JPH10277923A5 - - Google Patents
Info
- Publication number
- JPH10277923A5 JPH10277923A5 JP1998033924A JP3392498A JPH10277923A5 JP H10277923 A5 JPH10277923 A5 JP H10277923A5 JP 1998033924 A JP1998033924 A JP 1998033924A JP 3392498 A JP3392498 A JP 3392498A JP H10277923 A5 JPH10277923 A5 JP H10277923A5
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- mechanical
- abrasive
- polished
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Description
【０００９】
【課題を解決するための手段】
このため本発明は、被研磨体と研磨層とを相対的に摺動させながら、前記被研磨体を研磨する研磨装置において、前記研磨層は、多数の凹部が形成された研磨面と、この研磨面から露出するように当該研磨層に埋め込まれた、機械的な研磨作用を有する機械的研磨粒子と、を含むことを特徴とする。また前記研磨装置において、前記研磨層に化学的な研磨作用を有する化学的研磨材を含む研磨液を供給するように構成してもよい。
[0009]
[Means for solving the problem]
Therefore, the present invention provides a polishing apparatus for polishing a workpiece while sliding the workpiece and a polishing layer relative to each other, characterized in that the polishing layer includes a polishing surface on which a large number of recesses are formed, and mechanical abrasive particles having a mechanical abrasive action embedded in the polishing layer so as to be exposed from the polishing surface. The polishing apparatus may also be configured to supply a polishing liquid containing a chemical abrasive having a chemical abrasive action to the polishing layer.
前記研磨液は、例えば機械的研磨粒子と化学的研磨材とのうち化学的研磨材のみを含むことが好ましい。また前記研磨層は、バインダ樹脂中に前記機械的研磨粒子を分散させると共に、このバインダ樹脂を発泡させて発泡体を得た後、所定の形状に切断して加工され、切断面を研磨面としたものを用いることができる。
また他の発明は、被研磨体と研磨層とを相対的に摺動させながら、前記被研磨体を研磨する研磨装置において、多数の凹部が形成された研磨面と、この研磨面から露出するように埋め込まれた、機械的な研磨作用を有する機械的研磨粒子とを含む研磨層を用いて前記被研磨体を研磨することを特徴とする。
さらに他の発明は、被研磨体と研磨層とを相対的に摺動させながら、前記被研磨体を研磨する研磨方法において、多数の凹部が形成された研磨面と、この研磨面から露出するように埋め込まれた、機械的な研磨作用を有する機械的研磨粒子とを含む研磨層を用いて前記被研磨体を研磨することを特徴とする。
The polishing liquid preferably contains only a chemical abrasive out of, for example, mechanical abrasive particles and a chemical abrasive. The polishing layer can be formed by dispersing the mechanical abrasive particles in a binder resin, foaming the binder resin to obtain a foam, and then cutting and processing the foam into a predetermined shape, with the cut surface serving as the polishing surface.
Another invention is a polishing apparatus that polishes an object to be polished while sliding the object and a polishing layer relative to each other, characterized in that the object to be polished is polished using a polishing surface on which a large number of recesses are formed and a polishing layer that includes mechanical abrasive particles that have a mechanical abrasive action and are embedded so as to be exposed from the polishing surface.
Yet another invention is a polishing method for polishing an object to be polished while sliding the object and an abrasive layer relative to each other, characterized in that the object to be polished is polished using an abrasive layer that includes a polishing surface having a large number of recesses formed therein and mechanical abrasive particles that have a mechanical abrasive action and are embedded so as to be exposed from the polishing surface.
Claims (6)
前記研磨層は、多数の凹部が形成された研磨面と、この研磨面から露出するように当該研磨層に埋め込まれた、機械的な研磨作用を有する機械的研磨粒子と、を含むことを特徴とする研磨装置。 A polishing apparatus for polishing an object to be polished while sliding the object and a polishing layer relative to each other, comprising:
A polishing device characterized in that the polishing layer includes a polishing surface having a large number of recesses formed therein, and mechanical polishing particles having a mechanical polishing action embedded in the polishing layer so as to be exposed from the polishing surface.
多数の凹部が形成された研磨面と、この研磨面から露出するように埋め込まれた、機械的な研磨作用を有する機械的研磨粒子とを含む研磨層を用いて前記被研磨体を研磨することを特徴とする研磨装置。A polishing apparatus characterized by polishing the object to be polished using a polishing layer including a polishing surface having a large number of recesses formed therein and mechanical abrasive particles having a mechanical abrasive action embedded so as to be exposed from the polishing surface.
多数の凹部が形成された研磨面と、この研磨面から露出するように埋め込まれた、機械的な研磨作用を有する機械的研磨粒子とを含む研磨層を用いて前記被研磨体を研磨することを特徴とする研磨方法。 A polishing method for polishing an object to be polished while sliding the object and an abrasive layer relative to each other, comprising:
A polishing method characterized by polishing the object to be polished using a polishing layer including a polishing surface having a large number of recesses formed thereon and mechanical abrasive particles having a mechanical abrasive action embedded so as to be exposed from the polishing surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3392498A JPH10277923A (en) | 1997-02-03 | 1998-01-31 | Polishing apparatus and polishing method |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3548297 | 1997-02-03 | ||
| JP9-35482 | 1997-02-03 | ||
| JP3392498A JPH10277923A (en) | 1997-02-03 | 1998-01-31 | Polishing apparatus and polishing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH10277923A JPH10277923A (en) | 1998-10-20 |
| JPH10277923A5 true JPH10277923A5 (en) | 2005-08-18 |
Family
ID=26372696
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3392498A Pending JPH10277923A (en) | 1997-02-03 | 1998-01-31 | Polishing apparatus and polishing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH10277923A (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6913517B2 (en) * | 2002-05-23 | 2005-07-05 | Cabot Microelectronics Corporation | Microporous polishing pads |
| US7195544B2 (en) * | 2004-03-23 | 2007-03-27 | Cabot Microelectronics Corporation | CMP porous pad with component-filled pores |
| JP2010214575A (en) * | 2009-03-19 | 2010-09-30 | Sumitomo Bakelite Co Ltd | Method for manufacturing laminated plate for workpiece holding material, laminated plate for workpiece holding material, and workpiece holding material |
| JP7433170B2 (en) * | 2020-09-07 | 2024-02-19 | 株式会社ノリタケカンパニーリミテド | Wafer polishing method and wafer polishing device |
| JP7650218B2 (en) * | 2021-10-19 | 2025-03-24 | ノリタケ株式会社 | Polishing pad and method of manufacturing same |
| JP7728223B2 (en) * | 2022-03-30 | 2025-08-22 | ノリタケ株式会社 | Polishing pad and method of manufacturing the same |
| JP2023150173A (en) * | 2022-03-31 | 2023-10-16 | 株式会社ノリタケカンパニーリミテド | polishing pad |
-
1998
- 1998-01-31 JP JP3392498A patent/JPH10277923A/en active Pending
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