JPH10326818A - Semiconductor manufacturing equipment - Google Patents

Abstract

(57) [Problem] To improve the throughput and increase the operation rate of an external cassette transport means (AGV) by performing parallel processing of cassettes on a cassette stage. SOLUTION: The cassette stage 20 has a two-stage configuration and can be moved up and down. The stage 20 is moved upward to bring the lower cassette stage 21 to an accessible position from the external cassette transport means 34 and to bring the upper cassette stage 22 to an accessible position of the cassette loader. Cassettes 3 and 4 to lower cassette stage 21
During the loading, the processed cassettes 1 and 2 are taken out to the stage 22. The stage 20 is moved downward, and the stage 21 on which the loading cassettes 3 and 4 are placed is moved to the orientation flat aligner 13.
, And bring the processed cassettes 1 and 2 of the stage 22 to an accessible position of the external cassette transport means 34. During the alignment of the input cassettes 3 and 4, the processed cassettes 1 and 2 are paid out.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor manufacturing apparatus, and more particularly to an apparatus for realizing parallel processing of cassette processing performed via a cassette stage.

[0002]

2. Description of the Related Art FIG. 4 is a block diagram of a main part of a conventional vertical semiconductor manufacturing apparatus. Opening 3 opened on the front side of device 31
2 is provided with a cassette stage 33 for exchanging the wafer cassette 5 between an external cassette transfer means (AGV) 34 and the apparatus 31. The illustrated cassette stage 33 is configured to mount two cassettes 5 thereon. Cassette shelf 6 for storing cassette 5 behind cassette stage 33
A buffer shelf 7 for temporarily storing the cassette 5 is provided above the cassette shelf 6. Between the cassette stage 33 and the cassette shelf 6 and the buffer shelf 7, the cassette shelf 6
In addition, a cassette loader 8 for automatically carrying the cassette 5 in and out of the buffer shelf 7 is provided. The cassette loader 8 is provided with a cassette mounting table 12. Wafer transfer machine 11 for transferring wafers W between cassette 5 stored in cassette shelf 6 and boat 10 disposed below vertical reaction tube 9.
Is installed.

FIG. 5 shows an example of the above-described cassette transport sequence. First, the cassette 5 is loaded into the device 31 by the AGV 34.
And the two cassettes 5, 5 are placed on the cassette stage 33 (step 501). The wafer W stored in the cassette 5 while being placed on the cassette stage 33 is subjected to orientation flat alignment by the orientation flat alignment machine 13 (step 502). After aligning the orientation flat, the cassette 5 is transferred onto the cassette mounting table 12, and the cassette mounting table 12 is rotated to change the direction of the cassette 5 by 90 °. Next, the cassette loading table 12 is loaded by the cassette loader 8.
To move the cassette 5 to a predetermined position on the buffer shelf 7 (step 503). The paper is also conveyed to the buffer shelf 7 from the cassette shelf 6 (step 502).

After the cassette 5 is conveyed from the cassette stage 33 to the buffer shelf 7, the processed cassette 5 is taken out of the buffer shelf 7 and placed on the cassette mounting table 12, and the cassette mounting table 12 is moved to the position of the cassette stage 33 by the cassette loader 8. Descend. The cassette mounting table 12 is rotated to restore the cassette 5 to its original orientation, and is mounted on the cassette stage 33 (step 504). The cassette 5 placed on the cassette stage 33 is paid out of the apparatus 31 by the AGV 34 (step 505).

[0005]

However, in the above-described conventional semiconductor manufacturing apparatus, as can be seen from the sequence shown in FIG. 5, the cassette cannot be transported from the cassette shelf to the cassette stage while the cassette is being loaded. The cassette cannot be dispensed inside. That is, since the cassette stage 33 has only one stage, the AGV 34
A wait time is required from when the cassette 5 is inserted until the cassette 5 is paid out. This waiting time deteriorates the throughput of the apparatus and causes the operation rate of the AGV to decrease.

SUMMARY OF THE INVENTION An object of the present invention is to provide a semiconductor manufacturing apparatus which can solve the above-mentioned problems of the prior art, improve the throughput, and increase the operation rate of the AGV.

[0007]

According to the present invention, a cassette loaded into an apparatus from an external cassette carrying means is placed on a loading cassette stage, and wafers in the loading cassette are positioned. In a semiconductor manufacturing apparatus which transports a cassette processed in the apparatus to a cassette stage by a cassette loader and discharges the cassette from the cassette stage to an external cassette transport means, a plurality of cassette stages are provided. And the transfer of cassettes in the apparatus and the positioning of wafers and the discharge of cassettes can be performed on different cassette stages, and a plurality of cassette stages are provided so as to be movable. The cassette stage is a cassette for the external cassette transport means. When the cassette stage is in the accessible position where loading or unloading can be performed, another cassette stage is located in an accessible position where a cassette can be transported to or from a cassette loader or in a position where wafer positioning can be performed. Things.

A plurality of cassette stages are moved, and one of the cassette stages is transported to an external cassette transport means to an accessible position where a cassette can be loaded or unloaded. When the one cassette stage is empty, the cassette is loaded into the apparatus from the external cassette transport means, and the loaded cassette is placed on the one cassette stage. When the processed cassette is placed on the one cassette stage, the processed cassette is paid out from the one cassette stage to the external cassette transport means.

When one of the cassette stages is in the cassette loading or unloading accessible position, the other cassette stage is in the accessible position where the cassette can be transported to or from the cassette loader, or the wafer is positioned. It is in a position where it can be performed. When the cassette is at an accessible position where the cassette can be transported to and from the cassette loader, the processed cassette is transported from the inside of the apparatus to the other cassette stage by the cassette loader. This transfer is referred to as transfer of the cassette in the apparatus, and more specifically, removal of the cassette. When the other cassette stage is at a position where the wafer can be positioned, the wafer is positioned with respect to the wafer in the cassette mounted on the other cassette stage.

[0010] By providing a plurality of cassette stages and making them movable as described above, cassette insertion by the external cassette transport means and cassette removal from the apparatus by the cassette loader can be performed simultaneously. Further, it is also possible to simultaneously carry out the delivery of the cassette to the external cassette carrying means and the positioning of the wafer.

The positioning of the wafer includes both orientation flat alignment and notch alignment.

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment in which the present invention is applied to a vertical semiconductor manufacturing apparatus will be described below.

FIG. 2 is a structural view of a main part of a vertical semiconductor manufacturing apparatus. A cassette stage 20 is provided in an opening 32 on the front side of the apparatus 31, and an external cassette transport means (AGV) 3 is provided.
The wafer cassettes 1 to 4 are exchanged between the wafer cassettes 4 and 31. The cassette stage 20 has an upper and lower two-stage configuration, and is movable in the up and down direction. The lower cassette stage 21 has the function of the original cassette stage, and the upper cassette stage 22 has the buffer function.
In both cases, two cassettes 1 to 4 can be placed. The orientation flat aligner 13 is provided below the lower cassette stage 21. The orientation flat aligner 13
Each of the two cassettes 3 and 4 mounted on the lower cassette stage 21 is provided so as to be movable left and right so that the orientation flat can be performed on the wafers in the cassettes. The orientation flat aligner 13 can be moved to the position where the lower cassette stage 21 comes off, and when moved down, the lower cassette stage 21 can be moved down without being disturbed by the orientation flat aligner 13.

Behind the cassette stage 20, the cassette 5
And a buffer shelf 7 for temporarily storing the cassette 5 above the cassette shelf 6.
Cassette stage 20, cassette shelf 6, and buffer shelf 7
Between the cassette shelf 6 and the buffer shelf 7
Is installed in the cassette loader 8 for automatically carrying in and out. An L-shaped cassette mounting table 12 on which the cassette 5 is mounted is mounted on the cassette loader 8. Cassette mounting table 12
Is mounted so as to be rotatable, movable back and forth, and movable up and down as indicated by arrows. The cassette loader 8 stores the cassette 5 in a predetermined cassette shelf 6 or a buffer shelf 7.
In order to be able to carry in and out, it is provided to be movable left and right. A wafer transfer machine 11 for transferring wafers W between the cassette 5 stored in the cassette shelf 6 and a boat 10 disposed below the vertical reaction tube 9 is installed. In addition, the vertical reaction tube 9, the boat 10, and the wafer transfer machine 11
Although shown on the side of the cassette shelf 6 for convenience, it is actually arranged on the rear side of the cassette shelf 6.

FIG. 1 is a schematic perspective view of the above-described two-cassette, two-stage cassette stage, wherein FIG. 1 (a) is a configuration diagram of the cassette stage, FIG. 1 (b) is a cassette layout diagram, and FIG. Of the cassette stage lowered for
(d) is a view of the cassette stage lowered to the bottom with the orientation flat aligner removed.

The upper cassette stage 22 and the lower cassette stage 21 have two cassettes 1, 2, 3, and 2, respectively.
4 can be placed. Cassette stage 2
0 is designed to be able to move up and down by a predetermined stroke. In addition, the orientation flat aligner 13 can be moved left and right by a predetermined stroke along the longitudinal direction of the lower cassette stage 21 below the lower cassette stage 21.

At the top dead center position of the stroke shown in FIG. 1B, the lower cassette stage 21 is at a height position accessible by the AGV 34,
4 can be input. Upper cassette stage 22
Is located at a height where the cassette mounting table 12 attached to the cassette loader 8 is accessible, so that the cassettes 1 and 2 can be transferred from the cassette mounting table 12 to the upper cassette stage 22.

At the middle point of the stroke shown in FIG. 1C, the cassettes 3 and 4 mounted on the lower cassette stage 21 are at a level where they come into contact with the orientation flat aligner 13, so that orientation flat alignment can be performed. The upper cassette stage 22 is located at a height position to which the AGV 34 can access, so that the cassettes 1 and 2 can be paid out to the AGV 34. Therefore, if the cassettes 1 and 2 are processed cassettes and the cassettes 3 and 4 have just been loaded, when the cassette stage 20 is lowered, while the wafers in the cassettes 3 and 4 are aligned with the orientation flat, 1 and 2 can be paid out.

If the orientation flat alignment is not performed when the cassette stage 20 is lowered, the orientation flat alignment machine 13
Is moved to the position where the cassette stage 21 comes off as shown in FIG. 1D, so that the cassette stage 21 can be lowered to the lowermost position (bottom dead center). In this case, the intermediate point may be set to the bottom dead center, and the positioning within the stroke may be set to two points.

FIG. 3 shows an example of the above-described cassette transport sequence. First, the cassettes 3 and 4 are loaded into the apparatus 31 by the AGV 34, and the two cassettes 3 and 4 are placed on the lower cassette stage 21 (step 301). At this time, the processed cassettes 1 and 2 are transported from the cassette shelf 6 to the upper cassette stage 22 of the cassette stage 20 (step 302). This corresponds to FIG.

Next, the cassette stage 2 is moved to a position where the lower cassette stage 21 contacts the orientation flat aligner 13.
0 is decreased (step 303). After the lowering, the wafers W stored in the cassettes 3 and 4 just loaded into the lower cassette stage 21 are aligned by the orientation flat aligner 13 (step 305). At the same time, the processed cassettes 1 and 2 placed on the upper cassette stage 22 are paid out to the AGV 34 (step 304). This corresponds to FIG. After aligning the orientation flats, the cassette stage 20 is raised to an accessible position of the cassette loader 8, the cassettes 3 and 4, which have been aligned with the orientation flats, are transferred to the cassette mounting table 12, and the cassette stage 21 is transported to the buffer shelf 7. I do.

As is apparent from FIG. 3, an empty time is generated in the cassette loader 8 between the vertical movement of the cassette stage (step 303), the discharge of the cassette (step 304) and the alignment of the orientation flat (step 305). This empty time is used as the cassette transport time to the cassette shelf depending on the shelf configuration.

According to the embodiment as described above, AG
While the cassettes 3 and 4 are being loaded by the V34, the processed cassettes 1 and 2 can be transported to the cassette stage, and the cassettes 1 and 2 that have been processed can be paid out while aligning the orientation flats of the cassettes 3 and 4. Further, since the cassette can be moved to the AGV accessible position only by moving the cassette stage 20 up and down, the cassette loading and unloading of the AGV 34 can be performed continuously. Further, since the use efficiency of the cassette loader 8 is high, a vacant time can be made. During this time, the cassette before the process is moved from the buffer shelf 7 to the cassette shelf 6, and the transport outside the apparatus and the transport inside the apparatus are performed. Can be done simultaneously.

In the embodiment, of the two-stage cassette stage, the lower stage is the original cassette stage and the upper stage is the buffer stage, but the upper stage may be the cassette stage and the lower stage may be the buffer stage. In this case, a device is required to align the orientation flat. Further, the buffer stage can be composed of a plurality of stages. Also,
The vertical movement mechanism of the cassette stage can be configured using, for example, an air cylinder, or combining a ball screw and a linear guide. Further, the number of cassettes to be mounted on the cassette stage is two, but may be three or more. Further, the accessible position of the cassette loader may include the upper stage and the lower stage at the top dead center of the stage, and may include the upper stage and the lower stage at the intermediate point and the lower dead center.

[0025]

According to the present invention, since a plurality of cassette stages are provided so as to be movable, the cassette can be transported in the apparatus while the cassette is being inserted, or the processed cassette can be dispensed during the positioning of the wafer. Can be. Therefore, there is no waiting time as in the case where only one cassette stage is provided, so that the throughput of the apparatus is improved and the use efficiency of the external cassette transport means is improved.

[Brief description of the drawings]

FIG. 1 is a schematic perspective view of a cassette stage having a two-stage configuration according to an embodiment, wherein (a) is a configuration diagram of a cassette stage, (b) is a cassette layout diagram, and (c) is lowered for orientation flat alignment. (D) is a view of the cassette stage lowered when the orientation flat aligner is removed.

FIG. 2 is a configuration diagram of a main part of the semiconductor manufacturing apparatus according to the embodiment;

FIG. 3 is a flowchart illustrating the operation of the apparatus of FIG. 2;

FIG. 4 is a configuration diagram of a main part of a semiconductor manufacturing apparatus according to a conventional example.

FIG. 5 is a flowchart illustrating the operation of the device of FIG. 4;

[Explanation of symbols]

 1, 2, 3, 4 Cassette 6 Cassette shelf 7 Buffer shelf 8 Cassette loader 12 Cassette mounting table 20 Cassette stage 21 Lower cassette stage 22 Upper cassette stage 31 Device 34 External cassette transfer means (AGV) W Wafer

Claims (1)

[Claims] An input cassette loaded into the apparatus from an external cassette transport means is placed on a cassette stage to position a wafer in the input cassette, and then the loaded cassette is transported into the apparatus by a cassette loader. In a semiconductor manufacturing apparatus in which a processed cassette is transported to a cassette stage by a cassette loader and discharged from the cassette stage to an external cassette transport means, a plurality of the cassette stages are provided, and a cassette is inserted and the cassette is transported in the apparatus. And cassette positioning and wafer dispensing can be performed on different cassette stages, and a plurality of cassette stages are provided so that they can be moved. The cassette can be loaded or unloaded from the means. When in an accessible position, the semiconductor manufacturing device, characterized in that the cassette stage of other stages is accessible or in position, or positioning of the wafer can be performed a position capable of carrying the cassette between the cassette loader.