JPH10308572A - Structure for mounting surface mount components on printed wiring boards and printed wiring boards - Google Patents

Abstract

(57) [Summary] [Problem] A printed wiring of a surface mount component that can accurately mount a surface mount component on a printed wiring board without using a large-scale manufacturing facility and can confirm a mounting position after connection. Provide a mounting structure on a board and a printed wiring board. SOLUTION: In mounting a BGA package on a printed wiring board, a mounting jig that can be mounted manually is used. Further, a marking for confirming the position after mounting the BGA package is provided at the mounting position of the BGA package on the printed wiring board. In addition, a marking for confirming the position after mounting the ultra-small surface mount component is provided between the footprints. Further, a display unit facing the projection center of the mounted surface mount component is provided on the printed wiring board.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure for mounting surface mount components on a printed wiring board and a printed wiring board.

[0002]

2. Description of the Related Art A printed circuit board is composed of a surface mount component and a component with leads. The surface-mounted components are chip components constituting resistors and capacitors, and package-type BGA (Ball G) components constituting semiconductor surface-mounted components.
It is generally known that a (Rid Array) package and a flat package are often used.

FIG. 7 shows an explanatory diagram (part 1) of the prior art. Referring to FIG.
5 has a number of electrodes 56, which are arranged directly below the components. FIG. 2B shows a mounting form of the BGA package.

First, cream solder 53 is applied to a footprint 52 of a printed wiring board 51 facing the electrode 56.

Next, a BGA package 55 is mounted so as to face the footprint 52 of the printed wiring board 51.
In this state, the solder balls 57 provided on the electrodes 56 and the solder cream 53 are temporarily bonded.

Next, heating is performed to form a soldering portion 75 between the footprint 52 and the electrode 56, and the BGA package 55 is soldered to the printed wiring board 51.

The BGA package 55 is connected to the printed wiring board 5
In order to mount the electrodes 56 accurately in opposition to the one footprint 52, the electrodes 56 are arranged directly below the components. Therefore, BGA package 5
5 electrode 56 and footprint 5 of printed wiring board 51
2 is recognized by a camera or the like, and large-scale mechanical equipment based on image processing technology such as correcting the position of the BGA package 55 is used.

BG after connection to printed wiring board 51
In the same manner as described above, the mounting position of the A package 55 is also difficult to perform manually because the electrodes 56 are arranged directly below the components. For this reason, the electrodes 56 are
In general, a method of judging a positional shift of a component through the light is transmitted.

FIG. 8 shows an explanatory diagram (part 2) of the prior art. In the figure, a large semiconductor surface mount component 80 formed by a flat package is connected to a printed wiring board 5.
When mounting on the component 1, the components are arranged using, for example, one-pin coordinates 82 of the leads 81 of the surface-mounted component 80. This one
The center estimated coordinates 85 on the printed wiring board 51 side are set using the converted numerical values for the pin coordinate 82 data, and the component is mounted by the component mounting machine.

However, it is difficult to calculate the converted numerical value, and the reliability of the center estimation coordinates 85 is very low. For this reason, at present, after the components are mounted, the lead 81 and the footprint 52 facing the lead 81 are visually checked to perform position correction.

On the other hand, when mounting a surface-mounted component formed of an ultra-small chip component on a printed wiring board, the surface-mounted component is small and easily jumps on the printed wiring board, resulting in misalignment of the component. Parts may be lost. In addition, it is impossible to visually confirm the presence or absence of the mounted component after mounting the component on the surface mounted component because the component is small, and it is general to determine the presence or absence of the mounted component using a microscope or a visual inspection device. It is.

[0012]

As described above, the prior art has the following problems.

1) In mounting a BGA package having electrodes below components, for example, only component mounting using large-scale mechanical equipment was possible. Therefore, the BGA package cannot be mounted manually.

2) It is difficult to manually confirm the position after mounting the BGA package. Therefore, the mounting of the BGA package is limited to work in a manufacturing factory having large-scale manufacturing facilities and dedicated facilities.

3) A flat package type surface mount component cannot be accurately mounted at the component center position of the printed wiring board.

4) In checking the mounting of ultra-small chip components, manual work is difficult. Therefore, the operation is limited to a large-scale manufacturing facility or a manufacturing factory having dedicated facilities.

[0017]

In order to solve the above problems, the present invention takes the following measures.

1) In mounting the BGA package on a printed wiring board, a mounting jig that can be manually mounted is used.

2) A marking for confirming the position after mounting the BGA package is provided at the mounting position of the BGA package on the printed wiring board.

3) A marking is provided between the footprints so that the position of the ultra-small surface mount component can be confirmed after mounting.

4) A display section facing the center of projection of the mounted surface mount component is provided on the printed wiring board.

By adopting the above-mentioned means, mounting can be performed manually by using a mounting jig for a BGA package, and a large-scale component mounting apparatus is not required. Further, the position can be visually confirmed after the BGA package is mounted, and a large-scale component mounting confirmation device is not required. Also, visually confirm the presence or absence of components after mounting ultra-small surface mount components. Further, by reading the display section, the X coordinate and the Y coordinate from the substrate origin are clarified, and various functions such as mounting the surface mount component accurately on the surface mount component mounting position of the printed wiring board operate.

[0023]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention adopts the following embodiments.

As shown in FIG. 1, a mounting jig 11 for adjusting the position of the BGA package and a mounting jig insertion portion 4 for adjusting the position of the mounting jig 11 are provided near the BGA package mounting position. 1 is provided.

As shown in FIG. 2, a marking 21 and / or a BG corresponding to the external dimensions of the BGA package are provided at the mounting position of the BGA package on the printed wiring board 1.
It is preferable to provide the marking 22 which is set to have a certain dimension larger than the outer dimension of the A package.

Further, as shown in FIG. 3, it is preferable to provide a wide marking 23 extending at a fixed dimension from a position facing the outer dimensions of the BGA package at a mounting position of the BGA package on the printed wiring board 1. Further, it is preferable that the marking 23 is formed in a color different from that of the BGA package 5 and the printed wiring board 1.

Further, as shown in FIG. 5, it is preferable to provide a marking 31 for confirming the surface mount component on the resist 26 between the footprints 2 formed at the surface mount component mounting position of the printed wiring board 1.

Further, as shown in FIG. 6, it is preferable that the printed wiring board 1 is provided with a center coordinate display 35 facing the center of projection of the surface-mounted component at the surface-mounted component mounting position. Further, it is preferable that the center coordinate display section 35 is formed of a marking ink or a pattern.

By taking the above-described embodiment, the following operation works.

In the embodiment shown in FIG. 1, in the mounting of, for example, a BGA package having an electrode under a component, a component which can only be mounted by conventional machine recognition is used.
Mounting can be performed manually by using a mounting jig for the BGA package.

In the embodiment shown in FIG.
Confirm the position after mounting the package visually or by image processing.

Further, in the embodiment shown in FIG.
Confirm the position after mounting the package visually or by image processing. Further, it is confirmed visually or by image processing by color identification.

In the embodiment shown in FIG. 5, when checking the mounting of ultra-small chip components such as resistors and capacitors, the presence or absence of components after surface mounting components are visually checked.

In the embodiment shown in FIG. 6, when the mounting machine reads the center coordinate display section, the X coordinate and the Y coordinate from the substrate origin become clear, and the surface mounting component is mounted on the surface of the printed wiring board. Mount accurately at the component mounting position. Further, the center coordinate display section is accurately formed on the printed wiring board without adding a special process.

[0035]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A typical embodiment according to the present invention will be described with reference to FIGS.

FIG. 1 is a diagram (part 1) of an embodiment of the present invention.

In FIG. 1, a cream solder 3 is applied to a footprint 2 of a printed wiring board 1 in advance. On the other hand, solder balls 7 are provided on the electrodes 6 of the BGA package 5 in advance. The mounting jig 11 regulates the position of the BGA package 5 and the mounting jig 11, for example, a BGA
It has a BGA package regulation part 12 corresponding to the external dimensions of the package 5. Further, it has a mounting jig mounting portion 13 of, for example, a cylindrical shape, which is inserted into the printed wiring board 1.

The mounting jig mounting portion 13 is mounted on the printed wiring board 1 such that the footprint 2 of the BGA package 5 and the electrode 6 of the BGA package 5 positioned on the mounting jig 11 face each other. Is provided with a mounting jig insertion portion 4 for inserting the jig. It is preferable that the mounting jig insertion portions 4 are provided at four corners of the planned mounting position of the BGA package 5.

In order to mount the BGA package 5 on the printed wiring board 1, first, the mounting jig mounting section 13 provided on the mounting jig 11 is inserted into a predetermined mounting jig insertion section 4, and the mounting jig 11 is mounted. It is mounted on the printed wiring board 1.

Next, the BGA package 5 is inserted into the BGA package regulation section 12 provided on the mounting jig 11 so that the electrode 6 and the footprint 2 face each other. In this state, the solder balls 7 provided on the electrodes 6 and the solder cream 3 are temporarily bonded.

Next, after the mounting jig 11 is removed, heating is performed to connect the BGA package 5 to the printed wiring board 1 by soldering.

FIG. 2 is a diagram (part 2) of the embodiment of the present invention.

In FIG. 3A, a marking 2 previously set to the same dimensions as the outer dimensions of the BGA package 5 is provided at the position where the BGA package 5 is to be mounted on the printed wiring board 1.
1 and a marking 22 set to have a certain dimension larger than the outer dimension of the BGA package 5. The marking 21 and the marking 22 may be formed by, for example, a wiring pattern or may be printed with a marking ink.

BGA Connected to Printed Wiring Board 1
In checking the mounting position of the package 5, the distance between the outer shape of the BGA package 5 and the marking 22 can be visually checked.

In FIG. 3B, the distance between the outer shape of the BGA package 5 and the marking 22 is a fixed size, indicating that the mounting position of the BGA package 5 after soldering is correct.

In FIG. 4C, the BGA package 5
The spacing between the outer shape and the marking 22 is not a fixed size but varies, which indicates that the mounting position of the BGA package 5 after soldering is incorrect.

The marking 21 and the marking 2
2 does not necessarily need to be provided in both cases.
By simply providing one of the marking 1 and the marking 22, it is possible to visually confirm the distance between the outer shape of the BGA package 5 and the marking 21 or the marking 22.

FIG. 3 is a diagram (part 3) of the embodiment of the present invention.

In FIG. 5A, a wide marking 23 is provided at a predetermined position on the printed wiring board 1 where the BGA package 5 is to be mounted. The marking 23 may be formed by printing, for example, marking ink. further,
It is preferable that the color of the marking 23 be a color that can be distinguished from the color of the BGA package 5 or the printed wiring board 1.

BGA after connection to printed wiring board 1
In checking the mounting position of the package 5, the width of the marking 23 can be visually checked.

FIG. 4B shows a BGA package 5.
Indicates that the mounting position after soldering is correct.
FIG. 4C shows that the mounting position of the BGA package 5 after soldering is incorrect.

On the other hand, when checking the mounting position of the BGA package after being connected to the printed wiring board 1, it can be checked not only visually but also by mechanical equipment.

FIG. 4 is a diagram (part 4) of the embodiment of the present invention.

In the figure, the configuration after the BGA package 5 is connected to the printed wiring board 1 includes the surface of the BGA package 5, the markings 21 and 22, and the resist 26.
And the height dimension is different. This difference in height is used.
For example, a laser beam is applied to the vicinity of the mounting position of the BGA package 5 on the printed wiring board 1, and the amount of deviation in the width direction between the BGA package 5 and the marking 22 is measured based on the difference in the reflection speed of the laser beam.

FIG. 4B shows the BGA package 5.
Indicates that the mounting position after soldering is correct.
FIG. 4C shows that the mounting position of the BGA package 5 after soldering is incorrect.

Further, the vicinity of the mounting position of the BGA package 5 on the printed wiring board 1 is recognized by a camera, and the width of the marking 23 can be confirmed by image processing. It should be noted that color discrimination is also possible with an SMT mounter.

Further, a non-defective pattern is created in advance, and the vicinity of the mounting position of the BGA package 5 on the printed wiring board 1 is recognized by a camera. Can be compared to determine the quality.

FIG. 5 is a diagram (part 5) of the embodiment of the present invention.

In FIG. 5A, a micro chip component 32 constituting a resistor or a capacitor is mounted with an electrode 6 opposed to a footprint 2 and a soldering portion 25 is formed to form a printed wiring board 1. It is connected to the. It should be noted that a mark 31 is formed on the resist 26 between the footprints 2.
Is provided.

The marking 31 is printed circuit board 1
Can be formed by printing marking ink simultaneously with other markings (not shown). In addition, FIG.
Indicates the printed wiring board 1 on which the chip component 32 is not mounted.

In checking the mounting position of the chip component 32 after being connected to the printed wiring board 1, the marking 31
Can be visually confirmed. FIG. 3C shows that the chip component 32 is soldered at a predetermined position. FIG. 3D shows that the chip component 32 is not soldered at a predetermined position.

FIG. 6 is a diagram (part 6) of the embodiment of the present invention.

In FIG. 9A, for example, a large number of footprints 2 are formed on a printed wiring board so as to face flat semiconductor package leads (not shown). Further, the printed wiring board is provided with a center coordinate display section 35 for clearly indicating the mounting center position of the large semiconductor. The center coordinate display unit 35 may be formed by, for example, a wiring pattern or may be printed with marking ink. The shape of the center coordinate display unit 35 is not particularly limited as long as the component mounting machine can read the shape.

In FIG. 6B, when the large semiconductor is mounted on the printed wiring board 1, the central coordinate display section 35 is read by a component mounting machine so that the printed circuit board 1 is read from the origin 1 a of the printed wiring board 1. The X coordinate and the Y coordinate are accurately taken. Therefore, the mounting position of the surface mount component on the printed wiring board 1 can be accurately grasped.

[0065]

As described above, according to the present invention, the following effects can be obtained.

A mounting jig for adjusting the position of the BGA package and a mounting jig insertion portion for adjusting the position of the mounting jig are denoted by B.
A printed circuit board provided in the vicinity of the GA package mounting position is provided, so that, for example, in mounting a BGA package having an electrode under the component, only the component mounting based on the recognition of a conventional machine was possible. Mounting can be manually performed by a mounting jig. Therefore, a large-scale component mounting apparatus can be eliminated.

Further, since the BGA package mounting position on the printed wiring board is provided with markings facing the outer dimensions of the BGA package and / or markings set to have a certain dimension larger than the outer dimensions of the BGA package,
The position confirmation after mounting the GA package can be easily performed visually or by image processing.

Further, a wide marking is provided at a mounting position of the BGA package on the printed wiring board so as to extend a predetermined dimension from a position facing the outer dimensions of the BGA package. Further, since the marking is formed in a color different from that of the BGA package and the printed wiring board, the position confirmation after mounting the BGA package can be easily performed visually or by image processing. Furthermore, BG can be visually checked by color identification or image processing.
The mounting position of the A element can be confirmed. Therefore, a large-scale component mounting confirmation device can be eliminated.

Also, since a mark for confirming the surface mounted component is provided on the resist between the footprints formed at the mounting position of the surface mounted component on the printed wiring board, it is possible to confirm the mounting of the ultra-small chip component such as a resistor and a capacitor. Then, the presence or absence of the component after mounting the surface mount component can be visually confirmed.

Further, the printed wiring board is provided with a center coordinate display section opposed to the surface mount component projection center at the surface mount component mounting position. Further, since the center coordinate display section is formed of marking ink or a pattern, when the mounting machine reads the center coordinate display section, the X coordinate and the Y coordinate from the origin of the substrate become clear, and the surface mount component is printed and wired. It can be accurately mounted at the surface mounting component mounting position of the board. Further, the center coordinate display section can be accurately formed on the printed wiring board without adding a special process.

[Brief description of the drawings]

FIG. 1 is a diagram (part 1) of an embodiment of the present invention.

FIG. 2 is a diagram (part 2) of the embodiment of the present invention.

FIG. 3 is a diagram (part 3) of the embodiment of the present invention;

FIG. 4 is a diagram (No. 4) of the embodiment of the present invention;

FIG. 5 is a diagram (No. 5) of the embodiment of the present invention;

FIG. 6 is a view (No. 6) of the embodiment of the present invention;

FIG. 7 is an explanatory diagram (part 1) of a conventional technique.

FIG. 8 is an explanatory diagram (part 2) of a conventional technique.

[Explanation of symbols]

 1: Printed wiring board 2: Footprint 4: Mounting jig insertion section 5: BGA package 11: Mounting jig 12: BGA package regulation section 13: Mounting jig mounting section 21: Marking 22: Marking 23: Marking 26: Resist 31: Marking 35: Center coordinate display

Claims (7)

[Claims] 1. A print in which a mounting jig (11) for adjusting the position of a BGA package and a mounting jig insertion section (4) for adjusting the position of the mounting jig (11) are provided in the vicinity of the BGA package mounting position. A mounting structure for mounting a surface-mounted component on a printed wiring board, comprising: a wiring board (1). 2. A marking (21) facing the external dimensions of the BGA package at a mounting position of the BGA package on the printed wiring board (1) and / or a marking (22) set to be larger than the external dimensions of the BGA package by a certain dimension.
A printed wiring board, comprising: 3. A printed wiring board comprising a wide marking (23) extending at a fixed dimension from a position opposed to an external dimension of the BGA package at a mounting position of the BGA package on the printed wiring board (1). 4. The printed wiring board according to claim 3, wherein the marking is formed in a color different from that of the BGA package and the printed wiring board. 5. A marking (31) for confirming a surface-mounted component on a resist (26) between footprints (2) formed at a mounting position of the surface-mounted component on a printed wiring board (1).
A printed wiring board, comprising: 6. A printed wiring board comprising: a printed wiring board having a center coordinate display section facing a projection center of a surface mounted component at a surface mounting component mounting position. 7. The printed wiring board according to claim 6, wherein said center coordinate display section is formed of a marking ink or a pattern.