JPH1032323A - Solid-state imaging device and camera using it - Google Patents

Abstract

PROBLEM TO BE SOLVED: To contrive miniaturization of a camera and reduction in its production cost by a method in which a bare IC is provided on the circumferential circuit of a solid-state image-pickup element and they are sealed by resin. SOLUTION: A bare IC 6 is mounted on the part inside the circumferential wall 2 on the backside of a substrate 1, and an electrode is electrically connected by a wire 4 to the wiring board formed on the backside of the substrate 1. Sealing resin 7 is cast in the circumferential wall of the backside of the substrate 1 by potting, and the bare IC 6 is sealed. A discrete component 5 is mounted on the backside of the substrate 1, and it is sealed by sealing resin 7 together with the bare IC 6. The solid-state image-pickup element 3, which is mounted on the surface side of the substrate 1, and the light shielding case 8, with which the discrete component 5 is shielded from outside, are formed by non-transparent material, and the lower circumferential edge is fixed to the circumferential part of the surface of the substrate 1 using a bonding agent 9. The light transmitting hole 10, formed on the center of the head part, is blocked up using a sealing transparent plate 11. As a result, the solid state image pickup device can be made small in size, the cost of production can be cut down and the manhours of assembling can be decreased.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a solid-state imaging device and a camera using the same.

[0002]

2. Description of the Related Art A solid-state imaging device is required to have not only high electrical characteristics but also optical characteristics. Therefore, a solid-state imaging device which forms the core of the solid-state imaging device needs to be housed in a special package with high mechanical accuracy. Conventionally, an IC chip and other electronic components constituting the peripheral circuit have been mounted on a printed circuit board completely separate from the package containing the solid-state imaging device. FIG. 13 is a block diagram showing a schematic configuration of the image pickup apparatus. In the figure, CCD is a CCD solid-state image pickup device, S / H is a sample hold circuit, A / D is an A / D converter, and DSP is a color signal processing unit. , V. DRV is a V drive, TG is a timing generator, RAM is a random access memory connected to a color signal processing unit, and CONT is a microcomputer also connected to the color signal processing unit.

Here, the circuits absolutely necessary as peripheral circuits are described accurately. Sample and hold circuit, 2. 2. timing generation circuit; CC
D-type solid-state imaging device clock driver (so-called V-DRIV
ER etc.); AGC (AutoGain Control) circuit,
5. 5. clock generation circuit (crystal oscillator, etc.); A / D converter, 7. 7. Digital camera process circuit, D
8. A / A converter; Composite TV encoder,
10. IEEE 1394, FDDI, FiberCha
10. Digital communication peripheral circuits such as nnel,
It is a DC-DC converter.

[0004] In the case of the analog type, the digital type 1. Sample and hold circuit, 2. 2. timing generation circuit; 3. CCD type solid-state imaging device clock driver (so-called V-DRIVER or the like); AGC (Auto Gai
n Control) circuit; 8. Clock generation circuit (crystal oscillator, etc.); 10. Composite TV encoder, DC
11. a DC converter; This is a camera process circuit.

FIG. 14 is a configuration diagram showing one conventional example of a solid-state imaging device. In FIG. 14, a is a CCD type solid-state imaging device, b is a lens unit, c is a solid-state imaging device mounting substrate, d
Is a flexible substrate, which connects between the solid-state imaging element mounting board c and an IC mounting board e made of, for example, glass epoxy resin. f is an IC mounted on the IC mounting board e;
g is a pin jack of the IC mounting board e.

[0006]

According to the conventional solid-state imaging device shown in FIG. 14, there is a limit in meeting the demand for miniaturization. This is because solid-state imaging devices and cameras using the same have a wide variety of uses.For example, there is no strong demand for miniaturization for professional cameras for broadcasting stations, etc. The demand for conversion is extremely strong. What is important along with the expansion of applications is a demand for price reduction in addition to miniaturization.

However, in the case of a solid-state imaging device as shown in FIG. 14, a solid-state imaging device mounting substrate c and an IC mounting substrate e
And a flexible board d that connects the two, and each occupies an area that cannot be ignored independently.
It is difficult to miniaturize. And since many kinds of substrates are used, and the connection work between them requires a lot of man-hours, the manufacturing cost is high and the reduction in price is restricted.

The present invention has been made to solve such problems, and has as its object to reduce the size and cost of a solid-state imaging device and a camera using the same.

[0009]

According to a first aspect of the present invention, there is provided a solid-state imaging device comprising: a solid-state imaging device; and one or more bare members formed on a back surface or a back surface of the solid-state imaging device and forming a peripheral circuit of the solid-state imaging device. Wherein the bare IC is sealed with a resin.

Therefore, according to the solid-state imaging device of the first aspect, it is not necessary to mount the solid-state imaging device and the bare IC constituting the peripheral circuit on a separate board, and the conventional solid-state imaging device shown in FIG. There is no need for a flexible substrate that connects the solid-state imaging device substrate and the bare IC substrate that were required in the above. Therefore, the size of the solid-state imaging device can be reduced.

In addition, since it is not necessary to use various types of substrates, and it is not necessary to use a substrate for connecting the substrates, it is possible to reduce the number of parts used, the cost, and the number of assembly steps. it can. Therefore, the cost of the solid-state imaging device can be reduced. Further, since the signal line can be made shorter than before, noise is less likely to be generated and penetrated, and electrical characteristics are improved.

According to a second aspect of the present invention, there is provided a solid-state imaging device including a package having a multilayer wiring structure, a solid-state imaging device provided on an outer bottom surface of the package, and a solid-state imaging device provided on an inner bottom surface of the package. And one or more bare ICs forming a peripheral circuit connected via the multilayer wiring of the package.

Therefore, according to the solid-state image pickup device of the second aspect, the solid-state image pickup device is provided on one side of the package having the multilayer wiring structure, and the IC constituting the peripheral circuit is provided on the other side, and the solid-state image pickup device is required between the solid-state image pickup device and the IC. Since such an electrical connection can be made by wiring of the package, a solid-state imaging device, an IC forming a peripheral circuit, and the like can be mounted with a higher integration density.

A camera according to the present invention is characterized by using the solid-state imaging device according to the present invention. Therefore, according to the camera of the present invention, since the solid-state imaging device of the present invention is used as the imaging means that forms the core of the camera, it is possible to inevitably reduce the size and cost.

In addition, since the signal line can be made shorter than before, noise is less likely to occur and penetrate, and the electrical characteristics are improved.

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail with reference to the illustrated embodiments. FIG. 1 shows a first embodiment of the present invention.

In the drawings, reference numeral 1 denotes a substrate, for example, a ceramic wiring substrate, and reference numeral 2 denotes a peripheral wall formed integrally with a peripheral portion of the back surface of the substrate 1. Reference numeral 3 denotes, for example, a CCD type solid-state imaging device mounted at a substantially central portion of the surface of the substrate 1, and its electrodes are connected to wiring films on the surface of the substrate 1 via wires 4. Reference numeral 5 denotes a discrete component, which is mounted on the front surface of the substrate 1 in this embodiment. However, it may be mounted on the back surface similarly to the IC (6) described later.

Reference numeral 6 denotes one or more bare ICs mounted on the inner side of the peripheral wall 2 on the back surface of the substrate 1. Each electrode of the bare IC 6 is electrically connected via a wire 4 to a wiring film formed on the back surface of the substrate 1. 7 is the substrate 1
The bare IC 6 is sealed by the resin 7 with a sealing resin filled in the peripheral wall 2 on the back surface by potting. The discrete component 5 may be mounted on the back surface of the substrate 1 and sealed with the sealing resin 7 together with the bare IC 6.

Reference numeral 8 denotes a light-shielding case for shielding the solid-state image pickup device 3, the discrete component 5 and the like mounted on the front side of the substrate 1 from the outside, which is made of a non-transparent member. 10 is a light transmission hole formed in the center of the head, and is a transparent plate 11 for sealing.
Is closed by

In this solid-state imaging device, the bare IC 6
A peripheral circuit is configured by the discrete components 5 and the like. Specifically, in the case of the digital type, Sample and hold circuit, 2. 2. timing generation circuit; C
CD-type solid-state imaging device clock driver (so-called V-DRI)
VER etc.); AGC (Auto Gain Control) circuit,
5. 5. clock generation circuit (crystal oscillator, etc.); A / D converter, 7. 7. Digital camera process circuit, D
8. A / A converter; Composite TV encoder,
10. IEEE 1394, FDDI, Fiber Ch
digital communication peripheral circuit such as
1. It is a DC-DC converter.

In the case of the analog type, the digital type 1. Sample and hold circuit, 2. 2. timing generation circuit; 3. CCD type solid-state imaging device clock driver (so-called V-DRIVER or the like); AGC (Auto Gai
n Control) circuit; 8. Clock generation circuit (crystal oscillator, etc.); 10. Composite TV encoder, DC
11. a DC converter; This is a camera process circuit.

According to such a solid-state image pickup device, the solid-state image pickup device 3 and the discrete components 5 constituting its peripheral circuits are mounted on the front side of the substrate 1 made of a ceramic wiring board, and the solid-state image pickup device is mounted on the back side of the substrate 1. 3 is mounted, and the solid-state image pickup device 3, discrete components 5, and bare IC 6 are electrically connected to each other by a wiring film (a through-hole wiring film) formed on the substrate 1 itself. Including). Therefore, the substrate constituting the solid-state imaging device is only the ceramic substrate 1, and the area occupied by the solid-state imaging device can be remarkably reduced, so that the solid-state imaging device can be downsized and the substrate is required. Part prices are also significantly lower than before.

The wiring of the substrate 1 itself can be used for the electrical connection between the solid-state image sensing device 3 and the discrete components 5 and the bare IC 6 constituting the peripheral circuit, so that the flexible substrate and the solid-state image sensing device mounted as in the prior art can be used. There is no need for a connection between the substrate and the flexible substrate and the IC mounting substrate, so that the number of assembling steps is significantly reduced, which also causes a reduction in the cost of the solid-state imaging device.

Therefore, a very small solid-state imaging device can be provided at low cost.

Further, since the signal line can be made shorter as a whole as compared with the related art, the noise resistance is improved.

[0026]

FIG. 2 is a sectional view showing a second embodiment of the present invention. This embodiment is different from the first embodiment in that a lens (13) is built in, and the case 8 has an aperture (14) through which a required predetermined aperture can be applied. The aperture hole (14) is closed by an infrared cut filter (15), and therefore does not require a separate lens, aperture, and filter. Therefore, the aperture is largely different in that it is a camera, but is otherwise common. Since the common points have already been described, the description thereof will be omitted, and only different points will be described.

Reference numeral 12 denotes a lens mounting portion (leg portion) formed integrally with the lens 13, and the lower end surface thereof is located at a position where the lens 13 can position a subject on the surface of the solid-state imaging device 3. To the substrate 1 surface. Although the lens 13 is naturally transparent, it is preferable that the lens mount 12 is not transparent (for example, black) from the viewpoint of preventing light leakage. However, it may be transparent. In the case where the lens mount 12 is formed of a non-transparent material, the integration with the lens 13 may be performed by forming both separately and then bonding them together, but using resin materials of different colors. It may be performed by two-color molding.

Reference numeral 14 denotes a stop hole formed in the center of the head of the case 8, which is formed in a size that allows a stop required to obtain desired characteristics as a camera. 1
Reference numeral 5 denotes an infrared cut filter that closes the aperture 14.

According to the present embodiment, the aperture can be set by the aperture 14, and the image formed on the surface of the solid-state image sensor 3 by the light transmitted through the aperture 14 is formed by the lens 13. The CCD solid-state imaging device 3 can take an image, and the output signal of the CCD solid-state imaging device 3 is subjected to signal processing necessary for image reproduction by the ICs 6 and the discrete components 5 of each bare constituting a peripheral circuit. This embodiment can be said to be a camera.

According to the present camera, a very small and inexpensive solid-state imaging device shown in FIG.
By simply closing the aperture hole 14 with the infrared cut filter 15, a sufficient function as a camera is provided, so that an extremely small and inexpensive camera can be provided.

[0031]

FIG. 3 is a sectional view showing a third embodiment of the present invention, and FIGS. 4 (A) and 4 (B) show a state of the embodiment before resin sealing. (A) is a sectional view, and (B) is a bottom view.

In the drawings, reference numeral 3 denotes a solid-state imaging device; 19, an electrode formed on the periphery of the surface of the solid-state imaging device 3;
Is a bare IC whose back surface is bonded to the back surface of the solid-state imaging device 3 via an adhesive 16, and includes the above-described circuits constituting the peripheral circuits of the solid-state imaging device 3. As described above, in the present embodiment, the bare IC 6 constituting the peripheral circuit is directly bonded to the back surface of the solid-state imaging device 3 without interposing a substrate.

Reference numeral 12 denotes a lens attachment portion (attachment leg) formed integrally with the lens 13, which is integrated by bonding or two-color molding, whereas the lens 13 is made of a transparent member (eg, transparent resin). And a light shielding member (for example, a black resin). Reference numeral 18 denotes a metallized electrode film formed on the lower surface of the lens mounting portion 12,
Are connected to the lead 19, and by this connection, the solid-state imaging device 3 and the bare IC 6 and the lens 1 are temporarily connected.
The positional relationship between the leads 3 and the lens mounting portion 14 is determined. Reference numeral 4 denotes a wire for electrically connecting the lead 19 and the electrode of the bare IC 6. The electrode of the bare IC 6 is electrically connected to the outside and the camera outside via the wire 4 and the lead 19. At the same time, it is electrically connected to the electrodes of the solid-state imaging device 3. FIG. 4 shows the state of the structure described so far.

Reference numeral 17 denotes a sealing resin which seals the surface side of the bare IC 6 forming the peripheral circuit, the leads 19, the wires 4, and the lower portion of the lens mounting portion 12, and forms a package. Reference numeral 8 denotes a case, which has an aperture 14 at the center of the head, and the aperture 14 is closed by an infrared cut filter 15. The lower end of the case 8 is bonded to the peripheral edge of the upper surface of the sealing resin 17 forming the package. Thus, the camera is in a completed state.

FIGS. 5A to 5C show a method of manufacturing the camera shown in FIGS. 3 and 4 in the order of steps. FIG. 5A shows the lens mounting portion 14 and the lens 13 facing downward and adhered to each other. FIG. 2 is a perspective view showing a state where the solid-state imaging device 3 and a bare IC 6 are to be assembled, (B) shows a state after wire bonding is completed, and (C) shows a state at the time of mold clamping for resin sealing. FIG.

That is, a device in which the solid-state image pickup device 3 and the bare IC 6 are bonded and a device in which the lead 19 is previously connected to the metallized electrode film 18 on the lower surface of the lens mounting portion 12 are prepared. As shown in (), the solid-state imaging device 3 is made to face the lens mounting portion 12 such that the position of each electrode 29 of the solid-state imaging device 3 matches the position of the connection portion of the corresponding metallized electrode 18. Then, after that, each electrode 29 of the solid-state imaging device 3
And the metallized electrode 18 are connected.

When the above connection is completed, as shown in FIG. 5B, the lead 4 is connected between the lead 19 and the electrode of the bare IC 6 by the wire 4. That is, wire bonding is performed. Then, the molds shown in FIG. 5C (lower mold 20, upper mold 21)
Is sealed by molding. After that, case 8
Is completed, the camera shown in FIG. 3 is completed.

According to the present embodiment, a very small
An inexpensive camera can be provided.

[0039]

FIG. 6 is a sectional view showing a main part of another embodiment of the camera shown in FIG.

In this embodiment, a metallized electrode 18 serving as a wiring is formed on the outer surface of the lens mounting portion 12, and a bare circuit adhered to the solid-state imaging device 3, which forms a peripheral circuit on the outer surface. Bare IC2 different from IC6
6. Further, the chip component 5 is mounted, and each electrode of the bare IC 26 and the metallized electrode 18 are connected by the wire 4.

In this way, a higher-performance camera can be reduced in size and cost.

[0042]

FIG. 7 shows a fourth embodiment of the solid-state imaging device according to the present invention.
It is sectional drawing which shows embodiment. In the present embodiment, a ceramic package 1 having a multi-layer wiring structure as a substrate is used.
a, the solid-state imaging device 3 and the lens 13
The case 3 is shut off from the outside by the case 8, and a large number of ICs are mounted on the inner bottom surface side of the ceramic package 1a.
... and discrete parts 5, 5, ...
It is equipped with.

Numeral 30 denotes a step portion of the ceramic package 1a having a multi-stage multilayer wiring structure. A flat multilayer wiring substrate 31 is adhered to the step portion 30 at the peripheral portion, and IC6 and IC6 are provided on both surfaces thereof.
, And the chip components 5, 5 are mounted, and the electrical connection between the flat-plate multilayer wiring board 31 and the ceramic package 1a is made via the connect wires 4, 4,. I have. Reference numeral 32 denotes an inner bottom surface of the ceramic package 1a, and ICs 6 and 6 are also mounted on the inner bottom surface 32. Reference numeral 33 denotes a back cover for sealing the peripheral portion of the peripheral wall 2 of the ceramic package 1a by bonding the peripheral portion. 39 is a wiring film, 4
0 is a through hole.

According to such a solid-state image pickup device, the solid-state image pickup device 3 and the lens 13 are provided on the outer bottom surface of the package 1a having a multi-stage, multi-layer wiring structure, and the IC 5 forming a peripheral circuit is provided on the inner bottom surface.
, And a flat multi-layer wiring board 31 is also fixed to the step 30 of the package 1a, and ICs 6, 6,... And discrete components 5, 5,.
, The necessary electrical connection between the solid-state imaging device and the IC can be made by wiring of the packages 1a and 31. Therefore, it is possible to mount the solid-state imaging device and the IC forming the peripheral circuit with a higher integration density. it can.

[0045]

FIG. 8 shows a first embodiment of the fourth embodiment shown in FIG.
It is sectional drawing which shows the Example which is a variation of FIG. In the present embodiment, a lens mounting portion (leg portion) 12 integrally formed with the lens 13 has a positioning inclined surface 34 on the inner surface, and the inclined surface 34 is brought into contact with the edge of the upper surface of the solid-state imaging device 3. Thus, the positional relationship of the lens 13 with respect to the solid-state imaging device 3 is naturally determined by self-alignment, and the positioning operation can be performed easily and accurately.

More specifically, the lower surface of the lens mounting portion 12 is made of a semi-curable resin (for example, an ultraviolet-curable resin) 9a.
Position adjustment is performed by bringing the positioning inclined surface 13 of the lens mounting portion 12 into line contact with the edge of the upper surface of the solid-state imaging device 13 in a state where the resin 9a is temporarily bonded to the surface, and then the resin 9a is completely cured by ultraviolet irradiation. By doing so, it is in a bonded state. The other points are the same as those shown in FIG.

[0047]

FIG. 9 shows a second embodiment of the fourth embodiment shown in FIG.
It is sectional drawing which shows the Example which is a variation of FIG. In this embodiment, the solid-state imaging device 3 is covered with glass, and a lens is provided outside the glass. In the figure, reference numeral 35 denotes a rectangular frame for supporting glass, which is provided so as to surround the solid-state imaging device 3, and a glass plate 36 is fixed to a step portion on the inner surface of the solid-state imaging device 3, and the lens 13 has the glass plate 36 and the rectangular shape. Frame 3
5 and inside the case 8. The other points are the same as those shown in FIG.

[0048]

FIG. 10 is a sectional view showing an example which is a third variation of the fourth embodiment shown in FIG.
In this embodiment, a recess 37 for mounting a solid-state imaging device is formed on the outer bottom surface of the substrate 1a, the solid-state imaging device 3 is provided in the recess 37, and the recess 37 is covered with a glass plate 36. Forming a lens mounting recess 38 on the outside,
The mounting portion (leg) 12 of the lens 13 is fixed to the concave portion 38. The other points are the same as those shown in FIG.

[0049]

FIG. 11 is a sectional view showing an example which is a fourth variation of the fourth embodiment shown in FIG.
In this embodiment, the connection between the wiring board 31 and the wiring board 1a (the step portion 31) of the multi-stage multilayer wiring structure is made not by wires but by bumps 41, and the lower surface of the wiring board 31 is made of resin 7 by resin. Protected. The other points are the same as those shown in FIG.

[0050]

FIG. 12 is a sectional view showing an example which is a fourth variation of the fifth embodiment shown in FIG.
In the present embodiment, the region B can be electrostatically shielded from the region A and the region C. Reference numeral 42 denotes a shield wiring which is formed widely on the substrate 1a having a multi-layer wiring structure so as to cover the regions A and B. 43, a through hole for shielding connected to the wiring film 42; 44, a connect wire;
Reference numeral 5 denotes a shielding wiring film formed in the flat multi-layer wiring substrate 31, and includes a wiring film 42, a through hole 43, a connecting wire 44, a shielding wiring film 45, a connecting wire 44, a through hole 43, and a shielding wiring. The region B is electrostatically shielded from the regions A and C by the film 42.

Therefore, it is possible to prevent the noise generated in the area B from entering the areas A and C, and the noise generated in the areas A and C from entering the area B.

In this case, for example, by providing a digital circuit portion in the region B and providing analog circuit portions in the regions A and C, the analog circuit portion and the digital circuit portion can be electrically separated. Of course, area A,
The roles of B and C can be in various modes depending on the number of IC components, signal flows, and the like, and are not limited to those described above.

[0053]

According to the solid-state imaging device of the first aspect, it is not necessary to mount the solid-state imaging device and the bare IC constituting the peripheral circuit on separate substrates, and the conventional solid-state imaging device shown in FIG. There is no need for a flexible substrate that connects the solid-state imaging device substrate and the bare IC substrate that were required in the above. Therefore, the size of the solid-state imaging device can be reduced.

Moreover, since it is not necessary to use various types of substrates, and it is not necessary to use a substrate for connecting the substrates, it is possible to reduce the number of parts used, the cost thereof, and the number of assembly steps. it can. Therefore, the cost of the solid-state imaging device can be reduced. Further, since the signal line can be made shorter than before, noise is less likely to be generated and penetrated, and electrical characteristics are improved.

According to the solid-state image pickup device of the second aspect, the solid-state image pickup device is provided on one side of the package having the multilayer wiring structure, and the IC constituting the peripheral circuit is provided on the other side, and the electric power required between the solid-state image pickup device and the IC is provided. Since the electrical connection can be made by the wiring of the package, a solid-state imaging device, an IC forming a peripheral circuit, and the like can be mounted with a higher integration density.

No substrate is required. Therefore, the size of the solid-state imaging device can be reduced.

Further, according to the camera of the present invention, since the solid-state image pickup device of the present invention is used as the imaging means which forms the core of the camera, the size and the price can be inevitably reduced.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view showing a first embodiment of the present invention.

FIG. 2 is a sectional view showing a second embodiment of the present invention.

FIG. 3 is a sectional view showing a third embodiment of the present invention.

FIGS. 4A and 4B show a state before resin sealing according to the third embodiment, wherein FIG. 4A is a cross-sectional view and FIG. 4B is a bottom view.

FIGS. 5A to 5C show a manufacturing method according to a third embodiment in the order of steps, and FIGS. 5A and 5B are perspective views;
(C) is a sectional view.

FIG. 6 is a sectional view showing an example which is a variation of the third embodiment.

FIG. 7 is a sectional view showing a fourth embodiment of the present invention.

FIG. 8 is a sectional view showing an example which is a first variation of the fourth embodiment shown in FIG. 7;

FIG. 9 is a sectional view showing an example which is a second variation of the fourth embodiment shown in FIG. 7;

FIG. 10 is a sectional view showing an example which is a third variation of the fourth embodiment shown in FIG. 7;

FIG. 11 is a sectional view showing an example that is a fourth variation of the fourth embodiment shown in FIG. 7;

FIG. 12 is a sectional view showing an example that is a fifth variation of the fourth embodiment shown in FIG. 7;

FIG. 13 is a block diagram illustrating a schematic configuration of an imaging apparatus.

FIG. 14 is a configuration diagram showing a conventional example.

[Explanation of symbols]

1, 1a ... substrate, 3 ... solid-state image sensor, 6 ...
Bare IC, 7: sealing resin, 8: light shielding case,
12: lens mounting portion (mounting leg), 13: lens, 31: wiring board.

Continued on the front page (72) Inventor Makoto Dochimo Sony Corporation 7-35 Kita Shinagawa, Shinagawa-ku, Tokyo

Claims (6)

[Claims] 1. A solid-state imaging device, and one or more bare ICs formed on a back surface or a back surface side of the solid-state imaging device and forming a peripheral circuit of the solid-state imaging device.
And a solid-state imaging device, wherein the bare IC is sealed with a resin. 2. A package having a multilayer wiring structure, a solid-state imaging device provided on an outer bottom surface side of the package, and a solid-state imaging device provided on an inner bottom surface side of the package, wherein the solid-state imaging device is connected via a multilayer wiring of the package. A solid-state imaging device comprising: one or a plurality of bare ICs forming a connected peripheral circuit. 3. A package having a multi-stage structure, a package having another multilayer wiring structure provided on at least one step, and one or a plurality of bare ICs provided on one or both sides of the package. The solid-state imaging device according to claim 2, wherein 4. A light-shielding case having an aperture for restricting light from the outside to the surface of the solid-state imaging device; and a subject image located inside the light-shielding case and formed by light passing through the aperture and formed on the surface of the solid-state imaging device. The solid-state imaging device according to claim 1, further comprising a lens that forms an image. 5. The solid-state imaging device according to claim 2, further comprising a shield portion for electrostatically shielding between different regions in the internal wiring of the package. 6. A camera using the solid-state imaging device according to claim 1, 2, 3, 4, or 5.