JPH10277913A - Wire saw cutter - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a wire saw cutter which facilitates the management of wire tension. SOLUTION: This cutter is provided with a wire 11 to cut a semiconductor single crystal material 1, a pair of rollers with groove 21 and 22 on which a cut part 12 of the wire 11 is wound and stretched, wire travel driving reel 60 and 60 to run wire 11, and a roller rotation driving mechanism for wire tension adjustment 30 to adjust freely the rotation of a pair of rollers with groove 21 and 22, respectively. The tension of a cut part of the wire can be adjusted by adjusting a rotating torque of a pair of rollers for cutting, respectively by the roller rotation driving mechanism for wire tension adjustment.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wire saw cutting machine for cutting a workpiece by running a wire.
The present invention relates to a wire saw cutting machine capable of easily managing wire tension.

[0002]

2. Description of the Related Art For example, in the process of manufacturing a semiconductor chip, there is a step of cutting a round bar-shaped semiconductor single crystal material in a direction perpendicular to the crystal axis to cut into a large number of semiconductor wafers. In this step, a wire saw cutting machine or the like is used. A wire saw cutting machine used in such a semiconductor chip manufacturing process includes a wire, a pair of cutting rollers around which the wire is wound and stretched, a wire traveling drive mechanism for reciprocating the wire, and the pair of cutting wires. And a wire tension adjusting means provided at a portion on the end side from the roller for adjusting the tension of the wire. Adjusting the wire tension with the wire tension adjusting means is important for keeping the sharpness or durability of the wire within a reference value.

[0003]

However, in such a conventional wire saw cutting machine, wire tension adjusting means for adjusting the tension of the wire is provided at a portion of the wire closer to the end from the pair of cutting rollers. Therefore, it is difficult to adjust the tension of the cut portion which affects the sharpness or the durability of the entire wire with high precision, and it is difficult to control the tension of the wire.

The present invention has been made in view of such circumstances, and an object of the present invention is to provide a wire saw cutting machine capable of easily managing the tension of a wire.

[0005]

According to the present invention, there is provided a wire for cutting a workpiece, a plurality of cutting rollers around which a cut portion of the wire is wound and stretched, and a wire running for running the wire. In a wire saw cutting machine having a driving mechanism, a wire tension adjusting roller rotation driving mechanism capable of adjusting rotation of at least one pair of cutting rollers among the plurality of cutting rollers is provided. Therefore, the tension of the wire cutting portion is adjusted by adjusting the rotational torque of the pair of cutting rollers by the wire tension adjusting roller rotation driving mechanism.

Further, according to the present invention, a tension detecting mechanism for detecting a tension of a cut portion of the wire, and a cut portion of the wire based on the tension of the cut portion of the wire detected by the tension detecting mechanism. And a controller that controls the wire tension adjusting roller rotation drive mechanism so as to adjust the tension of the wire. Accordingly, the tension of the cut portion of the wire is easily and quickly adjusted by the control device.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the grinding apparatus according to the present invention will be described below in detail with reference to the accompanying drawings. As shown in FIG. 1, a wire saw cutting machine 100 includes a cutting machine body 10 having a wire 11 for cutting a round bar-shaped semiconductor single crystal material 1 as a workpiece, a semiconductor single crystal material 1, and a wire 11. Material support mechanism 90 pressing against
And In the schematic diagram of FIG. 1, only one semiconductor single crystal material 1 is depicted for clarity of description.
As shown in FIGS. 2 and 3, the crystal material supporting mechanism 90 supports a plurality of semiconductor single crystal materials 1 and simultaneously
Is to be pressed against.

The cutting machine body 10 is provided at both ends of the wire 11, a wire winding portion 20 around which the cutting portion 12 of the wire 11 is wound and stretched, and reciprocates the wire 11. Wire running drive reels 60 as a wire running drive mechanism;
A slurry supply mechanism 70 shown in FIG. 2 for supplying slurry containing abrasive grains to the wire running drive reels 60, 60 with respect to the cut portion 12 of the wire 11.
And two wire tension adjusting means 80 and 80 for adjusting the tension of the entire wire 11 by applying a vertical load W to the wire 11.

As shown in FIG. 3, the wire winding portion 20 includes a pair of grooved rollers 21 and 22, which are a pair of cutting rollers provided in parallel in a horizontal direction, and a pair of grooved rollers 21 and 22.
Sets of bearings 24, 24, 25, 2 for rotatably supporting the
5, and a pair of grooved rollers 21 and 22 are driven to rotate in the traveling direction of the wire 11, and the rotational torque of the pair of grooved rollers 21 and 22 is adjustable. A tension detecting mechanism 40 of FIG. 1 for detecting the tension of the cut portion 12 of the wire 11,
Cut portion 1 of wire 11 detected by tension detection mechanism 40
2, the wire tension adjusting roller rotation drive mechanism 30 is adjusted so as to adjust the rotational torque of the pair of grooved rollers 21 and 22 to adjust the tension of the cut portion 12 of the wire 11 and maintain the tension at a predetermined value. And a control device 50 for controlling.

As shown in FIG. 3, each of the grooved rollers 21 and 22 has a large number of annular grooves 21a and 22a which are equally spaced in the direction of the rotation axes CT1 and CT2 on the outer peripheral surface. Grooves 21a of a pair of grooved rollers 21, 22;
A wire row 17 is formed around the pair of grooved rollers 21 and 22 so as to be equally spaced in the direction of the rotation axes CT1 and CT2 of the grooved rollers 21 and 22 between the pair of grooved rollers 21 and 22. The wire row 17 forms the cut portion 12 of the wire 11.

Roller drive mechanism 30 for adjusting wire tension
Is provided at one end of the grooved roller 21 and the grooved roller 21
Is rotated around its rotational axis CT1, and its rotational torque is adjustable. The first electric rotary driver 31 is provided at one end of the grooved roller 22, and the grooved roller 22 is rotated around its rotational axis CT2. It has a second electric rotary drive 32 that is driven and whose rotational torque is adjustable.

The tension detecting mechanism 40 shown in FIG. 1 includes a voltage applying means 41 for applying a voltage between both ends of the wire 11 and an electric resistance detecting means for detecting a voltage or a current between both ends of the cut portion 12 of the wire 11. And a container 42. This voltage,
Alternatively, the value of the electric current is determined by the cutting portion 1 of the wire 11 due to the tension.
2 represents a change in electric resistance due to expansion and contraction of
Is a value corresponding to the tension of the cut portion 12 of FIG.

Since the wire saw cutting machine 100 is configured as described above, the semiconductor single crystal material 1 is as follows.
Can be cut. That is, first, the tension of the entire wire 11 is roughly set by adjusting the vertical loads W, W by the two wire tension adjusting means 80, 80. Therefore, the wire running drive reels 60, 60 of the wire saw cutting machine 100, the slurry supply mechanism 70 of FIG. This activation causes the wire 11
Slurry containing abrasive grains is supplied to the cut portion 12 of the wire 11, and a pair of grooved rollers 21 is driven by a wire tension adjusting roller rotation drive mechanism 30.
22 are respectively driven to rotate in the traveling direction of the wire 11.

By the rotation of the pair of grooved rollers 21 and 22, the wire row 17 forming the cut portion 12 of the wire 11 is formed.
Can smoothly run around the pair of grooved rollers 21 and 22. Further, the tension detecting mechanism 40 of the wire winding portion 20 detects a voltage or a current between both ends of the cut portion 12 of the wire 11, and the control device 50 detects the voltage or the current of the wire 11 based on the voltage or the current. Cutting part 12
The roller rotation drive mechanism 30 for adjusting the wire tension is controlled so that the tension of the wire is adjusted and maintained at a predetermined value. As a result, the wire tension adjusting roller rotation drive mechanism 30 changes the difference between the rotational torques of the pair of grooved rollers 21 and 22 to adjust the tension of the cut portion 12 of the wire 11, and
The value of the tension of the one cut portion 12 is kept within a predetermined allowable range.

Accordingly, in the wire saw cutting machine 100, the crystal material supporting mechanism 90 is driven to press the semiconductor single crystal material 1 against the cut portion 12 of the wire 11, and the cut portion 12 of the wire 11 is cut while cutting. Is kept within a predetermined tolerance. Thereby, the sharpness of the cut portion 12 of the wire 11 can be maintained, so that the cutting accuracy can be improved.

The tension of the wire 11 is
Since the entirety including the one cut portion 12 is kept within a predetermined allowable range, the durability of the wire 11 can be improved. Further, the holding of the tension of the cut portion 12 of the wire 11 is performed by the control device 50 controlling the wire tension adjusting roller rotation drive mechanism 30 based on the tension of the cut portion 12 of the wire 11 detected by the tension detection mechanism 40. Therefore, the adjustment operation by the operator is hardly required, that is, the adjustment operation is easy, and the adjustment for maintaining the tension can be quickly performed.

As described above, in the wire saw cutting machine 100 of the present embodiment, the tension of the wire 11 can be easily managed. In the above-described embodiment, the tension detecting mechanism includes a voltage application unit 41 that applies a voltage between both ends of the wire 11 and an electric resistance detection that detects a voltage or a current between both ends of the cut portion 12 of the wire 11. And the like, but instead of this, each grooved roller 21,
Needless to say, the rotation torque detector for detecting the rotation torque 22 may be a tension detection mechanism.

In the above embodiment, the grooved roller 2
Although only one pair of 1, 22 is provided, it may be a wire winding portion provided with three or more grooved rollers.

[0019]

As described above, according to the present invention,
By adjusting the rotation torque of the pair of cutting rollers by the wire tension adjusting roller rotation driving mechanism, the tension of the cut portion of the wire is adjusted, so that the tension of the wire can be easily managed. Further, according to the present invention, the control device controls the wire tension adjusting roller rotation drive mechanism so as to adjust the tension of the cut portion of the wire based on the tension of the cut portion of the wire detected by the tension detection mechanism. So
Adjustment of the tension of the cut portion of the wire is performed easily and quickly. Therefore, it is possible to easily manage the tension of the wire.

[Brief description of the drawings]

FIG. 1 is a schematic view of an embodiment of a wire saw cutting machine according to the present invention.

FIG. 2 is a partially cutaway view showing a side surface of the wire saw cutting machine of FIG. 1;

FIG. 3 is a cross-sectional view of the wire saw cutting machine shown in FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Semiconductor single crystal material (workpiece) 11 ... Wire 12 ... Cutting part 21,22 ... Groove roller (Cutting roller) 30 ... Wire tension adjustment roller rotation drive mechanism 40 ... Tension detection mechanism 50 ... Control device 60 … Wire running drive reel (wire running drive mechanism) 100… Wire saw cutting machine

 ──────────────────────────────────────────────────続 き Continuing from the front page (72) Inventor Satoru Matsubara 318-3 Ishida, Isehara-shi, Kanagawa Prefecture Inside NS Engineering Co., Ltd. (72) Inventor Atsuzou Sekiyama 318-3 Ishida Isehara-shi, Kanagawa Prefecture Inside NS Engineering Co., Ltd.

Claims (2)

[Claims] 1. A wire saw cutting machine comprising a wire for cutting a workpiece, a plurality of cutting rollers around which a cut portion of the wire is wound and stretched, and a wire running drive mechanism for running the wire. A wire saw cutting machine comprising: a wire tension adjusting roller rotation drive mechanism capable of adjusting rotation of at least one pair of cutting rollers among the plurality of cutting rollers. 2. A tension detecting mechanism for detecting a tension of a cut portion of the wire, and a tension of the cut portion of the wire is adjusted based on the tension of the cut portion of the wire detected by the tension detecting mechanism. 2. The wire saw cutting machine according to claim 1, further comprising: a control device for controlling said wire tension adjusting roller rotation driving mechanism.