JPH10315669A - Ic card for certification identification - Google Patents
Ic card for certification identificationInfo
- Publication number
- JPH10315669A JPH10315669A JP12687297A JP12687297A JPH10315669A JP H10315669 A JPH10315669 A JP H10315669A JP 12687297 A JP12687297 A JP 12687297A JP 12687297 A JP12687297 A JP 12687297A JP H10315669 A JPH10315669 A JP H10315669A
- Authority
- JP
- Japan
- Prior art keywords
- card
- chip
- sealing material
- interface
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003566 sealing material Substances 0.000 claims abstract description 21
- 239000000853 adhesive Substances 0.000 claims abstract description 19
- 230000001070 adhesive effect Effects 0.000 claims abstract description 19
- 239000000758 substrate Substances 0.000 claims abstract description 11
- 238000000034 method Methods 0.000 claims description 16
- 230000015556 catabolic process Effects 0.000 abstract 1
- 238000004026 adhesive bonding Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000000859 sublimation Methods 0.000 description 4
- 230000008022 sublimation Effects 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 238000005096 rolling process Methods 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 2
- -1 polyethylene terephthalate Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 230000007723 transport mechanism Effects 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229920002367 Polyisobutene Polymers 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 229920005549 butyl rubber Polymers 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 229920005990 polystyrene resin Polymers 0.000 description 1
- 229920001021 polysulfide Polymers 0.000 description 1
- 239000005077 polysulfide Substances 0.000 description 1
- 150000008117 polysulfides Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Landscapes
- Credit Cards Or The Like (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は接着剤貼合法によっ
て製造される非接触式のＩＣカードを、運転免許証、社
員証、会員証、外国人登録証、学生証等の認証識別カー
ドに用いる場合に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention uses a non-contact type IC card manufactured by an adhesive bonding method as an authentication identification card such as a driver's license, an employee card, a membership card, an alien registration card, a student ID card, and the like. About the case.
【０００２】[0002]
【従来の技術】非接触式のＩＣカードは部品が表面に無
いために、表面に顔画像等の認証識別画像を形成した
り、印刷を行ったり、偽変造を防止するのに有利で認証
識別カードとしての用途に好適である。その製造方式と
しては、熱貼合法、接着剤貼合法及び射出成形法が知ら
れているが、このうち接着剤貼合法は加工温度が低く、
使用するカード基材に関する制約が少ないため、認証識
別画像や書誌情報を形成する熱転写及び熱昇華画像形成
方法での受容層、筆記性層等の選択に優位性がある。2. Description of the Related Art A non-contact type IC card has no components on its surface, so it is advantageous for forming an authentication identification image such as a face image on the surface, performing printing, and preventing forgery and falsification. It is suitable for use as a card. As the manufacturing method, a heat bonding method, an adhesive bonding method, and an injection molding method are known. Among them, the adhesive bonding method has a low processing temperature,
Since there are few restrictions on the card base material to be used, there is superiority in selection of a receiving layer, a writable layer, and the like in a thermal transfer and thermal sublimation image forming method for forming an authentication identification image and bibliographic information.
【０００３】接着剤貼合法によって作成した非接触式の
ＩＣカードの構成の概略図を図１に示す。FIG. 1 is a schematic view showing the structure of a non-contact type IC card prepared by an adhesive bonding method.
【０００４】図１のＩＣカードは、２枚の表面シート
１、２の間にＩＣチップ３を搭載し、アンテナやコンデ
ンサがプリントされているＩＣ搭載基板４が、ＩＣチッ
プを封止材５で保護して接着剤６中に封入されてなるも
のである。アンテナ、コンデンサ等の部品はプリント基
板としてではなくコイルアンテナ等の別部品として封入
される形態でもよい。In the IC card shown in FIG. 1, an IC chip 3 is mounted between two top sheets 1 and 2, and an IC mounting substrate 4 on which an antenna and a capacitor are printed is sealed with a sealing material 5. It is protected and sealed in the adhesive 6. Components such as an antenna and a capacitor may be encapsulated as separate components such as a coil antenna instead of a printed circuit board.
【０００５】図２は接着剤貼合法の製造プロセスの一例
を示すものである。FIG. 2 shows an example of a manufacturing process of the adhesive bonding method.
【０００６】表面シート１を形成するシート（以下、シ
ート１と略称する。）ロール及び表面シート２を形成す
るシート（以下、シート２と略称する。）ロールは搬送
機構２１のローラ２１１及び２１２にそれぞれセットさ
れ、シート１の先端部がローラ２１３を介してシート２
の先端部と合わされ、圧接機構２２の間を通されてロー
ラ２１４に止められて掛け渡される。シート２にはＩＣ
搭載基板４が既に実装されている。A sheet (hereinafter abbreviated as “sheet 1”) roll forming the top sheet 1 and a sheet (hereinafter abbreviated as “sheet 2”) roll forming the top sheet 2 are fed to rollers 211 and 212 of the transport mechanism 21. Each sheet is set, and the leading end of the sheet 1 is
And is passed between the press-contact mechanisms 22 and stopped by the roller 214 to be bridged. IC on sheet 2
The mounting board 4 has already been mounted.
【０００７】駆動手段２１５によりローラ２１４が一定
速度で回転し、接着剤供給手段２３がシート１とシート
２の間に接着剤を流し込み、圧接機構２２により圧接す
る。ローラ２１４に巻き取られたＩＣカードシートは、
所定のサイズに裁断されてＩＣカードとなる。[0007] The roller 214 is rotated at a constant speed by the driving means 215, the adhesive supply means 23 flows the adhesive between the sheets 1 and 2, and is pressed by the pressing mechanism 22. The IC card sheet wound around the roller 214
An IC card is cut into a predetermined size.
【０００８】[0008]
【発明が解決しようとする課題】接着剤貼合法によって
作成した非接触式のＩＣカードは、上記の如く全部品を
対向する基板間に接着剤によって封入するものであるか
ら、内部の部品に起因して表面に凹凸ができ易い。近
年、認証識別用の顔画像を高階調で解像度に優れる昇華
熱転写方式で形成することがしばしば行われるが、昇華
熱転写方式での画像形成では特に画像形成面の平滑性が
要求されるため、この様な表面の凹凸があるカードへの
顔画像形成には昇華熱転写方式が採用できないことにな
る。The non-contact type IC card prepared by the adhesive bonding method involves sealing all the components between the opposing substrates with an adhesive as described above. The surface is likely to have irregularities. In recent years, a face image for authentication and identification is often formed by a sublimation thermal transfer method with high gradation and excellent resolution. The sublimation heat transfer method cannot be used for forming a face image on a card having such surface irregularities.
【０００９】従って、接着剤を圧延するにあたり、平坦
化し得る圧力を掛けることになるが、これがＩＣチップ
を破壊してしまうことがあり、製品の歩留まりや信頼性
に問題を生ずる。[0009] Therefore, when the adhesive is rolled, a pressure capable of flattening is applied, but this may break the IC chip, which causes a problem in product yield and reliability.
【００１０】本発明は上記の事情に鑑みてなされたもの
であり、その目的は、接着剤圧延時の平坦化のための過
剰圧力によるＩＣチップ破壊のリスクを無くして、製品
歩留まり及び信頼性を向上し、ＩＣカードの表面平滑性
を得ることに有る。The present invention has been made in view of the above circumstances, and an object of the present invention is to eliminate the risk of IC chip destruction due to excessive pressure for flattening at the time of adhesive rolling, and to improve product yield and reliability. It is to improve the surface smoothness of the IC card.
【００１１】[0011]
【課題を解決するための手段】本発明の上記目的は、封
止材で保護されるＩＣチップを含む全部品が対向する基
板間に硬化した接着剤によって封入されてなり、該封止
材と接着剤との界面が勾配を有する認証識別用ＩＣカー
ド、前記界面の勾配が界面全体に渡り、且つ０〜４５°
の範囲にあること、ＩＣチップの厚さをｔとするとき、
前記封止材の最大厚さｔ1がｔ＜ｔ1＜１．５ｔなる関係
を満たすこと、及び少なくとも一方の基板の外表面に認
証識別画像を有し、該認証識別画像を有する領域に前記
界面が存在しないこと、によって達成される。SUMMARY OF THE INVENTION It is an object of the present invention to provide a method for manufacturing a semiconductor device, wherein all parts including an IC chip protected by a sealing material are sealed between opposed substrates by a hardened adhesive. Authentication / identification IC card having a gradient at the interface with the adhesive, wherein the gradient of the interface extends over the entire interface, and is 0 to 45 °
Where t is the thickness of the IC chip,
The maximum thickness t 1 of the sealing material satisfies the relationship of t <t 1 <1.5t, and at least one of the substrates has an authentication identification image on the outer surface thereof, and the region having the authentication identification image has the authentication identification image. This is achieved by the absence of an interface.
【００１２】即ち、本発明者は圧延時の接着剤の流れが
滑らかであれば圧力も低く設定できて平坦化可能だろう
と考え、封止材の形状を制御して、本発明に至ったもの
である。That is, the present inventor believes that if the flow of the adhesive during rolling is smooth, the pressure can be set low and flattening can be performed, and the shape of the sealing material is controlled to achieve the present invention. It is.
【００１３】[0013]
【発明の実施の形態】以下、実施の形態を挙げて本発明
を詳細に説明するが、本発明はこれに限定されない。DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail with reference to embodiments, but the present invention is not limited thereto.
【００１４】図３に封止材の形状を本発明の如く制御し
て得たＩＣカードの長手方向の断面図を示す。FIG. 3 is a longitudinal sectional view of an IC card obtained by controlling the shape of the sealing material as in the present invention.
【００１５】図３のＩＣカードはポリエチレンテレフタ
レートシートを基板１、２とし、ＩＣチップ３及び該チ
ップとプリント基板４上のアンテナパターン７との接合
部８が封止材５で保護されるものである。In the IC card shown in FIG. 3, a polyethylene terephthalate sheet is used as the substrates 1 and 2, and the IC chip 3 and the joint 8 between the chip and the antenna pattern 7 on the printed circuit board 4 are protected by the sealing material 5. is there.
【００１６】図の如く封止材と接着剤との界面はなだら
かなカーブを描き、好ましくは界面の勾配が界面全体に
渡り、且つ０〜４５°の範囲にある。又、ＩＣチップの
厚さをｔとするとき、封止材の最大厚さｔ1がｔ＜ｔ1＜
１．５ｔなる関係を満たすことが、ＩＣチップの保護の
観点から好ましい。封止材の形状は封止材樹脂の滴下条
件や硬化条件の設定により制御すればよい。As shown in the figure, the interface between the sealing material and the adhesive has a gentle curve, and the gradient of the interface is preferably over the entire interface and in the range of 0 to 45 °. When the thickness of the IC chip is t, the maximum thickness t 1 of the sealing material is t <t 1 <
It is preferable to satisfy the relationship of 1.5t from the viewpoint of protection of the IC chip. What is necessary is just to control the shape of a sealing material by setting dripping conditions and hardening conditions of sealing material resin.
【００１７】対向するＩＣカードの基板は、同じでも異
なっていてもよく、ポリエチレンテレフタレート以外に
も、ポリ塩化ビニル、ポリカーボネート、ポリスチレ
ン、ＡＢＳ樹脂等の素材等が好適に用いられる。The substrates of the opposing IC cards may be the same or different, and materials other than polyethylene terephthalate, such as polyvinyl chloride, polycarbonate, polystyrene, and ABS resin, are suitably used.
【００１８】封止材の素材としては、シリコーンゴム、
ポリイソブチレン、ブチルゴム、ポリスルフィドゴム、
弾性エポキシ樹脂等が挙げられる。As the material of the sealing material, silicone rubber,
Polyisobutylene, butyl rubber, polysulfide rubber,
Elastic epoxy resin and the like can be mentioned.
【００１９】接着剤としては熱硬化性タイプの樹脂が一
般的に使用され、具体的にはエポキシ系樹脂、ポリウレ
タン、アクリル樹脂等が用いられるが、特にエポキシ樹
脂が好ましい。As the adhesive, a thermosetting resin is generally used, and specifically, an epoxy resin, a polyurethane, an acrylic resin or the like is used, and an epoxy resin is particularly preferable.
【００２０】又、特に昇華熱転写方式を用いて顔画像等
の認証識別画像を形成するとき、図４の如く顔画像９を
形成する領域に封止材５で保護されたＩＣチップ３が存
在しないことが好ましく、封止材端部から認証識別画像
を形成する領域までの距離をＬ、対向する基板間の距離
をｌとすればＬ＞３ｌであることが好ましい。In particular, when an authentication identification image such as a face image is formed by using the sublimation thermal transfer method, the IC chip 3 protected by the sealing material 5 does not exist in the area where the face image 9 is formed as shown in FIG. It is preferable that L> 31, where L is the distance from the end of the sealing material to the region where the authentication identification image is formed, and l is the distance between the opposing substrates.
【００２１】[0021]
【発明の効果】本発明によれば、ＩＣチップがなだらか
なカーブ形成の封止材で保護されるので、平坦化のため
の接着剤圧延時の過剰圧力によるＩＣチップの破壊が防
止されて生産性や信頼性が向上し、且つチップによるカ
ード表面の凹凸を有効に抑えることができる。According to the present invention, since the IC chip is protected by the sealing material having a gentle curve, the IC chip is prevented from being broken due to excessive pressure during the rolling of the adhesive for flattening. Performance and reliability are improved, and irregularities on the card surface due to the chip can be effectively suppressed.
【図１】接着剤貼合法によって作成した非接触式のＩＣ
カードの構成の概略図。FIG. 1 is a non-contact type IC prepared by an adhesive bonding method.
FIG. 2 is a schematic diagram of a configuration of a card.
【図２】接着剤貼合法の製造プロセスの一例を示す図。FIG. 2 is a diagram illustrating an example of a manufacturing process of an adhesive bonding method.
【図３】本発明の認証識別用ＩＣカードの構成の１例を
示す図。FIG. 3 is a diagram showing an example of the configuration of an authentication / identification IC card of the present invention.
【図４】本発明の好ましい認証識別用ＩＣカードの構成
例を示す図。FIG. 4 is a diagram showing a configuration example of a preferred authentication / identification IC card of the present invention.
１、２ 表面シート ３ ＩＣチップ ４ ＩＣ搭載基板 ５ 封止材 ６ 接着剤 ７ アンテナパターン ８ 接合部 ９ 顔画像 ２１ 搬送機構 ２１１、２１２、２１３、２１４ ローラ ２１５ 駆動手段 ２２ 圧接機構 ２２１、２２２ ローラ ２３ 接着剤供給手段 DESCRIPTION OF SYMBOLS 1, 2 Top sheet 3 IC chip 4 IC mounting board 5 Sealing material 6 Adhesive 7 Antenna pattern 8 Joining part 9 Face image 21 Transport mechanism 211, 212, 213, 214 Roller 215 Drive means 22 Pressure contact mechanism 221, 222 Roller 23 Adhesive supply means
Claims (4)
部品が対向する基板間に硬化した接着剤によって封入さ
れてなり、該封止材と接着剤との界面が勾配を有するこ
とを特徴とする認証識別用ＩＣカード。1. A method in which all parts including an IC chip protected by a sealing material are sealed between opposed substrates by a hardened adhesive, and that an interface between the sealing material and the adhesive has a gradient. Characteristic identification IC card.
０〜４５°の範囲にあることを特徴とする請求項１に記
載の認証識別用ＩＣカード。2. The authentication and identification IC card according to claim 1, wherein the gradient of the interface extends over the entire interface and is in a range of 0 to 45 °.
封止材の最大厚さｔ1がｔ＜ｔ1＜１．５ｔなる関係を満
たすことを特徴とする請求項１又は２に記載の認証識別
用ＩＣカード。3. The method according to claim 1, wherein when the thickness of the IC chip is t, the maximum thickness t 1 of the sealing material satisfies a relationship of t <t 1 <1.5t. The authentication identification IC card described in the above.
別画像を有し、該認証識別画像を有する領域に前記界面
が存在しないことを特徴とする請求項１、２又は３に記
載の認証識別用ＩＣカード。4. The authentication identification according to claim 1, wherein the authentication identification image is provided on an outer surface of at least one of the substrates, and the interface does not exist in a region having the authentication identification image. IC card.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12687297A JPH10315669A (en) | 1997-05-16 | 1997-05-16 | Ic card for certification identification |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12687297A JPH10315669A (en) | 1997-05-16 | 1997-05-16 | Ic card for certification identification |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH10315669A true JPH10315669A (en) | 1998-12-02 |
Family
ID=14945937
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12687297A Pending JPH10315669A (en) | 1997-05-16 | 1997-05-16 | Ic card for certification identification |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH10315669A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000036555A1 (en) * | 1998-12-17 | 2000-06-22 | Hitachi, Ltd. | Semiconductor device and production method thereof |
| US7520676B2 (en) * | 2005-05-24 | 2009-04-21 | Nsk Ltd. | Wheel supporting bearing unit |
-
1997
- 1997-05-16 JP JP12687297A patent/JPH10315669A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000036555A1 (en) * | 1998-12-17 | 2000-06-22 | Hitachi, Ltd. | Semiconductor device and production method thereof |
| KR100691593B1 (en) * | 1998-12-17 | 2007-03-09 | 가부시키가이샤 히타치세이사쿠쇼 | Semiconductor devices |
| CN1319023C (en) * | 1998-12-17 | 2007-05-30 | 株式会社日立制作所 | Semiconductor device and manufacturing method thereof |
| KR100753724B1 (en) * | 1998-12-17 | 2007-08-30 | 가부시키가이샤 히타치세이사쿠쇼 | Semiconductor devices |
| US7520676B2 (en) * | 2005-05-24 | 2009-04-21 | Nsk Ltd. | Wheel supporting bearing unit |
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Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20041216 |
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