JPH10294578A - Board mounting structure to mounting member - Google Patents

Abstract

(57) [Summary] [PROBLEMS] To a mounting member having a simple structure in which a flux when fixing a mounting member to another member by solder does not run around to the upper surface side of a substrate mounted on the mounting member. To provide a substrate mounting structure. SOLUTION: A flexible substrate 30 on which a desired pattern 33 is formed is mounted on a mounting plate (mounting member) 10, and
A sliding member 50 having a slider mounted thereon is rotatably mounted thereon. Solder connection pieces 17, 17 provided on mounting plate 10
Are provided in the vicinity of the root of. When the flexible substrate 30 is placed on the mounting plate 10, the protrusions 21 and 21
A gap a is formed between the mounting plate 10 and the flexible substrate 30 at the portion.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure for mounting a substrate on a mounting member.

[0002]

2. Description of the Related Art Conventionally, for example, in a rotary variable resistor, as shown in FIG. 8, a flexible substrate 120 is mounted on a metal mounting plate 110, and a slider 130 is further mounted thereon. Is mounted, and the mounting plate 1 is mounted.
The cylindrical projection 111 provided at the center of the slide 10 is inserted into the central hole 141 of the sliding object 140 and caulked to rotatably support the shaft, and by rotating the sliding object 140, the flexible substrate 120 is rotated. The slider 130 is slid into contact with the resistor pattern (not shown) and the current collecting pattern provided above, thereby forming a resistance value between each metal terminal (not shown) connected to the resistor pattern and the current collecting pattern of the flexible board 120. Some are configured so as to change.

In this rotary variable resistor, the mounting plate 110 is mounted on a main substrate 150, and a tongue-shaped solder connection piece 153 provided on the mounting plate 110 is provided in a hole 151 formed in the main substrate 150. And the solder connection piece 153 is inserted into the main board 15.
0 is fixed by solder 160 on the back surface.

[0004]

However, in the above-mentioned conventional example, when the solder connection piece 153 is fixed by the solder 160, the flux of the solder 160 is transmitted along the solder connection piece 153 by the surface tension and rises. As shown by the arrow F in FIG. 5, the flux easily propagates from the mounting plate 10 to the upper surface of the flexible substrate 120 and contaminates the upper surface of the flexible substrate 120.
There is a problem that an electrical characteristic (sliding noise) failure occurs between the resistor pattern and the like formed on the slider 20 and the slider 130.

The present invention has been made in view of the above points, and an object of the present invention is to provide a method for fixing a mounting member to another member by soldering so that a flux is applied to an upper surface side of a substrate mounted on the mounting member. It is an object of the present invention to provide a structure for mounting a substrate to a mounting member having a simple structure, which does not have a risk of turning around.

[0006]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention relates to a structure for mounting a substrate on a mounting member having a desired pattern formed on the mounting member. At a predetermined position on the surface of the member on which the substrate is placed, a convex portion that forms a gap between the mounting member and the substrate is provided.

[0007]

Embodiments of the present invention will be described below in detail with reference to the drawings. [First Embodiment] FIG. 1 is an exploded perspective view showing a rotary variable resistor to which the present invention is applied. As shown in FIG. 1, the rotary variable resistor is configured by mounting a flexible substrate 30 and a sliding object 50 on a mounting plate 10.
Hereinafter, each component will be described.

FIG. 2 is a side sectional view of the mounting plate 10 (a sectional view taken along line AA in FIG. 1). As shown in FIGS. 1 and 2, the mounting plate 10 is formed by pressing a metal plate, and a cylindrical tubular projection 11 is provided at the center thereof. Are provided with sliding contact projections 13 which project upward by pressing the mounting plate 10 itself.

A stopper tongue piece 15 bent upward is provided on the outer periphery of the mounting plate 10, and two tongue-shaped solder connection pieces 1 bent downward are provided.
7, 17 are provided.

The solder connecting pieces 17 of the mounting plate 10
At the base of the portion provided with 17, there are provided projections 21 and 21 which are press-worked so as to project upward in a substantially hemispherical shape.

Next, as shown in FIG. 1, the flexible substrate 30 is concentrically formed on a thin film 31 made of a synthetic resin by four patterns (a current collecting pattern and a resistor pattern) 33.
, A through hole 35 is provided at the center thereof, and a metal terminal 37 is connected and fixed to an end of each pattern 33.

The connection and fixing of each metal terminal 37 is performed by the metal terminal 3
7, one end of each pattern 33 is adhered to the end of each pattern 33 with a conductive adhesive, and a reinforcing film 36 is placed thereon.
This is performed by welding the film 31 having no metal terminal 37 and the reinforcing film 36 by ultrasonic welding. A hole 39 through which one of the sliding contact protrusions 13 is inserted is provided on the outer periphery of the film 31.

FIG. 3 is a side sectional view of the sliding die 50. As shown in FIG. As shown in FIGS. 1 and 3, the sliding mold 50 is formed by molding a synthetic resin into a substantially disk shape, and has a through hole 5 in the center thereof.
1, and a slider 60 is attached to the lower surface thereof. Note that a through hole 51 is provided on the lower surface of the sliding type object 50.
A ring-shaped support protrusion 55 is provided protruding from the center. The support protrusion 55 is provided at a position where it comes into contact with the four sliding contact protrusions 13 (see FIG. 1) of the mounting plate 10.

The mounting plate 1 is provided outside the support projection 55.
A ring-shaped recess 57 into which the 0 stopper tongue 15 (see FIG. 1) is inserted is provided. In the recess 57, a wall 58 for restricting the movement of the stopper tongue 15 is provided.

In order to assemble the rotary variable resistor, a flexible board 30 is first mounted on the mounting plate 10 as shown in FIG. At this time, the cylindrical protrusion 11 of the mounting plate 10 is inserted into the through hole 35 of the flexible substrate 30.

Next, the sliding object 50 is placed on the flexible substrate 30, the cylindrical projection 11 is inserted into the through hole 51, and the tip is swaged. At this time, the stopper tongue piece 15 of the mounting plate 10 is located in the concave portion 57 of the sliding mold 50 (see FIG. 3).

4 and 5 are cross-sectional views showing the state at this time. FIG. 4 is a cross-sectional view taken along the line AA shown in FIG. 1, and FIG. 5 is a cross-sectional view taken along the line BB shown in FIG. is there. However, FIGS. 4 and 5
In FIG. 1, the description of the sliders 60 (see FIG. 3) is omitted for convenience of description, but in actuality, each slider 60 is in elastic contact with each pattern 33 shown in FIG.

As shown in FIG. 4 and FIG.
Is supported at its center by not only being rotatably supported by the cylindrical projection 11 but also by the contact between the sliding contact projection 13 and the support projection 55.

Since the mounting plate 10 according to the present embodiment is provided with the convex portions 21 and 21, the flexible substrate 30 is lifted up at the convex portions 21 and 21 as shown in FIG. A gap a is formed between the plate 10 and the flexible substrate 30.

The rotary variable resistor is mounted on the main board 70 as shown in FIG. 5, and each solder connection piece of the rotary variable resistor is inserted into each through hole 71 formed in the main board 70. 17
(At this time, each metal terminal 37 is also connected to the main board 70).
Of the main substrate 70 is fixed by solder 75 on the back side. At this time, the solder connection piece 1
7, the flux rises to the upper portion of the mounting plate 10 due to the surface tension. In the case of the present embodiment, the flexible substrate 30 located at the root of the solder connection piece 17 has the convex portion 21 as shown in FIG. As a result, since the separated flux is separated from the surface of the mounting plate 10 by the gap a, the raised flux only enters the portion of the gap a and does not go around the upper surface side of the flexible substrate 30.

Accordingly, the upper surface of the flexible substrate 30 is not contaminated by the flux, and there is a possibility that the electrical characteristics (sliding noise) may be poor between each of the patterns 33 formed on the flexible substrate 30 and the slider 60. There is no.

Although the flux also rises from each metal terminal 37, in the case of this embodiment, each metal terminal 37
Since the reinforcing film 36 is attached to the root of the pattern, the flux cannot enter the respective patterns 33 on the flexible substrate 30. Since the distance from each metal terminal 37 to each pattern 33 is also large, the flux cannot penetrate onto each pattern 33 from this point.

Although the flexible substrate 30 slightly floats from the mounting plate 10 at the portion where the gap a is provided, the slider 60
Since the flexible substrate 10 is pressed against the mounting plate 10 by the resilient pressure when passing near the floating portion, there is no electrical problem and there is no danger of increasing the thickness of the rotary variable resistor.

[Second Embodiment] FIG. 6 is a side sectional view of a rotary variable resistor according to a second embodiment of the present invention. Also in this embodiment, a sliding type object 50- having a hard substrate 30-2 and a slider 60-2 mounted on a mounting plate 10-2.
2 is attached.

FIG. 7 is a view showing the mounting plate 10-2. FIG. 7 (a) is a plan view, and FIG. 7 (b) is a sectional view taken along the line CC of FIG. 7 (a). As shown in the figure, the mounting plate 10-2 is formed by pressing a metal plate, and a cylindrical projection 11-2 is provided at the center thereof.
A stopper tongue 15-2 bent upward is provided on the outer periphery of the mounting plate 10-2, and two tongue-shaped solder connection pieces 17-2 bent downward are provided.
2, 17-2 are provided.

The surface of the mounting plate 10-2 is provided with eight double-arc-shaped projections 21-2, 21-2 projecting upward by press working.

Next, as shown in FIG. 6, the hard substrate 30-2 has a metal terminal 37-2 fixed to one end thereof by eyelets. Needless to say, a resistor pattern (not shown) is formed on the hard substrate 30-2.

Next, a through hole 51-2 is provided at the center of the sliding type object 50-2, a slider 60-2 is mounted on the lower surface thereof, and a stopper for the mounting plate 10-2 is provided on the lower surface thereof. Ring-shaped recess 57 into which tongue piece 15-2 (see FIG. 7) is inserted
-2.

The rotary variable resistor is mounted on a mounting plate 1
The hard substrate 30-2 is placed on the hard substrate 30-2, the sliding type object 50-2 is placed on the hard substrate 30-2, and the cylindrical projection 11-2 is inserted through the through-hole 5-5.
It is assembled by inserting it into 1-2 and crimping its tip.

By the way, the mounting plate 10-
2 is provided with the projection 21-2, so that the hard substrate 3
0-2 rests on the convex portion 21-2, thereby creating a gap a-2 in the whole between the mounting plate 10-2 and the hard substrate 30-2.

Then, the rotary variable resistor is mounted on a main board (not shown), and each metal terminal 37-2 of the rotary variable resistor and the solder connection piece 17- are inserted into each through hole formed in the main board.
2 and is fixed by soldering on the back surface side of the main board. At this time, the mounting plate 10-2 is transferred along the solder connecting piece 17-2.
In the case of the present embodiment, the flux that has risen to the upper part only enters the gap a-2 and does not go around the surface of the hard substrate 30-2.

Accordingly, the upper surface of the hard substrate 30-2 is not contaminated by the flux, and the electrical characteristics (sliding) between each of the patterns 33 formed on the hard substrate 30-2 and the slider 60-2. Noise) There is no risk of failure.

[0033]

As described above in detail, according to the present invention, when the mounting member (mounting plate) is fixed to another member (main board or the like) by soldering despite its simple structure. There is an excellent effect that there is no possibility that the flux goes around the surface side of the substrate placed on the mounting member.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view showing a rotary variable resistor to which the present invention is applied.

FIG. 2 is a side sectional view (AA sectional view shown in FIG. 1) of the mounting plate 10;

FIG. 3 is a side sectional view of the sliding die 50;

FIG. 4 is a sectional view taken along the line AA shown in FIG.

FIG. 5 is a sectional view taken along the line BB shown in FIG.

FIG. 6 is a side sectional view of a rotary variable resistor according to a second embodiment of the present invention.

7A and 7B are diagrams showing the mounting plate 10-2, wherein FIG. 7A is a plan view and FIG. 7B is a cross-sectional view taken along the line CC of FIG.

FIG. 8 is a diagram showing a conventional example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Mounting plate (mounting member) 17 Solder connection piece 21 Convex part 30 Flexible board (substrate) 33 Pattern a gap 50 Sliding type 60 Slider 10-2 Mounting plate (mounting member) 17-2 Solder connection piece 21- 2 Convex part 30-2 Hard substrate (substrate) a-2 Gap 50-2 Sliding object 60-2 Slider

Claims (2)

[Claims] In a structure for mounting a substrate on a mounting member on which a substrate having a desired pattern is mounted, the mounting member is provided at a predetermined position on a surface of the mounting member on which the substrate is mounted. A structure for mounting a substrate to a mounting member, wherein a protrusion that forms a gap is provided between the mounting member and the substrate. 2. The structure according to claim 1, wherein a solder connecting piece is provided on the mounting member, and the projection is provided near the solder connecting piece.