JPH1034460A - Preprocessing system for substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a preprocessing system for a substrate capable of promoting automation to minimize operators and improving line balance to increase the processing capacity. SOLUTION: This system is provided a boring process to form locating holes 6, 7 in a substrate 1, a cutting process to movably locate the substrate 1 with reference to the locating hole 6, while using a pair of upper and lower disk-like rotary cutting edges having shearing edges on the outer peripheries respectively to cut off one lug part 8 of opposed side of the substrate 1 and the other lug part 8 of the opposed sides and a deburring process to position and transfer the substrate 1 with reference to the locating hole 6, to removably cut off burrs of one of opposed sides and to removably cut off the burrs of the other opposed side of the substrate 1 respectively by cutting.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a pre-processing system for a board which is performed before forming a through hole for mounting components on a printed board.

[0002]

2. Description of the Related Art In general, a printed wiring board used in an electronic device or the like is liable to have a defective portion at an outer edge thereof. Therefore, the printed wiring board is manufactured in advance on a board having a size slightly larger than a required size, and components are mounted according to wiring. Before forming a through hole for use and forming a printed wiring, preprocessing such as cutting the substrate to a predetermined size is performed. As shown in FIG. 12, in the conventional preprocessing, first, in a marking step, a marking 101 for positioning is provided on the outer surface of a copper foil based on a marking formed on the substrate 100 in advance, and the next seat is formed. In the boring process, marking 1
No. 01 is subjected to spot facing to expose the mark 103 formed on the substrate 100 in advance, and in the next drilling step, the positioning hole 1 is formed in the mark king portion by the drilling device.
Form 94. Next, in the stacking step, the stack pins 105 are mounted in the positioning holes 103, and the plurality of substrates 100 are positioned and fixed in a layered manner. Is polished and removed by the router 106. next,
In the laminating tape taping step, an aluminum plate 107 for preventing the tip of the drill from shifting is provided on the upper surface side of the plurality of substrates 100 stacked in a stack, and a burr is formed on the lower surface side for preventing generation of burrs. The discarded plates 108 are respectively arranged in a layered manner, and these are stuck and fixed with a tape 109. After performing the pre-processing in this way, holes for component mounting are formed according to the component mounting position using the NC machine tool.

In the pre-processing, the working time in the outer peripheral processing step of the substrate 100 is much longer than the working time in other steps, so that the processing capacity cannot be sufficiently improved. Further, in order to absorb the difference in processing capacity, it is necessary to stack a plurality of substrates 100 immediately before the outer peripheral processing step and temporarily stock them.
There was also a problem that the surface of No. 0 was damaged.

Accordingly, the applicant of the present invention has proposed a technique disclosed in Japanese Utility Model Laid-Open No. 6-8059.
No. 1 discloses a device for removing the ears of the board from the outer periphery of the substrate, and Japanese Utility Model Publication No. 6-80519 discloses a device for removing the burrs on the outer periphery of the substrate from which the ears are removed. We proposed and constructed a pre-processing system for the substrate, in which the peripheral processing of the substrate was performed using this apparatus, and then a plurality of substrates were stacked in a stack.

[0005]

However, even in the above-mentioned pre-processing system, the processing speed of the stack assembly and the outer peripheral processing has been increased. There was a problem in that it was not possible to follow the set and outer periphery processing, and line balance was lost. In addition, since the operations from the marking step to the drilling step are performed, several workers are required, and there is a problem in labor saving in terms of personnel.

SUMMARY OF THE INVENTION An object of the present invention is to provide a substrate pre-processing system capable of promoting automation and minimizing the number of workers and improving the line balance to increase the processing capacity.

[0007]

According to a first aspect of the present invention, there is provided a substrate pretreatment system which positions a substrate set on a table in an X direction, a Y direction, and a rotation direction around a vertical axis while holding the substrate by suction. Using a positioning / drilling device that drills holes, a step of forming a positioning hole in the substrate and, while positioning and transporting the substrate based on the positioning hole, shear the ears on one opposite side of the substrate, respectively. A first cutting step of feeding and cutting between a pair of upper and lower disk-shaped rotary blades having blades on the outer periphery, and positioning and transporting the substrate with reference to the positioning hole, and removing the other opposing side of the substrate. A second cutting step in which each of the ears is fed and cut between a pair of upper and lower disk-shaped rotary blades having a shearing blade on the outer periphery, and one of the substrates while positioning and transferring the substrate with reference to the positioning holes; Burrs on opposite sides of each are cut Those having a first deburring step of further removing a second deburring step for removing the respective cutting burr of the other opposing sides of the substrate while transferring and positioning the substrate relative to the positioning holes.

According to a second aspect of the present invention, in the deburring step, the first cutting means for obliquely cutting the upper edge of the side edge of the substrate, the second cutting means for obliquely cutting the lower edge, and Cutting by a third cutting means for cutting in a vertical direction, as described in claim 3, as a positioning and drilling device, to temporarily position the substrate on the table by visual inspection, to place the substrate at an appropriate position on the table. In the set state, the positioning mark previously formed at the position where the positioning hole of the substrate is formed,
It is a preferred embodiment to use one having a beam irradiation means for irradiating with a laser beam having a diameter of 0.8 to 0.5 mm on the irradiation surface.

[0009]

In the substrate pretreatment system according to the present invention, since the conventional marking process to the drilling process are performed using a positioning and drilling device, the processing capacity until the positioning hole is formed is greatly increased. It will be improved. In addition, as the outer peripheral processing of the substrate, the first
In the cutting step and the second cutting step, the edge of the substrate is cut using a pair of upper and lower disc-shaped rotary blades having a shearing blade on the outer periphery, and the cutting is performed in the first deburring step and the second deburring step. As a result, burrs on the side edges of the substrate are removed, so that efficient peripheral processing can be performed, and the line balance of the entire pretreatment system is improved.

In the deburring step, first cutting means for obliquely cutting the upper edge of the side edge of the substrate, second cutting means for obliquely cutting the lower edge, and second cutting means for obliquely cutting the middle part in the vertical direction. 3 By cutting the side edge of the substrate by cutting means to remove burrs, without reducing the efficiency of deburring work
It is possible to improve the quality of the substrate by chamfering the upper and lower ends of the side edges of the substrate.

Further, as a positioning / drilling device, in order to visually position the substrate on the table temporarily, the substrate is set at an appropriate position on the table, and the positioning formed in advance in the position where the positioning hole is formed in the substrate. When the mark has a beam irradiation means for irradiating a laser beam having a diameter of 0.8 to 0.5 mm on the irradiation surface,
The positioning accuracy of the temporary positioning is improved without substantially changing the working time of the temporary positioning by hand, and the automatic positioning by the positioning and drilling device can be performed in about half the time of the conventional system. The line balance will be greatly improved.

[0012]

Embodiments of the present invention will be described below with reference to the drawings. First, the configuration of the substrate will be briefly described. As shown in FIG. 1 and FIG. 2, this substrate 1 is a printed wiring board, and is a multilayer thermosetting laminate 2
The copper foil 3 is adhered to both upper and lower surfaces of the sheet, and is formed in a size slightly larger than a required size in order to prevent a printing failure at an outer edge portion. However, the substrate 1 may be constituted by a multilayer printed circuit board. A pair of left and right positioning marks 4 for positioning the substrate 1 and one positioning mark 5 for identifying the left and right sides of the substrate 1 are formed on the upper surface of the intermediate plate 2a of the thermosetting laminate 2 by printing. The positioning marks 4 and 5 are configured to be visible through the copper foil 3.

Next, a description will be given of an overall system of a pretreatment performed before forming a through hole for mounting components on the substrate 1. As shown in FIG. 3, the pretreatment system for the substrate 1
Basically, a drilling step for forming positioning holes 6 and 7 at the positions of the positioning marks 4 and 5 and the ear 8
A cutting step for cutting off the substrate, a deburring step for cutting the side edge of the substrate 1 to remove the burrs, and as shown in FIGS. A stacking step of positioning and fixing the stacking pins 10 on the upper surface and a stack 13 of aluminum plates 11 and discarded plates 12 on the upper and lower surfaces of the plurality of stacked substrates 1, respectively. And a taping step of fixing with the above.

In the drilling step, as shown in FIG. 5, the positioning and punching device 20 is used to hold the substrate 1 set on the table 21 by suction while holding the positioning mark 4
While photographing with a pair of left and right cameras 22, the table 21
And the substrate 1 is slightly moved to move the substrate 1 in the X direction and the Y direction.
The positioning is automatically performed in the direction and the θ direction around the vertical axis, and positioning holes 6 and 7 are formed at positions where the positioning marks 4 and 5 are formed by using three drills 23, respectively. The substrate 1 is manually set on the table 21. At this time, the operator uses the laser beams from the pair of beam irradiation means 24 attached to the positioning / drilling device 20 to position the left and right positioning marks 4. The substrate 1 is placed on the table 21 so that
It is set by temporarily positioning it on top. When the diameter of the surface of the substrate 1 on which the laser beam is irradiated with the laser beam is larger than 0.8 mm, the manual positioning of the substrate 1 performed by the manual operation becomes too rough, The time required for the automatic positioning of the substrate 1 becomes longer, and if it is smaller than 0.5 mm, the time required for the temporary positioning of the substrate 1 manually becomes longer. ing.

The cutting step is divided into a first cutting step and a second cutting step. In both steps, the cutting device 30 having the same configuration is used. First, in the first cutting step, the substrate 1 is fed in the width direction. The substrate 1 is fed to the first cutting device 30 in the direction,
The edge portions 8 on both sides in the width direction of the substrate 1 are cut, and then, in a second cutting step, the substrate 1 is fed to the second cutting device 30 with the longitudinal direction of the substrate 1 directed in the feeding direction. The ears 8 on both sides in the longitudinal direction of the substrate 1 are cut. However, after cutting the ears 8 on both sides in the longitudinal direction of the substrate 1, the ears 8 on both sides in the width direction may be cut. Further, after cutting the ear portions 8 on both sides in the longitudinal direction or the width direction of the substrate 1, the same cutting device 30 is used.
Alternatively, the substrate 1 may be recirculated so that the ears 8 on both sides in the width direction or the longitudinal direction may be cut.

As shown in FIGS. 6 and 7, the cutting apparatus 30 includes a pair of left and right cutting means 32 having a pair of upper and lower rotary blades 31. The left and right cutting means 32 can be approached and separated from each other. The lower pair of left and right rotary blades 31 are synchronously rotated via a spline shaft 33 connected to an electric motor (not shown), and the upper and lower rotary blades 31 are synchronously rotated via a gear 34. . The rotary blade 31 has a substantially disk-shaped cutter holder 35 and a substantially annular cutter 36 fixed to the cutter holder 35, and the gap between the peripheral surfaces of the upper and lower cutters 36 is smaller than the thickness of the substrate 1. A small predetermined gap H is formed, and an annular escape portion 37 for allowing the cut end surface of the cut substrate 1 to escape is formed on the outer peripheral portion of the opposed end surfaces of the upper and lower cutters 36. In the cutting device 30, the substrate 1 is fed between the left and right cutting means 32 while being positioned via the positioning holes 6 in a state where the distance between the left and right cutting means 32 is adjusted to an appropriate size of the substrate 1 in advance. As a result, the left and right ears 8 are simultaneously cut by the shearing force between the upper and lower rotary blades 31 that rotate synchronously.

The deburring step includes a first deburring step and a second deburring step.
It is divided into a deburring step, and in both steps, a cutting device 40 having the same configuration is used. First, in the first deburring step, the longitudinal direction of the substrate 1 is directed to the first cutting device 40 in the feeding direction. 1 to remove burrs on both side edges in the longitudinal direction of the substrate 1, and then, in a second deburring step, the substrate 1 is fed to the second cutting device 30 with the width direction of the substrate 1 directed in the feeding direction. 1 to remove burrs on both side edges in the width direction of the substrate 1. However, after removing burrs on both side edges in the width direction of the substrate 1, burrs on both side edges in the longitudinal direction may be removed. Also,
After removing the burrs on both sides of the substrate 1 in the longitudinal direction or the width direction, the same cutting device 40 may return the substrate 1 to remove the burrs on the both sides in the width direction or the longitudinal direction. As shown in FIG. 8, the cutting device 40 includes three cutting wheels 4 that are rotationally driven by an electric motor (not shown).
A pair of left and right cutting means 44 having 1, 42, and 43 are provided, and the left and right cutting means 44 are supported so as to be able to approach and separate from each other.

In this cutting device 40, the left and right cutting means 4
By feeding the substrate 1 between the left and right cutting means 44 while positioning through the positioning holes 6 in a state where the distance between the four has been adjusted to an appropriate size of the substrate 1 in advance, as shown in FIG. Then, the upper end of the side edge of the substrate 1 is obliquely cut by the first cutting wheel 41, and then, as shown in FIG. 10, the lower end of the side edge of the substrate 1 is obliquely cut by the second cutting wheel 42. And then, as shown in FIG.
The middle part in the thickness direction of the substrate 1 is cut in the vertical direction by the cutting wheel 43, and the side edge of the substrate 1 is cut in a trapezoidal shape to remove burrs.

The stacking step and the taping step include:
In a post-process of the pre-processing of the substrate 1, the through-hole for component mounting can be simultaneously formed in a plurality of substrates 1 by the NC processing machine. In the stacking process, 3
The stack of the substrates 1 is stacked, the stacking pins 10 are mounted in the positioning holes 6, and the three substrates 1 are positioned and fixed in a stacked manner. An aluminum plate 11 for preventing slipping of a drill and a discarding plate 12 for preventing burrs on the upper and lower surfaces of
Are fixed in a state where they are arranged in a layered manner, respectively, with a tape 13. However, a plurality of substrates 1 other than three may be stacked and taped. The transfer of the substrate 1 between the steps may be performed by suctioning and holding the substrate 1 by a suction pad, or by using a transfer means such as a roller conveyor.

The pre-processing system requires one worker in the drilling process, two workers in the cutting process, and two workers in the deburring process.
Name, 1 person in stacking process and taping process, total 6
It is possible to perform pre-processing efficiently with about half the number of workers compared to the conventional pre-processing system. In addition, the time required for processing one substrate 1 in all the steps is about 9 seconds, the line balance is improved, the substrate 1 can be processed efficiently, and a plurality of substrates 1 are stocked in a stacked state. This makes it possible to prevent damage to the substrate surface and the like.

[0021]

According to the substrate pretreatment system of the present invention, since the conventional marking process to the drilling process are performed by using the positioning and drilling device, the processing capability until the positioning hole is formed is greatly increased. When it is improved, only one worker is required to work on it.
In addition, the line balance between the drilling process for forming the positioning holes and the outer peripheral processing process for cutting and deburring the ears of the substrate is improved, improving the overall processing capacity and stacking the substrates for stocking. Can prevent the occurrence of scratches and the like.

With this configuration, it is possible to improve the quality of the substrate by chamfering the upper and lower ends of the side edges of the substrate without lowering the efficiency of the deburring operation. With this configuration, the positioning accuracy of the temporary positioning of the substrate with respect to the table is improved, and the automatic positioning by the positioning and punching device is reduced to about 1 / the conventional level.
2 times. Then, the line balance between the hole forming step for forming the positioning holes and the outer peripheral processing step of cutting off the rim of the substrate to remove the burrs can be almost completely matched.

[Brief description of the drawings]

FIG. 1 is a plan view of a substrate.

FIG. 2 is a sectional view taken along line II-II of FIG.

FIG. 3 is an explanatory diagram of a process of a pretreatment system.

FIG. 4 is a vertical cross-sectional view of a taped substrate near a positioning hole.

FIG. 5 is an overall configuration diagram of a positioning and drilling device.

FIG. 6 is a front view of the cutting device.

FIG. 7 is a longitudinal sectional view of a main part near upper and lower cutters.

FIG. 8 is a perspective view of a cutting device.

FIG. 9 is a longitudinal sectional view of a main part of a first cutting wheel.

FIG. 10 is a longitudinal sectional view of a main part of a second cutting wheel.

FIG. 11 is a longitudinal sectional view of a main part of a third cutting wheel.

FIG. 12 is an explanatory view of a conventional pre-processing process.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Substrate 2 Thermosetting laminated board 2a Intermediate board 3 Copper foil 4 Positioning mark 5 Positioning mark 6 Positioning hole 7 Positioning hole 8 Ear part 10 Stacking pin 11 Aluminum plate 12 Discarded plate 13 Tape 20 Positioning and drilling device 21 Table 22 Camera 23 Drill 24 Beam irradiation means 30 Cutting device 31 Rotary blade 32 Cutting means 33 Spline shaft 34 Gear 35 Cutter holder 36 Cutter 37 Escape part 40 Cutting device 41 Cutting wheel 42 Cutting wheel 43 Cutting wheel 44 Cutting means

Claims (3)

[Claims] 1. A positioning / drilling device for positioning and drilling in the X direction, the Y direction, and the rotation direction about a vertical axis while holding a substrate set on a table by suction, and positioning the substrate with respect to the substrate. A pair of upper and lower disk-shaped rotary blades each having one edge on one of the opposite sides of the substrate with a shearing blade on the outer periphery while positioning and transporting the substrate with reference to the positioning hole; A first cutting step of feeding and cutting the substrate, and positioning and transporting the substrate with reference to the positioning holes, each of the ears on the other opposite side of the substrate, a pair of upper and lower having a shearing blade on the outer periphery. A second cutting step of feeding and cutting between the disk-shaped rotary blades, and a first step of cutting and removing burrs on one opposing side of the substrate while positioning and transferring the substrate with reference to the positioning holes. A deburring step; Pretreatment system board that includes a second deburring step for removing the respective cutting burr of the other opposing sides of the substrate while transferring and positioning the substrate relative to the-decided Me holes, the. 2. In the deburring step, first cutting means for cutting the upper edge side of the side edge of the substrate obliquely, second cutting means for cutting the lower edge obliquely, and second cutting means for cutting the middle part in the vertical direction. The substrate pretreatment system according to claim 1, wherein the substrate is cut by three cutting means. 3. A positioning / drilling device, in which a substrate is set at an appropriate position on a table in order to temporarily position the substrate on a table visually, and a positioning formed in advance at a position where a positioning hole of the substrate is formed. 2. A mark having beam irradiation means for irradiating a mark with a laser beam having a diameter of 0.8 to 0.5 mm on an irradiation surface.
Or a pretreatment system for a substrate according to 2.