JPH10325807A - Calibration standard sample for optical inspection device, method of manufacturing the same, and sensitivity calibration method in optical inspection device - Google Patents

Abstract

(57) Abstract: In a calibration of an optical inspection apparatus, a calibration standard sample capable of performing absolute sensitivity calibration stably with high accuracy for a long period of time without limitation of applicable optical inspection apparatus, and production thereof. Provide a way. Further, an optical inspection apparatus and a sensitivity calibration method in the optical inspection apparatus which improve the operation efficiency of the sensitivity calibration are provided. A defect is simulated by a single structure formed by defining a plurality of dimensions including a height and a depth direction in a predetermined number at a predetermined position on a surface of a sample by processing such as beam processing. And the detection output of the simulated defect is guaranteed in advance by actual measurement or simulation. In addition, in order to improve the efficiency of sensitivity calibration work, the optical inspection apparatus is provided with an initial state sensitivity assurance using the standard sample, and the apparatus stores and displays sensitivity calibration results, compares the results with the reference calibration results, Calibration is performed so that the adjustment necessary portion can be determined based on the comparison.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component such as a semiconductor wafer and a photomask, a reticle, a liquid crystal substrate, etc., as an object to be inspected. The present invention relates to a calibration standard sample for an optical inspection apparatus and a sensitivity calibration method for the optical inspection apparatus.

[0002]

2. Description of the Related Art In a manufacturing process of a semiconductor device or the like, a defect such as a foreign substance present on the surface of a product is inspected. In an optical inspection apparatus for performing this inspection, for example, the product is irradiated with light, and the detection is performed by detecting scattered light generated from a defect such as a foreign substance present on the surface of the product. The optical inspection apparatus requires sensitivity calibration because the detection sensitivity is changed depending on the inspection object. Sensitivity calibration is also required to determine whether the optical inspection device has changed over time. As a standard sample for the sensitivity calibration, a sample obtained by adhering standard particles of polystyrene latex as a simulated defect to the surface of the sample is generally used as a standard. By using polystyrene latex, a simulated defect having an accurate size can be formed on a sample surface, and absolute sensitivity calibration for obtaining a relationship between the size of a defect to be detected and a detection output can be performed. However, the standard sample created by this method changes the surface condition due to the adhesion of dust in the air, etc., over a long period of use. And sensitivity calibration becomes impossible. In addition, even if cleaning is performed to remove dust adhered later, since the standard particles that are simulated defects are also removed and the surface state changes, there is still a problem that sensitivity calibration becomes impossible. I have.

For this reason, several inventions have been made for stably using a standard sample to which standard particles are adhered for a long period of time. For example, in the example disclosed in JP-A-3-218044, a surface protector having a transparent film is provided on the surface of a sample to which standard particles are adhered, so that dust in the atmosphere is prevented from adhering to the surface. Things. Further, the example disclosed in Japanese Patent Application Laid-Open No. 5-160224 discloses a configuration in which fine particles adhered onto a sample are covered with a fixed film and fixed on the surface, so that the fine particles do not fall off due to washing, and the surface is removed later. By allowing only the dust adhering to the surface to be selectively removed, long-term use is made possible.

In the example disclosed in Japanese Patent Application Laid-Open No. 4-50976, a simulated defect is formed on a sample surface by lithography instead of standard particles, using a material resistant to cleaning. In the example disclosed in Japanese Patent Application Laid-Open No. 2-177251, a light C is applied to the sample surface instead of the standard particles.
A plurality of convex pseudo foreign substances are formed by VD processing, or a plurality of concave pseudo foreign substances are formed by ion beam processing. As a method of calibrating the sensitivity of a surface inspection apparatus, Japanese Patent Application Laid-Open No. 3-214
Japanese Patent No. 641 discloses a method in which metal particles having a polydispersed particle size distribution are attached to a wafer to obtain a correlation between a plurality of surface inspection devices. In addition, 5-1125
In Japanese Patent Application Laid-Open No. 7-107, by scanning a reference pattern installed in the apparatus, detecting and storing information on a beam width from time width information of the detected scattered light, and comparing with the reference information,
An example of a foreign substance inspection device that detects a change in sensitivity is disclosed.

[0005]

By the way, a standard sample having standard particles adhered to the surface of the sample (JP-A-3-2180)
44, JP-A-5-160224, JP-A-5-160224
Japanese Patent No. 340884) discloses that the standard particles as simulated defects are scattered on the surface, and it is difficult to control the attachment position and the number of attached particles. There is a problem that it is difficult to discriminate, and it is impossible to prepare a plurality of standard samples having the same attachment position and the same number of attachments. In a standard sample in which a simulated defect is formed by processing, problems such as control of the position and the number of the simulated defect and creation of a plurality of the same sample can be solved. Form a unit pattern with the same height (depth) on the top, simulate a defect with a unit pattern group that the whole is illuminated by the illumination spot of the surface inspection device, and determine the size of the defect Because it simulates with density,
There has been a problem that applicable inspection devices are limited.

Further, in the example disclosed in Japanese Patent Application Laid-Open No. 2-177251, since the correlation between the detection output of the created simulated defect and the detection output of the defect to be actually detected is not considered, the defect to be detected is not considered. It was unsuitable for performing absolute sensitivity calibration to obtain the relationship between magnitude and detection output. Further, an example of sensitivity calibration of a surface inspection apparatus disclosed in Japanese Patent Application Laid-Open No. 3-214641 discloses a method in which a wafer to which metal particles having a polydispersed particle size distribution are adhered is used as a standard sample, and a plurality of wafers in which the number of adhered particles is changed. The correlation between the inspection devices is determined only by the number of detected devices, and it is not possible to perform absolute sensitivity calibration to confirm whether the detection output obtained from the devices is appropriate for the size of the defect to be detected. It is possible. Further, in the example disclosed in Japanese Patent Publication No. 11257/1993, since the correlation between the detection output of the created simulation pattern and the detection output of the defect to be actually detected is not considered, the size of the defect to be detected and the detection It was not possible to perform an absolute sensitivity calibration to obtain a relationship with the output.

[0007] An object of the present invention is to solve the above problems.
An object of the present invention is to provide a calibration standard sample for an optical inspection apparatus capable of performing a guaranteed absolute sensitivity calibration without limiting an applicable inspection apparatus. Another object of the present invention is to provide an optical inspection apparatus that performs a guaranteed absolute sensitivity calibration so that a defect having various sizes existing on an inspection object can be inspected with high reliability without overlooking the defect. It is to provide a sensitivity calibration method.

Another object of the present invention is to provide a method for detecting defects under or in a transparent interlayer insulating film with high sensitivity to light formed on the surface of an object to be inspected such as a semiconductor wafer during manufacturing. It is an object of the present invention to provide a calibration standard sample for an optical inspection apparatus and a sensitivity calibration method in the optical inspection apparatus, which can be inspected. Another object of the present invention is to enable high-sensitivity inspection of defects on an interlayer insulating film that is transparent to light formed on the surface of an object to be inspected such as a semiconductor wafer during manufacturing. It is an object of the present invention to provide a calibration standard sample for an optical inspection device and a sensitivity calibration method in an optical inspection device.

[0009]

In order to achieve the above object, the present invention provides an illumination optical system for irradiating illumination light to an object to be inspected, and an optical system for detecting an optical image obtained from the object to be inspected. A detection optical system, a detector that receives an optical image detected by the detection optical system and converts the optical image into an image signal, and detects the object under inspection based on the image signal detected and converted by the detector. In a method of manufacturing a calibration standard sample used for calibrating an optical inspection apparatus having a defect inspection unit for inspecting an existing defect, a three-dimensional shape design data of a simulated defect corresponding to a particle diameter of a standard particle is actually measured. The relationship between the three-dimensional shape measurement data of the simulated defect and the three-dimensional shape measurement data of the simulated defect are substantially the same, and the sensitivity prediction data for the simulated defect simulated based on the three-dimensional shape design data of the simulated defect and the three-dimensional shape measurement data of the simulated defect are used. Then, a predetermined number of three-dimensional simulated defects having three-dimensional dimensions defined by processing parameters set so that the relationship between the simulated simulated defects and the predicted data of the sensitivity of the simulated defects substantially coincide with each other are arranged on the surface of the sample. A processing step of setting and forming, and a sensitivity data measurement step of actually measuring the sensitivity of the simulated defect by inspecting the simulated defect formed in the processing step by a standard optical inspection device,
From the sensitivity data of the simulated defect actually measured in the sensitivity data actual measurement step and the three-dimensional shape design data of the simulated defect obtained from the processing step or the three-dimensional shape measurement data of the simulated defect, the simulated defect corresponding to the particle diameter of the standard particle is obtained. A guaranteed data acquisition step of acquiring guaranteed sensitivity data with respect to the three-dimensional shape data. Further, the present invention is an illumination optical system that irradiates the inspection object with illumination light, a detection optical system that detects an optical image obtained from the inspection object,
A detector that receives the optical image detected by the detection optical system and converts the optical image into an image signal; and inspects a defect existing in the inspection object based on the image signal detected and converted by the detector. In a method of manufacturing a calibration standard sample used for calibrating an optical inspection apparatus having a defect inspection unit, a three-dimensional shape design data of a simulated defect corresponding to a particle diameter of a standard particle and a three-dimensional shape measurement of the simulated defect actually measured The relationship between the simulation data and the simulation defect based on the predicted data of the sensitivity of the simulation defect simulated based on the three-dimensional shape design data of the simulation defect and the simulation defect based on the three-dimensional shape measurement data of the simulation defect is substantially the same. A simulated defect having a three-dimensional shape whose three-dimensional dimension is defined by a processing parameter set so that the relationship with the prediction data of the sensitivity A processing step of arranging and forming on the surface of the sample, prediction data of the sensitivity of the simulated defect simulated in the processing step, and three-dimensional shape design data of the simulated defect obtained from the processing step or the three-dimensional shape of the simulated defect From the measurement data, a guaranteed data acquisition step of acquiring guaranteed sensitivity data for the three-dimensional shape data of the simulated defect corresponding to the particle diameter of the standard particles, and a calibration standard sample for an optical inspection device, It is a manufacturing method.

Further, the present invention provides an illumination optical system for irradiating an inspection object with illumination light, a detection optical system for detecting an optical image obtained from the inspection object, and a detection optical system for detecting the optical image. A detector for receiving the optical image to be converted into an image signal, and a defect inspection unit for inspecting a defect existing in the inspection object based on the image signal detected and converted by the detector. As a calibration standard sample used for calibration of optical inspection equipment, the projected area and the total scattered light amount or the detected scattered light amount are almost proportional regardless of the type of three-dimensional shape such as an ellipsoid, an elliptic cylinder, and a rectangular parallelepiped. Therefore, a predetermined number of simulated defects of a three-dimensional shape (convex or concave), which are single structures having three-dimensional dimensions corresponding to the projection area, are formed on the surface of the sample. Optical inspection characterized by It is a calibration standard sample of 置用.
Further, the present invention provides a simulation standard sample used for calibrating the optical inspection apparatus, which simulates various defect sizes present in the inspection object in correspondence with different particle diameters (for example, projection areas) of standard particles. It is characterized in that a predetermined number of three-dimensional (convex or concave) simulated defects, which are plural types of single structures having different three-dimensional dimensions, are arranged on the surface of the sample. This is a calibration standard sample for an optical inspection apparatus to be used. Further, the present invention provides an illumination optical system for irradiating illumination light to an inspection object having a film having a desired thickness on its surface and transparent to light, and an optical image obtained from the inspection object. Detection optical system, a detector that receives an optical image detected by the detection optical system and converts the optical image into an image signal, and the inspection object based on the image signal detected and converted by the detector. A three-dimensional object having a three-dimensional dimension defined so as to simulate a defect present in the inspection object as a calibration standard sample used for calibrating an optical inspection apparatus having a defect inspection means for inspecting a defect existing in the object. Simulated defects of the shape, on a film having a desired film thickness and transparent to light,
A calibration standard sample for an optical inspection device, wherein the calibration standard sample is arranged and formed in a predetermined number.

Further, the present invention provides a calibration standard sample used for calibrating the optical inspection apparatus for an object to be inspected having a film having a desired thickness and transparent to light on the surface.
A predetermined number of three-dimensional simulated defects with three-dimensional dimensions defined so as to simulate defects existing in the inspection object,
A calibration standard sample for an optical inspection device, which is formed by being arranged on the surface of a sample, and wherein the simulated defect has a desired film thickness and is coated with a film transparent to light. is there. Further, the present invention provides a calibration standard sample used for calibrating the optical inspection apparatus with respect to an object to be inspected having a film having a desired film thickness and being transparent to light on the surface, wherein the simulated defect is 3 It is characterized by being formed of a plurality of types having different dimensional dimensions. Further, the present invention provides a calibration standard sample used for calibrating the optical inspection apparatus for an object to be inspected having a film having a desired film thickness and being transparent to light on the surface, wherein the simulated defect is provided. It is characterized in that the thickness of the transparent film is changed for each region to be formed. Further, the present invention is characterized in that a circuit pattern similar to the object to be inspected is formed in the calibration standard sample for the optical inspection apparatus.

Further, in the present invention, in the calibration standard sample for the optical inspection apparatus, the simulated defect is processed by energy beam removal processing, gas-assisted charged particle beam etching processing, energy beam CVD processing, or trace liquid supply. -It is characterized by being formed by laser solidification. Further, the present invention is characterized in that in the calibration standard sample for the optical inspection device, the simulated defect is formed using a scanning probe microscope. Further, in the present invention, in the calibration standard sample for the optical inspection apparatus, the guaranteed three-dimensional shape data of the simulated defect corresponding to the particle diameter of the standard particle and the guaranteed sensitivity data of the simulated defect are attached. It is characterized by. Further, the present invention provides an illumination optical system that irradiates illumination light to an inspection object, a detection optical system that detects an optical image obtained from the inspection object, and an optical element that is detected by the detection optical system. An optical inspection system comprising: a detector that receives an image and converts the image signal into an image signal; and a defect inspection unit that inspects a defect existing in the inspection object based on the image signal detected and converted by the detector. In the device, 3 so that the defect existing in the inspection object can be simulated
Using a calibration standard sample formed by arranging a predetermined number of simulated defects of a single three-dimensional shape having a prescribed dimensional dimension on the surface of the sample, the sensitivity of inspecting the defect existing in the inspection object is improved. This is a sensitivity calibration method for an optical inspection device, characterized by performing calibration.

Further, the present invention provides an illumination optical system for irradiating an inspection object with illumination light, a detection optical system for detecting an optical image obtained from the inspection object, and a detection optical system for detecting the optical image. A detector that receives the optical image to be converted into an image signal, and a defect inspection unit that inspects a defect present in the inspection object based on the image signal detected and converted by the detector. In the optical inspection device, a predetermined number of simulated defects of a plurality of types of single three-dimensional shapes having different three-dimensional dimensions so that defects existing in the inspection object can be simulated corresponding to different particle diameters of standard particles are provided. A sensitivity calibration method for an optical inspection device, comprising: calibrating a sensitivity for inspecting a defect existing in the inspection object by using a calibration standard sample arranged and formed on a surface of the sample. . Further, the present invention provides an illumination optical system that irradiates illumination light to an object to be inspected having a film having a desired thickness on its surface and transparent to light, and an optical image obtained from the object to be inspected. Detection optical system, a detector that receives an optical image detected by the detection optical system and converts the optical image into an image signal, and the inspection object based on the image signal detected and converted by the detector. An optical inspection apparatus having defect inspection means for inspecting a defect present on the surface of the object, wherein a three-dimensional simulated defect having a three-dimensional dimension defined so as to simulate a defect existing on the surface of the object to be inspected, On a film having a desired film thickness and transparent to light, a predetermined number of calibration standard samples arranged and formed are used, on or in the surface film of the inspection object. An optical inspection apparatus characterized by calibrating the sensitivity for inspecting existing defects. Is that sensitivity calibration method.

The present invention also provides an illumination optical system for irradiating illumination light to an object to be inspected which has a transparent film having a desired thickness on its surface, and an illumination optical system obtained from the object to be inspected. A detection optical system for detecting an optical image to be detected, a detector for receiving an optical image detected by the detection optical system and converting the optical image into an image signal, and detecting the optical image based on the image signal detected and converted by the detector. An optical inspection apparatus having a defect inspection means for inspecting a defect existing in an inspection object, a simulated defect having a three-dimensional shape having a three-dimensional dimension defined so that the defect existing in the inspection object can be simulated. The dummy defect is formed by arranging on the surface of the sample, and forming the simulated defect using a calibration standard sample having a desired film thickness and covered with a film transparent to light. Calibrate the sensitivity to inspect for defects present under or within the surface film of the object. The sensitivity calibration method in an optical inspection apparatus according to claim. Further, according to the present invention, in the sensitivity calibration method for the optical inspection device, a result of calibrating the sensitivity is displayed on a display unit. Further, the present invention provides a sensitivity calibration method in the optical inspection device,
It is characterized in that a result of calibrating the sensitivity and sensitivity data serving as a reference thereof are displayed together on the display means. Further, the present invention is characterized in that, in the sensitivity calibrating method in the optical inspection apparatus, a result of calibrating the sensitivity and sensitivity data serving as a reference thereof are displayed on a display means.

Further, according to the present invention, there is provided means for comparing a result obtained by carrying out a sensitivity calibration with a calibration standard sample mounted thereon and a reference calibration result, and judging a portion to be adjusted of the apparatus from the result of the comparison. An optical inspection apparatus (appearance inspection apparatus) including means and output means for outputting the determination result. Further, the present invention is characterized in that the optical inspection device includes an alarm generation unit that generates an alarm when it is determined that adjustment of the device is necessary.

As described above, according to the above configuration,
An applicable inspection device is not limited, and a calibration standard sample for an optical inspection device that can perform guaranteed absolute sensitivity calibration can be realized.

Further, according to the above configuration, an optical inspection apparatus capable of performing a guaranteed absolute sensitivity calibration and performing an inspection with high reliability without overlooking defects having various sizes existing on the inspection object. Can be realized. Further, according to the configuration, it is possible to inspect a defect under or in a transparent interlayer insulating film with respect to light formed on a surface of an inspection object such as a semiconductor wafer during manufacturing with high sensitivity. . Further, according to the configuration, it is possible to inspect a defect on the interlayer insulating film which is transparent to light formed on the surface of the inspection object such as a semiconductor wafer during manufacturing with high sensitivity.

[0018]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below with reference to FIGS. First, an optical inspection apparatus for inspecting a defect such as a foreign substance on an inspection object according to the present invention is schematically shown in FIG. In the figure, reference numeral 162 denotes an illumination optical system. Reference numeral 1621 denotes a laser light source, and reference numeral 1622 denotes a condenser lens, which collects a light beam emitted from the laser light source 1621 and illuminates the surface of the sample 1. Reference numeral 1623 denotes an illumination spot formed on the sample surface by the illumination optical system 162. Reference numeral 164 denotes a detection optical system, an inspection field of view on the sample 1,
(A range of the surface of the sample 1 where light emitted by reflection and scattering from the surface can enter the detection optical system) is imaged on the detector 165. The detector 165 photoelectrically converts the imaged light, detects scattered light generated from the surface on the sample 1, and obtains a detection output as an electric signal. The detector 165 is configured so that the larger the received light, the larger the output electric signal. In addition,
The figure shows an example in which a one-dimensional solid-state imaging device is used for the detector 165. Sample 1 is an xyz stage 161
0, and xy scanning is performed while maintaining the position in the z direction at the focal position of the detection optical system 164, thereby inspecting the entire surface of the sample. The coordinates X, Y, and Z are directions indicated by arrows in FIG.

Next, scattered light generated from an object (defect such as a foreign substance) will be described. FIG. 7 is a diagram illustrating total scattered light generated from an object. Reference numeral 70 denotes an object that generates scattered light (a defect such as a foreign substance, or a simulated defect). 71 is the total scattered light generated from the object. An illumination light 72 illuminates an object. 73
Is the illumination angle of the illumination light. As shown at 71, the scattered light from the object is emitted in all directions. FIG. 8 is an explanatory diagram showing the detected scattered light detected by the detection optical system among the total scattered light generated from the object. Reference numeral 70 denotes an object that generates scattered light (a defect such as a foreign substance, or a simulated defect). 71 is the total scattered light generated from the object. An illumination light 72 illuminates an object. 73 is the illumination angle of the illumination light. 10 is a surface assuming the surface of the sample. 81 is a detection optical system. 82 is an opening of the detection optical system. 83 is a component of the total scattered light 71 generated from the object that directly enters the detection optical system. Reference numeral 84 denotes a component of the total scattered light 71 generated from the object, which is reflected on the sample surface and enters the detection optical system. As shown in FIG. 8, of the scattered light generated from the object, a component 8 entering the detection optical system
Reference numerals 3 and 84 denote components that contribute to the detection output of the optical inspection apparatus. The magnitude of this component is hereinafter referred to as a detected scattered light amount.

Next, a description will be given of the result of a study on which parameter of the object depends on the amount of scattered light generated from the object. FIG. 9 is a diagram illustrating the projected area of the object as an example of the parameter of the object. In the figure, 70
Is an object, 72 is illumination light for illuminating the object, and 73 is an illumination angle of the illumination light. Reference numeral 91 denotes a plane perpendicular to the optical axis of the illumination light, and reference numeral 92 denotes a shadow of the object 70 projected on the plane 91. The area of 92 is defined as the projected area of the object. As shown in the figure, the projected area of the object is a quantity related to how much light the object geometrically blocks. 10 and 11 show the relationship between the calculation result of the amount of scattered light from the object and the projected area of the object. FIG. 10 shows the projected area of the object,
FIG. 3 is an explanatory diagram showing a relationship with total scattered light generated from an object. FIG. 11 is an explanatory diagram showing the relationship between the projected area of the object and the amount of scattered light detected from the object. The calculation is based on the wavelength of the illumination light: 800
nm, illumination angle: 5 °, the object has three basic shapes: elliptical, elliptical cylinder, and cubic, and the projected area of the object:
Range of 0.1μm ² ~1μm ² (diameter 0.36Myuemu～1.
(Corresponding to standard particles of about 1 μm), the numerical aperture (NA) of the detection optical system: 0.5, (the aperture angle (82 in FIG. 8): 30 °).
The conditions were followed. As shown in FIGS. 10 and 11, in the range of this calculation, a result was obtained in which both the total scattered light amount and the detected scattered light amount were substantially proportional to the projection area of the object. From the above results, in the optical inspection apparatus, it is considered that the amount of scattered light detected from an object (defect such as a foreign substance) (the amount of light incident on the detection optical system) is proportional to the projection area defined above, regardless of its shape.

As described above, the sample 1 is irradiated with a laser spot (illumination spot) from an oblique direction by the illumination optical system 162, and scattered light generated from an object (defect such as a foreign substance) is generated by the optical inspection apparatus shown in FIG. A study until the light enters the detection optical system 164 was examined. As shown in FIG. 16, in the optical inspection apparatus, an image of the sample surface is formed on the detector 165 by the detection optical system 164, photoelectrically converted by the detector 165, and detected as an electric signal. We will get the output, which we will discuss below. FIG. 17 shows the relationship between the detection field of view, the illumination spot, and the detector of the optical inspection apparatus shown in FIG. 16 and the image of the foreign substance formed on the detector. Reference numeral 171 denotes a detection field of view, 172 denotes an illumination spot, 173 denotes a detector when a sample is replaced on a sample (for example, a one-dimensional solid-state imaging device is shown), 174, 175
Indicates a foreign substance imaged on the detector 165 (173 when replaced on the sample). Here, it is assumed that 174 and 175 are images of scattered light of foreign substances 184 and 185 as shown in FIG. In FIG. 18, 1 is a sample, 181 is illumination light, 18
Reference numerals 4 and 185 denote foreign substances formed as images 174 and 175 on the detector 165 (173 when replaced on the sample) in FIG. Here, the foreign substances 184 and 185 are flat
When viewed from the (xy plane), it is assumed that 185 is larger than 184 and height (z direction) is larger than 185 than 185. Considering the result described above that the amount of scattered light generated from an object (foreign matter) and incident on the detection optical system of the optical inspection device is proportional to the projected area of the object (foreign matter) with respect to the illumination light. 18
4 and 185 may have the same projected area. That is, even if the dimensions in plan view are different, the amount of light incident on the detection optical system 164 from each foreign substance may be the same. However, the detection output obtained by the optical inspection device is an electrical output as a result of photoelectric conversion by the detector 165, and even if the amount of light incident on the detection optical system 164 is the same, FIG. As shown, the size of both images formed on the detector 165 (173 when replaced on the sample) (size of foreign matter when viewed in a plan view)
Are different from one pixel of the detector 165 ((0.
3 μm × 0.3 μm) to (0.5 μm × 0.5 μm))
When the image is formed smaller than (174), the detector 16
In the case where an image is formed larger than one pixel of No. 5 (175), the electrical detection output is different.

[0022] assumption above, any size to form all the simulated defects of the three-dimensional shape formed calibration standard sample (about projected area of 0.1μm ² ~1μm ²⁾ of the optical inspection device according to the present invention I will describe below. FIG. 19 shows an example of standard particles generally used for a standard sample and a simulated defect formed by processing. 191, 192,
193 denotes standard particles having different sizes, 1911,
1912 and 1913 respectively define a planar dimension (x and y) and a dimension in the height direction (z), and have the same projected area as the standard particles 191, 192 and 193, and emit the same amount of scattered light. Simulated defects 1921, 1922, 192 formed so as to be incident on the detection optical system of the optical inspection device.
No. 3 has the same dimensions in the height direction (z), and changes only the planar dimensions (x and y) to obtain standard particles 191 and 1.
Have the same projected area as 92,193 (0.1μm ² ~1μm ² about), it is formed with simulated defects to be incident the same amount of scattered light detecting optical system 164 of the optical testing apparatus.
Forming simulated defects having the same thickness and defining only planar dimensions as shown in 1921, 1922, and 1923 requires efficient formation of all simulated defects at once by lithography. it can. Meanwhile, 1
In order to form the simulated defects by changing the height (dimension in the z direction) one by one as in 911, 1912, and 1913, it is necessary to form the simulated defects individually, which is inefficient compared to lithography. However, as described with reference to FIGS. 17 and 18, even if the projection area is the same and the scattered light incident on the detection optical system of the optical inspection apparatus is the same, the planar dimensions (x, y) are different. For example, since the output detected by the detector 165 may be different, for example, when the standard particle 193, the simulated defect 1913, and the simulated defect 1923 are compared, the detection output finally output from the detector 165 is in the planar direction. Defect 191 in which the size in the height direction is defined by processing
3, the same as the standard particle 193 can be obtained, but the simulated defect 1923 defining only the size in the plane direction.
In this case, the standard particles are different from the standard particles 193, and it is impossible to establish a relationship with a standard sample in which standard particles (particle diameter is about 0.36 μm to 1.1 μm) are scattered.

Until now, the simulated defect is assumed to be a convex defect as shown by 2 in FIG. 2 and the dimension in the z direction is set to “height”. However, the simulated defect formed by processing is 3 in FIG.
It is also possible to form a concave shape as shown in FIG. In this case, the dimension in the z direction is “depth”. (In FIG. 2, 1 is a sample.) As described above, in the standard sample for calibration of the optical inspection apparatus according to the present invention, the standard particles generally used (the particle diameter is 0.1 mm) are formed due to the simulated defects formed by the processing. 36
In order to obtain the correlation between the detection output and the standard sample on which 191 to 193 are scattered, the size of the simulated defect to be formed must be a plurality of sizes (3 or more including the height or depth direction). Dimensional dimensions) need to be defined. For example, when viewed in a plane (within the xy plane in FIG. 18), the size of the simulated defect is a standard particle (particle diameter 0.36 μm).
m to about 1.1 μm), and the height is such that scattered light equivalent to the scattered light generated by the standard particle can be generated (the projected area is the same as the standard particle). The height is specified (about 0.3 μm to 1 μm). Usually, the size of a defect is often defined as a planar dimension as a result of observation with a microscope or the like. Therefore, by defining the three-dimensional three-dimensional dimensions of the simulated defect as described above, The correspondence between the size and the detection output can be handled in the same manner as the standard particles (about 0.36 μm to 1.1 μm), and a calibration standard sample usable regardless of the inspection apparatus can be obtained. Thereby, for example, the detection sensitivity between optical inspection devices having different detection methods (for example, a scattered light detection type optical inspection device (foreign matter inspection device) and a bright field illumination / comparative inspection type optical inspection device (defect inspection device)) Can be correlated.

As described above, the simulated defect formed as the calibration standard sample of the optical inspection apparatus according to the present invention is:
The position and number of formations on the sample can be specified, and the applicable inspection device is specified so as not to be limited.
What is needed is one that has various dimensions in a three-dimensional (three-dimensional) manner, is capable of producing a plurality of identical standard samples, is washable, and maintains stable characteristics for a long period of time. In particular, as a simulated defect, in order not to limit the applicable inspection apparatus, it is not sufficient to simply change the planar dimensions, but variously three-dimensionally to correspond to standard particles of various particle diameters ( It is necessary to change the dimensions three-dimensionally.

Next, a method of manufacturing a simulated defect defining a plurality of three-dimensional (three-dimensional) dimensions including the height or depth direction according to the present invention will be described. First, a simulated defect (three-dimensional dimension of about 0.3 μm to 1 μm) defining a plurality of dimensions (three-dimensional dimension) including the height or depth direction according to the present invention is defined by FIB. (Focused Ion Bea
m: Focused ion beam or EB (Elctron Beam:
A method of manufacturing using a charged particle beam such as an electron beam will be described with reference to FIG. In the drawing, reference numeral 1 denotes a sample on which a simulated defect is formed on the surface. 30 is a gas supply system,
31 is a gas supply source. 32 and 34 are valves, 33
Is a gas flow control means. Reference numeral 35 denotes a nozzle for supplying gas to the surface of the sample 1. 36 is a supplied gas. 301 is a vacuum chamber, 302 is a vacuum chamber 30
Reference numeral 303 denotes a charged particle beam source, reference numeral 304 denotes an electrostatic lens for converging the charged particle beam, reference numeral 305 denotes a stage on which a sample can be placed and movable in the X and Y directions, and reference numeral 306. Is a charged particle beam.

There are several types of processing using a charged particle beam. The first processing method uses the charged particle beam 30
6 is a sputtering process. In this case, the processing is performed by removing the surface material by sputtering, and a simulated defect having a concave shape or a simulated defect having a convex shape is formed by removing a part of the simulated defect. In this case, the gas supply system 30 is unnecessary. Both the simulated defect having a concave shape and the simulated defect having a convex shape are three-dimensionally, and the dimension of one side is about 0.3 μm to 1 μm. Therefore, when the dimension of one side is about 0.3 μm,
Processing can be performed with high accuracy by focusing the charged particle beam to 0.1 μm or less and performing processing while scanning it two-dimensionally. Regarding the concave or convex simulated defect, a height or depth of about 0.3 μm can be obtained depending on the dose and the irradiation time. Also, three-dimensionally,
When the size of one side is about 1 μm, the processing can be performed with high accuracy by focusing the charged particle beam to 0.3 μm or less and processing while scanning two-dimensionally. Regarding the height or depth method, 1μ depends on the dose and irradiation time.
m can be obtained. The second processing method is gas-assisted etching using the charged particle beam 306.
In this case, the gas to be supplied is chlorine gas (Cl ₂ ), xenon difluoride (XeF ₂ ), iodine gas (I ₂ ), bromine gas (Br ₂ ),
Alternatively, steam (H ₂ O) or the like is used as an assist gas,
Processing is performed by removing the material on the surface by gas-assisted etching, and a simulated defect having a concave shape or a simulated defect having a convex shape is formed by removing the periphery while leaving a part thereof. Also in this case, the dimension of one side is three-dimensionally 0.3 μm.
Since the diameter is about m to 1 μm, processing accuracy can be improved by focusing and processing the charged particle beam 306 to 0.1 μm or less to 0.3 μm or less.

The third processing method uses a charged particle beam 306.
Is a CVD method using the above method. In this case, a pyrene gas, W (CO) ₆ , a mixed gas of TEOS + O _2, a mixed gas of TEOS + O ₃ , or the like is used as a material gas, and CVD is performed at a position irradiated with the charged particle beam. , W or the like, or a material such as SiO ₂ is deposited to form a simulated defect having a convex shape. Also in this case, since the dimension of one side is three-dimensionally about 0.3 μm to 1 μm, the charged particle beam 306 is not more than 0.1 μm to 0.3 μm
By converging the film to m or less and forming the film, the processing accuracy can be improved. However, in the case where the protrusions having a desired three-dimensional dimension are excessively deposited, the protrusions having the desired three-dimensional dimension are removed by sputtering or etching using charged particles. Simulated defects can be formed. The reason is that the removal processing can focus the charged particle beam diameter by 0.1 μm.
This is because processing can be performed with an accuracy of about 0.01 to 0.02 μm or less, and extremely fine processing accuracy can be obtained as compared with deposition film formation. In any processing method, defining the position at which the simulated defect is formed is performed by observing the reference mark formed on the sample 1 with a microscope and controlling the position of the stage 305 based on the observed reference mark. It becomes possible by doing. Further, the definition of the number of the simulated defects can be realized by controlling the position of the stage 305 and repeating the above processing. Also,
The three-dimensional (three-dimensional) dimension (size) of the simulated defect here is 0.1 μm or less to 0.3 μm in plan view.
m or less, and controls the irradiation range of the charged particle beam 306 focused below 30 m.
It becomes possible by controlling the processing time including the dose for irradiating No. 6. When controlling the irradiation range of the charged particle beam 306 in a plane, the deflection amount (scanning range) of the charged particle beam 306 may be controlled, or the movement amount of the stage 305 with respect to the charged particle beam 306 may be controlled. It may be controlled. In addition, the charged particle beam 3
When controlling the processing time by 06, in the case of CVD,
The gas flow rate may be controlled. In this way, the formation position and the number of formations can be specified, and three-dimensionally (three-dimensionally) various dimensions (the particle diameter of the standard particles is 0.36 μm to 1.1 μm
The extent corresponding three-dimensional geometry of one side is about 0.3μm~1μm projected area is 0.1μm ² ~1μm ² about. ) Can be realized.

Next, a method of manufacturing a simulated defect defining a plurality of dimensions (three-dimensional dimensions) including a height or depth direction using a laser beam according to the present invention will be described with reference to FIG. Will be explained. In the figure, reference numeral 1 denotes a sample on which a simulated defect is processed on the surface. 40 is a gas supply system;
Is the gas source. 42 and 44 are valves, 43 is a gas flow controller, 45 is a nozzle for supplying gas to the sample surface, and 46 is a supplied gas. Reference numeral 401 denotes a vacuum chamber; 402, a vacuum exhaust port for evacuating the vacuum chamber 401; 403, a laser source; 404, a lens for condensing a laser beam;
It is a stage that can be moved in any direction. 406 is a laser beam. 407 is a mirror for changing the direction of the laser beam, and 408 is a window for introducing the laser beam into the chamber.

There are several types of laser processing. First
Is a removing process using a laser beam 406. Processing is performed by removing the material at the position irradiated with the laser beam 406, and a concave-shaped simulated defect or a convex-shaped simulated defect is formed by removing a part of the simulated defect. However, even if ultraviolet light with a shorter wavelength is used as laser light, such as excimer laser light,
Since it is difficult to focus the light beam more finely than the charged particle beam, and the removal processing by the laser beam is basically a thermal processing, the dimensional accuracy of the simulated defect is significantly inferior to the removal processing by the charged particle beam. In this case, the gas supply system 40 becomes unnecessary. The second processing method uses laser C
VD processing. In this case, the supplied gas is Mo (CO)
₆ , W (CO) ₆ , or Pt (CO) ₆ , Au (CO) ₆ , T
Using EOS or the like as a material gas, CVD is performed at a position irradiated with a laser beam, and a metal or SiO ₂ is deposited to form a simulated defect having a convex shape. In this case, the deposition film forming speed is faster than that by the charged particle beam CVD, but the accuracy is inferior. Therefore, laser CV
Excessive ones are removed by sputtering or etching with charged particles from the film formed in D, and finishing is performed, thereby forming a high-precision simulated defect having a desired three-dimensional dimension with high accuracy. Can be formed.

In any of the processing methods, defining the position at which the simulated defect is formed is performed by observing the reference mark formed on the sample 1 with a microscope, and using the observed reference mark as a reference, the position of the stage 405 is determined. Can be controlled by controlling. Further, the definition of the number of the simulated defects can be realized by controlling the position of the stage 405 and repeating the above processing. The three-dimensional (three-dimensional) dimension (size) of the simulation defect is controlled by controlling the irradiation range of the laser beam 406 in a planar manner, and the laser beam 406 is irradiated in the height or depth. It becomes possible by controlling the processing time including the dose amount to be processed. When the irradiation range of the laser beam 406 is controlled in a plane, for example, the aperture of a rectangular aperture provided in the irradiation optical path may be adjusted, or the laser beam 406 may be adjusted.
The movement amount of the stage 405 may be controlled. When controlling the processing time by the laser beam 406 for the height or the depth, in the case of CVD, the gas flow rate may be controlled. In this way, the formation position and the number of formations can be specified, and three-dimensionally (three-dimensionally) various dimensions (the particle diameter of the standard particles is 0.36 μm to projected area of considerable 1.1μm is 0.1μm size of ^{2 ~1μm 2} about a is one side to realize a calibration standard sample simulated defect is fabricated having a three-dimensional shape.) of about 0.3μm~1μm be able to.

Next, a method for manufacturing a simulated defect defining a plurality of three-dimensional three-dimensional dimensions including the height or depth direction according to the present invention by a liquid trace supply-laser processing method will be described with reference to FIG. In the figure, reference numeral 1 denotes a sample, and a micropipette 501 supplies a small amount of a liquid material 502 in which, for example, an organometallic complex is made into a liquid state with a solvent (the supplied liquid material is 52), and a laser beam 503
Irradiation is performed to evaporate, for example, an organic substance of the liquid material to solidify the metal, thereby forming a convex-shaped simulated defect 2. In the figure, reference numeral 504 denotes a lens for condensing a laser beam. In this case, defining the position at which the simulated defect is formed is performed by observing a reference mark formed on the sample 1 with a microscope, and by using the observed reference mark as a reference, the position of the stage or the position of the micropipette 502 is determined. It becomes possible by controlling. As for defining the number of simulated defects, the position of the stage is controlled,
This can be realized by repeatedly supplying the micropipette 501 with a small amount of the liquid material 502.
The three-dimensional (three-dimensional) dimension (size) of the simulation defect can be realized by controlling the amount of the liquid material 502 supplied at a time by the micropipette 502. In particular, the liquid material 50
By controlling the viscosity of 2, it is possible to control the ratio between the height and the planar spread. In this case, too, the accuracy of the three-dimensional shape is greatly reduced. Therefore, by removing the excess by sputtering or etching with charged particles and performing finishing, a high-precision desired 3D shape can be obtained.
A simulated defect having a dimensional dimension and a convex shape can be formed.

Next, according to the present invention, a method of manufacturing a simulated defect defining a plurality of three-dimensional three-dimensional dimensions including a height or depth direction by a scanning probe microscope (SPM). This will be described with reference to FIG. Simulated defects are manufactured by performing removal, processing, or deposition processing at the atomic level by SPM. In the figure, 1 is a sample, 601 is an SPM probe, and 602 is a material to be deposited. By performing removal or deposition processing at the atomic or molecular level using an SPM probe, it is possible to form a fine simulated defect. Also in this case, defining the position where the simulated defect is formed is performed by observing the reference mark formed on the sample 1 with a microscope,
It becomes possible by controlling the position of the stage or the position of the probe 601 of the SPM with reference to the observed reference mark. Further, the definition of the number of the simulated defects can be realized by controlling the position of the stage and repeating the deposition of the material 602 at the atomic level by the SPM probe 601. The three-dimensional (three-dimensional) dimension (size) of the simulated defect is realized by repeating the deposition of the material 602 at the atomic or molecular level by the SPM probe 601 at the same location. Is possible.

Next, an embodiment in which the applicable range of the calibration standard sample according to the present invention, in which a plurality of three-dimensional simulated defects including a height or depth direction are defined, is manufactured. Will be described with reference to FIGS. FIG. 12 shows a calibration standard sample coated with a film having the same optical properties as the film formed by using the method for manufacturing a semiconductor device, with respect to the simulated defect manufactured on the sample surface as described above. It is explanatory drawing which shows a cross section. In the figure, 1
Is a sample. Reference numeral 2 denotes a simulated defect manufactured as described above. Reference numeral 3 denotes a concave dummy defect manufactured as described above. Since the simulated defects 2 and 3 are not limited to an optical inspection apparatus to be applied, it is desirable that a plurality of types having different three-dimensional dimensions are arranged. 121
Is a film made of an insulating film made of, for example, SiO ₂ which is transparent to light for covering the simulated defect by plasma CVD or the like. 12
2 is the thickness of the film 121. As described above, the manufactured film 121 covering the simulated defects 2 and 3 may be the same as an insulating film such as SiO ₂ formed at the time of manufacturing a semiconductor device, or may have optical properties ( Another material having the same refractive index as that of the insulating film may be used. By using the calibration standard sample configured as described above, when performing a defect inspection on an object to be inspected having a light-transparent film formed on a surface thereof, such as a semiconductor wafer, the inspection is performed with respect to the light. To simulate defects present in or below the transparent film. That is, it is possible to simulate a defect existing in or under an insulating layer that is transparent to light as an object to be inspected. Further, by using a calibration standard sample in which the film thickness 122 of the film 121 covering the simulated defect is changed, the simulated defect 2 or 3 can be detected with respect to the variation in the film thickness transparent to light in the manufacturing process. It is also possible to simulate a change in output.

FIG. 13 shows a calibration standard sample coated with a film having the same or the same optical properties as the film formed on the surface as the object to be inspected, and on which a simulated defect was manufactured as described above. Explanatory drawing which shows a cross section. In the figure, 1 is a sample.
Reference numeral 2 denotes a convex shaped simulated defect manufactured as described above. 3
Is a simulated concave defect manufactured as described above. Since the simulated defects 2 and 3 are not limited to an optical inspection apparatus to be applied, it is desirable that a plurality of types having different three-dimensional dimensions are arranged. 131 The sample surface was coated with a plasma CVD or the like, a film made of an insulating film of a transparent example, SiO ₂ or the like to light the simulated defect is formed thereon. 132 is the thickness of the film 131. A film 131 that covers the surface of the sample and on which a simulated defect is formed
Is a light-transmissive SiO such as a semiconductor wafer.
The insulating film may be the same as the insulating film such as ₂ or another material having the same optical physical properties (refractive index, etc.) as the insulating film. By using the calibration standard sample configured as described above, when performing a defect inspection for an inspection target such as a semiconductor wafer having a light-transparent film formed on its surface, it is difficult to detect a defect with respect to light. It is possible to simulate a defect existing on a transparent film (insulating layer). Further, by using a calibration standard sample in which the film surface is changed and the film thickness 132 of the film 131 on which the simulated defect is formed is formed, the film 131 is coated on the film 131 with respect to the film thickness variation in the manufacturing process. It is also possible to simulate a change in the detection output of the simulated defect 2 or 3 existing in the above.

In the case shown in FIGS. 12 and 13, since a film transparent to light, such as an insulating layer, is formed as the object 1 to be inspected, the light reflected from the surface of the film and the light reflected from the back surface of the film And the reflected light is received by the detector 165 under the influence of the interference of these lights and the like, and the image signal is detected. In addition, a change in the thickness of the insulating layer changes the state of light interference. Therefore, when inspecting the inspection object 1 having a light-transparent film such as an insulating layer for defects, the calibration standard sample is used to obtain the light-transparent film. The sensitivity can be calibrated to a state where the influence is reduced as much as possible. FIG.
A standard sample or a sample surface in which the simulated defect formed on the sample surface is coated with a film having the same or the same optical properties as a film (insulating film) formed in a semiconductor manufacturing process,
In a standard sample with the same or the same optical properties as the film (insulating film) formed in the semiconductor manufacturing process, and a simulated defect formed on it, the film of the film coated on the same sample surface It is a figure for explaining a calibration standard sample formed so that a thickness differs with places. In the figure, reference numeral 23 denotes a simulated defect manufactured as described above on the sample surface or film. Since the simulated defect 23 is not limited to an applicable optical inspection apparatus, it is preferable that a plurality of types of three-dimensionally different sizes are arranged. Reference numerals 141, 142, 143, and 144 are films covering the simulated defects 23 or films covering the surface of the sample and having the simulated defects 23 formed thereon. Membrane 14
1, 142, 143, and 144 are other materials having the same optical properties (refractive index, etc.) as the film formed in the semiconductor manufacturing process, even if they are the same as the film formed in the semiconductor manufacturing process. Is also good. Membranes 141, 142, 1
43 and 144 have the same geometric shape in a plane (within the xy plane in the figure) (a rectangular shape of Xc × Yc in the example of FIG. 14), and have a constant interval (the pitch in the example of FIG. 14). Xc)
It is arranged by. This simulates a chip formed on a wafer in a semiconductor manufacturing process. Simulated defect 23
Are located at the same position in the regions within the films 141, 142, 143, 144. The films 141, 142, 14
When the insulating films 3 and 144 are formed of an insulating film such as SiO ₂ by plasma CVD or the like, the thin films are formed over the entire surface, and regions having a small thickness are sequentially masked, so that, for example, the film thickness is set in a chip unit. Is different from Z1 to Zn. The films 141, 142, 143, 144
A case of forming an insulating film such as SiO ₂ by plasma CVD or the like, is formed over the entire surface to the most large thickness, by varying locally polishing amount thereafter using a CMP (Chemical Mechanical Polishing), for example, The film thickness is made different from Z1 to Zn for each chip.

By using the calibration standard sample thus configured, the sensitivity can be calibrated for an object to be inspected in which the thickness of the film transparent to light changes. Also,
For example, in an inspection of a type in which a surface inspection is performed by chip comparison, it is possible to calibrate the detection characteristics of the comparative inspection even if a change occurs in the thickness of a film transparent to light. FIG.
Was provided adjacent to the simulated defect formed on the sample surface,
It is explanatory drawing about the calibration standard sample which has a structure which simulates a circuit pattern of a semiconductor device etc. In the figure, 1 is a sample. Reference numeral 72 denotes illumination for illuminating the sample in the optical inspection device. Reference numeral 23 denotes a convex or concave simulated defect manufactured as described above (a convex simulated defect is shown in FIG. 15). Since the simulated defect 23 is not limited to an applicable optical inspection apparatus, it is preferable that a plurality of types of three-dimensionally different sizes are arranged.
Reference numeral 150 denotes a structure that simulates a circuit pattern of a semiconductor device. 151 is the distance between the simulated defect 23 and the structure 150 simulating the circuit pattern of the semiconductor device, 152 is the height of the structure 150 simulating the circuit pattern of the semiconductor device, 153 is the structure 150 simulating the circuit pattern of the semiconductor device and the illumination. 7
It is the angle between the two. The circuit pattern 150 is formed by using a normal semiconductor manufacturing process (sputtering film formation, exposure, and etching). By using the calibration standard sample configured as described above, it is possible to simulate a defect such as a foreign matter in a shadow of a circuit pattern of a semiconductor device. In this case, the detection output of the simulated defect is a distance 15 from the structure 150 simulating the circuit pattern of the semiconductor device.
1. The height 152 of the structure 150 simulating the circuit pattern of the semiconductor device. Since it changes depending on the angle 153 between the structure 150 simulating the circuit pattern of the semiconductor device and the illumination 72, the above-mentioned 151 to 153 are parameters when simulating a defect such as a foreign matter in the shadow of the circuit pattern of the semiconductor device.

FIG. 1 shows an embodiment of an apparatus according to the present invention for performing a procedure for manufacturing a calibration standard sample in which a plurality of types of simulated defects having different three-dimensional dimensions are arranged. It is a schematic structure diagram showing. Numeral 100 denotes design data of the simulated defect corresponding to the physical property value of the standard particle and the particle diameter thereof, and the contents thereof include the simulated defect physical property value data 101 and the simulated defect shape design data 102. The simulated defect physical property value data 101 is provided as physical property data and particle diameter data of standard particles. In particular, the shape design data 102 of the simulated defect is designed and created based on the data of the physical property values and the particle diameters of the standard particles. The defect detection simulator 110 uses the wavelength of the illumination light of a standard optical inspection device, the illumination angle, the NA (opening) of the detection optical system 164, the size of the pixel of the detector 165 (converted value on the inspection object), and the like. Based on the configuration data 103, the detection output (sensitivity) is predicted on the basis of the shape design data 102 of the simulated defect, and a simulation result 106 is obtained. The defect detection simulator 110
An optical simulator using a Fourier transform may be used, a detection output from an object may be obtained by directly solving the Maxwell equation, or a combination of both may be used. On the other hand, the simulated defect processing means 1
Reference numeral 11 denotes a simulated defect 105 having a three-dimensional shape conforming to the shape design data 102 based on a processing parameter 104 set based on the simulated defect shape design data 102.
Is formed on the surface of the sample 1 by processing. As the simulated defect processing means 111, various processing methods such as beam removal processing or CVD local film formation processing can be applied, as described in detail in the above description of FIGS. . However, the size of the three-dimensional shape of the simulated defect is 0.36 μm to 1.1 μm in the particle diameter of the standard particle.
Therefore, the FIB removal processing or the FIBCVD film formation processing is most suitable. In this way, in the simulated defect processing means 111, the size of the three-dimensional shape of the simulated defect is set to 0.36 μm to 1.
Since it is necessary to correspond to about 1 μm, it may not be possible to perform processing according to shape design data by setting processing parameters once. Accordingly, the shape of the processed simulated defect 105 is measured by the shape measuring means 112, and the measured shape data 108 of the simulated defect measured by the shape measuring means 112 is the shape design data 1 of the simulated defect.
02 is compared with the comparing means (1001), and if the dimensional difference is within the allowable range, it is determined to be OK, and if it exceeds the allowable range, it is determined to be NG. In the case of NG, the processing parameter 1 set above
04 is corrected, and the simulated defect 105 is processed on the sample again by the simulated defect processing means 111. In this way, it is possible to form a simulated defect 105 having a three-dimensional shape within an allowable range for the design shape data 102 on the sample. It should be noted that the shape measuring means 112 can use an SPM (Sc
anning Probe Microscope (scanning probe microscope) or an optical measurement method such as a phase contrast microscope and a differential interference microscope, 0.36 μm to 1.1 μm
It suffices if the three-dimensional shape size of the simulated defect having a size corresponding to the degree can be measured.

Further, the defect detection simulator 110 uses the wavelength of the illumination light of the standard optical inspection apparatus, the illumination angle, the NA (opening) of the detection optical system 164, and the size of the pixel of the detector 165 (on the inspection object). The detection output (sensitivity) is estimated based on the actual measured data 106 of the simulated defect measured by the shape measuring means 112 based on the configuration data 103 such as (converted value of), and the simulation result 107 is obtained. A means for comparing a predicted detection output (prediction sensitivity) 107 based on the shape measurement data, which is the simulation result, with a prediction detection output (prediction sensitivity) 106 based on the shape design data 102 of the simulated defect obtained as a simulation result earlier ( 100
If the difference between the two is within the allowable range, it is determined to be OK, and if the difference is outside the allowable range, it is determined to be NG. In the case of NG, the processing parameters 104 are corrected again, and the simulated defect 105 is processed on the sample again by the simulated defect processing means 111. Thus, finally, the shape design data 1 of the simulated defect
02 is to find a processing parameter that matches a predicted detection output (prediction sensitivity) 107 based on shape measurement data. The comparing means 1001 is for driving the required processing parameters from the three-dimensional shape. Note that the simulation program conditions in the defect detection simulator 110 are determined in advance so as to substantially match the detection output (sensitivity) actually measured by the detection output measuring means 113 described later. However, by determining the simulation program conditions in the defect detection simulator 110 with reference to the detection output (sensitivity) actually measured by the detection output measuring means 113 described later, the detection outputs (sensitivity) 106 and 107 by the simulation and the detection by the actual measurement are determined. The output (sensitivity) 109 can be easily matched. As described above, the shape design data of a simulated defect for manufacturing a calibration standard sample in which a large number of a plurality of types of simulated defects having different three-dimensional dimensions (each side is about 0.3 μm to 1.0 μm) is arranged. Optimum processing by the simulated defect processing means (for example, the FIB removal processing apparatus or the FIBCVD processing apparatus) 111 for the actual measurement data 102 or the simulated defect shape measurement data 106 (for example, the three-dimensional shape data of the simulated defect given by the particle diameter of the standard particle). The parameters will be determined.

Next, based on the obtained optimum processing parameters, a simulated defect processing means (for example, an FIB removal processing apparatus or a FIBCVD processing apparatus) 111 places the same three-dimensional dimensions on a predetermined region on the sample. A group of simulated defects in which a large number of simulated defects are two-dimensionally arranged at predetermined intervals is further processed so as to be sequentially arranged in different regions with different three-dimensional dimensions, and one calibration standard sample is prepared. Create That is, a plurality of types of simulated defects having different three-dimensional dimensions (one simulated defect group includes a large number of simulated defects of the same type) on one sample so that applicable optical inspection apparatuses are not limited. Are two-dimensionally arranged in a predetermined area. Further, based on the same optimum processing parameters, the simulated defect processing means (for example, FIB removal processing apparatus or FIBC
The required number of calibration standard samples are repeatedly created by the VD processing device 111. As described above, a predetermined number of calibration standard samples for the optical inspection device according to the present invention are manufactured.

Finally, the detection output (sensitivity) of the simulated defect on each of the manufactured calibration standard samples is measured by the detection output measuring means 113 comprising a standard optical inspection apparatus, and the simulated defect detection output (sensitivity) is measured. Sensitivity) Obtain actual measurement data 109. The detection output measuring means 113 used at this time may use an optical inspection apparatus itself used for actual defect inspection or an equivalent apparatus configuration capable of obtaining a result equivalent to the optical inspection apparatus used for actual defect inspection. What is necessary is just to use the standard optical inspection apparatus which has. That is, this standard optical inspection apparatus uses the wavelength of the illumination light, the illumination angle, the NA (aperture) of the detection optical system 164, and the size of the pixel of the detector 165 (the object to be inspected) for simulation in the defect detection simulator 110. A device configuration having configuration data 103 such as a conversion value on an object may be used. The reason why the detection output (sensitivity) of the simulated defect is actually measured using the standard optical inspection apparatus is that the guaranteed detection output (sensitivity) of the simulated defect is obtained by simulation. By the above procedure, from the shape design data 102 of the simulated defect or the measured shape data 106 of the simulated defect,
For example, three-dimensional shape data in which a simulated defect given by the particle diameter of the standard particle is guaranteed can be obtained.
Can obtain the guaranteed detection output (sensitivity) data of the simulated defect having the three-dimensional shape data, and by attaching a recording medium or the like on which these data are recorded to each calibration standard sample, it is possible to obtain the guaranteed accuracy. A calibration standard sample for a high optical inspection apparatus can be obtained.

In the simulation 110, regarding the configuration data such as the wavelength of illumination light, the illumination angle, the aperture of the detection optical system, the size of the pixel of the detector, etc., the optical inspection apparatus to be calibrated is used in the simulation 110. The detection output (sensitivity) of the simulated defect can be predicted at any conceivable configuration data value, so that the detection output can be guaranteed over a wide range. For example, different optical inspection devices,
Alternatively, it is possible to guarantee the detection output of the standard sample over future optical inspection devices that do not currently exist. In this case, the detection output (sensitivity) data 1 by simulation is used as the guaranteed detection output (sensitivity) data of the simulated defect.
07 can be used, but it is preferable to use the detection output (sensitivity) data 109. By the way, in the above description, the method of guaranteeing the detection output of the simulated defect by both the simulation and the actual measurement has been described.
In some cases, it is needless to say that it is possible to guarantee only by simulation or only by actual measurement.

The simulated defects described above may be provided directly on a product of an electronic component such as a semiconductor wafer having a pattern. By providing a simulated defect on the actual product, the sensitivity status of the optical inspection device in use on the production line can be grasped in real time, and the device can be adjusted quickly or based on the result of the simulated defect detection output. Inspection results can be corrected. In this case, the simulated defect is provided in a region other than the circuit pattern region of the product so that the formed simulated defect does not adversely affect the product.

FIG. 20 illustrates a position where a simulated defect is provided using a semiconductor wafer as an example of a calibration standard sample for an optical inspection apparatus according to the present invention. In the figure, 230 is a semiconductor wafer, and 231 is a semiconductor chip to be a product. 2
32, 233, and 234 are areas where the simulated defects are provided;
Numeral 232 designates the entire area of one chip as an area where a simulated defect is provided, 233 designates an area between chips as an area where a simulated defect is provided, and 234 designates a circuit pattern in a product chip. The area not provided is the area where the simulated defect is provided.

Further, it is also possible to provide a simulated defect on a region where a pattern of a product of an electronic component such as a semiconductor wafer having a circuit pattern is formed, and use the simulated defect as a calibration sample for an optical inspection apparatus. This case is particularly effective for calibrating an optical inspection apparatus that performs a comparative inspection. To explain using an optical inspection apparatus for a semiconductor wafer as an example, since a plurality of chips are formed on a semiconductor wafer, a comparison is made between the surface conditions at the same location in different chips, and when they do not match. An inspection method (chip comparison) for detecting the portion as a defect, or a comparison of surface states between different locations inside a repeated portion of a circuit pattern in a chip (eg, a memory cell portion of a memory product) is performed. If not, there is an inspection method (cell comparison) for detecting that part as a defect.

FIGS. 21 and 22 show an embodiment of a calibration sample suitable for calibrating a surface condition optical inspection apparatus using these inspection methods. In FIG. 21, 230 is a semiconductor wafer, 231 is a semiconductor chip having a circuit pattern, and 241 is a simulated defect formed on the semiconductor chip. Simulated defects 241 so that they can be detected by the comparative inspection
It is preferable to arrange the chips so that the positions in the chips are different for each chip. Also, although the figure shows a case in which one simulated defect is formed on one chip, it is sufficient if a comparative inspection can be performed. Some chips may not be formed. FIG. 22 illustrates the arrangement of the simulated defects in the semiconductor chip. 251
Is a semiconductor chip, 252 is a region of a circuit pattern having repeatability in the chip (for example, a memory cell region of a memory product), and 253 is a region of a circuit pattern having no repeatability (for example, a peripheral circuit portion of a memory product). . 2
41 is a dummy defect formed on the chip. Simulated defect 2
Reference numeral 41 denotes a circuit pattern region 252 having repeatability and a circuit pattern region 253 having no repeatability within the chip. By arranging the simulated defects in this way, it is possible to quantify the detection sensitivity for each region.

Next, an embodiment of the configuration of the optical inspection apparatus which can improve the work efficiency of the calibration and the adjustment of the apparatus based on the result when performing the sensitivity calibration using the calibration standard sample described above. This will be described with reference to FIGS. FIG. 23 is a diagram for explaining a situation in which the sensitivity calibration of the inspection apparatus is performed and the contents of the work at that time. 2 in the figure
Reference numeral 11 denotes a sensitivity calibration performed by the device manufacturer, and 21
Reference numeral 11 denotes sensitivity calibration performed by the device manufacturer to confirm the initial state of the device and to guarantee the sensitivity. The calibration result at this point is data that guarantees the initial sensitivity of the device, and is also used as a reference calibration result that is a reference for calibration performed later. This reference calibration result is desirably attached to the device as data that guarantees the sensitivity of the device. The attached form may be printed matter, stored in a floppy disk or the like as an electronic file, stored in a storage device in the device as described later, or connected to the device. May be stored in a server on a network. Reference numeral 212 denotes a sensitivity calibration performed on the user side of the apparatus. Reference numeral 2121 denotes a sensitivity calibration performed before the start of application of the apparatus and performed to confirm whether the apparatus can secure the sensitivity in an initial state. Reference numeral 2113 denotes a sensitivity calibration performed during continuous use of the apparatus, and is a sensitivity calibration for confirming whether or not the apparatus has changed from an initial state due to aging.

The contents of the sensitivity calibration performed in each of 2111, 2121, and 2123 are as shown in 2101 to 2103, and include the following three steps. First, an inspection is performed on a calibration standard sample to obtain a detection result (2101).
Next, the obtained detection result is compared with a predetermined specification or a reference calibration result to determine whether there is any problem in the detection capability of the device (2103). If there is a problem, the device is adjusted, and this is repeated until it is determined that there is no problem in the detection capability of the device. If there is no problem, shipment of the device (2112) or start of use of the device (212)
2) Alternatively, the use of the device is continued (2124). In this series of sensitivity calibration work, if the calibration standard sample described above is used, the absolute sensitivity of the apparatus can be calibrated because the size of the simulated defect and its detection output are guaranteed, and cleaning is also required. Because it is possible, it is possible to stably calibrate the sensitivity of the device for a long period of time, and since multiple standard samples of the same quality can be created by processing, the detection sensitivity of many devices will be the same. The advantage that sensitivity calibration can be performed can be obtained.

Further, by providing the optical inspection apparatus with a function suitable for sensitivity calibration work, it is possible to improve the efficiency of sensitivity calibration work. An example will be described below. In FIG. 24, reference numeral 191 denotes a signal processing unit that processes a signal obtained by the detector 165 to detect a defect signal, and 192 denotes a control unit of the apparatus. Reference numeral 194 denotes a display device for displaying the result of the inspection and the like. Reference numeral 193 denotes a storage device for storing the results of inspection and the like. Here, reference numeral 195 denotes data of the reference calibration result, which is stored in the storage device 193.
Is stored. Reference numeral 196 denotes data 195 of the reference calibration result displayed on the display device 194. Reference numeral 197 denotes calibration result data, and reference numeral 198 denotes calibration result data 197 displayed on the display device 194. As described above, the data of the reference calibration result and the calibration result at an arbitrary time are stored in the storage device 193 and displayed side by side on the display device 194, so that the problem of the device can be confirmed at a glance. The work efficiency of sensitivity calibration is improved.

In FIG. 25, reference numeral 201 denotes a portion for comparing the result of the sensitivity calibration with the reference calibration result or the calibration result performed at any other time.
Is a part for making a judgment on a part for adjusting the apparatus from the result of the comparison. As a result of the comparison, if the value exceeds a preset allowable range, it is determined that the device needs to be adjusted. For example, if the detection output of the same simulated defect becomes smaller than a preset allowable range as compared with the calibration result to be compared, the output of the light source decreases, the sensitivity of the detector decreases, and the like. It is determined that adjustment is necessary for that part. If the detection position of the simulated defect is out of the predetermined allowable range as compared with the target calibration result, a problem has occurred in the stage, and it is determined that adjustment is necessary for that portion. You. The determination result 205 is the display device 19
4, the calibration result 198 and the reference calibration result 196 are displayed side by side. By doing so, the criterion for determination and the result of the determination can be confirmed at a glance, and the work efficiency of sensitivity calibration is improved. In addition, the device is configured to generate an alarm by the control unit 192 when it is determined that adjustment is necessary for the device. The form of the alarm may be displayed on the display device 194, may be indicated by light using the indicator lamp 203 or the like, may be generated by the sound generating device 204 such as a speaker or a buzzer, or may be obtained by a combination thereof. In FIG. 26, when it is determined by the comparison means 201 and the determination means 202 of the calibration result that adjustment of the apparatus is necessary, the apparatus control means 192 adjusts the illumination optical system (including, for example, the illumination intensity and the state of the condensed spot). ) 211, stage adjustment means 212 and detection optical system adjustment means (amplification ratio for image signal obtained from detector 165, shading correction, background (dark) correction, threshold value when converting into binary signal, focus control) The configuration of the optical inspection apparatus that automatically adjusts the apparatus is shown by 213. With such a configuration that the adjustment can be performed automatically, it is possible to improve the work efficiency when adjusting the optical inspection apparatus based on the result of the calibration.

[0050]

According to the present invention, it is possible to realize a calibration standard sample for an optical inspection apparatus capable of performing guaranteed absolute sensitivity calibration without limiting the applicable inspection apparatus. The effect that can be performed. Further, according to the present invention, a sensitivity calibration in an optical inspection device that performs a guaranteed absolute sensitivity calibration so that a defect having various sizes existing on an inspection object can be inspected with high reliability without overlooking it. There is an effect that the method can be realized.

Further, according to the present invention, a defect under or in a transparent interlayer insulating film is inspected with high sensitivity to light formed on the surface of an object to be inspected, such as a semiconductor wafer during manufacturing. The effect that can be achieved. Further, according to the present invention, there is provided an effect that a defect on an interlayer insulating film which is transparent to light formed on a surface of an inspection object such as a semiconductor wafer during manufacturing can be inspected with high sensitivity. Play.

Further, according to the present invention, by forming a simulated defect capable of simulating a defect with a single structure by processing such as beam processing on the surface of the sample, the position and the number of the formed simulated defect can be reduced. It is possible to control, it is possible to prepare a plurality of the same standard sample, it is possible to wash,
This has the effect of obtaining a calibration standard sample that maintains stable properties for a long time. Further, according to the present invention, there is provided an optical inspection apparatus provided with means for guaranteeing initial sensitivity by a calibration result obtained from a calibration standard sample, and comparing and judging a calibration result at any time with the initial sensitivity. By doing so, there is an effect that the working efficiency of sensitivity calibration and adjustment can be improved.

[Brief description of the drawings]

FIG. 1 is a schematic configuration diagram showing an embodiment of a procedure for forming a simulated defect for producing a calibration standard sample for an optical inspection apparatus according to the present invention.

FIG. 2 is an explanatory diagram showing a cross-sectional structure of a simulated defect.

FIG. 3 is a diagram illustrating a processing method using a charged particle beam such as a focused ion beam (FIB) or an electron beam (EB).

FIG. 4 is an explanatory view showing a method of processing a simulated defect by laser processing.

FIG. 5 is an explanatory view showing a method of processing a simulated defect by a liquid trace supply-laser solidification processing method.

FIG. 6 is an explanatory diagram showing a method of processing a simulated defect by using a scanning probe microscope (SPM).

FIG. 7 is an explanatory diagram showing total scattered light generated from an object.

FIG. 8 is an explanatory diagram showing detected scattered light detected by a detection optical system out of all scattered light generated from an object.

FIG. 9 is an explanatory diagram showing a projected area of an object (simulated defect).

FIG. 10 is an explanatory diagram showing a relationship between a projected area of an object (simulated defect) and total scattered light generated from the object (simulated defect).

FIG. 11 is an explanatory diagram showing a relationship between a projected area of an object (simulated defect) and scattered light detected from the object (simulated defect).

FIG. 12 is an explanatory view showing a cross section of a standard sample in which a simulated defect formed on the surface of a sample is covered with a film having the same or the same optical properties as a film formed in a semiconductor device manufacturing process.

FIG. 13 is an explanatory view showing a cross section of a standard sample in which a sample surface is coated with a film having the same or the same optical physical properties as a film formed in a semiconductor device manufacturing process, and a simulated defect is formed thereon.

FIG. 14 is an explanatory diagram of the standard sample described in FIGS. 12 and 13, wherein the thickness of the standard sample differs depending on the location.

FIG. 15 is an explanatory diagram showing a structure for simulating a circuit pattern of a semiconductor device provided adjacent to a simulated defect formed on a sample surface.

FIG. 16 is a schematic configuration diagram of an optical inspection device.

FIG. 17 is an explanatory diagram showing a relationship between a detection field of view, an illumination spot, and a detector of the optical inspection apparatus, and an image of a defect such as a foreign substance formed on detection.

FIG. 18 is a front sectional view showing a state in which a foreign substance having different dimensions in a plane is placed on a sample.

FIG. 19 is an explanatory diagram showing the relationship between a standard particle, a simulated defect created by individually defining a dimension in the height direction, and a simulated defect created with a constant dimension in the height direction.

FIG. 20 is a view for explaining a position when a simulated defect is formed in a region of a semiconductor wafer as a calibration standard sample according to the present invention where no circuit pattern exists;

FIG. 21 is a view for explaining a formation position when a simulated defect is formed on a circuit pattern in a chip of a semiconductor wafer as a calibration standard sample according to the present invention.

FIG. 22 is a diagram illustrating a position in a semiconductor chip where a simulated defect as a calibration standard sample according to the present invention is formed.

FIG. 23 is an explanatory diagram of a situation in which sensitivity calibration of the optical inspection device according to the present invention is performed, and an operation content.

FIG. 24 shows an optical system according to the present invention which has means for comparing a sensitivity calibration result with a reference sensitivity calibration result, and means for judging a portion to be adjusted of the apparatus, and which can display the judgment result side by side with the calibration result. Explanatory drawing showing the structure of an inspection device.

FIG. 25 includes means for comparing a sensitivity calibration result with a reference sensitivity calibration result, and means for judging a portion to be adjusted of the apparatus, wherein the judgment result is displayed side by side with the calibration result, and adjustment is required. FIG. 1 is an explanatory diagram showing a configuration of an optical inspection device according to the present invention that can generate an alarm.

FIG. 26 shows means for comparing a sensitivity calibration result with a reference sensitivity calibration result, and means for judging a portion of the apparatus to be adjusted, and automatically adjusts each component of the apparatus based on the judgment result. FIG. 1 is an explanatory diagram illustrating a configuration of an optical inspection apparatus according to the present invention.

[Explanation of symbols]

100: Design data of a simulated defect, 101: Physical property value data of a simulated defect, 102: Shape design data of a simulated defect, 10
3 ... Configuration data of the standard optical inspection apparatus, 104 ... Processing parameters, 110 ... Defect detection simulator, 111 ... Simulated defect processing means, 105 ... Simulated defects formed, 112 ...
Shape measuring means, 113 ... Detection output measuring means (standard optical inspection device), 1 ... Sample, 2, 3, 23 ... Simulated defect, 30
... gas supply system, 31 ... gas supply source. 32, 34: valve, 33: gas flow control means, 35: nozzle, 36: supplied gas, 301: vacuum chamber, 302: vacuum exhaust port, 303: charged particle beam source, 304: electrostatic lens, 305: Stage, 306 ... charged particle beam, 4
03 laser source, 404 lens, 406 laser beam, 501 micropipette, 502 liquid material 50
2, 601: SPM probe, 70: object generating scattered light, 71: total scattered light generated from the object, 72: illumination light, 73: illumination angle, 81: detection optical system, 82: detection optical system aperture, 83 ... A component of the total scattered light generated from the object which directly enters the detection optical system, 84 a component of the total scattered light generated from the object which is reflected on the sample surface and enters the detection optical system, 91. A plane perpendicular to the optical axis, 121: a film covering the simulated defect, 131: a film covering the surface of the sample and a simulated defect is formed thereon, 150: a structure simulating a circuit pattern of a semiconductor device, 162: illumination Optical system, 16
4 detection optical system, 165 detector (linear image sensor), 171 detection field of view, 173 pixels of the linear image sensor on the sample, 192 control unit of the device, 19
3. Storage device (storage unit for inspection results and calibration results), 194
... display device (display unit), 166 ... elements for performing optical processing, 201 ... comparison part, 202 ... determination part, 203
... Indicator light, 204... Sound generator, 211... Illumination optical system adjustment means, 212... Stage adjustment means, 213.

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Akira Shimase 292, Yoshida-cho, Totsuka-ku, Yokohama-shi, Kanagawa Prefecture Inside the Hitachi, Ltd. Production Technology Research Laboratory (72) Inventor Junzo Higashi 292 Yoshida-cho, Totsuka-ku, Yokohama-shi, Kanagawa Prefecture Address Co., Ltd.Hitachi Manufacturing Technology Laboratory

Claims (18)

[Claims] An illumination optical system for irradiating illumination light to an inspection object, a detection optical system for detecting an optical image obtained from the inspection object, and an optical image detected by the detection optical system An optical inspection apparatus comprising: a detector that receives light and converts it into an image signal; and a defect inspection unit that inspects a defect present in the inspection object based on the image signal detected and converted by the detector. In the method of manufacturing a calibration standard sample used for calibration, the relationship between the three-dimensional shape design data of the simulated defect corresponding to the particle diameter of the standard particle and the three-dimensional shape measurement data of the actually measured simulated defect substantially matches, The predicted data of the sensitivity of the simulated defect simulated based on the three-dimensional shape design data of the simulated defect and the sensitivity of the simulated defect simulated based on the three-dimensional shape measurement data of the simulated defect. A processing step of arranging a predetermined number of simulated defects in a three-dimensional shape having three-dimensional dimensions defined by processing parameters set so that the relationship with the prediction data is substantially the same as the processing parameters, and forming the simulated defects on the surface of the sample; A sensitivity data measurement step of inspecting the simulated defect formed in the processing step with a standard optical inspection device and actually measuring the sensitivity of the simulated defect; and From the obtained three-dimensional shape design data of the simulated defect or the three-dimensional shape measurement data of the simulated defect, a guaranteed data acquisition step of acquiring guaranteed sensitivity data for the three-dimensional shape data of the simulated defect corresponding to the particle diameter of the standard particle. A method for producing a calibration standard sample for an optical inspection device. 2. An illumination optical system for irradiating an inspection object with illumination light, a detection optical system for detecting an optical image obtained from the inspection object, and an optical image detected by the detection optical system. An optical inspection apparatus comprising: a detector that receives light and converts it into an image signal; and a defect inspection unit that inspects a defect present in the inspection object based on the image signal detected and converted by the detector. In the method of manufacturing a calibration standard sample used for calibration, the relationship between the three-dimensional shape design data of the simulated defect corresponding to the particle diameter of the standard particle and the three-dimensional shape measurement data of the actually measured simulated defect substantially matches, The predicted data of the sensitivity of the simulated defect simulated based on the three-dimensional shape design data of the simulated defect and the sensitivity of the simulated defect simulated based on the three-dimensional shape measurement data of the simulated defect. A processing step of arranging a predetermined number of simulated defects in a three-dimensional shape having three-dimensional dimensions defined by processing parameters set so that the relationship with the prediction data is substantially the same as the processing parameters, and forming the simulated defects on the surface of the sample; From the predicted data of the sensitivity of the simulated defect simulated in the processing step and the three-dimensional shape design data of the simulated defect obtained from the processing step or the three-dimensional shape measurement data of the simulated defect, the three-dimensional shape of the simulated defect corresponding to the particle diameter of the standard particle A guaranteed data acquisition step of acquiring guaranteed sensitivity data for the shape data. A method of manufacturing a calibration standard sample for an optical inspection apparatus. 3. An illumination optical system for irradiating illumination light to the inspection object, a detection optical system for detecting an optical image obtained from the inspection object, and an optical image detected by the detection optical system. An optical inspection apparatus comprising: a detector that receives light and converts it into an image signal; and a defect inspection unit that inspects a defect present in the inspection object based on the image signal detected and converted by the detector. As a calibration standard sample used for the calibration of the above, a predetermined number of three-dimensional simulated defects having three-dimensional dimensions so as to simulate a defect existing in the inspection object are arranged on the surface of the sample. A calibration standard sample for an optical inspection device, characterized by being formed by: 4. An illumination optical system for irradiating an inspection object with illumination light, a detection optical system for detecting an optical image obtained from the inspection object, and an optical image detected by the detection optical system. An optical inspection apparatus comprising: a detector that receives light and converts it into an image signal; and a defect inspection unit that inspects a defect present in the inspection object based on the image signal detected and converted by the detector. As a calibration standard sample used for the calibration of a plurality of types of three-dimensional simulated defects with different three-dimensional dimensions so that defects existing in the inspection object can be simulated corresponding to different particle diameters of the standard particles. A calibration standard sample for an optical inspection apparatus, wherein a predetermined number of the standard samples are arranged on the surface of the sample. 5. An illumination optical system for irradiating illumination light on an object to be inspected having a light-transmissive film having a desired film thickness on a surface, and an optical image obtained from the object to be inspected. A detection optical system for detecting, a detector for receiving an optical image detected by the detection optical system and converting the optical image into an image signal, and the inspection object based on the image signal detected and converted by the detector. A three-dimensional shape having three-dimensional dimensions defined as a calibration standard sample used for calibrating an optical inspection apparatus having a defect inspection means for inspecting a defect existing in an object to be inspected. A calibration standard sample for an optical inspection device, wherein a predetermined number of the simulated defects are arranged and formed on a film having a desired film thickness and transparent to light. 6. An illumination optical system for irradiating illumination light to an object to be inspected having a film having a desired thickness and transparent to light, and an optical image obtained from the object to be inspected. A detection optical system for detecting, a detector for receiving an optical image detected by the detection optical system and converting the optical image into an image signal, and the inspection object based on the image signal detected and converted by the detector. A three-dimensional shape having three-dimensional dimensions defined as a calibration standard sample used for calibrating an optical inspection apparatus having a defect inspection means for inspecting a defect existing in an object to be inspected. A predetermined number of simulated defects are arranged on the surface of the sample and formed, and the simulated defects are coated with a film having a desired film thickness and being transparent to light. Calibration standard for optical inspection equipment. 7. The calibration standard sample for an optical inspection apparatus according to claim 5, wherein the dummy defects are formed by a plurality of types having different three-dimensional dimensions. 8. The calibration standard sample for an optical inspection apparatus according to claim 5, wherein the thickness of the transparent film is changed for each region where the dummy defect is provided. 9. A calibration for an optical inspection apparatus according to claim 3, wherein the calibration standard sample for the optical inspection apparatus forms a circuit pattern similar to that of an object to be inspected. Standard sample. 10. The simulated defect is formed by energy beam removal processing, gas-assisted charged particle beam etching processing, energy beam CVD processing, or microfluid supply-laser solidification processing. 7. A calibration standard sample for an optical inspection device according to 4 or 5 or 6. 11. The calibration standard sample for an optical inspection apparatus according to claim 3, wherein the simulated defect is formed by using a scanning probe microscope. 12. The three-dimensional shape data of the simulated defect corresponding to the particle diameter of the standard particle and the proof of the simulated defect in the calibration standard sample for an optical inspection apparatus according to claim 3 or 4 or 5 or 6. A calibration standard sample for an optical inspection device, wherein the calibration standard sample is attached with the obtained sensitivity data. 13. An illumination optical system for irradiating illumination light to an inspection object, a detection optical system for detecting an optical image obtained from the inspection object, and an optical image detected by the detection optical system. An optical inspection apparatus comprising: a detector that receives light and converts it into an image signal; and a defect inspection unit that inspects a defect present in the inspection object based on the image signal detected and converted by the detector. In the method, a predetermined number of simulated defects having a single three-dimensional shape having three-dimensional dimensions so as to simulate a defect existing in the inspection object is provided on a surface of the sample using a calibration standard sample. A sensitivity calibration method for inspecting a defect existing in the inspection target object. 14. An illumination optical system for irradiating an inspection object with illumination light, a detection optical system for detecting an optical image obtained from the inspection object, and an optical image detected by the detection optical system. An optical inspection apparatus comprising: a detector that receives light and converts it into an image signal; and a defect inspection unit that inspects a defect existing in the inspection object based on the image signal detected and converted by the detector. In, a predetermined number of simulated defects of a plurality of types of single solid shapes having different three-dimensional dimensions so that defects existing in the inspection object can be simulated corresponding to different particle diameters of standard particles, and A sensitivity calibration method for an optical inspection apparatus, comprising: calibrating a sensitivity for inspecting a defect existing in an inspection object using a calibration standard sample formed on a surface. 15. An illumination optical system for irradiating illumination light to an object to be inspected having a film having a desired thickness and transparent to light, and an optical image obtained from the object to be inspected. A detection optical system for detecting, a detector for receiving an optical image detected by the detection optical system and converting the optical image into an image signal, and the inspection object based on the image signal detected and converted by the detector. A defect inspection means for inspecting a defect existing on the surface of the object, wherein a three-dimensional simulated defect having a three-dimensional dimension defined so as to simulate the defect existing on the surface of the inspection object is desired. A predetermined number of calibration standard samples arranged and formed on a film that is transparent to light with a film thickness of and exists on or in the surface film of the inspection object. Optical inspection equipment characterized by calibrating the sensitivity of inspecting defective defects Sensitivity calibration method. 16. An illumination optical system for irradiating illumination light to an object to be inspected having a film having a desired thickness and transparent to light, and an optical image obtained from the object to be inspected. A detection optical system for detecting, a detector for receiving an optical image detected by the detection optical system and converting the optical image into an image signal, and the inspection object based on the image signal detected and converted by the detector. And a defect inspection means for inspecting a defect existing in the optical inspection device, a simulated defect having a three-dimensional shape in which three-dimensional dimensions are defined so as to simulate a defect existing in the inspection object,
A predetermined number of test samples are formed on the surface of the sample, and the simulated defects are inspected using a calibration standard sample having a desired film thickness and covered with a film transparent to light. A sensitivity calibration method for an optical inspection apparatus, comprising: calibrating a sensitivity for inspecting a defect existing under or in a surface film of an object. 17. A sensitivity calibration method in an optical inspection apparatus according to claim 13, wherein the result of the sensitivity calibration is displayed on a display means. 18. A sensitivity calibration method for an optical inspection device according to claim 13, wherein the result of the sensitivity calibration and sensitivity data serving as a reference are displayed on a display means. Sensitivity calibration method in an optical inspection device to perform.