JPH10279070A - Substrate transfer fingers - Google Patents
Substrate transfer fingersInfo
- Publication number
- JPH10279070A JPH10279070A JP9410597A JP9410597A JPH10279070A JP H10279070 A JPH10279070 A JP H10279070A JP 9410597 A JP9410597 A JP 9410597A JP 9410597 A JP9410597 A JP 9410597A JP H10279070 A JPH10279070 A JP H10279070A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- finger
- height
- suction
- glass substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Landscapes
- Liquid Crystal (AREA)
- Manipulator (AREA)
- Warehouses Or Storage Devices (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
(57)【要約】
【課題】各支持点に確実に接触した状態で基板を吸着
し、搬送することができる基板搬送用フィンガを提供す
る。
【解決手段】基板を吸着して搬送するための基板搬送用
フィンガであって、平板状のフィンガ本体1と、フィン
ガ本体1上に配設され、基板を支持するための高さの等
しい少なくとも4つの支持部材2と、支持部材2の間の
略中央部に配置された基板を吸着するための吸着部材3
であって、少なくとも4つの支持部材2と高さの異なる
少なくとも1つの吸着部材3とを具備する。
(57) Abstract: A substrate transfer finger capable of adsorbing and transferring a substrate while securely contacting each support point is provided. Kind Code: A1 A substrate transport finger for sucking and transporting a substrate, comprising: a flat finger body; and at least four finger bodies disposed on the finger body and having the same height for supporting the substrate. One supporting member 2 and an adsorbing member 3 for adsorbing a substrate disposed at a substantially central portion between the supporting members 2
And at least four support members 2 and at least one suction member 3 having a different height.
Description
【0001】[0001]
【発明の属する技術分野】本発明は、液晶表示装置用ガ
ラス基板等の基板を吸着して搬送するための基板搬送用
フィンガに関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate transfer finger for sucking and transferring a substrate such as a glass substrate for a liquid crystal display device.
【0002】[0002]
【従来の技術】従来、ガラス基板の搬送用フィンガとし
ては、本願出願人が既に出願している特開平8−208
003号に記載されたものが知られている。2. Description of the Related Art Conventionally, as a finger for transporting a glass substrate, Japanese Patent Application Laid-Open No. Hei 8-208 filed by the present applicant has been used.
No. 003 is known.
【0003】この従来例では、ガラス基板搬送用フィン
ガは、クリーン度を保ったあと、ガラス基板表面に傷等
をつけないように必要最少限の支持点で支持及び吸着を
行っている。In this conventional example, the glass substrate transfer finger supports and sucks at a minimum necessary support point so as not to damage the glass substrate surface after keeping the cleanness.
【0004】[0004]
【発明が解決しようとする課題】しかしながら、上記の
従来例では、各支持点の高さに機械加工精度でバラツキ
があり、一様にならない場合があり、ガラス基板の搬送
中に支持点に接触しないガラス基板の部分が振動してた
たき音が発生したりや、吸着ミスが発生する場合がある
という問題点があった。However, in the above-mentioned conventional example, the height of each support point varies in the machining accuracy and may not be uniform. There is a problem that a tapping sound is generated due to vibration of a portion of the glass substrate that is not used, and a suction error may occur.
【0005】従って、本発明は上述した課題に鑑みてな
されたものであり、その目的は、各支持点に確実に接触
した状態で基板を吸着し、搬送することができる基板搬
送用フィンガを提供することである。SUMMARY OF THE INVENTION Accordingly, the present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide a substrate transfer finger capable of adsorbing and transferring a substrate while securely contacting each support point. It is to be.
【0006】[0006]
【課題を解決するための手段】上述した課題を解決し、
目的を達成するために、本発明に係わる基板搬送用フィ
ンガは、基板を吸着して搬送するための基板搬送用フィ
ンガであって、平板状のフィンガ本体と、該フィンガ本
体上に配設され、前記基板を支持するための高さの等し
い少なくとも4つの支持部材と、該支持部材の間の略中
央部に配置された前記基板を吸着するための吸着部材で
あって、前記少なくとも4つの支持部材と高さの異なる
少なくとも1つの吸着部材とを具備することを特徴とし
ている。Means for Solving the Problems The above-mentioned problems are solved,
In order to achieve the object, a substrate transfer finger according to the present invention is a substrate transfer finger for sucking and transferring a substrate, a flat plate-shaped finger body, and disposed on the finger body, At least four supporting members having the same height for supporting the substrate, and an adsorbing member for adsorbing the substrate disposed at a substantially central portion between the supporting members, wherein the at least four supporting members are provided. And at least one suction member having a different height.
【0007】また、この発明に係わる基板搬送用フィン
ガにおいて、前記フィンガは、搬送用ロボットに水平に
片持ち固定されていることを特徴としている。Further, in the substrate transfer finger according to the present invention, the finger is horizontally and cantileverly fixed to the transfer robot.
【0008】また、この発明に係わる基板搬送用フィン
ガにおいて、前記吸着部材は、前記支持部材間の中心線
状に3個並んで配置されていることを特徴としている。Further, in the substrate transfer finger according to the present invention, three of the suction members are arranged side by side on a center line between the support members.
【0009】また、この発明に係わる基板搬送用フィン
ガにおいて、前記吸着部材の上面の高さは、前記少なく
とも4個の支持部材の上面の高さよりも所定値だけ高く
設定されている特徴としている。Further, in the substrate transport finger according to the present invention, the height of the upper surface of the suction member is set higher than the height of the upper surface of the at least four support members by a predetermined value.
【0010】また、この発明に係わる基板搬送用フィン
ガにおいて、前記支持部材が支持する四角形状の前記基
板の縦の長さをA、横の長さをBとすると、前記支持部
材は前記基板の横の辺より0.21×Aだけ内側で且つ
縦の辺より0.21×Bだけ内側の位置に配置されてい
ることを特徴としている。Further, in the substrate transfer finger according to the present invention, if the vertical length of the rectangular substrate supported by the support member is A and the horizontal length is B, the support member is It is characterized by being arranged at a position inside by 0.21 × A from the horizontal side and at a position inside by 0.21 × B from the vertical side.
【0011】また、この発明に係わる基板搬送用フィン
ガにおいて、前記少なくとも4個の支持部材は、前記フ
ィンガ本体に対して高さ調整可能に配設されていること
を特徴としている。Further, in the substrate transfer finger according to the present invention, the at least four support members are arranged so as to be adjustable in height with respect to the finger body.
【0012】また、この発明に係わる基板搬送用フィン
ガにおいて、前記少なくとも4個の支持部材は、スペー
サにより前記フィンガ本体に対して高さ調整可能に配設
されていることを特徴としている。Further, in the substrate transfer finger according to the present invention, the at least four support members are arranged so as to be adjustable in height with respect to the finger body by a spacer.
【0013】[0013]
【発明の実施の形態】以下、本発明の好適な一実施形態
について、添付図面を参照して詳細に説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.
【0014】図1は、本発明の一実施形態に係わる基板
搬送用フィンガのフィンガ本体を上方から見た斜視図で
ある。また、図2は図1のフィンガ本体を背面から見た
斜視図、図3乃至図5はそれぞれ図1のフィンガ本体の
A−A、C−CおよびB−Bにおける断面図である。FIG. 1 is a perspective view of a finger body of a substrate transfer finger according to an embodiment of the present invention as viewed from above. 2 is a perspective view of the finger main body of FIG. 1 as viewed from the back, and FIGS. 3 to 5 are cross-sectional views of the finger main body of FIG. 1 along AA, CC, and BB, respectively.
【0015】フィンガ本体1は図3に示す断面形状Aを
有する第1形状部1aと図5に示す断面形状Bを有する
第2形状部1bと複数(図1では4か所)の基板支持用
張出し部1c(図4参照)とから構成される。張出し部
1cには、不図示の基板を支持するための支持部材2が
設けられている。The finger body 1 has a first shape portion 1a having a cross-sectional shape A shown in FIG. 3 and a second shape portion 1b having a cross-sectional shape B shown in FIG. 5, and a plurality of (four in FIG. 1) substrates. And an overhang portion 1c (see FIG. 4). The overhang portion 1c is provided with a support member 2 for supporting a substrate (not shown).
【0016】第1形状部1aの中心線上には、基板を吸
着するための吸着パッド3が設けられている(図1では
3か所)。フィンガ本体1の裏面には、図2に示すよう
に、基板を吸着するための吸着エアーを導くための配管
部4が配設されている。具体的にはフィンガ本体1に溝
4を切り、後で帯状部材5を接着剤等で接着し、溝4を
密封することによって、配管路を構成している。もちろ
ん、ロングドリル等で丸穴をあけてもよい。溝4は図1
の吸着パッド部において吸着パッド3の穴3aと貫通し
ている。On the center line of the first shape portion 1a, suction pads 3 for sucking the substrate are provided (three positions in FIG. 1). As shown in FIG. 2, on the back surface of the finger main body 1, a piping section 4 for guiding suction air for sucking a substrate is provided. Specifically, a groove 4 is cut in the finger main body 1, a band-like member 5 is later bonded with an adhesive or the like, and the groove 4 is sealed to form a piping path. Of course, a round hole may be formed with a long drill or the like. The groove 4 is shown in FIG.
In the suction pad portion, and penetrates through the hole 3a of the suction pad 3.
【0017】フィンガ1をロボット等と固定する部分に
は取付用ボルト穴7および吸着エア供給用穴6が形成さ
れている。上述のように構成されたフィンガは、図6の
ようにロボット101(詳細図は図示せず)に固定さ
れ、例えばカセット102にガラス基板103を収納し
たり、逆にカセットからガラス基板104を取り出した
りするのに用いられる。A mounting bolt hole 7 and a suction air supply hole 6 are formed in a portion where the finger 1 is fixed to a robot or the like. The finger configured as described above is fixed to a robot 101 (a detailed view is not shown) as shown in FIG. 6, and for example, a glass substrate 103 is stored in a cassette 102 or a glass substrate 104 is taken out from the cassette. Used for
【0018】次に基板支持部材2の位置であるが、図7
に示すように基板103の寸法をP×Q、基板支持部材
2の各辺からの距離をp,qとすると、公知のとおり、 p1 =0.21P、q1 =0.21Q …(1) となるようにp及びqの値を概略決定すると基板のたわ
み量が最小となる。Next, regarding the position of the substrate support member 2, FIG.
Assuming that the dimensions of the substrate 103 are P × Q and the distances from each side of the substrate supporting member 2 are p and q, as is known, p1 = 0.21P, q1 = 0.21Q (1) When the values of p and q are roughly determined so as to be as described above, the deflection amount of the substrate is minimized.
【0019】次に、本発明の特徴的な部分である基板支
持部材2及び吸着パッド3の高さ関係について述べる。Next, the height relationship between the substrate support member 2 and the suction pad 3, which is a characteristic part of the present invention, will be described.
【0020】ガラス基板103を図7に示した状態で支
持したときのガラス基板103の変形は図8(b)のよ
うになり、基板103のガラス基板吸着部a,b,cで
の変形はX−X断面、Y−Y断面でそれぞれ示され、そ
の変形量をv1 ,v2 とすると、v1 <v2 となる関係
がある。つまり、吸着部bに対応するガラス基板103
の部位は吸着部a,cに対応するガラス基板103の部
位よりも変形量が大きい。FIG. 8B shows the deformation of the glass substrate 103 when the glass substrate 103 is supported in the state shown in FIG. 7, and the deformation of the substrate 103 at the glass substrate suction portions a, b, and c. It is shown by an XX section and a YY section, respectively, and when the deformation amounts are v1 and v2, there is a relation of v1 <v2. That is, the glass substrate 103 corresponding to the suction portion b
Is larger in deformation amount than the portion of the glass substrate 103 corresponding to the suction portions a and c.
【0021】次に、図9のようにガラス基板103を3
ヶ所の吸着部パッド3のみで吸着支持したとき(すなわ
ち基板支持部材2を取り除いた状態)のガラス基板10
3の変形は、図9(b)のようになり、ガラス基板支持
部に対応する位置a’,b’,c’,d’での変形は
X’−X’断面で示される。その変形量をv1 ’とす
る。Next, as shown in FIG.
Glass substrate 10 when sucked and supported by only three suction portion pads 3 (that is, with substrate support member 2 removed)
The deformation of No. 3 is as shown in FIG. 9B, and the deformation at the positions a ′, b ′, c ′, d ′ corresponding to the glass substrate support is shown by the X′-X ′ cross section. Let the deformation amount be v1 '.
【0022】更に、前記のようにガラス基板103を図
8のように支持したときとのたわみ量の比較を行うと、
v1 <v2 <v1 ’なる関係がある。すなわち、ガラス
基板103を吸着パッドのみで支持したときが、ガラス
基板103のたわみ量が最も大きくなる。Further, when the amount of deflection is compared with the case where the glass substrate 103 is supported as shown in FIG.
There is a relationship v1 <v2 <v1 '. That is, when the glass substrate 103 is supported only by the suction pad, the amount of deflection of the glass substrate 103 is the largest.
【0023】例えば、図7において、Q=360mm、
P=465mm、q1 =75mm、p1 =97.5mm
とすると、厚さt=1.1mm、t=0.7mmのガラ
ス基板の各部位の変形量は図11のようになる。For example, in FIG. 7, Q = 360 mm,
P = 465 mm, q1 = 75 mm, p1 = 97.5 mm
Then, the deformation amount of each part of the glass substrate having the thickness t = 1.1 mm and t = 0.7 mm is as shown in FIG.
【0024】当然ながら、ガラス基板103の厚みが厚
い方が支持時の変形量が少ない。As a matter of course, the larger the thickness of the glass substrate 103, the smaller the amount of deformation during support.
【0025】このようにガラス基板103を図8のよう
に外側4ヶ所の支持部で支持するか、図9のように3ヶ
所の吸着パッド3で支持するかによって、外側4ヶ所の
支持部2の上面の高さと、3ヶ所の吸着パッド3の上面
の高さの差に要求される精度(許容公差)が変わってく
る。Depending on whether the glass substrate 103 is supported by the four support portions on the outside as shown in FIG. 8 or by the three suction pads 3 as shown in FIG. And the required accuracy (allowable tolerance) for the difference between the heights of the upper surfaces and the heights of the upper surfaces of the three suction pads 3.
【0026】言い換えれば、ガラス基板103を外側4
ヶ所の基板支持部材2で支持する場合には、吸着パッド
3の高さが、基板支持部材2と同じ高さか、ガラス基板
103の中央部での自重変形分だけ低い高さとの間にあ
れば、吸着パッド3でガラス基板103を吸着したとき
にガラス基板103が支持部材2から浮いてしまうこと
もないし、吸着パッド3がガラス基板103を吸着でき
ないことも起こらない。すなわち、支持部材2の高さと
吸着パッド3の高さの差に要求される許容公差は、(支
持部材2の高さ)と(支持部材2の高さ−ガラス基板の
自重変形によるたわみ量)の間となる。また、3つの吸
着パッド3でガラス基板103を支持する場合も同様
で、支持部材2の高さと吸着パッド3の高さの差に要求
される許容公差は、(支持部材2の高さ)と(支持部材
2の高さ−ガラス基板の自重変形によるたわみ量)の間
となる。In other words, the glass substrate 103 is placed on the outside 4
In the case where the substrate is supported by the two substrate support members 2, if the height of the suction pad 3 is the same as that of the substrate support member 2, or if the height is lower than the height of the glass substrate 103 by its own weight deformation at the center of the glass substrate 103, When the glass substrate 103 is sucked by the suction pad 3, the glass substrate 103 does not float from the support member 2, and the suction pad 3 cannot suck the glass substrate 103. That is, the allowable tolerance required for the difference between the height of the support member 2 and the height of the suction pad 3 is (height of the support member 2) and (height of the support member 2−deflection amount due to deformation of the glass substrate by its own weight). Between. The same applies to the case where the glass substrate 103 is supported by the three suction pads 3. The allowable tolerance required for the difference between the height of the support member 2 and the height of the suction pad 3 is (the height of the support member 2). (The height of the support member 2−the amount of deflection of the glass substrate due to its own weight deformation).
【0027】具体的には、図8のように外側4ヶ所の支
持部材2の上面を基準とし、360×465mm、t=
1.1mmのガラス基板103を把持しようとした時、
支持部材2の上面の高さと3ヶ所の吸着パッド3の上面
との高さの差の公差(この場合、支持部材2の上面より
吸着パッド3の上面のほうが低い)は、a,c部で0.
05mm以下、b部で0.17mm以下となる。支持部
材2の高さと吸着パッド3の高さの差がこれらの数値以
内のとき、ガラス基板103は全ての支持点および吸着
面で接触する。高さの差がこれより大きくなると吸着面
に接触せず、吸着不能となる。これがガラス基板の中凹
把持である。More specifically, as shown in FIG. 8, with reference to the upper surfaces of the four outer support members 2, 360 × 465 mm, t =
When trying to hold a 1.1 mm glass substrate 103,
The tolerance of the difference between the height of the upper surface of the support member 2 and the height of the three suction pads 3 (in this case, the upper surface of the suction pad 3 is lower than the upper surface of the support member 2) 0.
05 mm or less, and 0.17 mm or less in part b. When the difference between the height of the support member 2 and the height of the suction pad 3 is within these values, the glass substrate 103 contacts all the support points and the suction surface. If the difference in height is larger than this, no contact is made with the suction surface, and suction becomes impossible. This is the middle concave grip of the glass substrate.
【0028】一方、図9のように3ヶ所の吸着パッド3
の上面を基準として360×465mm、t=1.1m
mのガラス基板103を把持しようとしたとき、外側4
ヶ所の支持部材2の上面の高さと吸着パッド3の上面の
高さの差の公差(この場合、支持部材2の上面より吸着
パッド3の上面のほうが高い)は0.2mm以下とな
る。図8の場合と同様に支持部材2の高さと吸着パッド
3の高さの差がこの数値以内のときガラス基板103は
全ての支持点および吸着面で接触する。高さの差がこれ
より大きくなると吸着面に接触せず、吸着不能となる。
これがガラス基板の中凸把持である。On the other hand, as shown in FIG.
360 × 465 mm, t = 1.1 m based on the upper surface of
When trying to grip the glass substrate 103 of m
The tolerance of the difference between the height of the upper surface of the support member 2 and the height of the upper surface of the suction pad 3 (in this case, the upper surface of the suction pad 3 is higher than the upper surface of the support member 2) is 0.2 mm or less. As in the case of FIG. 8, when the difference between the height of the support member 2 and the height of the suction pad 3 is within this value, the glass substrate 103 contacts all the support points and the suction surface. If the difference in height is larger than this, no contact is made with the suction surface, and suction becomes impossible.
This is the middle convex grip of the glass substrate.
【0029】以上にようにみてみると、中凸把持の方が
支持部材2と吸着パッド3の高さの差に許される公差が
大きくとれるため、基板搬送フィンガの製作上の精度が
ゆるくなり有利であることがわかる(図10のx)。ま
た、実際にはガラス基板103に初期ソリがあったり、
プロセス(工程)による変形があったりするため、交差
の範囲は若干大小する。From the above, it can be seen that the central convex grip has a greater tolerance in the difference in height between the support member 2 and the suction pad 3, so that the precision in manufacturing the substrate transport finger is reduced, which is advantageous. (X in FIG. 10). Also, actually, the glass substrate 103 has an initial warp,
The crossing range is slightly larger or smaller due to deformation due to the process (step).
【0030】更に、機械工作精度によるバラツキをとり
やすくするため、図10に示すように外側4ヶ所の支持
部材2のフィンガ取付面側に支持部材2の高さを調整で
きるようにスペーサを配置しておくと良い。吸着パッド
3側をスペーサ調整するとバキュームエアーがリークし
やすくなるので好ましくない。Further, in order to facilitate variation due to machining accuracy, spacers are arranged on the finger mounting surface side of the four outer supporting members 2 so as to adjust the height of the supporting members 2 as shown in FIG. Good to keep. It is not preferable to adjust the spacer on the suction pad 3 side because vacuum air is likely to leak.
【0031】以上説明したように、上記の実施形態にお
いては、吸着パッドの高さを支持部材の高さより若干高
くしておくことにより、支持部材の高さと吸着パッドの
高さの差に許される公差が大きくなり、基板搬送フィン
ガの製作が容易になる。As described above, in the above embodiment, by setting the height of the suction pad slightly higher than the height of the support member, the difference between the height of the support member and the height of the suction pad is allowed. The tolerance is increased, and the manufacture of the substrate transfer finger is facilitated.
【0032】なお、本発明は、その主旨を逸脱しない範
囲で、上記実施形態を修正又は変形したものに適用可能
である。It should be noted that the present invention can be applied to a modification or modification of the above embodiment without departing from the gist thereof.
【0033】[0033]
【発明の効果】以上説明したように、本発明によれば、
以下のような効果が得られる。 (1)ガラス基板を確実に吸着把持できる基板搬送用フ
ィンガを提供できる。 (2)ガラス基板を安定に吸着把持及び搬送できる。 (3)機械加工精度上、作り易い基板搬送用フィンガを
提供できる。 (4)支持点の高さ調整が容易にできる。As described above, according to the present invention,
The following effects can be obtained. (1) It is possible to provide a substrate transfer finger capable of reliably sucking and holding a glass substrate. (2) The glass substrate can be stably gripped and transported. (3) It is possible to provide a substrate transfer finger that is easy to manufacture because of its machining accuracy. (4) The height of the support point can be easily adjusted.
【0034】[0034]
【図1】本発明の一実施形態に係わるフィンガの上面斜
視図である。FIG. 1 is a top perspective view of a finger according to an embodiment of the present invention.
【図2】図1のフィンガの下面斜視図である。FIG. 2 is a bottom perspective view of the finger of FIG. 1;
【図3】図1のフィンガのA−A断面図である。FIG. 3 is a sectional view taken along line AA of the finger of FIG. 1;
【図4】図1のフィンガのC−C断面図である。FIG. 4 is a sectional view taken along line CC of the finger of FIG. 1;
【図5】図1のフィンガのB−B断面図である。FIG. 5 is a sectional view of the finger of FIG. 1 taken along line BB.
【図6】図1のフィンガをロボットに装着した様子を示
す図である。FIG. 6 is a diagram showing a state where the finger of FIG. 1 is mounted on a robot.
【図7】図1のフィンガにおける基板支持位置を示す図
である。FIG. 7 is a view showing a substrate supporting position in the finger of FIG. 1;
【図8】4ヶ所の基板支持部材のみで支持したときの基
板の変形を示す図である。FIG. 8 is a diagram illustrating deformation of a substrate when the substrate is supported only by four substrate support members.
【図9】3ヶ所の吸着パッドのみで支持したときの基板
の変形を示す図である。FIG. 9 is a diagram illustrating deformation of a substrate when supported by only three suction pads.
【図10】図1のフィンガの4ヶ所の基板支持部材上面
と、3ヶ所の吸着パッド上面との高さ関係を示す図であ
る。FIG. 10 is a diagram illustrating a height relationship between four upper surfaces of a substrate support member and three upper surfaces of a suction pad of the finger of FIG. 1;
【図11】基板の厚さと基板の自重によるたわみ量の関
係を示す図である。FIG. 11 is a diagram showing the relationship between the thickness of the substrate and the amount of deflection due to the weight of the substrate.
1 フィンガ本体 1a 第1形状部 1b 第2形状部 2 基板支持部材 3 基板吸着パッド 3a 吸着パッドの穴 4 吸着エアー配管路(溝) 5 エアー配管カバー 6 吸着エアー供給穴 7 フィンガ固定用穴 10 スペーサ 11 フィンガ固定位置(フィンガ固定端) 101 ロボット 102 カセット 103 ガラス基板 104 カセットに収納された基板 DESCRIPTION OF SYMBOLS 1 Finger main body 1a 1st shape part 1b 2nd shape part 2 Substrate support member 3 Substrate suction pad 3a Suction pad hole 4 Suction air piping (groove) 5 Air piping cover 6 Suction air supply hole 7 Finger fixing hole 10 Spacer 11 Finger fixed position (Finger fixed end) 101 Robot 102 Cassette 103 Glass substrate 104 Substrate stored in cassette
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 FI H01L 21/68 H01L 21/68 B ──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. 6 Identification code FI H01L 21/68 H01L 21/68 B
Claims (7)
用フィンガであって、 平板状のフィンガ本体と、 該フィンガ本体上に配設され、前記基板を支持するため
の高さの等しい少なくとも4つの支持部材と、 該支持部材の間の略中央部に配置された前記基板を吸着
するための吸着部材であって、前記少なくとも4つの支
持部材と高さの異なる少なくとも1つの吸着部材とを具
備することを特徴とする基板搬送用フィンガ。1. A finger for transporting a substrate for sucking and transporting a substrate, comprising: a plate-shaped finger main body; and at least an equal height provided on the finger main body and supporting the substrate. Four supporting members, and an adsorbing member for adsorbing the substrate arranged at a substantially central portion between the supporting members, wherein the at least four supporting members and at least one adsorbing member having different heights are provided. A finger for transporting a substrate, comprising:
に片持ち固定されていることを特徴とする請求項1に記
載の基板搬送用フィンガ。2. The substrate transfer finger according to claim 1, wherein the finger is horizontally and cantileverly fixed to a transfer robot.
線状に3個並んで配置されていることを特徴とする請求
項1に記載の基板搬送用フィンガ。3. The substrate transfer finger according to claim 1, wherein three suction members are arranged side by side along a center line between the support members.
くとも4個の支持部材の上面の高さよりも所定値だけ高
く設定されている特徴とする請求項1に記載の基板搬送
用フィンガ。4. The substrate transfer finger according to claim 1, wherein the height of the upper surface of the suction member is set higher than the height of the upper surface of the at least four support members by a predetermined value.
基板の縦の長さをA、横の長さをBとすると、前記支持
部材は前記基板の横の辺より0.21×Aだけ内側で且
つ縦の辺より0.21×Bだけ内側の位置に配置されて
いることを特徴とする請求項1に記載の基板搬送用フィ
ンガ。5. Assuming that the vertical length of the rectangular substrate supported by the support member is A and the horizontal length is B, the support member is 0.21 × A from the horizontal side of the substrate. 2. The substrate transfer finger according to claim 1, wherein the finger is disposed inside and at a position inside the vertical side by 0.21 * B.
フィンガ本体に対して高さ調整可能に配設されているこ
とを特徴とする請求項1に記載の基板搬送用フィンガ。6. The substrate transfer finger according to claim 1, wherein the at least four support members are provided so as to be adjustable in height with respect to the finger body.
ーサにより前記フィンガ本体に対して高さ調整可能に配
設されていることを特徴とする請求項6に記載の基板搬
送用フィンガ。7. The substrate transfer finger according to claim 6, wherein the at least four support members are arranged so as to be height-adjustable with respect to the finger body by a spacer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9410597A JPH10279070A (en) | 1997-04-11 | 1997-04-11 | Substrate transfer fingers |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9410597A JPH10279070A (en) | 1997-04-11 | 1997-04-11 | Substrate transfer fingers |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH10279070A true JPH10279070A (en) | 1998-10-20 |
Family
ID=14101169
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9410597A Withdrawn JPH10279070A (en) | 1997-04-11 | 1997-04-11 | Substrate transfer fingers |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH10279070A (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002305233A (en) * | 2001-04-05 | 2002-10-18 | Olympus Optical Co Ltd | Arm for carrying wafer |
| JP2004026426A (en) * | 2002-06-26 | 2004-01-29 | Espec Corp | Printed circuit board supporting structure, its loading device and robot hand |
| WO2004113205A1 (en) * | 2003-06-19 | 2004-12-29 | Rorze Corporation | Thin plate-supporting body |
| KR100520232B1 (en) * | 2002-08-23 | 2005-10-11 | 로체 시스템즈(주) | End Effector for robot conveying glass plate |
| JP2007008700A (en) * | 2005-07-04 | 2007-01-18 | Toshiba Mach Co Ltd | Method and apparatus for transporting flat plate-like conveyed product |
| KR100916532B1 (en) * | 2007-01-19 | 2009-09-11 | 피에스케이 주식회사 | Board Carrier |
| KR20200062152A (en) * | 2020-05-27 | 2020-06-03 | 세메스 주식회사 | Hot plate and apparatus for heat-treating substrate with the hot plate, and fabricating method of the hot plate |
| JP2023013106A (en) * | 2021-07-15 | 2023-01-26 | 東京エレクトロン株式会社 | Substrate transport device and substrate transport method |
| US11735443B2 (en) | 2018-08-21 | 2023-08-22 | Semes Co., Ltd. | Hot plate, substrate heat-treating apparatus including the hot plate, and method of fabricating the hot plate |
-
1997
- 1997-04-11 JP JP9410597A patent/JPH10279070A/en not_active Withdrawn
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002305233A (en) * | 2001-04-05 | 2002-10-18 | Olympus Optical Co Ltd | Arm for carrying wafer |
| JP2004026426A (en) * | 2002-06-26 | 2004-01-29 | Espec Corp | Printed circuit board supporting structure, its loading device and robot hand |
| KR100520232B1 (en) * | 2002-08-23 | 2005-10-11 | 로체 시스템즈(주) | End Effector for robot conveying glass plate |
| WO2004113205A1 (en) * | 2003-06-19 | 2004-12-29 | Rorze Corporation | Thin plate-supporting body |
| JP2007008700A (en) * | 2005-07-04 | 2007-01-18 | Toshiba Mach Co Ltd | Method and apparatus for transporting flat plate-like conveyed product |
| KR100916532B1 (en) * | 2007-01-19 | 2009-09-11 | 피에스케이 주식회사 | Board Carrier |
| US11735443B2 (en) | 2018-08-21 | 2023-08-22 | Semes Co., Ltd. | Hot plate, substrate heat-treating apparatus including the hot plate, and method of fabricating the hot plate |
| KR20200062152A (en) * | 2020-05-27 | 2020-06-03 | 세메스 주식회사 | Hot plate and apparatus for heat-treating substrate with the hot plate, and fabricating method of the hot plate |
| JP2023013106A (en) * | 2021-07-15 | 2023-01-26 | 東京エレクトロン株式会社 | Substrate transport device and substrate transport method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 20040706 |