JPH1035880A - IC package transfer device, IC package separation method and positioning method using the transfer device, and IC package supply positioning device using the transfer device - Google Patents

Abstract

(57) [Summary] [Problem] To provide an IC package 2 that can be reliably separated and supplied without damaging the IC package 2, and at the same time, a positioning unit that is arbitrarily set in accordance with an appearance inspection performed after separation. Make a quick stop. SOLUTION: Separation positioning device 1 for IC package 2
, A separating section 1a and a conveying section 1b having a positioning section 1c are provided. In the separating section 1a, the continuous IC packages 2 are conveyed while being simultaneously pressed by the separating belt 11, and the separating belt 11 The IC packages 2 released from the pressing are supplied to the transport unit 1b in a state where they are separated from each other.
Thus, the IC package 2 is conveyed while being pressed in the direction of the conveying rail 4, and the IC package 2 is stopped quickly and accurately at an arbitrary position.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC package transfer apparatus for transferring, separating and positioning an IC package in a semiconductor manufacturing apparatus, a separation method and a positioning method using the transfer apparatus, and a transfer apparatus therefor. The present invention relates to an IC package supply / positioning device using the same.

[0002]

2. Description of the Related Art In order to test and measure an IC package after manufacturing, a so-called IC handling apparatus for separating and transporting a continuously transported IC package is required. An IC handling device shown in FIG. 4 has been devised.

For example, in an IC handling apparatus 31 shown in FIG. 3, IC packages 34a, b, c,... (Hereinafter, referred to as “IC packages”) continuously transported along a transport rail 33 formed on an inclined frame 32. The IC package 34a positioned at the head of the IC package 34 is simply locked by a first stopper pin 35, and the IC package 34b one upstream of the IC package 34a is And is held by being pressed by the stopper pin 36 of FIG. In the above, the first
When the stopper pin 35 releases the locking of the leading IC package 34a, the IC package 34a slides down along the transport rail 33, but the IC package 34 located upstream from the IC package 34a.
Is the IC package 3 with the second stopper pin 36
Since the IC package 34 is stopped by holding the IC package 4b, only the IC package 34a can be separated from the IC package 34.

Then, the first stopper pin 35 is displaced to the locking position again, and the second stopper pin 3
6 release the pressing of the IC package 34b, I
The entire C package 34 is sequentially fed one by one, and the IC package 34b is brought into contact with and locked by the first stopper pin 35, and the IC package 34 below the second stopper pin 36 and one upstream of the IC package 34b. 34c is located. If the IC package 34c is pressed and held by the second stopper pin 36, the state returns to the initial state. By repeating the above operation, the IC packages 34 can be separated one by one. Further, a third stopper pin 37 is provided for positioning the separated IC package 34 in the course of downhilling.
When the lock by the stopper pin 36 is released,
The IC package 34 is locked by displacing the third stopper pin 37 to the locking position.

On the other hand, as shown in FIG. 4, there is a type in which the IC package 34b is pressed by using a rotatable roller 40 instead of the second stopper pin 36 to separate the IC package 34. . The IC handling devices as described above are disclosed in Japanese Patent Application Laid-Open No. 3-278556 and
It is disclosed in JP-A-3-187237.

[0006]

However, the mechanism for realizing separation in the above-described conventional IC handling apparatus 31 has the following problems. First, since the transfer on the transfer rail 33 is basically performed by gravity, the transfer speed cannot be controlled, and the IC packages 34 having different sizes and weights are different.
In the case of transporting the stopper pin, it is necessary to reset the position of the stopper pin, and it is troublesome to set the timing of operation and release of the stopper pin.

Further, for example, in the former IC handling apparatus 31, the upper surface of each IC package 34 is pressed by the second stopper pin 36 when separating the continuously supplied IC packages 34. Depending on the strength of the IC package 34, there is a problem that the surface of the IC package 34 is scratched, the inside of the IC package 34 is damaged, and the yield is deteriorated.
When the roller 40 is used instead of the second stopper pin 36 as in the latter case, when the IC package 34 is separated, the IC package 34 does not bite into the roller 40 and is clogged. There was a problem.

Further, as a problem common to both, I
The third stopper pin 3 is used to position the C package 34.
However, in this case, the separated IC package 34 during the downhill rebounds to the third stopper pin 37, so that it takes time to stop and the positioning is performed at high speed. And it is difficult to continuously transport. Of course, when the high-speed operation is to be performed, the impact applied to the IC package 34 becomes large, so that the problem that the yield is deteriorated also arises.

SUMMARY OF THE INVENTION An object of the present invention is to provide an IC package transfer device which is less likely to damage the IC package during separation and transfer and which can be transferred at high speed, and an IC using the transfer device.
It is an object of the present invention to provide a method for separating and positioning a package and a supply and positioning device for an IC package using the transport device.

[0010]

According to the first aspect of the present invention, there is provided:
In order to solve the above-mentioned problem, a C-package transport device is an IC that transports an IC package on a slanted transport rail with a direction in which gravitational acceleration can act as a transport direction.
In a package transport device, a delivery member having a pressing surface that is rotationally driven in a transport direction of an IC package, and a driving member capable of arbitrarily controlling the driving speed and driving / stopping, and urging the pressing surface against a transport rail. Biasing means for carrying the IC package while nipping the IC package between the transport rail and the pressing surface of the sending member. With the above configuration, the IC package is driven by the rotationally driven pressing surface. However, since the driving speed and the driving / stopping during the rotational driving can be arbitrarily controlled, the setting of the IC package transport speed and the timing of the driving / stopping are performed. Can be set freely, and settings can be easily made in accordance with the change of the IC package to be conveyed.

According to a second aspect of the present invention, in order to solve the above-mentioned problem, in addition to the configuration of the first aspect, a belt-shaped member extended drivably as the delivery member is provided. Is provided, and the pressing of the IC package is performed by the belt-shaped member. According to the above configuration, the IC package is pressed against the transport rail by the belt-like member in a state where the surface pressure is dispersed, so that the possibility that the pressing causes damage to the IC package is reduced, and the IC package is separated. It is possible to prevent a decrease in yield in the supply device.

According to a third aspect of the present invention, in order to solve the above-mentioned problems, in addition to the configuration of the second aspect, the belt-shaped member is driven by a motor. A support arm supporting the belt-shaped member transmits the rotation of the motor to the belt-shaped member supported by the support arm, and is rotatably attached to one end of a link rotatable with respect to the rotation axis of the motor. It is characterized by having. By driving with a motor as in the above configuration, the driving and stopping of the belt-shaped member can be easily controlled, while the support arm holds the IC package pressed against the transport rail by the urging means. The link makes it possible to freely change the distance to the transport rail. Therefore, it is easy to cope with the case where the thickness of the IC package varies, and it is easy to cope with the IC package having a different thickness, and it is possible to stably guide and transport the IC package to the belt-like member during driving.

According to a fourth aspect of the present invention, there is provided an IC package separating method using the IC package transporting device according to any one of the first to third aspects. When the IC package located on the leading side is released from being held by the pressing surface, the driving of the sending member is temporarily stopped. In the above method, in the IC package transfer device according to any one of claims 1 to 3, since the driving can be stopped arbitrarily, the leading IC package is separated from the pressing surface of the sending member on the downstream side in the transfer direction of the transfer device. When the sending member is temporarily stopped, the second IC package is stopped while being sandwiched by the sending member, but the leading IC package has a propulsive force due to the rotation of the sending member. Due to its own weight, it will slide down in the transport direction,
Even when the IC packages are continuously supplied, the IC packages can be reliably separated. Further, since this separation can be controlled only by driving / stopping the delivery member, the control of the delivery member can be simplified.

According to a fifth aspect of the present invention, there is provided an IC package separating method using the IC package transport device according to any one of the first to third aspects, in order to solve the above problems. The driving speed of the member is controlled so as to be lower than the maximum speed when the IC package slides down by its own weight. In the above-described method, the IC package transport device according to any one of claims 1 to 3 can control the driving speed arbitrarily, so that the leading IC package from the pressing surface of the sending member is located downstream of the transport device in the transport direction. After moving away, when it starts to move in the transport direction due to the propulsive force of the rotation of the sending member and its own weight, for example, it is driven at a constant speed lower than the average speed at which the IC package slides down, or the first IC Sending out the package, stopping it when the second IC package comes to a predetermined position, and driving it intermittently,
Since the driving speed of the sending member is set to be lower than the sliding speed of the IC package, the second IC package is released from the pressing of the sending member at an interval from the leading IC package, Even when the IC packages are continuously supplied, the IC packages can be reliably separated. In the above, when the sending member is driven at a constant speed, the control of the sending member is further simplified.

A method for positioning an IC package according to a sixth aspect of the present invention is to solve the above-mentioned problem.
The method according to any one of (1) to (3), wherein the IC package is stopped at a positioning section set on the transfer rail by using the IC package transfer device. In the above method, the IC package transfer device according to any one of claims 1 to 3 can stop driving arbitrarily, so that different IC packages are transferred or different positions are inspected in inspection. Even if it is necessary to change the position of the positioning portion, it can be easily coped with and can be stopped at an arbitrary position. In addition, since the IC package is hardly damaged at the time of stopping, quick positioning and high-speed conveyance can be performed at the same time.

According to a seventh aspect of the present invention, in order to solve the above-mentioned problems, the IC package supply / positioning device is installed at an angle, and the IC package is continuously connected with a direction in which gravitational acceleration can act as a transport direction. 4. A supply and positioning device for an IC package provided on a transport rail supplied in a state of separation in the transport direction in the order of a positioning device, wherein the separating device and the positioning device are provided in a manner as described in claim 1. The first IC package, which is configured by the transport device according to any one of the above and is released from the pressing by the first sending member in the separating unit, is transported to the positioning unit set in the positioning unit. The driving speed and driving of the first sending member so that the pressing of the second and subsequent IC packages by the first sending member is not released. It is characterized in that the timing of stopping is set. In the IC package supply positioning device, when the IC package is separated, the IC package may be temporarily stopped in a separated state for an appearance inspection or the like. Therefore, as in the above configuration, since the transfer device according to any one of claims 1 to 3 is used as the separation unit and the positioning unit, separation of the IC package can be reliably performed. , Depending on the size of the IC package and the differences
It is easy to arbitrarily change the stop position even when the stop position of the positioning unit is different. Further, since the IC package is basically conveyed while being pressed by the belt-shaped member, the IC package can be quickly and safely stopped at the stop position when positioning, so that the conveying speed can be increased.

[0017]

BEST MODE FOR CARRYING OUT THE INVENTION

[Embodiment 1] The configuration and operation of an IC package supply and positioning device (hereinafter, simply referred to as a separation positioning device) according to an embodiment of the present invention will be described with reference to FIGS. This will be described below. As shown in FIGS. 1 and 2, the separating and positioning apparatus 1 separates the continuously supplied IC packages 2 one by one in a separating section 1a and transports the separated IC packages 2 in a transport section 1b. In addition, positioning for inspection is performed.

The separating section 1a and the transporting section 1b are formed on the slope of the gantry 3 of the separating and positioning apparatus 1. This slope has an inclination of 30 ° to 45 ° with respect to the horizontal plane. The transport path 6 is formed by the transport rail 4 and the guide 5 that covers the transport rail 4 so as to penetrate the separation section 1a and the transport section 1b.
On the transport rail 4 other than the separation section 1a and the transport section 1b, the transport path 6 basically moves down the transport path 6 by its own weight. The IC package 2 continuously supplied from the entrance side of the separation unit 1a is supplied separately from the exit side of the transport unit 1b. Further, a positioning section 1c of the IC package 2 is formed in the middle of the transport section 1b. Notches 5a, 5a are formed in the guide 5 of the positioning portion 1c, and the appearance inspection can be performed by stopping the IC package 2 at the positioning portion 1c. Further, slits 5b and 5c are formed on the upper surface of the guide 5 so that the IC package 2 can be transported and held by the separation belt 11 and the transport belt 21 described later.

The separation section 1a is provided with the separation belt 11 that is disposed on the conveyance rail 4 and holds the IC package 2 with the conveyance rail 4, and a motor 12 that drives the separation belt 11. The separation belt 11 holds the IC package 2 in the transfer path 6 and performs separation and transfer by holding the IC package 2 in the transfer path 6 by the outer surface side (pressing surface) through the slit 5b. Shaft 12 of the motor 12
A pulley 15a fixed to the shaft portion 12a and driven to rotate integrally therewith, and one end of a link 14 provided with a rotatable shaft portion 13 at the other end side with respect to the shaft portion 12a are turned. Mounted freely. A pulley 15 on which the drive belt 15 is stretched by the pulley 15a is mounted on the shaft portion 13.
b and the pulley 11a are mounted so as to rotate integrally, and one end of the support arm 16 is rotatably mounted. Further, the separation belt 11 is stretched by a pulley 11b rotatably attached to the other end of the support arm 16 and the pulley 11a. In the above configuration, when the shaft portion 12a of the motor 12 rotates, the pulley 15a rotates and the drive belt 15
Drive. The pulley 11a is driven by the drive belt 15 via the shaft 13 and the pulley 15b, and the separation belt 11 is driven by the pulley 11a.

Coil springs 17a and 17b connected to the gantry 3 are attached to both ends of the support arm 16, and the support arm 16 is urged in the direction of the gantry 3 and is moved from the gantry 3 to the support arm 16a. The height adjustment screws 18a and 18b protruding near both ends of the support arm 16
The height adjustment screw 1
8a and 18b, the movement of the support arm 16 in the direction of the gantry 3 is prevented.
And a predetermined gap is formed. A sensor 19 for detecting passage of the IC package 2 discharged from the separation belt 11 is provided near the exit of the separation unit 1a, and drives and stops the motor 12, that is, drives and stops the separation belt 11. The stop is performed based on the detection result of the sensor 19.

On the other hand, the transport section 1b also has substantially the same configuration as the above-mentioned separation section 1a,
A conveyor belt 21 for nipping and conveying the C package 2,
A motor 22 for driving the transport belt 21 is provided. The transport belt 21 holds the IC package 2 in the transport path 6 by the outer surface side (pressing surface) through the slit 5c, and performs positioning and transport. It has become. The shaft 22a of the motor 22 has a shaft 22a.
, And one end of a link 24 provided with a rotatable shaft portion 23 at the other end thereof is rotatably attached to the shaft portion 22a. . A pulley 25b on which the drive belt 25 is stretched by the pulley 25a,
a is mounted so as to rotate integrally with it, and one end of a support arm 26 is rotatably mounted. Further, the transport belt 21 is stretched by a pulley 21b rotatably attached to the other end of the support arm 26 and the pulley 21a. In the above configuration, when the shaft portion 22a of the motor 22 rotates, the pulley 25a rotates to drive the drive belt 25. Then, the pulley 21a is driven by the drive belt 25 via the shaft portion 23 and the pulley 25b,
Is driven by the pulley 21a.

Coil springs 27a and 27b connected to the gantry 3 are attached to both ends of the support arm 26. The support arm 26 is urged in the direction of the gantry 3 and is urged from the gantry 3 to the support arm 26. The height adjustment screws 28a and 28b protruding near both ends of the support arm 26
The height adjustment screw 2
8a and 28b, the movement of the support arm 26 in the direction of the gantry 3 is prevented.
And a predetermined gap is formed. Note that the transport unit 1b is provided with a sensor 29 for detecting the passage of the IC package 2 immediately before the positioning unit 1c, and the stop accompanying the positioning of the IC package 2 is performed based on the detection result of the sensor 29. .

The predetermined gap between the separation belt 11 and the conveyance rail 4 in the separation section 1a and the conveyance section 1
The predetermined gap between the conveyor belt 21 and the conveyor rail 4 at b is adjusted so that the respective inlet sides are equal to or slightly larger than the thickness of the IC package 2 by height adjusting screws 18a and 28a, The respective outlet sides are adjusted to be equal to or less than the thickness of the IC package 2 by the height adjusting screw 18b and the height adjusting screw 28b, and the gap is set to be narrower as approaching the outlet side. .

Thus, the separation section 1a and the transport section 1b
The IC package 2 can move along the conveyance path 6 without being clogged by the separation belt 11 and the conveyance belt 21 at the entrance side of the IC package 2, and the separation belt 11 and the conveyance belt 21 move toward the exit side as the IC package 2 approaches. Is pressed toward the transport rail 4, so that even if the thickness of the IC package 2 varies, the invitation to the separation belt 11 and the transport belt 21 and the transport can be performed stably.

The operation of the IC package separating and positioning apparatus 1 according to the present invention based on the above configuration will be described below. First, the IC package 2 is continuously supplied along the inclined conveyance path 6, and at the same time, the separation belt 11 is driven by the motor 12 so that the IC package 2 is sandwiched between the separation belt 11 and the conveyance rail 4. While transporting.

When the sensor 19 detects the IC package 2, the driving of the separation belt 11 is stopped. In the above, the distance between the sensor 19 and the end of the separation belt 11 on the pulley 11b side is one of the IC packages 2. Since the length of the IC package 2 is longer than the length of the IC package 2 and smaller than the length of the two ICs, the sensor 19 detects the IC package 2 after the leading IC package 2 is not driven by the separation belt 11. Will be Therefore, when the driving of the separation belt 11 is stopped, only the leading IC package 2 slides down to the transport unit 1b side, and the next IC package 2 is held by the separation unit 1a by the separation belt 11. ing. Thus, the IC package 2 can be separated.

On the other hand, the IC package 2 supplied to the transport section 1b is driven by a motor 22 to drive the transport belt 21.
When the sensor 29 detects the passage of the IC package 2, the motor 22 moves the IC package 2 to a stop position of the positioning section 1 c. It is set to stop when it is done. After the appearance inspection or the like of the IC package 2 is performed at the stop position, the conveyor belt 21 is driven again, and the IC package 2 is discharged from the separation positioning device 1.

Then, at the same time as the driving of the conveyor belt 21 or after the IC package 2 is discharged from the separation positioning device 1, the separation belt 11 is driven to drive the IC package 2
Resume supply. By repeating the above operation,
The IC packages 2 are sequentially supplied to the positioning section 1c, so that the appearance inspection and the like can be continuously performed.

The transfer speed of the separation belt 11 or the transfer belt 21 can be set arbitrarily. However, this is not necessary because of the change in the transfer speed due to the difference in the size of the IC package 2 and the necessity in manufacturing. This is to cope with a case where the supply number of the IC package 2 needs to be changed accordingly.

[Embodiment 2] The structure and operation of an IC package separation and positioning device (hereinafter, simply referred to as a separation and positioning device) according to another embodiment of the present invention will be described below with reference to FIGS. 2 will be described below. The separation positioning device of the present embodiment has basically the same configuration as the separation positioning device 1 of the first embodiment, and the control of the separation belt 11 in the separation unit 1a of FIGS. 1 and 2 differs. Is what it is.

In the first embodiment, the IC package 2 is separated by intermittently operating and stopping the separation belt 11 in the separation section 1a. As described above, the conveyance speed of the separation belt 11 or the conveyance belt 21 can be arbitrarily set, and the conveyance speed of the separation belt 11 can be reduced without stopping the separation belt 11.
Is set to be slower than the transfer speed.

That is, if the transport speed of the transport belt 21 is low, the IC package 2 stays on the upstream side of the transport belt 21, but conversely, the transport speed of the separation belt 11 is lower than the transport speed of the transport belt 21. If you set it late,
The transport speed of the IC package 2 in the transport unit 1b is faster than the speed at which the IC package 2 is supplied from the separation unit 1a side, and immediately before the next IC package 2 is supplied to the upstream side of the transport belt 21, The IC package 2 is transported to the positioning section 1c in the transport section 1b,
The IC package 2 is supplied separately to the positioning section 1c. As a result, in the present embodiment, there is no need to provide the sensor 19, and the control is simplified because the separation belt 11 itself only needs to be driven at a constant speed. Further, the load on the motor 12 due to driving / stopping can be reduced.

In the separation positioning device 1 in each of the above embodiments, the separation belt 11 and the conveyance belt 21
By pressing the package 2 in the direction of the transport rail 4, the IC package 2 is held and transported on the transport rail 4. The pressing force required to hold the IC package 2 is reduced. Since the pressing force applied to the IC package 2 per unit area is small as a result of being dispersed on the entire surface, the IC package 2 is hardly damaged by the pressing, and the stop position of the IC package 2 in the positioning portion 1c is , I by the sensor 29
It can be changed arbitrarily by changing the timing at which the transport belt 21 is stopped after the detection of the C package 2, and the stop position can be easily changed by changing the type of the IC package 2 to be transported. In addition, since the time until the IC package 2 is stopped by the positioning unit 1c can be accurately controlled, it is easy to increase the speed of separation and conveyance as necessary.

[0034]

As described above, the IC package transfer device according to the first aspect of the present invention has a pressing surface that is rotationally driven in the IC package transfer direction, and its driving speed and driving / stopping can be arbitrarily performed. A controllable sending member and an urging means for urging the pressing surface against the conveying rail are provided, and the IC package is conveyed while sandwiching the IC package between the conveying rail and the pressing surface of the sending member. Configuration. Therefore, the driving speed and the driving speed of the IC package
Since the stop can be arbitrarily controlled, there is an effect that the setting according to the change of the IC package to be transported can be easily performed.

According to a second aspect of the present invention, as described above, in addition to the configuration of the first aspect, a belt-shaped member that is drivably stretched is provided as the delivery member. In this configuration, the IC package is pressed by the belt-shaped member. Therefore, in addition to the effect of the configuration of claim 1, the surface pressure applied to the IC package at the time of transport decreases, but the wide pressing surface allows sufficient holding for transport, and for example, The IC package becomes smaller for the purpose of low space,
Even when there is a decrease in the strength of the package, the IC package is hardly damaged by the above-described pressing,
There is an effect that it is possible to prevent a decrease in the yield at the time of transporting the IC package.

According to a third aspect of the present invention, in addition to the configuration of the second aspect, the belt-shaped member is driven by a motor. The supporting arm that supports the motor is configured to transmit the rotation of the motor to a belt-shaped member supported by the supporting arm and to be rotatably attached to one end of a link that is rotatable with respect to the rotation shaft of the motor. . Therefore, in addition to the effect of the configuration of claim 2, since the distance between the support arm and the transport rail can be freely changed by the link, the thickness of the IC package may vary, or the thickness of the IC package may vary. Therefore, it is possible to stably guide and transport the IC package to the belt-shaped member during driving.

According to a fourth aspect of the present invention, there is provided a method of separating an IC package using the IC package transporting device according to any one of the first to third aspects. When the IC package is released from being held by the pressing surface, the driving of the sending member is temporarily stopped. Therefore, since the driving of the IC package can be arbitrarily stopped, the driving of the sending member is temporarily stopped when the leading IC package is separated from the pressing surface of the sending member on the downstream side in the carrying direction of the carrying device. In addition, even when the IC packages are continuously supplied to the upstream side of the transfer device, there is an effect that only the leading IC package can be separated securely and safely.

According to a fifth aspect of the present invention, there is provided a method of separating an IC package using the IC package conveying apparatus according to any one of the first to third aspects. However, the configuration is such that the speed is controlled to be lower than the maximum speed when the IC package slides down by its own weight. Therefore, the driving speed of the IC package is controlled, and the IC package next to the leading IC package separated from the pressing surface of the sending member is driven at a speed lower than the sliding speed of the leading IC package. Even when the packages are continuously supplied, the IC packages can be reliably and safely separated. Also,
In this case, if the sending member is driven at a constant speed, there is an effect that the control of the sending member is simplified.

According to a sixth aspect of the present invention, there is provided an IC package positioning method using the IC package transport device according to any one of the first to third aspects.
It is configured to stop at a positioning section set on the transport rail. Therefore, since the IC package can be stopped at an arbitrary position on the transport rail, it is possible to easily cope with the need to change the position of the positioning portion.
Since there is almost no damage to the IC package at the time of the stop, there is an effect that high-speed transport can be performed simultaneously with quick positioning.

According to the seventh aspect of the present invention, the supply and positioning device for an IC package is provided in a state where the IC package is continuously installed with the direction in which the gravitational acceleration can act as a transport direction while being installed in an inclined manner. 4. A supply and positioning device for an IC package, wherein a separating means and a positioning means are provided in this order on a conveying rail in a conveying direction, wherein the separating means and the positioning means are any one of claims 1 to 3. And the second and subsequent steps until the leading IC package, from which the pressing by the first sending member in the separating means is released, is transferred to the positioning portion set in the positioning means. The driving speed of the first sending member and the timing of driving / stopping so that the pressing of the IC package of the first sending member by the first sending member is not released. Grayed a configuration has been set. Therefore, in the IC package supply / positioning device, when the IC package needs to be temporarily stopped in a state where the IC package is separated for the purpose of visual inspection or the like, the IC package can be reliably separated. It is possible to easily change the stop position arbitrarily even when the stop position of the positioning unit is different due to a difference in size or an inspection part depending on the type of the IC package. Further, since the IC package is basically conveyed while being pressed by the belt-shaped member, the IC package can be quickly and safely stopped at the stop position when positioning, so that the conveying speed can be increased. It has the effect of being able to.

[Brief description of the drawings]

FIG. 1 is a schematic diagram of an IC package separation and positioning device according to the present invention as viewed from a direction orthogonal to a slope of a gantry.

FIG. 2 is a cross-sectional view of the IC package separating and positioning device shown in FIG.

FIG. 3 is a schematic diagram of an IC package separation and positioning device to which a conventional IC handling device is applied.

FIG. 4 shows an I to which another conventional IC handling device is applied.
It is the schematic of the separation positioning device of C package.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Separation positioning apparatus 1a Separation part (transfer apparatus / separation means) 1b Transport part (conveyance apparatus / positioning means) 1c Positioning part 2 IC package 4 conveyance rail 11 Separation belt (delivery member / belt-shaped member / first transmission member) DESCRIPTION OF SYMBOLS 12 Motor 14 Link 16 Support arm 17a / 17b Coil spring (biasing means) 21 Conveying belt (delivery member / belt-like member) 22 Motor 24 Link 26 Support arm 27a / 27b Coil spring (biasing means)

Claims (7)

[Claims] 1. An IC package transporting device for transporting an IC package on a slanted transport rail with a direction in which gravitational acceleration can act as a transport direction, the device having a pressing surface that is rotationally driven in the IC package transport direction. And a delivery member whose drive speed and drive / stop can be controlled arbitrarily, and a biasing means for biasing the pressing surface against the transport rail are provided, and a pressing surface of the transport rail and the transport member is provided. An IC package being conveyed while sandwiching the IC package between the IC package and the IC package. 2. The IC package according to claim 1, wherein a belt-like member stretched drivably is provided as the sending member, and the IC package is pressed by the belt-like member. Transport device. 3. The belt-shaped member is driven by a motor, and a support arm for supporting the belt-shaped member transmits rotation of the motor to the belt-shaped member supported by the support arm, and the motor is driven by a motor. 3. The IC package transport device according to claim 2, wherein the IC package transport device is rotatably attached to one end of a link that is rotatable with respect to a rotation shaft. 4. A delivery member when the IC package located at the leading side in the transport direction is released from being pinched by the pressing surface by using the IC package transport device according to any one of claims 1 to 3. A method for separating an IC package, wherein the driving of the IC package is temporarily stopped. 5. The driving speed of the sending member is lower than the maximum speed when the IC package slides down by its own weight using the IC package transport device according to any one of claims 1 to 3. A method for separating an IC package. 6. An IC which stops at a positioning portion set on a transport rail by using the IC package transport device according to claim 1.
Package positioning method. 7. A separation means and a positioning means, which are installed on a slant, and on which the IC package is conveyed continuously with the direction in which gravitational acceleration can act as a conveyance direction. ICs provided in order
In the package supply / positioning device, the separating means and the positioning means are constituted by the conveying device according to any one of claims 1 to 3, and the pressing by the first sending member in the separating means is released. Until the leading IC package is conveyed to the positioning section set in the positioning means, the second and subsequent ICs are transferred.
An IC package supply / positioning device, wherein a drive speed and a drive / stop timing of the first delivery member are set so that the pressing of the C package by the first delivery member is not released.