JPH10279898A - Thermosetting adhesive sheet - Google Patents
Thermosetting adhesive sheetInfo
- Publication number
- JPH10279898A JPH10279898A JP9086468A JP8646897A JPH10279898A JP H10279898 A JPH10279898 A JP H10279898A JP 9086468 A JP9086468 A JP 9086468A JP 8646897 A JP8646897 A JP 8646897A JP H10279898 A JPH10279898 A JP H10279898A
- Authority
- JP
- Japan
- Prior art keywords
- parts
- curing
- adhesive sheet
- epoxy resin
- epoxy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Adhesives Or Adhesive Processes (AREA)
Abstract
(57)【要約】
【課題】電子部品、半導体部品接着材料として、低温低
圧圧着できる、ポリイミド等のフィルム材料、金属、シ
リコン、エポキシ、セラミック等に対する接着性が硬化
時、半硬化時共に優れ、半硬化時の加工性に優れ、さら
に硬化時の耐湿性、耐熱性を併せもつ熱硬化性接着シ−
トを提供すること。
【解決手段】エポキシ樹脂及び硬化剤成分１００部（重
量）に対し、ゴム変成のエポキシ樹脂２０〜５０部、分
子量が１万以上のエポキシ骨格の高分子成分１０〜４０
部、分子量５万以上のゴム成分５０〜１５０部、硬化促
進剤０．３〜２．５部からなる接着剤組成物を、基材フ
ィルムに塗布し、半硬化状態に熱処理してなる熱硬化性
接着シ一ト。[57] [Problem] As an adhesive material for electronic parts and semiconductor parts, adhesiveness to film materials such as polyimide, metal, silicon, epoxy, ceramic, etc., which can be pressed at low temperature and low pressure, is excellent both at the time of curing and semi-curing, A thermosetting adhesive sheet that has excellent workability during semi-curing, and has both moisture resistance and heat resistance during curing.
To provide A rubber-modified epoxy resin (20 to 50 parts) and an epoxy skeleton polymer component (10 to 40) having a molecular weight of 10,000 or more based on 100 parts (weight) of an epoxy resin and a curing agent component.
Part, an adhesive composition comprising 50 to 150 parts of a rubber component having a molecular weight of 50,000 or more and 0.3 to 2.5 parts of a curing accelerator is applied to a base film, and heat-treated by heat treatment to a semi-cured state. Adhesive sheet.
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、電子部品、半導体
部品接着材料として、低温、低圧で接着、硬化できか
つ、ポリイミド等のフィルム材料、金属、シリコン、エ
ポキシ、セラミック等に対する接着性が硬化時、半硬化
時共に優れ、半硬化時の加工性に優れ、硬化時の耐湿
性、耐熱性を併せもつ熱硬化性接着シ−トに関する。BACKGROUND OF THE INVENTION The present invention relates to an adhesive material for electronic parts and semiconductor parts which can be bonded and cured at low temperature and low pressure, and has good adhesion to film materials such as polyimide, metal, silicon, epoxy and ceramic. The present invention relates to a thermosetting adhesive sheet which is excellent in both semi-cured conditions, has excellent workability in semi-cured conditions, and has both moisture resistance and heat resistance during curing.
【０００２】[0002]
【従来の技術】従来、電子部品、半導体部品接着材料の
接着材料としては、ガラスエポキシプリプレグやエポキ
シ樹脂に各種ゴムを添加した接着シ−ト材料や、液状の
接着剤を塗布して接着する等の方法がとられている。こ
こで、ガラスエポキシプリプレグを使用した場合には、
接着剤の薄膜化が難しい、接着条件が高温で長時間であ
る、吸湿後の密着性の確保が難しい、加工時に切断粉が
発生する等の問題があった。また、エポキシ樹脂に各種
ゴムを添加した接着シ一ト材料は、加工性や密着性の改
善は図られているが、接着シ−ト自身の凝集破壊が起こ
りやすい、接着剤の耐熱性が乏しい等の欠点があった。
さらに液状の接着剤では、作業工数が大きい、塗布時の
ニジミ、ズレ等による、扱いづらさなどの問題があっ
た。2. Description of the Related Art Conventionally, as an adhesive material for an electronic component and a semiconductor component adhesive material, an adhesive sheet material obtained by adding various rubbers to glass epoxy prepreg or epoxy resin, or a liquid adhesive is applied and adhered. The method of is taken. Here, when using a glass epoxy prepreg,
There are problems that it is difficult to make the adhesive thinner, that the bonding condition is a long time at a high temperature, that it is difficult to ensure adhesion after moisture absorption, and that cutting powder is generated during processing. The adhesive sheet material obtained by adding various rubbers to the epoxy resin is improved in processability and adhesion, but the adhesive sheet itself is apt to undergo cohesive failure, and the adhesive has poor heat resistance. And the like.
Further, liquid adhesives have problems such as a large number of work steps, and difficulty in handling due to bleeding and deviation during application.
【０００３】[0003]
【発明が解決しようとする課題】本発明はかかる状況に
鑑みなされたもので、電子部品、半導体部品接着材料と
して、低温、低圧で接着硬化でき、かつ、ポリイミド等
のフィルム材料、金属、シリコン、エポキシ、セラミッ
ク等に対する接着性が硬化時、半硬化時共に優れ、半硬
化時の加工性に優れ、硬化時の耐湿性、耐熱性を併せも
つ熱硬化性接着シ−トを提供するものである。SUMMARY OF THE INVENTION The present invention has been made in view of such circumstances, and as an adhesive material for electronic parts and semiconductor parts, can be adhesively cured at low temperature and low pressure, and can be a film material such as polyimide, metal, silicon, or the like. An object of the present invention is to provide a thermosetting adhesive sheet which has excellent adhesiveness to epoxy, ceramics, etc. at the time of curing and semi-curing, has excellent workability at the time of semi-curing, and has both moisture resistance and heat resistance at the time of curing. .
【０００４】[0004]
【課題を解決するための手段】即ち本発明は、エポキシ
樹脂及び硬化剤成分１００部（重量）に対し、ゴム変成
のエポキシ樹脂２０〜５０部、分子量が１万以上のエポ
キシ骨格の高分子成分１０〜４０部、分子量５万以上の
ゴム成分５０〜１５０部、硬化促進剤０．３〜２．５部
からなる接着剤組成物を、基材フィルムに塗布し、半硬
化状態に熱処理してなる熱硬化性接着シ一トに関する。That is, the present invention relates to a rubber-modified epoxy resin having a molecular weight of 20 to 50 parts and an epoxy skeleton polymer component having a molecular weight of 10,000 or more based on 100 parts (weight) of an epoxy resin and a curing agent component. An adhesive composition comprising 10 to 40 parts, 50 to 150 parts of a rubber component having a molecular weight of 50,000 or more, and 0.3 to 2.5 parts of a curing accelerator is applied to a base film and heat-treated to a semi-cured state. The present invention relates to a thermosetting adhesive sheet.
【０００５】[0005]
【発明の実施の形態】本発明に用いられるエポキシ樹脂
としては、特に制限するのものではないが、好ましくは
エポキシ当量５００以上の２３℃以下の温度で固形のも
のが好ましく、エポキシ当量５００以上のエポキシ樹脂
を使用することにより、切断加工時の切断粉発生を切断
温度１０℃まで向上できる。この様なエポキシ樹脂とし
ては、エピコート−１００１、１００３（油化シェル株
式会社製）、エピクロン−９００、１０５０（大日本イ
ンキ化学株式会社製）等がある。また好ましくは、フェ
ノ−ルノボラック型エポキシを全エポキシ成分の１０〜
４０％添加することにより、耐熱性（Ｔｇ）の向上をは
かることができる。この様なフェノ−ルノボラック型エ
ポキシには、ＥＳＣＮ−００１（住友化学工業株式会社
製）、エピクロンＮ−６７３（大日本インキ化学株式会
社製）等がある。更に硬化促進剤としては、各種イミダ
ゾール類を使用することが望ましい。イミダゾールとし
ては、２−メチルイミダゾール、２−エチル−４メチル
イミダゾール、１−シアノエチル−２−フェニルイミダ
ゾール等が挙げられ、２Ｅ４ＭＺ、２ＰＺ、２ＰＺ−Ｃ
Ｎ、２ＰＺ−ＣＮＳ（四国化成工業株式会社製）等があ
る。BEST MODE FOR CARRYING OUT THE INVENTION The epoxy resin used in the present invention is not particularly limited, but is preferably a solid resin having an epoxy equivalent of 500 or more and a temperature of 23 ° C. or less, and an epoxy resin having an epoxy equivalent of 500 or more. By using an epoxy resin, generation of cutting powder during cutting can be improved to a cutting temperature of 10 ° C. Examples of such an epoxy resin include Epicoat-1001, 1003 (manufactured by Yuka Shell Co., Ltd.) and Epicron-900, 1050 (manufactured by Dainippon Ink and Chemicals, Inc.). Also preferably, the phenol-novolak type epoxy is used in an amount of 10 to 10% of the total epoxy component.
By adding 40%, the heat resistance (Tg) can be improved. Examples of such phenol novolak epoxy include ESCN-001 (manufactured by Sumitomo Chemical Co., Ltd.) and Epicron N-673 (manufactured by Dainippon Ink and Chemicals, Inc.). Further, it is desirable to use various imidazoles as a curing accelerator. Examples of the imidazole include 2-methylimidazole, 2-ethyl-4-methylimidazole, 1-cyanoethyl-2-phenylimidazole, and the like, and 2E4MZ, 2PZ, 2PZ-C
N, 2PZ-CNS (manufactured by Shikoku Chemical Industry Co., Ltd.) and the like.
【０００６】ゴム変成エポキシ樹脂の添加は、半硬化状
態の基材との密着性の向上を目的としており、添加量が
１０部以下の時は，接着シ−ト切断時に切断部分のシ−
トと基材フィルムよりの浮き、はがれが発生してしま
い、加工時の取扱いに問題がある。また５０重量部以上
では、半硬化状態でベタツキが発生するという問題があ
り、この添加量は１０〜５０部の添加が望ましい。さら
に、ゴム変成エポキシ樹脂としては、ＣＴＢＮ（末端カ
ルボキシル基変性ゴム）変成品が望ましく、この変成率
が３０％以下では接着シ−ト切断時に、切断部分のシ−
トと基材フィルムよりの浮き、はがれが発生し、６０％
を超えると不純物の増加等の問題があり、ＣＴＢＮ変成
率は３０〜６０％が望ましい。この様なゴム変成エポキ
シ樹脂には、エピクロンＴＳＲ−６０１、９６０（大日
本インキ化学株式会社製）等がある。[0006] The addition of the rubber-modified epoxy resin is intended to improve the adhesion to the semi-cured base material. When the addition amount is 10 parts or less, the cut portion is cut when the adhesive sheet is cut.
Floating and peeling from the substrate and the base film occur, and there is a problem in handling during processing. If the amount is more than 50 parts by weight, there is a problem that stickiness occurs in a semi-cured state, and the addition amount is desirably 10 to 50 parts. Further, as the rubber-modified epoxy resin, a modified product of CTBN (terminal carboxyl group-modified rubber) is desirable. If this modification rate is 30% or less, the cut portion is cut off when the adhesive sheet is cut.
Floats and peels off from the base and base film, 60%
If the ratio exceeds the above, there is a problem such as an increase in impurities, and the CTBN conversion rate is desirably 30 to 60%. Examples of such a rubber-modified epoxy resin include Epicron TSR-601 and 960 (manufactured by Dainippon Ink and Chemicals, Inc.).
【０００７】分子量が１万以上のエポキシ骨格の高分子
成分及び、分子量５万以上のゴム成分の添加は以下の理
由による。分子量５万以上のゴム成分の添加は、硬化物
の密着性、耐湿性の向上と、エポキシ樹脂及び硬化剤成
分、ゴム変成エポキシ樹脂成分だけでは、半硬化状態で
の膜特性が確保できない為であり、添加量５０部以下で
は、半硬化時に基材フィルムから剥離するとき割れの現
象が発生してしまう。さらに、１５０部を超えると硬化
物の耐熱（Ｔｇ）が急激に低下するという問題があり、
添加部数は５０〜１５０部が望ましい。また、ゴム成分
はエポキシ基含有アクリロニトリル−ブタジエンゴムが
エポキシ樹脂相溶性の面から好ましく、ＨＴＲ−８６０
−Ｐ３（テイコク化学産業株式会社製）等がある。さら
に、分子量が１万以上のエポキシ骨格の高分子成分の添
加は、硬化物のエポキシゴム海面の密着性を、エポキシ
樹脂との密着と、ゴム成分との絡み合い効果により、強
固なものとし、耐湿処理時の海面ヘの水の侵入を防止
し、凝集破壊による密着性の低下を防止する為のもので
ある。その添加量は１０〜４０部が好ましく、１０部未
満では耐湿性の向上が見られず、４０部以上では、耐熱
特性が低下するという問題がある。この様な樹脂には、
フェノトートＹＰ−４０、５０、６０（東都化成工業株
式会社製）、ＨＭＥ（日立化成工業株式会社製）があ
る。[0007] The addition of a polymer component having an epoxy skeleton having a molecular weight of 10,000 or more and a rubber component having a molecular weight of 50,000 or more is based on the following reasons. The addition of a rubber component having a molecular weight of 50,000 or more improves the adhesion and moisture resistance of the cured product, and the epoxy resin, curing agent component, and rubber-modified epoxy resin component alone cannot secure film properties in a semi-cured state. In the case where the amount is 50 parts or less, cracking occurs when peeled from the base film during semi-curing. Further, when the amount exceeds 150 parts, there is a problem that the heat resistance (Tg) of the cured product rapidly decreases,
The number of added parts is desirably 50 to 150 parts. The rubber component is preferably acrylonitrile-butadiene rubber containing an epoxy group from the viewpoint of epoxy resin compatibility, and HTR-860.
-P3 (manufactured by Teikoku Chemical Industry Co., Ltd.). Furthermore, the addition of a polymer component having an epoxy skeleton having a molecular weight of 10,000 or more enhances the adhesion of the cured product to the sea surface of the epoxy rubber due to the effect of the adhesion with the epoxy resin and the effect of entanglement with the rubber component. The purpose is to prevent water from entering the sea surface during the treatment and to prevent a decrease in adhesion due to cohesive failure. The addition amount is preferably from 10 to 40 parts, and if it is less than 10 parts, no improvement in moisture resistance is observed, and if it is more than 40 parts, there is a problem that heat resistance is reduced. For such resins,
Phenothote YP-40, 50, 60 (manufactured by Toto Kasei Kogyo Co., Ltd.) and HME (manufactured by Hitachi Chemical Co., Ltd.).
【０００８】また密着性向上成分として、目的に応じシ
ランカップリング剤等を添加しても良い。シランカップ
リング剤としては、ＮＣＵＡ−１８７、１８９、１１０
０、１１６０（日本ユニカー株式会社製）等が挙げられ
る。Further, a silane coupling agent or the like may be added as an adhesion improving component depending on the purpose. As silane coupling agents, NCUA-187, 189, 110
0, 1160 (manufactured by Nippon Unicar Co., Ltd.) and the like.
【０００９】熱硬化性接着シ−トは、前記の接着剤組成
を、ＭＥＫ、トルエン等の有機溶剤により溶解し、基材
に塗布し乾燥することで得られる。この時基材はＰＥ
Ｔ、ポリイミド、銅箔等が挙げられ、乾燥温度に耐える
ことができるものであれば、特に限定されるものではな
い。乾燥条件としては特に限定されないが、接着シ−ト
の硬化率を１０〜６０％に乾燥条件により調整する必要
がある。この時、硬化率が１０％未満であると、３０℃
以上の温度で粘着性を発生してしまい、ブロッキングの
発生や、取扱いのしにくさ等の弊害が発生してしまう。
さらに硬化率を６０％以上にすると、圧着条件が１２０
℃以上、かつ圧力条件が１０ｋｇ／ｃｍ2 以上と低温低
圧での接着が難しくなる。したがって、硬化率としては
１０〜６０％が望ましい。ここで、硬化率は以下のよう
に定義するものとする。 未硬化状態の樹脂組成物のＤＳＣ発熱量＝Ａ（ジュ−ル
／ｇ） 熱乾燥して半硬化させた接着フィルムのＤＳＣ発熱量＝
Ｂ（ジュ−ル／ｇ） 硬化率（％）＝（Ａ−Ｂ）／Ａ×１００A thermosetting adhesive sheet is obtained by dissolving the above-mentioned adhesive composition with an organic solvent such as MEK, toluene, etc., applying the solution to a substrate, and drying. At this time, the base material is PE
Examples include T, polyimide, and copper foil, and are not particularly limited as long as they can withstand the drying temperature. Although the drying conditions are not particularly limited, it is necessary to adjust the curing rate of the adhesive sheet to 10 to 60% depending on the drying conditions. At this time, if the curing rate is less than 10%, the
At the above temperature, tackiness is generated, and adverse effects such as generation of blocking and difficulty in handling occur.
Further, when the curing rate is 60% or more, the pressure bonding condition is 120
When the temperature is 10 ° C. or more and the pressure condition is 10 kg / cm 2 or more, adhesion at low temperature and low pressure becomes difficult. Therefore, the curing rate is desirably 10 to 60%. Here, the curing rate is defined as follows. DSC calorific value of resin composition in uncured state = A (joule / g) DSC calorific value of adhesive film that has been thermally dried and semi-cured =
B (joule / g) Curing rate (%) = (AB) / A × 100
【００１０】これにより、 圧着温度：１２０℃以下 圧着圧力：１０ｋｇ／ｃｍ2 以下 硬化温度：１５０℃（６０分） の低温低圧圧着できる、ポリイミド等のフィルム材料，
金属、シリコン、エポキシ、セラミック等に対する接着
性が硬化時、半硬化時共に優れ、半硬化時の加工性に優
れ、さらに硬化時の耐湿性、耐熱性を併せもつ熱硬化性
接着シ−トを得ることができた。[0010] With this, a compression temperature: 120 ° C or less, a compression pressure: 10 kg / cm 2 or less, a curing temperature: 150 ° C (60 minutes), a film material such as polyimide which can be pressed at a low temperature and a low pressure;
A thermosetting adhesive sheet that has excellent adhesion to metals, silicon, epoxy, ceramics, etc. when cured and semi-cured, has excellent workability during semi-cured, and has both moisture resistance and heat resistance when cured. I got it.
【００１１】[0011]
実施例１ エポキシ樹脂エピコート１００１を３８部、エピクロン
Ｎ−６７３を２５部、硬化剤ＬＦ−２８８２を３７部、
ゴム変成エポキシ樹脂エピクロンＴＳＲ−６０１を３８
部、フェノトートＹＰ−５０を２５部、ＨＴＲ−８６０
−Ｐ３を６０部、硬化促進剤２ＰＺ−ＣＮを０．５部、
シランカップリング剤Ａ−１８７を３部を有機溶剤１６
０部に溶解し、１時間撹拌した後、厚み７５μｍのＰＥ
Ｔ基材の上に塗布し、１５０℃で５分間乾燥し、厚み５
０μｍで、硬化率２０％の熱硬化性接着シ−トを作製し
た。評価方法としては、未硬化状態の基材付接着シ−ト
の３０℃雰囲気での粘着性の有無、１０℃での切断加工
時の加工性、及び基材フィルムからの剥離の有無につい
て確認した。さらに接着品の評価には、熱硬化性接着シ
−トでポリイミドと電解銅箔とを、温度１２０℃、圧
力：１０ｋｇ／ｃｍ2 、３分圧着し、常圧１５０℃で６
０分硬化し評価用の試験片を得た。評価項目及び結果
は、表１に示す。さらに同様の方法により、組成を変更
して作製した接着シ−トの実施例２〜４を表１に示す。
なお、配合部数は重量部である。Example 1 38 parts of epoxy resin epicoat 1001, 25 parts of Epicron N-673, 37 parts of curing agent LF-2882,
Epoxy TSR-601 rubber modified epoxy resin 38
Parts, 25 parts of phenotote YP-50, HTR-860
-P3 60 parts, curing accelerator 2PZ-CN 0.5 part,
3 parts of silane coupling agent A-187 was added to an organic solvent 16
0 parts, stirred for 1 hour, and then 75 μm thick PE
Coated on T substrate, dried at 150 ° C for 5 minutes, thickness 5
A thermosetting adhesive sheet having a thickness of 0 μm and a curing rate of 20% was prepared. As an evaluation method, the presence or absence of tackiness in a 30 ° C. atmosphere of the uncured adhesive sheet with a base material was checked for workability at the time of cutting at 10 ° C., and the presence or absence of peeling from the base material film. . Further, for evaluation of the adhesive product, a polyimide and an electrolytic copper foil were pressure-bonded with a thermosetting adhesive sheet at a temperature of 120 ° C., a pressure of 10 kg / cm 2 for 3 minutes, and a pressure of 150 ° C. at a normal pressure of 150 ° C.
It was cured for 0 minutes to obtain a test piece for evaluation. Table 1 shows the evaluation items and results. Tables 1 to 4 show Examples 2 to 4 of the adhesive sheets prepared by changing the composition in the same manner.
The number of parts is by weight.
【００１２】比較例 実施例と同様の方法により、作製した接着シ−トの特性
の比較例１〜４を表２に示す。Comparative Examples Table 2 shows Comparative Examples 1 to 4 of the characteristics of the adhesive sheets produced in the same manner as in the examples.
【００１３】[0013]
【表１】 [Table 1]
【００１４】[0014]
【表２】 [Table 2]
【００１５】[0015]
【発明の効果】本発明により、電子部品、半導体部品接
着材料として、低温低圧圧着できる、ポリイミド等のフ
ィルム材料、金属、シリコン、エポキシ、セラミック等
に対する接着性が硬化時、半硬化時共に優れ、半硬化時
の加工性に優れ、さらに硬化時の耐湿性、耐熱性を併せ
もつ熱硬化性接着シ一トが得られた。According to the present invention, as an adhesive material for electronic parts and semiconductor parts, the adhesiveness to film materials such as polyimide, metal, silicon, epoxy, ceramic, etc., which can be pressed at low temperature and low pressure, is excellent both at the time of curing and at the time of semi-curing. A thermosetting adhesive sheet having excellent workability at the time of semi-curing and having both moisture resistance and heat resistance at the time of curing was obtained.
Claims (5)
量）に対し、ゴム変成のエポキシ樹脂２０〜５０部、分
子量が１万以上のエポキシ骨格の高分子成分１０〜４０
部、分子量５万以上のゴム成分５０〜１５０部、硬化促
進剤０．３〜２．５部からなる接着剤組成物を、基材フ
ィルムに塗布し、半硬化状態に熱処理してなる熱硬化性
接着シ一ト。1. A rubber modified epoxy resin of 20 to 50 parts and a polymer component of an epoxy skeleton having a molecular weight of 10,000 or more based on 100 parts (by weight) of an epoxy resin and a curing agent component.
Part, an adhesive composition comprising 50 to 150 parts of a rubber component having a molecular weight of 50,000 or more and 0.3 to 2.5 parts of a curing accelerator is applied to a base film, and heat-treated by heat treatment to a semi-cured state. Adhesive sheet.
あり、かつ２３℃以下の室温で固形であるエポキシ樹脂
である請求項１記載の熱硬化性接着シート。2. The thermosetting adhesive sheet according to claim 1, wherein the epoxy resin is an epoxy resin having an epoxy equivalent of 350 or more and being solid at room temperature of 23 ° C. or less.
品であり、かつ変成率が３０〜６０％である請求項１記
載の熱硬化性接着シート。3. The thermosetting adhesive sheet according to claim 1, wherein the rubber-modified epoxy resin is a CTBN-modified product, and has a conversion rate of 30 to 60%.
含有アクリルニトリルブタジエンゴムである請求項１記
載の熱硬化性接着シート。4. The thermosetting adhesive sheet according to claim 1, wherein the rubber component having a molecular weight of 50,000 or more is an acrylonitrile-butadiene rubber containing an epoxy group.
り、半硬化状態の硬化率が１０〜６０％である請求項１
記載の熱硬化性接着シート。5. A semi-cured curing rate of 10 to 60% by heat treatment after application to a substrate film.
The thermosetting adhesive sheet according to the above.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9086468A JPH10279898A (en) | 1997-04-04 | 1997-04-04 | Thermosetting adhesive sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9086468A JPH10279898A (en) | 1997-04-04 | 1997-04-04 | Thermosetting adhesive sheet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH10279898A true JPH10279898A (en) | 1998-10-20 |
Family
ID=13887800
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9086468A Pending JPH10279898A (en) | 1997-04-04 | 1997-04-04 | Thermosetting adhesive sheet |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH10279898A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100613754B1 (en) * | 2000-01-18 | 2006-08-22 | 주식회사 코오롱 | Heat resistant adhesive tape |
| KR100651475B1 (en) | 2005-11-15 | 2006-11-29 | 삼성전기주식회사 | Interlayer insulating resin for substrates for imprinting lithography process |
-
1997
- 1997-04-04 JP JP9086468A patent/JPH10279898A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100613754B1 (en) * | 2000-01-18 | 2006-08-22 | 주식회사 코오롱 | Heat resistant adhesive tape |
| KR100651475B1 (en) | 2005-11-15 | 2006-11-29 | 삼성전기주식회사 | Interlayer insulating resin for substrates for imprinting lithography process |
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