1μ
If it is thinner than m, it may be broken at the time of ultrasonic bonding, and if it is thicker than 1 mm, the surface of the permeation prevention treatment film may be broken due to insufficient strength.
【００１２】次に、図２に示すようにパイプ３，４同士
をはめ合わせて加圧し、溶けたはんだ５を供給しながら
超音波を印加して接合部にはんだ５を流入、浸透させ接
合を行う。このとき、はんだ５が接合端部１，２まで流
入すると、浸透防止剤の作用によりはんだ５の浸透が止
まる。その結果、はんだ５がパイプ４の内面側に漏れ
ず、接合部がはんだ５で充填される。はんだ５は図３に
示すように、接合部上端にリング状の固形はんだ５を設
置しておき、加熱、溶解させる方法で供給する。例え
ば、アルミニウムパイプを用いた接合では、アルミニウ
ム部材用であるＺｎ−Ａｌ系、Ｚｎ−Ｓｎ系、Ｚｎ−Ｃ
ｄ系等の固形はんだ５を用いる。この場合、強度、融
点、耐食性の点からＺｎ−Ａｌ系のはんだ５が好まし
い。Next, as shown in FIG. 2, the pipes 3 and 4 are fitted together and pressurized, and while applying the melted solder 5, ultrasonic waves are applied to flow and permeate the solder 5 into the joint, thereby joining the joint. Do. At this time, when the solder 5 flows into the joining ends 1 and 2, the penetration of the solder 5 is stopped by the action of the penetration preventing agent. As a result, the solder 5 does not leak to the inner surface side of the pipe 4, and the joint is filled with the solder 5. As shown in FIG. 3, the solder 5 is supplied by a method in which a ring-shaped solid solder 5 is placed on the upper end of the joint and heated and melted. For example, in the joining using an aluminum pipe, Zn-Al, Zn-Sn, Zn-C
A solid solder 5 of d type or the like is used. In this case, a Zn-Al-based solder 5 is preferable in terms of strength, melting point, and corrosion resistance.
【００１３】[0013]
［実施例１］接合するパイプとして、外径３１．８ｍ
ｍ、板厚１．２ｍｍの鉄パイプ（ＪＩＳ：ＳＴＫＭ１１
Ａ）と外径３８ｍｍ、板厚５ｍｍのアルミニウムパイプ
（ＪＩＳ：Ａ５０５２）を用いた例を示す。アルミニウ
ムパイプ４の接合部を内径３３ｍｍに削りだし、アルミ
ニウムパイプ４と鉄パイプ３の接合端部１，２を図１に
示すように浸透防止処理をした。この浸透防止処理とし
ては、塗型剤（ＴｉＯ2 ：７０％、Ａｌ2 Ｏ3 ：１５
％、ＳｉＯ2 ：１０％、ＣａＯ：５％）を用い、水を媒
体としてはけで塗布したのち、自然乾燥により硬化させ
た。このときの膜厚は２０μｍであった。これを図２の
ようにはめ合わせ、接合部上端に図３に示すようにリン
グ状の亜鉛はんだ５（Ｚｎ−５％Ａｌ、ＪＩＳ：ＡＨ−
Ｚ９５Ａ）を設置した。次いで、両パイプ３，４を２Ｍ
Ｐａで加圧しながらガスバーナーで接合部を加熱し、亜
鉛はんだ５が溶融した時点で超音波（出力６００Ｗ、周
波数１９．６ｋＨｚ）を１０秒間印加して超音波接合を
行った。接合後、水洗により塗布した塗型剤を除去し
た。その結果、図４に示すように、はんだ５の漏れのな
い良好な接合部が得られた。[Example 1] As a pipe to be joined, an outer diameter of 31.8 m was used.
m, 1.2 mm thick steel pipe (JIS: STKM11
An example using A) and an aluminum pipe (JIS: A5052) having an outer diameter of 38 mm and a plate thickness of 5 mm is shown. The joint portion of the aluminum pipe 4 was cut into an inner diameter of 33 mm, and the joint end portions 1 and 2 of the aluminum pipe 4 and the iron pipe 3 were subjected to a penetration preventing treatment as shown in FIG. As the penetration preventing treatment, a coating agent (TiO 2 : 70%, Al 2 O 3 : 15)
%, SiO 2 : 10%, CaO: 5%), using a brush as a medium with water, and then cured by natural drying. At this time, the film thickness was 20 μm. This was fitted as shown in FIG. 2, and a ring-shaped zinc solder 5 (Zn-5% Al, JIS: AH-
Z95A). Then, both pipes 3 and 4 are 2M
The joint was heated with a gas burner while pressurizing with Pa, and when the zinc solder 5 was melted, ultrasonic waves (output 600 W, frequency 19.6 kHz) were applied for 10 seconds to perform ultrasonic bonding. After joining, the applied mold wash was removed by washing with water. As a result, as shown in FIG. 4, a good joint without leakage of the solder 5 was obtained.
【００１４】［実施例２］実施例１と同じ条件で、浸透
防止処理に固体潤滑剤を用いた例を示す。浸透防止処理
として、固体潤滑剤であるＢＮを用い、有機溶剤を媒体
としてスプレーで接合端部１，２に塗布した。このとき
の膜厚は２ｍｍとした。接合の結果、はんだの漏れのな
い良好な接合部が得られた。Embodiment 2 An example in which a solid lubricant is used for the permeation prevention treatment under the same conditions as in Embodiment 1 will be described. As a permeation preventing treatment, BN as a solid lubricant was applied to the joining ends 1 and 2 by spraying using an organic solvent as a medium. The film thickness at this time was 2 mm. As a result of joining, a good joint without solder leakage was obtained.
【００１５】本実施例による作用的効果を以下に説明す
る。超音波はんだ付を用いたパイプ接合において、接合
端部１，２に浸透防止処理を行うため、はんだ５の漏れ
のない良好な接合部が得られる。浸透防止処理剤とし
て、安価で取扱いが容易な水溶性の塗型剤、耐火物材料
を用いるため、安価なコストではんだ５の漏れを防ぐこ
とができる。また、接合後、水洗により浸透防止処理剤
を簡単に除去することができる。はんだ５の供給方法と
して、接合部上端にリング状の固形はんだ５を設置し
て、加熱および溶解させる方法をとるため、超音波はん
だ付やメッキでパイプにはんだを付けておく方法に比較
し、工数を削減することができる。また、接合部上端か
らはんだを供給していくため、はんだの浸透を完全に制
御することができる。接合するパイプ材としては、はん
だ付が可能なものなら全て可能である。特に、亜鉛はん
だ（Ｚｎ−５％Ａｌ、ＪＩＳ：ＡＨ−Ｚ９５Ａ）を用い
たアルミニウムと鉄パイプの接合に適している。部材の
接合部の間隙の寸法が０．５〜３．０ｍｍと広い許容範
囲を持つため、部材の接合部の寸法精度管理が容易にな
る。なお、本発明ははんだ付に限定されず、ろう付につ
いても適用が十分可能な技術である。The operation and effect of this embodiment will be described below. In the pipe joining using ultrasonic soldering, since the permeation preventing treatment is performed on the joining ends 1 and 2, a good joining portion without leakage of the solder 5 can be obtained. Since a water-soluble coating agent and refractory material that are inexpensive and easy to handle are used as the permeation preventive treatment agent, it is possible to prevent the solder 5 from leaking at low cost. After the joining, the permeation preventive agent can be easily removed by washing with water. As a method of supplying the solder 5, a ring-shaped solid solder 5 is provided at the upper end of the joint, and a method of heating and melting is adopted. In comparison with a method of applying solder to the pipe by ultrasonic soldering or plating, Man-hours can be reduced. Further, since the solder is supplied from the upper end of the joint, the penetration of the solder can be completely controlled. Any pipe material can be used as long as it can be soldered. Particularly, it is suitable for joining aluminum and an iron pipe using zinc solder (Zn-5% Al, JIS: AH-Z95A). Since the dimension of the gap between the joining portions of the members has a wide allowable range of 0.5 to 3.0 mm, dimensional accuracy control of the joining portions of the members becomes easy. The present invention is not limited to soldering, but is a technique that can be sufficiently applied to brazing.
【００１６】[0016]
【発明の効果】上述したように、本発明に係る超音波は
んだ付方法によれば、 (1) はんだの浸透防止処理を施すことにより、はんだの
浸透が制御でき、接合端部からのはんだの漏れを防ぐこ
とができる。 (2) はんだの浸透防止処理を施すことによりはんだが漏
れずに十分に充填されるため、接合部の接合強度、耐食
性、気密性、平滑性が向上する。 (3) はんだの浸透防止処理剤として水溶性の塗型剤、耐
火物材料を用いる場合、コストが安価で取扱いが容易に
なる。As described above, according to the ultrasonic soldering method according to the present invention, (1) solder permeation prevention treatment can be performed to control solder permeation, and to prevent solder permeation from the joint end. Leakage can be prevented. (2) Since the solder is sufficiently filled without leakage by performing the solder penetration preventing treatment, the joint strength, corrosion resistance, airtightness, and smoothness of the joint are improved. (3) When a water-soluble coating agent or refractory material is used as a solder penetration preventing agent, the cost is low and the handling is easy.
【００１７】(4) はんだの浸透防止処理剤として塗型
剤、耐火物材料を用いる場合、これらの塗型剤、耐火物
材料は水溶性なため、接合後の除去が容易である。 (5) 接合部上端にリング状の固形はんだを配置して加
熱、溶解させる方法をとる場合、予め、超音波はんだ付
やメッキでパイプにはんだを付けておく方法に比較し、
作業工数を削減することができる。 (6) 接合部上端からはんだを供給していくため、はんだ
の浸透を完全に制御することができる。 (7) 接合部にはんだが完全に充填されるため、大物部
品、強度の必要な部品に適用できる。 (8) 接合部の間隙の寸法精度が広い許容範囲を持つた
め、部材の寸法精度管理が容易になる。 (9) 固形はんだを溶解する供給方法で接合部にのみはん
だを供給できるため、はんだの歩留まりが良く、また、
浸透防止処理剤も少量ですむため、コスト低減が図れ
る。(4) When a mold wash or a refractory material is used as a solder penetration preventing agent, these mold wash or refractory material are water-soluble, so that they can be easily removed after joining. (5) When a method of disposing a ring-shaped solid solder at the upper end of the joint and heating and melting is used, compared with the method of attaching solder to the pipe by ultrasonic soldering or plating in advance,
Work man-hours can be reduced. (6) Since the solder is supplied from the upper end of the joint, the penetration of the solder can be completely controlled. (7) Since the joint is completely filled with solder, it can be applied to large parts and parts that require strength. (8) Since the dimensional accuracy of the gap at the joint has a wide allowable range, the dimensional accuracy of the members can be easily controlled. (9) Solder can be supplied only to the joints by a supply method that dissolves solid solder, so the solder yield is good, and
Since only a small amount of the permeation preventive agent is required, the cost can be reduced.
【図１】本発明に係るはんだの浸透防止処理を施す部位
を示す縦断面図である。FIG. 1 is a vertical cross-sectional view showing a part to be subjected to a solder penetration preventing treatment according to the present invention.
【図２】本発明に係るはんだの流入状態を示す縦断面図
である。FIG. 2 is a vertical cross-sectional view showing a state in which a solder according to the present invention flows.
【図３】本発明に係る固形はんだの配置状態を示す縦断
面図である。FIG. 3 is a longitudinal sectional view showing an arrangement state of a solid solder according to the present invention.
【図４】本発明に係る接合部下端の断面の金属組織を示
す写真である（倍率５倍）。FIG. 4 is a photograph showing a metal structure of a cross section of a lower end of a joint according to the present invention (magnification: 5).
【図５】従来のはんだの流入状態を示す縦断面図であ
る。FIG. 5 is a vertical cross-sectional view showing a state of inflow of a conventional solder.
【図６】本発明に係る接合部下端の断面の金属組織を示
す写真である（倍率５倍）。FIG. 6 is a photograph showing a metal structure of a cross section of a lower end of a joint according to the present invention (magnification: 5).
１ 継手端部 ２ 継手端部 ３ パイプ ４ パイプ ５ はんだ DESCRIPTION OF SYMBOLS 1 Joint end 2 Joint end 3 Pipe 4 Pipe 5 Solder
フロントページの続き (51)Int.Cl.6 識別記号 ＦＩ Ｂ２３Ｋ 35/14 Ｂ２３Ｋ 35/14 Ｅ Continued on the front page (51) Int.Cl. 6 Identification code FI B23K 35/14 B23K 35/14 E
Claims (2)
材に超音波を印加しながら部材の接合部にはんだを浸透
および充填させることにより、部材を接合する超音波は
んだ付方法において、上記部材の接合部の一部にはんだ
の浸透防止処理を施すことによりはんだが不必要な部位
に流入しないようにするとともに、接合部の上部からは
んだを供給することを特徴とする超音波はんだ付方法。An ultrasonic soldering method for joining members by bringing a plurality of members into contact with each other, applying pressure, applying ultrasonic waves to the members, and infiltrating and filling the joints of the members with solder. Ultrasonic soldering characterized by applying a solder permeation prevention treatment to a part of the joint of the above member so that the solder does not flow into unnecessary parts and supplying the solder from the upper part of the joint. Method.
き、上記はんだがリング状の固形はんだであることを特
徴とする請求項１に記載の超音波はんだ付方法。2. The ultrasonic soldering method according to claim 1, wherein when the member is a cylindrical or columnar member, the solder is a ring-shaped solid solder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10393397A JPH10277732A (en) | 1997-04-07 | 1997-04-07 | Ultrasonic soldering method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10393397A JPH10277732A (en) | 1997-04-07 | 1997-04-07 | Ultrasonic soldering method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH10277732A true JPH10277732A (en) | 1998-10-20 |
Family
ID=14367246
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10393397A Pending JPH10277732A (en) | 1997-04-07 | 1997-04-07 | Ultrasonic soldering method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH10277732A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003014612A1 (en) * | 2001-08-08 | 2003-02-20 | Jgc Corporation | Method and structure for connecting difficult-to-join pipes to be used at high temperature |
| JP2008503353A (en) * | 2004-06-24 | 2008-02-07 | スネクマ・プロピュルシオン・ソリド | Method for soldering composite parts |
| WO2012077415A1 (en) * | 2010-12-08 | 2012-06-14 | 住友金属鉱山株式会社 | Pb-FREE SOLDER ALLOY HAVING Zn AS MAIN COMPONENT |
| JP2013256914A (en) * | 2012-06-13 | 2013-12-26 | Mitsubishi Heavy Ind Ltd | Turbine and gas turbine engine |
| JP2017048797A (en) * | 2016-12-07 | 2017-03-09 | 三菱重工航空エンジン株式会社 | Turbine and gas-turbine engine |
| CN119820178A (en) * | 2024-12-15 | 2025-04-15 | 君原电子科技(海宁)有限公司 | Low-temperature brazing method for CVD-HEATER ALN ceramic disc and ceramic shaft |
-
1997
- 1997-04-07 JP JP10393397A patent/JPH10277732A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003014612A1 (en) * | 2001-08-08 | 2003-02-20 | Jgc Corporation | Method and structure for connecting difficult-to-join pipes to be used at high temperature |
| JP2008503353A (en) * | 2004-06-24 | 2008-02-07 | スネクマ・プロピュルシオン・ソリド | Method for soldering composite parts |
| KR101153560B1 (en) * | 2004-06-24 | 2012-06-13 | 에스엔에쎄엠아 프로폴지옹 솔리드 | A method of brazing composite material parts sealed with a silicon-based composition |
| WO2012077415A1 (en) * | 2010-12-08 | 2012-06-14 | 住友金属鉱山株式会社 | Pb-FREE SOLDER ALLOY HAVING Zn AS MAIN COMPONENT |
| GB2498912A (en) * | 2010-12-08 | 2013-07-31 | Sumitomo Metal Mining Co | Pb-Free Solder Alloy Having Zn as Main Component |
| US8845828B2 (en) | 2010-12-08 | 2014-09-30 | Sumitomo Metal Mining Co., Ltd. | Pb-free solder alloy mainly containing Zn |
| JP2013256914A (en) * | 2012-06-13 | 2013-12-26 | Mitsubishi Heavy Ind Ltd | Turbine and gas turbine engine |
| JP2017048797A (en) * | 2016-12-07 | 2017-03-09 | 三菱重工航空エンジン株式会社 | Turbine and gas-turbine engine |
| CN119820178A (en) * | 2024-12-15 | 2025-04-15 | 君原电子科技(海宁)有限公司 | Low-temperature brazing method for CVD-HEATER ALN ceramic disc and ceramic shaft |
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