JPH10277772A - Substrate beam processing equipment - Google Patents

Abstract

(57) [Summary] [PROBLEMS] When a large area substrate is placed on a stage and beam processing is performed, deflection of the substrate's own weight / warpage is corrected to secure flatness of the entire substrate, and reliability and yield of the beam processing are achieved. Improve. A beam irradiation device for irradiating a beam on a substrate, a stage having a support for supporting the periphery of the substrate at a predetermined height, and a plurality of bars for supporting a central portion of the substrate at the same height. A plurality of peripheral intake / exhaust ports provided on the support base, a plurality of central intake / exhaust ports provided at the center of the stage, a plurality of valves for performing intake / exhaust of each port, a peripheral intake / exhaust port, and An intake / exhaust pump for depressurizing the central intake / exhaust port, an air pressure detecting unit for detecting the degree of vacuum of the peripheral intake / exhaust port and the central intake / exhaust port, respectively, and when the substrate is installed on the stage, the substrate The control unit controls the valves and the suction / exhaust pump based on the detected degree of vacuum so that the table is vacuum-suctioned and then the respective bars are vacuum-suctioned.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate beam processing apparatus, and more particularly, a large area substrate on which a thin film solar cell is formed is placed on a stage while maintaining the flatness of the substrate, and is patterned by a laser beam. The present invention relates to a substrate beam processing apparatus.

[0002]

2. Description of the Related Art In general, a thin-film solar cell is formed by laminating a transparent conductive film electrode, an amorphous semiconductor photoelectric conversion layer film, and a backside reflective metal film electrode in this order on a light-transmitting insulating substrate such as flat glass. In order to obtain a desired photovoltaic power, a plurality of photovoltaic elements must be integrated in a state of being electrically connected in series, so that a step of patterning each layer is required. In this step, a laser scribe method has been established which is more advantageous in terms of the number of steps and cost than the photoetching method. In addition, the laser scribe method is suitable for fine beam processing using the directivity and high energy density of a laser beam. For beam processing, a YAG laser, an excimer laser, or the like is used. These lasers have various wavelengths and intensities depending on the application.

Further, by utilizing the difference in light absorption of the processed substrate, it is possible to selectively perform beam processing on each layer. Such a beam processing apparatus is usually a laser oscillator, an optical system, an XY stage or an XYZ stage,
It is composed of a control computer and the like. Conventionally, as a method of integrating a thin-film solar cell, a transparent conductive film layer formed on a light-transmitting insulating substrate is subjected to insulating division processing into a strip shape (first scribe), and an amorphous photoelectric conversion layer is laminated. First
A process (second scribing) for dividing only the amorphous photoelectric conversion layer without damaging the transparent conductive film layer at a position shifted from the scribe line is performed, and after the back electrode layer is laminated, the second
A process (third scribe) of dividing the back electrode layer to a position shifted from the scribe line to the opposite side to the first scribe line has been performed.

Conventionally, a laser scribing method has been used for processing (first scribing) for insulatingly dividing a transparent conductive film layer. By irradiating a laser beam while scanning a stage on which a processing substrate is mounted, or by scanning while irradiating a laser on a processing substrate, a groove can be easily formed, thereby simplifying a production process. And production costs can be kept low. Further, the groove width of the element division formed by the laser scribe is 10
Since it can be processed to 0 μm or less, the area of the electrode junction portion of the photoelectric conversion element can be small, the area not involved in photoelectric conversion is small, and the power generation effective area of the integrated thin-film solar cell can be increased. It is.

[0005] Also, the laser scribe method has been used in the processing (second scribe) for groove-patterning only the amorphous photoelectric conversion layer. Since this is a contact line for connecting the unit cells of the integrated thin-film solar cell in series, it is necessary to selectively process only the amorphous photoelectric conversion layer without damaging the underlying transparent conductive film layer, For example, the second harmonic laser light (0.532 μm) of Nd-YAG
m), a selective scribe was performed. Further, the second scribe irradiates the laser light from the light-transmitting insulating substrate side (sunlight incident side) so that the amorphous photoelectric conversion layer ablated by the laser light does not adhere again to the patterning line, Selective thin film processing has been performed by transmitting laser light through the transparent insulating substrate and the transparent conductive film layer and absorbing laser light with the amorphous photoelectric conversion layer.

[0006]

However, in the process of dividing the transparent conductive film layer by using a laser (first scribe) and the process of performing groove patterning of the amorphous photoelectric conversion layer (second scribe), a good result is obtained. In order to perform beam machining, it is necessary that the surface to be irradiated with the laser is located within the laser beam machining allowable depth. In other words, when the processing surface deviates from the laser beam processing allowable depth, the image becomes defocused and the laser power on the processing surface decreases, and good beam processing cannot be performed.
It is important to ensure the flatness of the substrate.

Originally, if the entire glass substrate is fixed by a method such as vacuum suction, the deflection and warpage of its own weight can be corrected, but in the insulating division processing of the transparent conductive film layer, the Nd-YAG fundamental wave is applied from the transparent conductive film layer side. When irradiating (1.064 μm) and performing insulation division by ablation, laser light passes through the translucent insulating substrate and is reflected on the stage of the laser device. Therefore, a method of bringing the substrate into full contact with the stage cannot be adopted. Therefore, it is necessary to sufficiently defocus the laser beam on the stage and to float and hold the processing surface of the substrate so as not to be affected by the scattered laser beam.

For example, when the size of the substrate is small, the substrate itself is less bent or warped. Therefore, by controlling the variation in thickness and the deflection of the substrate within a reference value, the flatness required for beam processing can be improved. Is secured, but productivity and solar cell utilization efficiency decrease. The larger the substrate size, the higher the productivity and the utilization efficiency of the solar cell.However, in fact, the self-weight deflection of the substrate cannot be ignored, and in the case of a tempered glass substrate, due to the surface shrinkage stress at the time of wind-cooling strengthening, Warpage of about 0.2% occurs in the side direction of the glass substrate.

This is because, for example, one side of the substrate is 650 mm
In the case of a large glass substrate, it is 1.3 mm. In addition, its own weight deflection is 1.2 mm. Although the effective processing depth of the laser beam differs depending on the focal length f between the imaging lens and the objective lens in the case of an imaging optical system, for example, in a laser device used in an experiment, the imaging lens f = 690m
m, objective lens f = 30 mm and imaging magnification 1/23, Nd
-About ± 400 µm with YAG fundamental wave (1.064 µm), Nd-Y
It is about ± 400 μm at the AG second harmonic (0.532 μm), and without the correction of the substrate, it becomes defocused and good beam processing cannot be performed.

FIG. 15 is an explanatory view showing a method of fixing a substrate installed on a stage in a conventional example. As shown in FIG. 15, since the substrate 101 has to be fixed with the processing surface floating from the stage 103, the substrate 101 is mounted on the stage 103 only on four sides around the substrate 101, so that a large-area glass having a large weight deflection is large. For a substrate or a tempered glass substrate having a large warp, the laser beam 102 is defocused, so that good beam processing was impossible. In FIG.
102 denotes a laser beam, 104 denotes a just focus position of the laser beam, and 105 denotes a defocus range of the laser beam.

According to Japanese Patent Application Laid-Open No. Sho 60-263481, when producing a tiled solar cell, a laser beam is set within an allowable processing depth to perform good beam processing.
A method of manufacturing a photovoltaic device in which a beam head detects a change in a processed surface of a substrate and controls the beam head to follow the change has been proposed. There is a problem that productivity is reduced. Further, according to Japanese Patent Application Laid-Open No. 60-72279, when producing a tiled solar cell, a laser beam is set within an allowable processing depth and good beam processing is performed. Although a method of processing a film within a predetermined range has been proposed, there is a problem in that the patterning width is increased, the laser beam is weakened, and processing time is required, thereby lowering productivity. Further, in such a method, the coating surface of the concave lens is burned due to the concentration of the laser beam, which is not practical.

The present invention has been made in view of the above circumstances. For example, in beam processing of a substrate on which a large-scale thin-film solar cell is formed, a stage is formed while correcting a peripheral portion of the substrate which is bent first. The substrate is fixed at the center, then the substrate is fixed at the center, the flatness of the entire substrate is maintained, the laser beam is always positioned within the processing allowable depth, and the laser beam is always just focused on the processing surface It is intended to provide a substrate beam processing apparatus capable of performing the following.

[0013]

According to the present invention, there is provided a beam irradiation apparatus for irradiating a beam onto a substrate, a support for supporting the periphery of the substrate at a predetermined height, and a support for supporting a central portion of the substrate at the same height. A stage having a plurality of crosspieces, a plurality of peripheral intake / exhaust ports provided on a support table, a plurality of central intake / exhaust ports provided at the center of the stage, and a plurality of intake / exhaust ports for each port. A valve, a suction / exhaust pump for depressurizing the peripheral intake / exhaust port and the central intake / exhaust port, an air pressure detecting unit for detecting the degree of vacuum of the peripheral intake / exhaust port and the central intake / exhaust port, and the substrate is mounted on the stage. And a controller configured to control the valves and the suction / exhaust pump based on the detected degree of vacuum so that the substrate is vacuum-sucked to the support table and then vacuum-suctioned to the bars. Beam processing equipment It is.

In the present invention, the substrate is composed of a reinforced glass plate and a transparent insulating substrate, and a transparent conductive film (transparent electrode), an amorphous semiconductor photoelectric conversion film,
A thin-film solar cell in which the back reflection metal film is laminated is formed.
The beam irradiation device includes a laser oscillation device such as an Nd-YAG laser or an excimer laser and an optical system (beam head), and irradiates the substrate 1 with a laser beam having a selected wavelength to perform patterning processing (scribe processing). It is configured as follows.

When the beam head is driven, the beam irradiation device 2 includes, for example, a ball screw for driving the X-axis, Y-axis, and Z-axis and an AC servomotor, a linear scale (encoder) for detecting a position, and a beam head for controlling the beam head. A computer is incorporated and the computer for controlling the beam head
Performs closed control of the C servo motor.

The stage is constituted by an XY stage or an XYZ stage made of steel or aluminum. If the stage is driven, the stage is X
Axis, Y axis, Z axis drive ball screw and AC servo motor,
A linear scale (encoder) for detecting a position and a stage control computer are incorporated, and the stage control computer performs closed control (feedback control) of the AC servomotor.

The support table is composed of an aluminum block and a stainless steel block which are supported at a predetermined height in accordance with the shape of the periphery of the substrate, and are incorporated at four side edges on the stage. The contact surface with the substrate is treated with a fluorine-based composition, a nylon resin, a polyolefin-based resin, urethane rubber, or the like.

The crosspieces are arranged so as to be replaceable in a plurality of rows at the center of the stage along the line between the processing lines of the beam irradiated on the substrate by the beam irradiation device. For example, the beam is arranged so that the laser beam being processed does not transmit through the translucent insulating substrate and is irregularly reflected on the beam to cause processing failure.The material of the beam is made of aluminum or stainless steel. The contact surface with the substrate is treated with a fluorine-based composition, nylon resin, polyolefin-based resin, urethane rubber, or the like.

The peripheral intake / exhaust port is provided with a peripheral intake / exhaust valve (pressure regulating valve) and a peripheral intake / exhaust tube which are provided with a plurality of holes at equal intervals in the support base to perform intake / exhaust / open / close. Each is connected.

The central intake / exhaust port is provided with a plurality of holes at equal intervals along the bar 5 inside the stage 3.
The valve is connected to a central intake / exhaust port valve for exhaust / open / close and a central intake / exhaust tube. Further, each tube (vacuum line) is formed of a flexible simplex tube when the stage is driven, and the stage is not driven when the beam irradiation device is driven. Therefore, each tube (vacuum line) can be formed of a SUS tube.

As the intake / exhaust pump, for example, an oscillating piston type oilless pump (compressor / vacuum piston pump) is used and connected to the peripheral intake / exhaust port and the central intake / exhaust port via respective valves. I have.

The air pressure detecting section uses a pressure sensor for detecting the air pressure [mmHg] of the peripheral intake / exhaust port and the central intake / exhaust port. The pressure sensor is provided between the peripheral intake / exhaust port and the peripheral intake / exhaust valve, the central intake / exhaust port. Each port is provided between the exhaust port and the central intake / exhaust valve, and constantly monitors the air pressure / vacuum level of each port, and the detected pressure information is transmitted to the control unit. The control unit includes a computer including a CPU, a ROM, a RAM, and an I / O port, and controls an intake / exhaust pump, a valve connected to a tube (pipe) of each port, and the like. Further, the control unit can also function as a computer for controlling the beam irradiation device and a computer for controlling the stage.

According to the present invention, when the substrate is beam-processed, the peripheral portion of the substrate is vacuum-adsorbed to the support table and temporarily fixed, and then the entire substrate is vacuum-adsorbed to the bar having the same height as the support table. Since the flatness can be maintained by more reliably correcting the warp / self-weight deflection of the substrate, it is possible to provide a substrate processing apparatus suitable for beam processing of a large-area substrate.

The apparatus further includes a substrate transfer section for setting a substrate on the stage or taking out the substrate from the stage and transferring the substrate, and a peripheral pressing mechanism for pressing the periphery of the substrate set on the stage from above, and the control section includes: When the substrate mounted on the stage is vacuum-sucked to the support table by the substrate transfer section, the peripheral portion pressing mechanism may be controlled in advance so as to press the periphery of the substrate within a predetermined pressing range.

In the above configuration, the substrate transfer section includes:
For example, it is composed of a handling robot. The peripheral pressing mechanism includes a pneumatic cylinder or a linear drive motor, a linear scale (encoder) for detecting pressing, and the like. The contact surface with the substrate 1 is treated with a fluorine-based composition, a nylon resin, a polyolefin-based resin, urethane rubber, or the like. The board transfer unit and the peripheral part holding mechanism are configured to be controlled by a computer of the control unit.

According to the above configuration, when the peripheral portion of the substrate is first vacuum-adsorbed to the support base and temporarily fixed, the peripheral portion pressing mechanism presses the peripheral portion of the substrate in advance. Therefore, the time for correcting the warpage / deflection of the substrate by its own weight can be reduced. Further, a more accurate flatness is obtained, and the accuracy of beam processing is improved.

[0027] The apparatus further includes a substrate transfer unit for setting a substrate on the stage or taking out the substrate from the stage and transferring the substrate, and a center pressing mechanism for pressing a center of the substrate set on the stage from above. After the periphery of the substrate set on the stage by the substrate transport unit is vacuum-sucked to the support table, when the center portion of the substrate is further vacuum-sucked to each of the crosspieces, the center portion of the substrate is held in a predetermined pressing range in advance. The central portion pressing mechanism may be controlled to be pressed.

In the above configuration, the central holding mechanism is constituted by a pneumatic cylinder or a linear drive motor, a linear scale (encoder) for detecting the pressing, and the like. The contact surface with the substrate 1 is treated with a fluorine-based composition, a nylon resin, a polyolefin-based resin, urethane rubber, or the like. The board transfer unit and the center pressing mechanism are configured to be controlled by a computer of the control unit.

According to the above configuration, after the peripheral portion of the substrate is first vacuum-adsorbed to the support table and temporarily fixed, and then the central portion of the substrate is vacuum-adsorbed to each bar, the central portion of the substrate is previously fixed to a predetermined position. Pressing within the pressing range prevents leakage when depressurizing with the suction / exhaust pump, so that the flatness of the entire surface can be more reliably secured in a short time, so that beam processing accuracy is improved and substrate installation time is improved. Can be shortened.

[0030] The apparatus further comprises a storage for accommodating the peripheral part pressing mechanism and the irradiation part pressing mechanism, respectively, wherein the control unit is provided when the substrate is vacuum-adsorbed to the support base and the bars by a predetermined degree of vacuum. The peripheral part pressing mechanism and the central part pressing mechanism may be controlled so as to be sequentially stored in the storage.

In the above structure, the storage is provided, for example, on a processing line near the stage, and when the beam processing or the substrate is not installed on the stage, the peripheral pressing mechanism and the central pressing mechanism are provided. Is stored in the storage.

According to the above configuration, the substrate is vacuum-sucked to the stage support and each beam to ensure flatness, and when performing beam processing, the peripheral pressing mechanism and the central pressing mechanism are separated from the substrate surface. Since the substrate is stored in the storage, the installation of the substrate, the transfer of the substrate, the beam processing, and the like can be performed efficiently.

A movable holding mechanism for movably holding a part of the irradiation area of the substrate, wherein the movable holding mechanism moves on the substrate along a moving line of a beam irradiated by the beam irradiation apparatus. It may be.

In the above configuration, the movable holding mechanism is provided on the beam irradiation device or the stage, and includes a frame, a roller, and the like. The contact surface with the substrate is treated with a fluorine-based composition, nylon resin, polyolefin-based resin, urethane rubber, or the like.

According to the above configuration, in addition to the vacuum suction between the support stand located around the stage and the beam located in the entire irradiation area, the movable processing mechanism further presses the beam processing area from above. Flatness can be improved, and beam processing accuracy can be improved.

A substrate transfer section for mounting a substrate on the stage or taking out the substrate from the stage and transferring the substrate, a plurality of side intake / exhaust ports on both side surfaces of the stage, and valves for performing intake / exhaust of each port. Furthermore, when the substrate transport unit takes out the substrate placed on the stage, the control unit supplies pressurized air from a side intake / exhaust port provided on one side surface of the stage, and provides the pressurized air on the other side surface. The above-described valves and the intake / exhaust pump may be controlled to exhaust air from the side intake / exhaust port.

In the above structure, the side intake / exhaust ports are provided with a plurality of holes on both side surfaces of the stage, and these holes are connected to a flexible sine-flex tube and a valve for intake / exhaust / open / close. You. When the beam irradiation device is driven, the stage is not driven, so that the hole can be connected to the SUS tube.

According to the above configuration, when the substrate is taken out of the stage by the substrate transfer section, the pressure in the stage is controlled to be high so that the suction force of the substrate on the stage side is reduced, so that the substrate can be taken out with a small suction force. . In addition, since the airflow in the stage is controlled in one direction, scattered matter adhering to the stage during processing below the film surface of the substrate is prevented from being rolled up, and is discharged from one of the side intake / exhaust ports. Properties and yield can be improved.

[0039]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail based on an embodiment shown in the drawings. Note that the present invention is not limited by this. The present invention is mainly an improvement technique of a substrate beam processing apparatus for performing patterning / scribe processing of a substrate on which a large-scale thin-film solar cell is formed.

FIG. 1 is a block diagram showing the structure of a substrate beam processing apparatus according to the present invention. As shown in FIG. 1, reference numeral 1 denotes a substrate, and the substrate 1 is formed of a transparent insulating substrate of a tempered glass plate. Further, a transparent conductive film (transparent electrode), an amorphous semiconductor photoelectric conversion film, A thin-film solar cell in which the back reflection metal film is laminated is formed.

Reference numeral 2 denotes a beam irradiation device, which is a Nd-YAG
It is composed of a laser oscillation device such as a laser or an excimer laser and an optical system (beam head), and is configured to irradiate the substrate 1 with a laser beam of a selected wavelength to perform patterning processing (scribe processing) (FIG. 10). To FIG. 13). When the beam head is driven, the beam irradiation device 2 includes, for example, an X-axis, a Y-axis, and a Z-axis driving ball screw and A
A C servomotor, a linear scale (encoder) for detecting a position, and a computer for controlling a beam head are incorporated, and the AC servomotor is closed-controlled by the computer for controlling the beam head.

Reference numeral 3 denotes a stage, which is constituted by an XY stage or an XYZ stage made of steel or aluminum. When the stage 3 is driven, the stage 3 incorporates an X-axis, Y-axis, and Z-axis driving ball screw and an AC servomotor, a linear scale (encoder) for detecting a position, and a stage control computer, and performs stage control. Computer performs closed control (feedback control) of the AC servomotor.

Reference numeral 4 denotes a support table, which is composed of an aluminum block and a stainless block which are supported at a predetermined height in accordance with the shape of the periphery of the substrate 1.
It is incorporated in the side edge portion (see FIGS. 2 and 3). The contact surface with the substrate 1 has a fluorine-based composition, a nylon resin, a polyolefin-based resin,
It is treated with urethane rubber.

Reference numeral 5 denotes a crosspiece, which is arranged so as to be replaceable in a plurality of rows at the center of the stage along the movement line of the beam irradiated on the substrate 1 by the beam irradiation device 2 (FIGS. 2 to 2). 4). The height of the bar 5 is made the same as the height of the support 4, and the material of the bar 5 is made of aluminum or stainless steel. The contact surface with the substrate 1 is made of fluorine so that the substrate is not damaged. It is treated with a resin composition, nylon resin, polyolefin resin, urethane rubber, or the like.

Reference numeral 6 denotes a peripheral intake / exhaust port provided with a plurality of holes on the support base 4 at equal intervals, and reference numeral 8 denotes a peripheral intake / exhaust valve (pressure regulating valve) for intake / exhaust / open / close operation. Each is connected by a peripheral suction / exhaust tube (see FIG. 2). Reference numeral 7 denotes a central portion of the stage 3 in which a plurality of holes are provided at equal intervals along the bar 5 and a central intake / exhaust port.
A central intake / exhaust port valve that performs exhaust / open / close.
These are connected by a central suction / exhaust tube 71 (see FIG. 2). In addition, each tube (vacuum line)
When the stage 3 is driven, it is composed of a flexible simple flex tube, and when the beam irradiation device 2 is driven, the stage 3 is not driven, so that it can be composed of a SUS tube.

Reference numeral 10 denotes an intake / exhaust pump. For example, an oscillating piston oilless pump (compressor / vacuum piston pump) is used.
Through the peripheral intake / exhaust port 6 and the central intake / exhaust port 7
And are connected respectively. Reference numeral 11 denotes an air pressure detecting unit, which uses a pressure sensor for detecting the air pressure [mmHg] of the peripheral intake / exhaust port 6 and the central intake / exhaust port 7, between the peripheral intake / exhaust port 6 and the peripheral intake / exhaust valve 8. , Provided between the central intake / exhaust port 7 and the central intake / exhaust valve 9 to constantly monitor the air pressure / vacuum level of each port 6, 7, and the detected pressure information is transmitted to the control unit 12.

Reference numeral 12 denotes a control unit, which includes a CPU, a ROM, an R
It consists of a computer consisting of AM and I / O ports,
Based on the pressure information detected by the atmospheric pressure detection unit 11, the intake / exhaust pump 10, the valves 8, 9 and the like are controlled. In addition, the control unit 12 may function as a sequencer that controls each unit in sequence, a computer for controlling the beam irradiation device that controls the beam irradiation device, and a computer for controlling the stage that controls the mechanism of the stage.

Reference numeral 13 denotes a substrate transfer unit for setting the substrate 1 on the stage 3 or taking out the substrate 1 from the stage and transferring the same. The substrate transfer unit 13 is composed of, for example, a handling robot. Reference numeral 14 denotes a peripheral pressing mechanism that presses the periphery of the substrate 1 placed on the stage 3 from above.
The peripheral holding mechanism 14 includes a pneumatic cylinder, a hydraulic cylinder, a spring, a linear drive motor, a linear scale (encoder) for detecting pressing, and the like. Also,
The tip portion that comes into contact with the substrate 1 (see FIGS. 6 to 8) is treated with a fluorine-based composition, a nylon resin, a polyolefin-based resin, urethane rubber, or the like.

The substrate transport unit 13 and the peripheral pressing mechanism 14 are configured so as to be controlled by a computer of the control unit 12. The control unit 12 transfers the substrate 1 set on the stage by the substrate transport unit 13 to the support table 4. When the substrate 1 is vacuum-adsorbed, the peripheral pressing mechanism 14 is controlled so as to press the periphery of the substrate 1 within a predetermined pressing range.

Reference numeral 15 denotes a center pressing mechanism that presses the center of the substrate placed on the stage 3 from above. The center pressing mechanism 15 includes a pneumatic cylinder, a hydraulic cylinder, a spring, a linear drive motor, and a linear sensor for detecting pressing. It is composed of a scale (encoder) and the like. Also, substrate 1
(See FIG. 9) is treated with a fluorine-based composition, a nylon resin, a polyolefin-based resin, urethane rubber, or the like. After the periphery of the substrate 1 placed on the stage 3 is vacuum-adsorbed to the support 4 by the substrate transport unit 13, the control unit 12 controls the center pressing mechanism 15 to press the center of the substrate 1 within a predetermined pressing range. Control.
The central portion of the substrate 1 is vacuum-sucked to each bar 5.

Reference numeral 16 denotes a storage for storing the peripheral pressing mechanism 14 and the central pressing mechanism 15, respectively. The storage 16 is provided, for example, in the vicinity of the stage 3; When it is not installed, the peripheral pressing mechanism 14 and the central pressing mechanism 15
Are stored in the storage 16.

Reference numeral 17 denotes a movable holding mechanism which moves while holding a part of the processing area of the substrate.
Consists of stabilizers, frames, rollers, etc.
Provided on the beam irradiation device 2 or the stage 3 (FIG. 1)
0 to FIG. 13). The contact surface with the substrate 1 is treated with a fluorine-based composition, a nylon resin, a polyolefin-based resin, urethane rubber, or the like. Reference numeral 18 denotes a side intake / exhaust port provided with a plurality of holes on both side surfaces of the stage 3 (see FIG. 14), and reference numeral 18a denotes a side connected to a side intake / exhaust port valve 19 for performing intake / exhaust / opening / closing. It is a tube for part intake and exhaust. When the beam irradiation device 2 is driven, the stage 3 is not driven, so that each port 18 can be connected to a SUS tube.

FIG. 2 is an explanatory view showing a method of fixing a substrate installed in the substrate beam processing apparatus of the present invention. FIG.
2A and 2B, the same components as those in FIG. 1 are denoted by the same reference numerals. The fixing of the substrate is divided into two stages, the peripheral portion of the substrate and the central portion of the substrate. The peripheral portion of the flexible substrate is temporarily fixed to the periphery of the stage, and then the central portion of the substrate is fixed to the crosspiece. Have been. FIG. 2 (a)
FIG. 2B shows an installation state before the substrate is fixed to the substrate beam processing apparatus, and FIG. 2B shows a state where bending / warpage is corrected and fixed.

The pressure of the substrate 1 set on the stage 3 by the substrate transfer section 13 is reduced by the suction / exhaust pump 10 through the peripheral suction / exhaust port tube 6 a through the peripheral suction / exhaust port 6 provided on the support section 4. The four sides of the peripheral portion of the substrate 1 are vacuum-sucked to the support 4. Further, the peripheral intake / exhaust port 6 is connected to the peripheral intake / exhaust valve 8 via the peripheral intake / exhaust tube 61, and the adsorption strength is controlled by controlling the peripheral intake / exhaust valve 8 by the control unit 12. It is configured so that it can be adjusted arbitrarily. Further, the center of the substrate 1 is
A vacuum suction is performed on the crosspiece 5 by a central suction / exhaust port 7 provided at the center of the substrate, and the entire surface of the substrate is fixed to the stage 3. The central intake / exhaust port 7 is connected to the central intake / exhaust port tube 7a, and the suction strength thereof can be arbitrarily adjusted by the central intake / exhaust port valve 9 by the control unit 12.

According to the above configuration, first, the substrate is temporarily fixed to the stage support while correcting the peripheral portion of the substrate having a large warp, and then the entire substrate is uniformly fixed to the crosspiece of the stage. Air leaks can be prevented and flatness can be ensured with the substrate raised with the processing surface. For example, a light-transmitting insulating substrate having a thickness of 3.3 mm and a substrate size of 6
Using white glass substrate 50 × 550 mm refractive index of 1.5, a normal pressure CVD of SiO ₂ having a refractive index of 1.5 on one side to a thickness of 100nm
To be laminated. On top of this, SnO ₂ is laminated by a normal pressure CVD method to a thickness of 1 μm as a transparent conductive film layer having a texture structure with a haze ratio of 12 to 15%. The sheet resistance at this time is 10
Ω / □. When this is divided into strip-shaped unit cells by insulation, in the conventional stage shown in FIG. 15, the substrate bends by about 1.2 mm by its own weight.

If the apparatus of the present invention shown in FIG. 2 is used to secure the flatness of the substrate, the processing surface of the substrate can be positioned within the processing allowable depth of the laser beam emitted from the beam irradiation device. The laser beam can satisfactorily perform the first scribe and the second scribe patterning with the just focus on the processing surface. In FIG. 2, reference numeral 31 denotes a sub-stage.

FIG. 3 is a perspective view showing a part of the structure of the stage of the present invention. As shown in FIG. 3, stage 3
For example, a sub-stage 31 for fixing a glass substrate having a thickness of 3.3 mm and a size of 650 × 550 mm and a support 4 are provided. The support portion 4 is provided with a peripheral intake / exhaust port 6. The substage 31 is located at the central intake / exhaust port 7.
(Not shown), and further, the substage 31 is provided with a beam fixing screw hole 32 for making the beam 5 movable, and the movable beam 5 is arbitrarily set with a screw 51. It has a configuration that allows it.

A screw hole 32 of a notch hole for screwing is provided so that the setting width of the bar 5 can be set arbitrarily from 5 mm to 1.5 mm, so that the interval between scribe lines can be set to an arbitrary value. The setting width is not limited to the values shown here. The sub-stage 31 employs a method of fixing to the stage 3 with the sub-stage fixing screw 33. However, the present invention is not limited to this method, and for example, a magnet-type fixing may be used.

With the above configuration, scribe processing was successfully performed at predetermined scribe line intervals. Thereby, the integrated processing can be performed to a predetermined voltage from the substrate of one thin film solar cell. However, if the interval is too large, the conversion efficiency decreases due to an increase in the sheet resistance of the transparent conductive film electrode. If the interval is too narrow, the area loss of one thin-film solar cell increases and the conversion efficiency decreases. Is set.

FIG. 4 is a perspective view showing an example of the shape of a beam installed on the stage of the present invention. As shown in FIGS. 4A to 4C, the crossbar 5 has a rectangular crossbar 52, a square crossbar 53, and a circular crossbar 54 in contact with the substrate. By arranging one or more crosspieces, each layer laminated on the substrate 1 can be scribed with a laser beam of a selected wavelength by fixing the processing surface of the substrate 1 in a floating state. In addition, after the laser beam has passed through the glass substrate, consideration has been given to prevent irregular reflection on the beam and processing marks already processed, resulting in processing defects.
The reliability and yield of beam processing can be improved.

FIG. 5 is a flowchart showing the procedure of the substrate fixing process and the beam processing process of the present invention. In FIG. 5, step S1: the substrate 1 is set on the stage 3 by the substrate transport unit 13 (see FIG. 2A). Step S2: The peripheral pressing mechanism 14 is moved from the storage 16 to the stage 3 to press the peripheral portion of the substrate 1 from above with a predetermined pressing force (see FIGS. 6 to 8). Step S3: The peripheral intake / exhaust port 6 is depressurized by the intake / exhaust pump 10, and the four sides of the peripheral portion of the substrate 1 are vacuum-adsorbed to the support 4 (see FIG. 2B).

Step S4: The center pressing mechanism 15 is moved to the stage 3, and the center of the substrate 1 is pressed from above by a predetermined pressing force (see FIG. 9). Step S5: The suction / exhaust pump 10 reduces the pressure in the central suction / exhaust port 6, and the central portion of the substrate 1 is vacuum-adsorbed to the crosspiece 5. Step S6: The air pressure / vacuum level of the peripheral intake / exhaust port 6 and the central intake / exhaust port 7 is detected by the air pressure detecting unit 11, and it is determined whether or not the detected vacuum degree has reached a set value. If not, the process returns to step S2 or S4, and the processing up to step S6 is repeated. If the degree of vacuum has reached the set value, the process proceeds to step S7. Step S7: The peripheral pressing mechanism 14 and the central pressing mechanism 15 are retracted from the stage 3 and stored in the storage 16.

Step S8: Beam processing (patterning / scribe processing) is started by the beam irradiation device 2. In this embodiment, the transparent conductive film layer is placed on the upper side, and the division is performed by repeating a Q-switch oscillation coupling optical system Nd-YAG-user light (fundamental wave: 1.064 μm) at a frequency of 5 kHz, a laser irradiation speed of 200 mm / sec, and processing. Irradiation is performed from the transparent conductive film layer side at a surface output of 500 W / mm ² to perform patterning by laser scribe. Step S9: The movable holding mechanism 17 follows the movement of the laser beam or the stage 3 to hold down the processing area of the substrate (see FIGS. 10 to 13).

In this embodiment, the allowable processing depth of the laser beam is ± 400 μm from the just focus plane.
The position of the processing surface was within this range, and the actual processing width when the length of 650 mm was scribed was 90 ± 5 μm with respect to the set width of the scribe line of 90 μm. Step S10: End the beam processing. Step S11: Depressurization of the peripheral intake / exhaust port 6 and the central intake / exhaust port 7 by the intake / exhaust pump 10 is stopped.
Pressurized air is supplied to one side intake / exhaust port 18 and a small amount of pressurized air is exhausted from the other side intake / exhaust port 18 to slightly increase the air pressure in the stage 3 (FIG. 1).
4). Step S12: The substrate 1 is taken out of the stage 3 by the substrate transport unit 13.

FIG. 6 is a perspective view showing a shape example (1) of the distal end portion of the peripheral part pressing mechanism of the present invention. When the substrate 1 to be beam-processed is set on the stage 3 by the substrate transfer unit 13 and the four sides of the peripheral portion of the substrate are vacuum-adsorbed and temporarily fixed to the support of the stage, the peripheral portion as shown in FIG. The peripheral portion of the substrate 1 is pressurized by a predetermined pressure in advance by the distal end portion 141 of the pressing mechanism 14. Peripheral part holding mechanism 14 of the present invention
As a result, the reduced pressure air can be prevented from leaking from the peripheral portion of the substrate, so that the substrate is securely temporarily fixed to the support table. Further, when the central portion of the substrate 1 is vacuum-sucked to each bar 5, the flatness of the substrate can be secured. . Therefore, it can be applied to beam processing of a large-area substrate.

FIG. 7 is a perspective view showing a shape example (2) of the distal end portion of the peripheral part pressing mechanism of the present invention. FIG. 8 is a perspective view showing a shape example (3) of the distal end portion of the peripheral part pressing mechanism of the present invention. The shape of the tip of the peripheral part holding mechanism 14 is
The discontinuous bar-shaped tip 142 as shown in FIG.
The same effect can be obtained with a plurality of pin-shaped tips 143 as shown in FIG. Also, the surface of the tip portion that comes into contact with the substrate 1 is
It is treated with resin, urethane rubber or the like so as not to damage the contact surface of the substrate 1. 6 to FIG.
4a indicates the pressing direction of the peripheral pressing mechanism 14.

FIG. 9 is a perspective view showing an example of the shape of the distal end of the central holding mechanism of the present invention. After the peripheral portion of the substrate 1 is vacuum-adsorbed to the support 4 of the stage 3 in the first stage, the entire surface of the substrate is vacuum-adsorbed to each of the bars 5 provided on the stage 3 in the second stage to secure flatness. The central portion of the substrate 1 is pressurized by a predetermined pressure in advance by the distal end portion 151 of the central portion pressing mechanism 15 as shown in FIG. In addition, the surface of the tip portion that comes into contact with the substrate 1 is treated with resin, urethane rubber, or the like so as not to damage the surface of the substrate 1. In FIG.
Reference numeral 15a indicates a pressing direction of the center pressing mechanism 15.

According to the above structure, when the substrate is beam-processed, the peripheral portion of the substrate is vacuum-adsorbed to the support table and temporarily fixed, and then the entire substrate is vacuum-adsorbed to the bar having the same height as the support table. Since the flatness can be maintained more reliably by correcting the warpage / self-weight deflection of the substrate, it is possible to provide a substrate processing apparatus suitable for beam processing of a large-area substrate.

Next, when the central portion of the substrate is vacuum-sucked to each bar, the flatness of the substrate can be ensured. When the flatness of the substrate is ensured, the peripheral pressing mechanism 14 and the central pressing mechanism 15 are retracted from the stage 3 and stored in the storage 16 to start beam processing.

FIG. 10 is a perspective view showing a configuration example (1) of a beam irradiation apparatus and a stage equipped with a movable holding mechanism of the present invention. As shown in FIG.
Is a driving method in which a beam head 21 for guiding a laser beam by an optical fiber 20 is used. In this case, the movable holding mechanism 17 is mounted on the beam irradiation device 2 and includes substrate holding rollers 172 held on both sides of the beam head 21 by roller arms 171, and laser processing is performed in parallel with the processed scribe line 1 a. It moves with the beam head 21 while pressing both sides of the surface. 10, 1 is a substrate, 3 is a stage, 5 is a bar, 6 is a peripheral intake / exhaust port, 7 is a central intake / exhaust port, 22 is a condenser lens, 23 is an attenuator, 24 is a beam expander, 25 is an imaging lens, 26 is a slit, 27 is an objective lens, 2a is a laser beam, and 2b is a moving direction of a beam head.

The beam head 21 and the roller arm 1
When the spring 71 or the air cylinder type buffer mechanism (shock absorber) is interposed in the mounting of the roller 71, the movement of the roller 172 moving while correcting the deflection of the substrate 1 becomes smooth, and the effect of pressing the substrate increases.
The contact surface of the roller 172 is treated with resin, urethane rubber or the like so as not to damage the surface of the substrate. Therefore, the movable holding mechanism 17 can move while holding a part of the processing area of the substrate, and can position the processing surface of the substrate so that the laser beam is within the processing allowable depth.

FIG. 11 is a perspective view showing a configuration example (2) of a beam irradiation apparatus and a stage equipped with a movable holding mechanism of the present invention. 11, the same components as those in FIG. 10 are denoted by the same reference numerals. As shown in FIG. 11, the beam irradiation device 2 employs a driving method in which a beam head 21 that guides a laser beam through an optical fiber 20 is driven. In this case, the movable holding mechanism 17 is incorporated into the stage 3 and includes a stabilizer 173 that moves on a rail 34 provided on the stage 3. The stabilizer 173 corrects the deflection by pressing the substrate 1 at a position sandwiching the scribe line 1a while the beam head 21 performs the scribe processing. After processing one scribe line 1a, the stabilizer 17 is synchronized with the movement of the beam head 21 that is pitch-fed in a direction orthogonal to the scribe line.
3 moves on the rail 34. In FIG. 11, 17
“a” indicates the moving direction of the movable holding mechanism 17.

Here, the stabilizer 173 is connected to the rail 34
When moving upward by pitch feeding, smooth pressing can be realized by releasing the pressing operation of the substrate and further moving away from the substrate. Also, stabilizer 1
The contact surface of 73 is treated with resin, urethane rubber or the like so as not to damage the surface of the substrate. Stabilizer 1
Reference numeral 73 is located on one side or both sides of the scribe line 1a in parallel with the scribe line 1a and does not hinder beam processing. With this configuration, the flatness of the substrate can be reliably ensured during the beam processing.

FIG. 12 is a perspective view showing a configuration example (3) of a beam irradiation apparatus and a stage equipped with the movable holding mechanism of the present invention. 12, the same components as those in FIG. 10 are denoted by the same reference numerals. As shown in FIG. 12, the beam irradiation device 2 includes a beam head 21 that guides a laser beam by a bending mirror 28 and a laser light path housing 29.
Is a fixed system, and is a case where scribe processing is performed by driving the stage 3. The stage 3 is driven by a ball screw 35 and an AC servomotor.

The movable holding mechanism 17 in this case is incorporated into the beam irradiation device 2 and has rollers 172 held by roller arms 171 on both sides of the laser beam emitting portion of the laser beam path housing 29, and is processed. In parallel with the scribe line, both sides of the laser processing surface are pressed when the stage 3 moves. With the above configuration, the flatness of the substrate can be reliably ensured even in the beam processing in which the stage is driven.

FIG. 13 is a perspective view showing a configuration example (4) of a beam irradiation apparatus and a stage equipped with the movable holding mechanism of the present invention. 13, the same components as those in FIG. 10 are denoted by the same reference numerals. As shown in FIG. 13, the beam irradiation device 2 includes a beam head 21 that guides a laser beam by a bending mirror 28 and a laser light path housing 29.
Is a fixed system, and is a case where scribe processing is performed by driving the stage 3. The stage 3 is driven by a ball screw 33 and an AC servomotor 34. 12 to 1
In 3, 3a indicates the moving direction of the stage 3.

In this case, the movable holding mechanism 17 is incorporated in the stage 3 and provided on the transfer rail 3 provided on the stage 3.
b, the stabilizer 17c moves the substrate 1 at a position sandwiching the scribe line 1a while the beam head 21 performs scribe processing.
To correct the deflection. Then, after processing one scribe line 1a, the scribe line 1a moves on the rail 34 in accordance with the movement of the stage 3 pitch-fed in a direction orthogonal to the scribe line. With the above configuration, even in the case of a laser processing machine in which the stage is driven, the flatness of the substrate can be reliably ensured.

FIG. 14 is an explanatory view showing a method of taking out a substrate set in the substrate beam processing apparatus of the present invention. FIG.
As shown in FIG. 4, reference numeral 18 denotes a side intake / exhaust port provided with a plurality of holes on both side surfaces of the stage 3, and a side intake / exhaust port for performing intake / exhaust / opening / closing by a side intake / exhaust tube 181. (Not shown).
When the substrate is taken out of the stage by the substrate transfer unit, the decompression of the peripheral intake / exhaust port 6 and the central intake / exhaust port 7 is stopped by the intake / exhaust pump 10, and pressurized air is supplied to one side intake / exhaust port 18. And the other side intake / exhaust port 1
Air is evacuated from 8 to slightly increase the air pressure in the stage 3 so that the substrate 1 can be easily removed from the stage 3. On the other hand, since the airflow in the stage is controlled in one direction, the scattered matter adhering to the stage during the processing under the film surface of the substrate is prevented from being rolled up. Properties and yield can be improved.

In this embodiment, for example, as a method of integrating a thin film solar cell, a fundamental wave (1.064 μm) of an Nd-YAG laser is applied to a transparent conductive film formed on a glass substrate.
Is radiated from the light-transmitting insulating side, and is divided into strips by ablation (first scribe). Then, an amorphous photoelectric conversion film is laminated, and a transparent conductive film is formed at a position shifted from the first scribe line. Without damage, the second of Nd-YAG
The harmonic (0.532 μm) is irradiated only to the amorphous photoelectric conversion layer to perform division (second scribe), and after laminating the back electrode layer, the second scribe line is shifted from the second scribe line to the side opposite to the first scribe line. A process (third scribe) of dividing the back electrode layer at the shifted position is performed.

A reinforced white glass substrate having a thickness of 3.3 mm, a substrate size of 650 × 550 mm and a refractive index of 1.5 was used as a light-transmitting insulating substrate, and ZnO was laminated on one surface thereof by RF sputtering to a thickness of 2 μm, and a haze ratio of 10 to 15 was used. % Of a transparent conductive film layer having a texture structure. The sheet resistance at this time is 8-10Ω / □
It is. In this embodiment, the transparent conductive film is satisfactorily applied to the step of dividing the insulating film into strip-shaped unit cells, the step of laminating the amorphous semiconductor photoelectric conversion layer, and the strengthening glass substrate having about 0.2% warpage in the side direction. Insulation patterning of the film and division lines of the amorphous semiconductor photoelectric conversion layer could be formed.

An amorphous semiconductor photoelectric conversion layer is laminated on a glass substrate with a transparent conductive film that has been subjected to insulation separation and patterning by a plasma CVD method. The film surface is placed downward on the stage of the present invention, and fixed by suction. Q from glass side
The second harmonic (SHG: 0.532 μm) of the switch oscillation imaging optical system Nd-YAG laser is repeated at a frequency of 5 kHz, a laser irradiation speed of 200 mm / sec, and a processing surface output of 100 W / mm ² from the glass surface side to the transparent conductive film. Patterning is performed by laser scribe by irradiating an adjacent position in parallel. The allowable processing depth of the laser beam according to the present embodiment is ± 400 μm from the just focus plane, but the position of the processing plane falls within this range, and when the scribe line is scribed for a set width of 100 μm and a length of 650 mm. The actual processing width was as good as 100 ± 5 μm, and the insulation separation patterning processing was successfully performed.

According to this embodiment, (1) the four sides of the periphery of the large-area substrate are vacuum-adsorbed to the stage support and temporarily fixed, and then the entire substrate is vacuum-adsorbed to the crossbar in the stage. Leakage during pressure reduction can be prevented, and the substrate can be more reliably flattened by correcting its own weight deflection and warpage. (2) Regardless of the direction of bending and warping of the substrate, the peripheral holding mechanism pre-presses the peripheral portion of the substrate and vacuum-adsorbs to the stage support, so that a large-area substrate can be temporarily fixed quickly. (3) After the peripheral portion of the substrate is vacuum-adsorbed to the stage support, the substrate is vacuum-adsorbed to the beam in the stage while the center portion of the substrate is pressed in advance by the center pressing mechanism. Since the entire surface can be adsorbed, the setting time of the substrate can be reduced. Since the entire surface of the substrate is flat, the focal point of the laser beam can be held at a position within the allowable processing depth on any processing surface, and the reliability of the beam processing is improved. Further, since the focal point of the laser beam does not always follow the processing surface of the substrate, beam processing can be performed at high speed.

(4) By fixing the substrate to a beam provided along the interval of the scribe line to be irradiated with the laser beam, the laser beam transmitted through the translucent insulating substrate is irradiated on the beam and the laser beam is irradiated. Processing defects due to scattering can be prevented. For this reason, the reliability and yield of beam processing are improved. (5) The flatness of the processing surface of the substrate can be always ensured by the vacuum suction on the beam located at the center of the stage and the movable pressing mechanism that presses the substrate from above the irradiation surface of the laser beam. , Can always be held at a position within the allowable processing depth.

(6) When the substrate beam processing apparatus of the present invention is applied, a step (first scribe) of insulatingly patterning a transparent conductive film layer laminated on a light-transmitting insulating substrate by a laser beam and laminating thereon. In processing (second scribing) for groove-groove patterning the amorphous photoelectric conversion layer thus formed,
A laser beam is incident from the light-transmitting insulating substrate side (sunlight incident side), passes through the light-transmitting insulating substrate and the transparent conductive film layer, and is selectively absorbed by absorbing the laser beam with the amorphous photoelectric conversion layer. When thin film processing is performed, laser processing can be favorably performed by correcting the warpage of the substrate and the deflection of its own weight. (7) Not only bending of the substrate under its own weight but also warping of the tempered glass substrate can be corrected. This makes it possible to form a thin-film solar cell directly on a tempered glass substrate by laminating and integrating the thin-film solar cell, thereby eliminating the need for a conventional protective glass and reducing the cost of a large-area thin-film solar cell for outdoor installation. And lighter weight can be achieved.

[0085]

According to the present invention, when a substrate is beam-processed, the peripheral portion of the substrate is vacuum-adsorbed to a support table and temporarily fixed, and then the entire substrate is vacuum-adsorbed to a bar having the same height as the support table. Therefore, it is possible to more reliably correct the warpage / deflection of the substrate and maintain the flatness. Therefore, the reliability and yield of beam processing are improved, and a substrate processing apparatus particularly suitable for beam processing of a large-area substrate can be provided.

[Brief description of the drawings]

FIG. 1 is a block diagram showing a configuration of a substrate beam processing apparatus according to the present invention.

FIG. 2 is an explanatory view showing a method for fixing a substrate installed in the substrate beam processing apparatus of the present invention.

FIG. 3 is a perspective view showing a part of the configuration of the stage of the present invention.

FIG. 4 is a perspective view showing an example of the shape of a beam installed on the stage of the present invention.

FIG. 5 is a flowchart showing a procedure of a substrate fixing process and a beam processing process of the present invention.

FIG. 6 is a perspective view showing a shape example (1) of a distal end portion of the peripheral part pressing mechanism of the present invention.

FIG. 7 is a perspective view showing a shape example (2) of the distal end portion of the peripheral part pressing mechanism of the present invention.

FIG. 8 is a perspective view showing a shape example (3) of the distal end portion of the peripheral part pressing mechanism of the present invention.

FIG. 9 is a perspective view showing an example of the shape of the distal end portion of the irradiation unit pressing mechanism of the present invention.

FIG. 10 is a perspective view showing a configuration example (1) of a beam irradiation apparatus and a stage equipped with a movable holding mechanism of the present invention.

FIG. 11 is a perspective view showing a configuration example (2) of a beam irradiation apparatus and a stage equipped with a movable holding mechanism of the present invention.

FIG. 12 is a perspective view showing a configuration example (3) of a beam irradiation device and a stage equipped with a movable holding mechanism of the present invention.

FIG. 13 is a perspective view showing a configuration example (4) of a beam irradiation apparatus and a stage equipped with a movable holding mechanism of the present invention.

FIG. 14 is an explanatory view showing a method of taking out a substrate installed in the substrate beam processing apparatus of the present invention.

FIG. 15 is an explanatory view showing a method of fixing a substrate installed on a stage in a conventional example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate 1a Scribe line 2 Beam irradiation device 20 Optical fiber 21 Beam head 22 Condensing lens 23 Attenuator 24 Beam expander 25 Imaging lens 26 Slit 27 Objective lens 28 Bending mirror 29 Beam optical path housing 2a Laser beam 2b Beam head moving direction 3 stage 31 substage 32 beam fixing screw hole 33 substage fixing screw 34 rail 35 ball screw 3a stage moving direction 4 support base 5 beam 51 beam fixing screw 52 rectangular beam 53 rectangular beam 54 circular beam 6 Peripheral intake / exhaust port 61 Peripheral intake / exhaust tube 7 Central intake / exhaust port 71 Central intake / exhaust tube 8 Peripheral intake / exhaust port valve 9 Central intake / exhaust port valve 10 Intake / exhaust pump 11 Atmospheric pressure detection Part (pressure 12) Control unit (computer) 13 Substrate transport unit 14 Peripheral pressing mechanism 141 Tip of peripheral pressing mechanism 142 Tip of peripheral pressing mechanism 143 Tip of peripheral pressing mechanism 14a Pressure direction of peripheral pressing mechanism Reference Signs List 15 central pressing mechanism 151 tip of central pressing mechanism 15a pressing direction of central pressing mechanism 16 storage 17 movable pressing mechanism 171 roller arm 172 roller 173 stabilizer 17a moving direction of movable pressing mechanism 18 side suction / exhaust port 19 Valve for side intake / exhaust port

Claims (11)

[Claims] 1. A stage having a beam irradiation device for irradiating a beam onto a substrate, a support for supporting the periphery of the substrate at a predetermined height, and a plurality of bars for supporting a central portion of the substrate at the same height. And a plurality of peripheral intake / exhaust ports provided on the support base, a plurality of central intake / exhaust ports provided at the center of the stage, a plurality of valves for intake / exhaust of each port, and a peripheral intake / exhaust port And a suction / exhaust pump for depressurizing the central intake / exhaust port, an air pressure detecting unit for detecting the degree of vacuum of the peripheral intake / exhaust port and the central intake / exhaust port, respectively, and when the substrate is installed on the stage, the substrate A substrate beam processing apparatus comprising: a control unit that controls each of the valves and the suction / exhaust pump based on the detected degree of vacuum so that the vacuum suction is performed on the support after the vacuum suction is performed on the support table. 2. The substrate beam processing apparatus according to claim 1, wherein said substrate is a transparent insulating substrate made of a tempered glass plate. 3. The thin-film solar cell as claimed in claim 2, wherein the substrate is formed by laminating a transparent conductive film, an amorphous semiconductor photoelectric conversion film, and a back reflection metal film on a tempered glass plate.
The substrate beam processing apparatus as described in the above. 4. The substrate beam processing apparatus according to claim 1, wherein said beam irradiation apparatus is constituted by a laser oscillator such as an Nd-YAG laser or an excimer laser and an optical system. 5. The substrate beam processing apparatus according to claim 4, wherein said beam irradiation apparatus patterns said substrate with a laser beam having a selected wavelength. 6. The system according to claim 1, wherein the plurality of beams are replaceably arranged in a central portion of a stage along a processing line of a beam irradiated on the substrate by the beam irradiation device. Substrate beam processing equipment. 7. The apparatus further comprises: a substrate transfer unit that mounts a substrate on the stage or takes out the substrate from the stage and transfers the substrate; and a peripheral pressing mechanism that presses a periphery of the substrate installed on the stage from above, and the control unit includes: Wherein, when the substrate mounted on the stage is vacuum-sucked to the support table by the substrate transfer section, the peripheral portion pressing mechanism is controlled so as to press the periphery of the substrate within a predetermined pressing range in advance. 2. The substrate beam processing apparatus according to 1. 8. The control unit further comprising: a substrate transfer unit for setting a substrate on the stage or taking out the substrate from the stage and transferring the substrate; and a center pressing mechanism for pressing a center of the substrate set on the stage from above. After the periphery of the substrate set on the stage is vacuum-sucked to the support table by the substrate transfer unit, when the center of the substrate is further vacuum-sucked to each of the crossbars, the center of the substrate is pressed in advance by a predetermined pressure. The substrate beam processing apparatus according to claim 1, wherein the central portion pressing mechanism is controlled so as to hold the substrate within a range. 9. A storage unit for storing the peripheral part pressing mechanism and the irradiating part pressing mechanism, respectively, wherein the control unit is configured so that the substrate is vacuum-adsorbed to the support base and the crosspieces at a predetermined degree of vacuum. 9. The substrate beam processing apparatus according to claim 7, wherein the control unit controls the peripheral part pressing mechanism and the central part pressing mechanism to be sequentially stored in the storage. 10. A movable holding mechanism for movably holding a part of an irradiation area of the substrate, wherein the movable holding mechanism moves on the substrate along a moving line of a beam irradiated by the beam irradiation device. The substrate beam processing apparatus according to claim 1, wherein: 11. A substrate transfer section for mounting a substrate on the stage or taking out a substrate from the stage and transferring the substrate, a plurality of side intake / exhaust ports on both side surfaces of the stage, and valves for sucking / exhausting the ports. When the substrate transport unit takes out the substrate placed on the stage,
The control unit supplies the pressurized air from a side intake / exhaust port provided on one side surface of the stage, and controls the valves and the intake / exhaust pump to exhaust air from a side intake / exhaust port provided on the other side surface. The apparatus according to claim 1, wherein the apparatus is controlled.