JPH10314860A - Die for punching printed board - Google Patents

Die for punching printed board

Info

Publication number
JPH10314860A
JPH10314860A JP14110797A JP14110797A JPH10314860A JP H10314860 A JPH10314860 A JP H10314860A JP 14110797 A JP14110797 A JP 14110797A JP 14110797 A JP14110797 A JP 14110797A JP H10314860 A JPH10314860 A JP H10314860A
Authority
JP
Japan
Prior art keywords
die
punching
circuit board
printed circuit
floor plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14110797A
Other languages
Japanese (ja)
Other versions
JP3159126B2 (en
Inventor
Shigeo Naito
繁夫 内藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lincstech Circuit Co Ltd
Original Assignee
Hitachi AIC Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi AIC Inc filed Critical Hitachi AIC Inc
Priority to JP14110797A priority Critical patent/JP3159126B2/en
Publication of JPH10314860A publication Critical patent/JPH10314860A/en
Application granted granted Critical
Publication of JP3159126B2 publication Critical patent/JP3159126B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Details Of Cutting Devices (AREA)
  • Punching Or Piercing (AREA)

Abstract

PROBLEM TO BE SOLVED: To increase die strength, to prevent the die from being damaged, and to prolong the life of the die by mounting a blade cutting and segregating slugs on the floor plate of a lower die. SOLUTION: The printed board P is positioned and held on the upper surface of the piercing punch 41 of the lower die 40, and the piercing punch 41, a stripper plate 42 and the floor plate 43 are provided. Further, the die is composed of a die holder 46 holding the whole of the lower die 40. To cut and segregate slugs punched in slit holes with long sizes and slender widths, and to segregate the slugs by the five blades 45 into six divisions, U-grooves are formed in places up to 5 mm in depth from the front surface of the floor plate 43, and the blades 45 are force-fitted into the U-grooves, and are fixed. Consequently, the removing treatment of the punched slugs is made simple, and by force-fitting the five blades 45 into the inside of the front surface of the floor plate 43, the compressive strength of the whole lower die 40 is increased other than the strength of the floor plate 43. Since the punching can be per-formed by one shot, one die for punching the printed board is enough.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明はプリント基板打抜き
用金型に関して、特に長寸で細幅のスリット穴の多いプ
リント基板を打抜き加工する時に、打抜き穴の仕上り不
良と金型の破損を防止するプリント基板打抜き用金型に
関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a die for punching a printed circuit board, and more particularly to a die for punching a long and narrow slit having a large number of slit holes, thereby preventing defective finishing of the punched hole and damage to the die. The present invention relates to a die for printing a printed circuit board.

【0002】[0002]

【従来の技術】従来から回路導体、ソルダーレジスト,
マーキング,金属めっきなどの形成された図3に示すよ
うなプリント基板の丸穴12,通常のスリット穴13お
よびプリント基板の外形14を、プレス加工機に取り付
けられたプリント基板打抜き用金型で通常は1ショット
(工程ともいう)で打抜き加工をしている。ただし、長
寸で細幅のスリット穴15の打抜きは2ショットとして
いる。
2. Description of the Related Art Conventionally, circuit conductors, solder resists,
A round hole 12, a normal slit hole 13, and an outer shape 14 of a printed circuit board as shown in FIG. 3 on which marking, metal plating, etc. are formed are usually formed by a printed circuit board punching die mounted on a press machine. Performs punching in one shot (also called a process). However, the punching of the long and narrow slit holes 15 is performed in two shots.

【0003】次に、一般的に1ショット加工として用い
られているプリント基板打抜き用金型を図4に基づいて
説明する。まず、上金型50はポンチ矢55を正しい位
置に案内、保護しながら上下移動をするシェダー51、
前記のシェダー51の外周全体の水平方向の位置決め案
内する外周抜きダイ52、プリント基板の穴抜きをする
ためのポンチ矢55を水平方向と垂直方向の位置決めを
し固定するポンチプレート53とが備えられ、上金型の
全体はパンチホルダー54で保持される構造となってい
る。この前記の上金型50はプレス加工機のスライド機
構部の上金型保持具に取り付けられる。
Next, a die for punching a printed circuit board generally used for one-shot processing will be described with reference to FIG. First, the upper mold 50 guides the punch arrow 55 to the correct position, and moves the shedder 51 up and down while protecting it.
An outer peripheral punching die 52 that guides the entire outer periphery of the shedder 51 in a horizontal direction and a punch plate 53 that positions and fixes a punch arrow 55 for punching holes in a printed board in the horizontal and vertical directions. The entire upper mold is held by a punch holder 54. The upper die 50 is attached to an upper die holder of a slide mechanism of a press machine.

【0004】図4と図3に基づいて、下金型40の詳細
について説明する。プリント基板Pを下金型40の上部
表面に位置決め保持し上金型50とで所望する丸穴1
2,通常のスリット穴13,およびプリント基板の外形
14などを抜くための穴抜きポンチ41、前記の穴抜き
ポンチ41の外周全体の水平方向の位置決めをし、上下
運動の際の案内をする。さらにプリント基板Pから打抜
かれた外周縁材Qを有効なプリント基板部から分離し跳
ね上げさせるストリッパープレート42、この下刃型と
呼ばれる穴抜きポンチ41とストリッパープレート42
とを支え保持する敷板43と、下金型40の全体を保持
するダイホルダー46とで構成されている。この下金型
40のダイホルダー46をプレス加工機のボルスター部
に取り付けて下金型40の全体を固定し、プレス加工機
の垂直方向のスライド機構部の上金型保持具に取り付け
た上金型50が上下運動をして、下金型40にある穴抜
きポンチ41の上面の正しい位置に設置したプリント基
板Pに丸穴12,通常のスリット穴13の孔あけとプリ
ント基板Pの外形14とが打抜き加工される。
[0004] Details of the lower mold 40 will be described with reference to FIGS. 4 and 3. The printed circuit board P is positioned and held on the upper surface of the lower mold 40, and the desired round hole 1 is formed with the upper mold 50.
2. A punching punch 41 for punching out the normal slit hole 13, the outer shape 14 of the printed circuit board, and the like, and positioning of the entire outer periphery of the punching punch 41 in the horizontal direction to guide the vertical movement. Further, a stripper plate 42 for separating the outer peripheral edge material Q punched from the printed circuit board P from the effective printed circuit board portion and for flipping it up, a punching punch 41 called a lower blade type and a stripper plate 42
And a die holder 46 for holding the entire lower die 40. The die holder 46 of the lower mold 40 is attached to the bolster part of the press machine to fix the entire lower mold 40, and the upper mold attached to the upper mold holder of the vertical slide mechanism of the press machine. The mold 50 moves up and down to make a round hole 12, a normal slit hole 13 in the printed board P installed at a correct position on the upper surface of the punching punch 41 in the lower mold 40, and the outer shape 14 of the printed board P. Are punched.

【0005】しかし、図3に示すようなスリット穴の長
さlが50mm以上,スリット穴の幅wが2mm以下となっ
ている単独の長寸で細幅のスリット穴15や、さらに前
記の長寸で細幅のスリット穴15が並行して隣接設定さ
れている長寸で細幅のスリット穴15を有するプリント
基板Pを打抜き加工する金型の場合は、第1の打抜き用
金型と第2の打抜き用金型の2つの金型に分けて、2シ
ョット(工程)のプレス打抜き加工を実施している。前
記の長寸で細幅のスリット穴15の1個の穴を部分的な
分割や並行して隣接設定されている長寸で細幅のスリッ
ト穴15を交互に第1の打抜き用金型と第2の打抜き用
金型とに分割してプリント基板打抜き金型を製作し、プ
リント基板Pを2ショットで打抜き加工をすることによ
り金型の打抜き衝撃,耐圧加重に対して強度アップし金
型の破損を防止するとともに、プリント基板Pの長寸で
細幅のスリット穴15の打抜き加工をしている。
However, as shown in FIG. 3, a single long and narrow slit hole 15 in which the length 1 of the slit hole is 50 mm or more and the width w of the slit hole is 2 mm or less, In the case of a die for punching a printed circuit board P having a long and narrow slit hole 15 in which adjacent narrow slit holes 15 are set in parallel, a first punching die and a second die for punching are used. The press die of two shots (processes) is performed by dividing the die into two die of die for punching. One of the long and narrow slit holes 15 is partially divided, and the long and narrow slit holes 15 set adjacently in parallel alternately with the first punching die. A printed circuit board punching die is manufactured by dividing the die into a second punching die, and the printed board P is punched by two shots to increase the strength against punching impact and pressure resistance of the die. Of the printed circuit board P, and punching of the long and narrow slit hole 15 is performed.

【0006】[0006]

【発明が解決しようとする課題】本発明は、長寸で細幅
のスリット穴15や長寸で細幅のスリット穴が多数並行
して隣接設定されているプリント基板Pをプリント基板
打抜き用金型で打抜く場合、長寸で細幅のスリット穴1
5の1個を2つの金型に部分的に分割して配置したり、
並行配列されている2個以上の長寸で細幅のスリット穴
15を異なる2つの金型に分割して配置させることは、
金型の耐圧強度不足による金型破損の問題は解決される
が、他に打抜き穴の仕上り精度,位置精度,関連寸法精
度,仕上り穴の断面状態不良,外観不良などの多数の問
題が残っている。さらに、打抜き加工が2ショットであ
るため作業効率が悪く、また、長寸で細幅のスリット穴
15の前記記載の精度不良,穴断面不良が20〜30%
と多くなっていた。
SUMMARY OF THE INVENTION The present invention relates to a method for punching a printed circuit board P having a large number of long and narrow slit holes 15 and a plurality of long and narrow slit holes arranged adjacently in parallel. When punching with a mold, long and narrow slit hole 1
5 is partially divided into two molds and arranged,
To arrange the two or more long and narrow slit holes 15 arranged in parallel in two different molds,
Although the problem of mold breakage due to insufficient pressure resistance of the mold is solved, many other problems remain, such as the finished accuracy of punched holes, positional accuracy, related dimensional accuracy, poor sectional state of finished holes, and poor appearance. I have. Furthermore, since the punching process is performed in two shots, the working efficiency is low, and the above-described defective precision and hole cross-sectional defect of the long and narrow slit hole 15 are 20 to 30%.
And many more.

【0007】[0007]

【課題を解決するための手段】本発明では前記の問題点
を解決するため、回路導体,金属めっきなどの形成がさ
れたプリント基板Pをプレス打抜き加工するプリント基
板打抜き用金型は上金型50と下金型40とからなり、
前記下金型40は穴抜きポンチ41と、ストリッパープ
レート42と、敷板43とが備えられている。この前記
の敷板43の上面内部に長寸で細幅のスリット穴15の
打抜かれたかすを切断し分割するための刃具45を設け
る。
According to the present invention, in order to solve the above-mentioned problems, a printed board punching die for press-punching a printed board P on which circuit conductors, metal plating, etc. are formed is an upper mold. 50 and the lower mold 40,
The lower mold 40 is provided with a punch 41, a stripper plate 42, and a floor plate 43. A cutting tool 45 is provided inside the upper surface of the floor plate 43 for cutting and dividing the punched residue of the long and narrow slit hole 15.

【0008】または、長寸で細幅のスリット穴15の打
抜かれたかすを切断し分割するための刃具45を穴抜き
ポンチ41の下面内部に設けてもほぼ同等の目的を達成
することができる。
Alternatively, the same purpose can be achieved even if a cutting tool 45 for cutting and dividing the punched residue of the long and narrow slit hole 15 is provided inside the lower surface of the punch 41. .

【0009】すなわち、穴抜きポンチ41と敷板43の
中間部分に、この刃具45を組み込めばよいが一般的に
敷板43は母材材料と呼ばれる金属材料の炭素鋼,炭素
工具鋼などの硬度の軟かい材料が使用されるが、穴抜き
ポンチ41は刃材材料を使用し、金属材料として合金工
具鋼,高速度工具鋼などの硬度の硬い材料が使用される
ため刃具45を設定する加工が難しくなることがある。
In other words, the cutting tool 45 may be incorporated into the intermediate portion between the punch 41 and the base plate 43. In general, the base plate 43 is made of a soft material having a hardness such as carbon steel or carbon tool steel, which is a metal material called a base material. Although a padding material is used, the punching punch 41 uses a blade material, and a hard material such as an alloy tool steel or a high-speed tool steel is used as a metal material. May be.

【0010】[0010]

【発明の実施の形態】以下、本発明の実施の形態につい
て図面を参照して説明する。本発明では、図3に示すよ
うな特に次の仕様条件が指定されているプリント基板
P,スリット穴の長さl=233mm,スリット穴の幅w
=1mm,スリット穴ピッチ=6.8mm,並行スリット穴
数=9個,板厚=1.0mm,プリント基板寸法=248
×77mmの設定である場合を考慮して、発明の実施の形
態を詳細に説明する。
Embodiments of the present invention will be described below with reference to the drawings. In the present invention, as shown in FIG. 3, a printed circuit board P in which the following specification conditions are specified in particular, the length l of the slit hole l = 233 mm, and the width w of the slit hole
= 1 mm, slit hole pitch = 6.8 mm, number of parallel slit holes = 9, plate thickness = 1.0 mm, printed circuit board dimensions = 248
The embodiment of the present invention will be described in detail in consideration of the case of setting of × 77 mm.

【0011】本発明のプリント基板打抜き用金型では、
上金型50については図4のプリント基板打抜き用金型
を説明する構造断面図で示すように、上金型のポンチプ
レート53に組み込まれたポンチ矢55を保護しながら
正しい位置に案内するシェダー51と、プリント基板P
から外形を打抜くことと前記のシェダー51の外周全体
で水平方向の位置決めをし、上下運動の際の案内をする
外周抜きダイ52と、丸穴12や通常のスリット穴1
3,長寸で細幅のスリット穴15などを打抜くためのポ
ンチ矢55を水平方向,垂直方向の位置決め固定するポ
ンチプレート53とが備えられた従来通りの上金型50
である。
In the die for punching a printed circuit board of the present invention,
As for the upper mold 50, as shown in a structural sectional view for explaining a printed board punching mold in FIG. 4, a shedder for guiding a punch arrow 55 incorporated in a punch plate 53 of the upper mold to a correct position while protecting the punch arrow 55. 51 and printed circuit board P
And an outer peripheral punching die 52 for positioning in the horizontal direction over the entire outer periphery of the above-mentioned shedder 51, and for guiding during vertical movement, a round hole 12 and a normal slit hole 1.
3. A conventional upper die 50 provided with a punch plate 53 for positioning and fixing a punch arrow 55 for punching a long and narrow slit hole 15 in a horizontal direction and a vertical direction.
It is.

【0012】本発明の下金型40については図1に基づ
いて説明する。プリント基板Pを下金型40の穴抜きポ
ンチ41の上部表面に位置決め保持し、図3で示す丸穴
12,通常のスリット穴13や長寸で細幅のスリット穴
15などを抜くための穴抜きポンチ41と、プリント基
板Pから打抜かれた外周縁材Qを有効なプリント基板部
から分離し上昇させるストリッパープレート42と、前
記の穴抜きポンチ41とストリッパープレート42とを
支え保持するための敷板43が備えられ、さらに下金型
40の全体を保持するダイホルダー46とで構成されて
いる。
The lower mold 40 of the present invention will be described with reference to FIG. The printed circuit board P is positioned and held on the upper surface of the punch 41 of the lower mold 40, and is used to remove the round hole 12, the normal slit hole 13, the long and narrow slit hole 15 shown in FIG. A punching punch 41, a stripper plate 42 for separating an outer peripheral material Q punched from the printed circuit board P from an effective printed circuit board portion and raising the same, and a floor plate for supporting and holding the punching punch 41 and the stripper plate 42. 43 and a die holder 46 for holding the entire lower mold 40.

【0013】前記の下金型40の敷板43の材料は切削
加工性,柔軟性,耐圧強度に優れた炭素鋼のS55C、
または炭素工具鋼のSK3を使用する。この敷板43の
金属材料厚みは20mmとする。長寸で細幅のスリット穴
15の長さl=233mmの打抜かれたかすを30〜50
mmの長さに切断し分割するため5本の刃具45で6分割
させるため、前記の敷板43の上面から深さ5mmまでの
箇所にU字溝を形成し、そのU字溝に厚み1.5mm,幅
5mm,長さ100mmの刃具45を圧入して固定する。
The bottom plate 43 of the lower mold 40 is made of carbon steel S55C having excellent machinability, flexibility and pressure resistance.
Alternatively, carbon tool steel SK3 is used. The thickness of the metal material of the floor plate 43 is 20 mm. A long and narrow slit hole 15 having a length of l = 233 mm and a punched residue of 30 to 50 mm
A U-shaped groove is formed at a depth of 5 mm from the upper surface of the floor plate 43 in order to cut into a length of 5 mm and divide into six with five blades 45, and the U-shaped groove has a thickness of 1. A cutting tool 45 having a size of 5 mm, a width of 5 mm and a length of 100 mm is press-fitted and fixed.

【0014】刃具45の材質は硬度の硬い高速度工具鋼
SKH51でロックウェル硬度HRC60°〜62°の
金属材料またはハイス鋼の金属材料を使用し、刃先とな
る先端の断面は山型形状とした刃具45にする。上記の
如く長寸(l=233mm)で打抜かれたかすを6分割
し、約40mmの長さに切断し分割するため抜きかすの除
去処理が簡単になり、厚み×幅×長さ=15×5×10
0mmの刃具45を5本を敷板43の上面内部に圧入する
ことにより敷板43の強度の他に下金型40全体が耐圧
強度アップし、1ショットで打抜き加工ができたため1
台のプリント基板打抜き用金型で済む。
The material of the cutting tool 45 is a high-speed tool steel SKH51 having a high hardness and a metal material of Rockwell hardness HRC 60 ° to 62 ° or a metal material of high-speed steel. The cutting tool 45 is used. As described above, the chip that has been punched in a long dimension (l = 233 mm) is divided into six pieces, cut into pieces each having a length of about 40 mm, and divided, so that the chip removal processing is simplified, and the thickness × width × length = 15 × 5 × 10
By press-fitting five 0 mm cutting tools 45 into the upper surface of the floor plate 43, the lower die 40 as a whole is improved in pressure resistance in addition to the strength of the floor plate 43.
A die for punching a printed circuit board is sufficient.

【0015】[0015]

【実施例】本発明の実施例1は図1に基づいて、前記し
た実施の形態で説明したが実施例2として、図2に基づ
いて説明する。長寸で細幅のスリット穴15の打抜かれ
たかすを切断し分割する刃具45の仕様は下記に示す。 刃具45の材質:高速度工具鋼 SKH51 刃具45の寸法:厚み×幅×長さ=1.5×5×100
mm 刃具45の刃先の断面形状:山型形状 刃具45の本数:5本 金属材料の厚み15mmの穴抜きポンチ41の下面に深さ
5mmのU字溝をフライスマシンや放電加工機で形成し、
この穴抜きポンチ41の下面内部のU字溝に上記仕様の
刃具45を圧入し固定する。
Embodiment 1 Embodiment 1 of the present invention has been described in the above-mentioned embodiment based on FIG. 1. However, Embodiment 2 will be described with reference to FIG. The specifications of the cutting tool 45 for cutting and dividing the punched residue of the long and narrow slit hole 15 are shown below. Material of the cutting tool 45: high-speed tool steel SKH51 Dimension of the cutting tool 45: thickness × width × length = 1.5 × 5 × 100
mm Cross-sectional shape of the cutting edge of the cutting tool 45: mountain shape Number of cutting tools 45: 5 A U-shaped groove having a depth of 5mm is formed on the lower surface of the punch 41 having a thickness of 15mm made of a metal material by a milling machine or an electric discharge machine.
The cutting tool 45 of the above specification is pressed into the U-shaped groove inside the lower surface of the punch 41 and fixed.

【0016】[0016]

【発明の効果】本発明の効果として次のことがあげられ
る。 1.プリント基板のスリット穴の長さlが50mm以上,
スリット穴の幅w2mm以下の長寸で細幅のスリット穴1
5の打抜きプレス加工が1台のプリント基板打抜き用金
型で、抜きかすの詰りもなく良好にできる。 2.下金型の敷板43または穴抜きポンチ41に抜きか
すを切断、分割する刃具45を取り付けることにより金
型強度がアップし金型の破損が防止でき金型寿命が従来
の3〜5倍に伸びる。 3.前記の刃具45を取り付けることにより、従来は2
つの金型で2ショットのプレス打抜き加工をしていたの
が1台の金型で1ショットのプレス打抜き加工ででき
る。 4.長寸で細幅のスリット穴15に関する精度不良,外
観不良が従来の1/8〜1/10と大幅に減少し、品質
が安定化する。
The effects of the present invention are as follows. 1. The length l of the slit hole in the printed circuit board is 50 mm or more,
Long, narrow slit hole 1 with a slit hole width w 2 mm or less
The stamping press process of No. 5 is performed by a single die for punching a printed circuit board, and can be satisfactorily performed without clogging of chips. 2. By attaching a cutting tool 45 for cutting and dividing the chip to the bottom plate 43 or the punching punch 41 of the lower mold, the strength of the mold is increased, the damage of the mold is prevented, and the mold life is extended 3 to 5 times as compared with the conventional case. . 3. Conventionally, by attaching the cutting tool 45,
Two-shot press punching with two dies can be performed by one-shot press punching with one die. 4. Poor precision and poor appearance of the long and narrow slit hole 15 are greatly reduced to 1/8 to 1/10 of the conventional size, and the quality is stabilized.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の実施例1のプリント基板打抜き用下金
型の構造断面図。
FIG. 1 is a structural sectional view of a lower die for punching a printed circuit board according to a first embodiment of the present invention.

【図2】本発明の実施例2のプリント基板打抜き用下金
型の構造断面図。
FIG. 2 is a structural sectional view of a lower die for punching a printed circuit board according to a second embodiment of the present invention.

【図3】打抜き加工後のプリント基板を説明する平面
図。
FIG. 3 is a plan view illustrating a printed board after punching.

【図4】従来のプリント基板打抜き用金型の構造断面
図。
FIG. 4 is a structural sectional view of a conventional printed circuit board punching die.

【符号の説明】[Explanation of symbols]

P…プリント基板 Q…外周縁材 l…スリット穴の長
さ w…スリット穴の幅 12…丸穴 13…スリット穴 14…プリント基板の外形 15…長寸で細幅のスリッ
ト穴 40…下金型 41…穴抜きポンチ 42…ストリッパープレート 4
3…敷板 45…刃具 46…ダイホルダー 50…上金型 51…シェダー
52…外周抜きダイ 53…ポンチプレート 54…パンチホルダー 55…
ポンチ矢
P: Printed circuit board Q: Outer edge material l: Slit hole length w: Slit hole width 12: Round hole 13: Slit hole 14: Printed circuit board outer shape 15: Long and narrow slit hole 40: Lower metal Mold 41: punch punch 42: stripper plate 4
3 ... Sill plate 45 ... Cutting tool 46 ... Die holder 50 ... Upper mold 51 ... Shedder
52: die for outer periphery 53: punch plate 54: punch holder 55:
Punch arrow

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 回路導体、金属めっきなどの形成が済ん
だプリント基板をプレス打抜き加工をするプリント基板
打抜き用金型で、穴抜きポンチ(41)と、ストリッパ
ープレート(42)と、敷板(43)とが備えられた下
金型(40)において、前記敷板(43)の上面内部に
長寸で細幅のスリット穴(15)の打抜かれたかすを切
断し分割する刃具(45)を設けたことを特徴とするプ
リント基板打抜き用金型。
1. A die for punching a printed circuit board for press-punching a printed circuit board on which circuit conductors, metal plating, etc. have been formed, comprising a punch (41), a stripper plate (42), and a floor plate (43). ), A cutting tool (45) is provided in the upper surface of the floor plate (43) for cutting and dividing the punched residue of the long and narrow slit hole (15). A die for punching a printed circuit board.
【請求項2】 請求項1において、長寸で細幅のスリッ
ト穴(15)の打抜かれたかすを切断し分割する刃具
(45)を、穴抜きポンチ(41)の下面内部に設けた
ことを特徴とするプリント基板打抜き用金型。
2. A cutting tool (45) according to claim 1, wherein a cutting tool (45) for cutting and dividing the punched residue of the long and narrow slit hole (15) is provided inside the lower surface of the punch (41). A die for printed circuit board punching.
JP14110797A 1997-05-16 1997-05-16 Die for printed circuit board punching Expired - Fee Related JP3159126B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14110797A JP3159126B2 (en) 1997-05-16 1997-05-16 Die for printed circuit board punching

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14110797A JP3159126B2 (en) 1997-05-16 1997-05-16 Die for printed circuit board punching

Publications (2)

Publication Number Publication Date
JPH10314860A true JPH10314860A (en) 1998-12-02
JP3159126B2 JP3159126B2 (en) 2001-04-23

Family

ID=15284346

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14110797A Expired - Fee Related JP3159126B2 (en) 1997-05-16 1997-05-16 Die for printed circuit board punching

Country Status (1)

Country Link
JP (1) JP3159126B2 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103817206A (en) * 2014-03-14 2014-05-28 东莞市东升压铸模具有限公司 Side shearing die
CN104056893A (en) * 2014-06-17 2014-09-24 无锡朗贤汽车组件研发中心有限公司 Stamping die for separation of hot formed workpiece and separation stamping process
CN106003173A (en) * 2015-07-24 2016-10-12 西南交通大学 Cutting device for removing unnecessary rubber on surface of half ring
CN107010407A (en) * 2017-05-24 2017-08-04 瑞安市晨力机械制造有限公司 A kind of hydraulic detachment mark machine
CN107856176A (en) * 2017-11-11 2018-03-30 盐城协同机械有限公司 A kind of pile end board takes aim at punch die
CN116638590A (en) * 2023-07-10 2023-08-25 莆田市城厢区星华电子模具有限公司 A circuit board blanking cutting stamping die

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CN103586328B (en) * 2012-08-15 2015-06-10 北京爱慕内衣有限公司 Round-corner hookflex cutter
CN103121060B (en) * 2013-02-05 2015-01-14 深圳市中金高能电池材料有限公司 Forming die and punching machine for punching of lithium-ion energy-storing current collector material and die machining method

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103817206A (en) * 2014-03-14 2014-05-28 东莞市东升压铸模具有限公司 Side shearing die
CN104056893A (en) * 2014-06-17 2014-09-24 无锡朗贤汽车组件研发中心有限公司 Stamping die for separation of hot formed workpiece and separation stamping process
CN106003173A (en) * 2015-07-24 2016-10-12 西南交通大学 Cutting device for removing unnecessary rubber on surface of half ring
CN107010407A (en) * 2017-05-24 2017-08-04 瑞安市晨力机械制造有限公司 A kind of hydraulic detachment mark machine
CN107856176A (en) * 2017-11-11 2018-03-30 盐城协同机械有限公司 A kind of pile end board takes aim at punch die
CN116638590A (en) * 2023-07-10 2023-08-25 莆田市城厢区星华电子模具有限公司 A circuit board blanking cutting stamping die

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