JPH1041376A - Substrate holding apparatus, substrate holding method, and exposure apparatus - Google Patents

Abstract

[PROBLEMS] To ensure a large contact area with a substrate when holding the substrate, and to reduce the peeling charge generated when the substrate is peeled. SOLUTION: A part of a substrate mounting surface 50 is formed by a movable member 55a.
To 55e. When holding the substrate 6 by vacuum suction, the movable member is positioned at the first position slightly inside the substrate mounting surface, and the vacuum suction grooves 51a to 51d are evacuated to suck the substrate. The Bernoulli chuck works and the substrate comes into close contact with the substrate mounting surface instantaneously. When peeling the substrate from the substrate mounting surface, the surface 57 of the movable member is lowered from the first position to the second position further inside from the first position before the peeling, and the contact area between the substrate and the substrate mounting surface is reduced in advance. Let it be. Thereafter, the substrate is lifted by center-up 38, and the substrate is peeled from the substrate mounting surface.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an exposure apparatus used for transferring a pattern to a substrate when a semiconductor device or a liquid crystal display device is manufactured by a lithography process, and a substrate held in an exposure apparatus or the like. And a method for holding a substrate.

[0002]

2. Description of the Related Art Conventionally, a projection exposure apparatus, an X-ray exposure apparatus,
2. Description of the Related Art In an electron beam exposure apparatus, a semiconductor wafer inspection apparatus, a laser repair apparatus, and the like, a substrate holding apparatus of a vacuum suction type is used to hold a substrate such as a semiconductor wafer to be processed or inspected flat.

FIGS. 7A and 7B are a plan view and a sectional view showing an example of a conventional substrate holding device. The substrate holding device has a substrate holder 30, and a plurality of vacuum suction grooves 51 a to 51 d are provided on a substrate mounting surface 50 on the substrate holder 30. A vacuum exhaust unit 60 such as a vacuum pump and an air pressure adjusting unit 61 are connected to each of the vacuum suction grooves 51a to 51d. The substrate 6 can be held in close contact with the substrate mounting surface 50 by operating the evacuation unit 60 while the substrate 6 is mounted on the substrate mounting surface 50 of the substrate holder 30. The pneumatic pressure adjusting means 61 moves the substrate 6 from the substrate mounting surface 50.
This is for supplying air to the vacuum suction grooves 51a to 51d so that the peeling can be easily performed.
Further, a plurality of (four in the figure) spindle parts 38a to 38a-3
A center up 38 made of 8d is provided so as to be vertically movable with respect to the substrate mounting surface 50 of the substrate holder 30.
The vertical movement of the center-up 38 is performed by the center-up driving means 36.

A substrate 6 such as a semiconductor wafer or a glass plate
When the substrate is mounted on the substrate mounting surface 50 of the substrate holder 30, the center-up drive means 36 first raises the center-up 38 to a position above the substrate mounting surface 50, and the substrate is transferred by a substrate transfer device (not shown). The substrate is received on the center-up 38. Subsequently, the center-up drive unit 36 lowers the center-up 38, and the substrate 6 supported on the tip of the center-up 38.
On the substrate mounting surface 50 of the substrate holder 30.

[0005] Positioning pins 52a to 52c are provided on the substrate mounting surface 50 of the substrate holder 30, and the end faces of the substrate are pressed against the positioning pins 52a to 52c so that they can be placed on the substrate mounting surface 50. The positioning of the substrate 6 is performed. The substrate 6 positioned on the substrate mounting surface 50 is
By evacuating the vacuum suction grooves 51a to 51d provided on the substrate mounting surface 50 by the vacuum evacuation unit 60, the vacuum suction grooves 51a to 51d are held in close contact with the substrate mounting surface 50.

When the substrate 6 is detached from the substrate mounting surface 60, the center-up driving means 36 is driven to raise the center-up 38. By this operation, the substrate 6 is separated from the substrate mounting surface 50, is mounted on the tips of the four spindles 38a to 38d of the center-up 38, and is raised to a position above the substrate holder 30. It is carried out. At this time, in order to facilitate the peeling of the substrate 6, the air pressure adjusting means 61 sends the vacuum suction groove 51a.
To 51d.

[0007]

In order to correct the warpage of the substrate by holding the substrate in close contact with the substrate holding device, it is necessary to increase the contact area between the substrate and the substrate mounting surface.
By the way, when the substrate is peeled from the substrate holding surface, a peeling charge is generated. The peeling charge increases as the peeling speed from the substrate mounting surface is increased to increase the throughput of the substrate processing. When the static electricity generated by the peeling charge discharges to another member such as the substrate transfer arm, there is a problem that a pattern formed on the substrate is damaged by the exposure and a noise is given to a control system of the apparatus. Was.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems of the prior art, and has ensured a large contact area with the substrate when holding the substrate and reduced the peeling charge generated when the substrate was peeled. It is an object to provide a substrate holding method and a substrate holding device. Another object of the present invention is to provide an exposure apparatus provided with a substrate holding device in which the peeling charge generated when the substrate is peeled is reduced.

[0009]

According to the present invention, a part of the substrate mounting surface is constituted by a movable member, and when the substrate is peeled off from the substrate mounting surface, the movable member is lowered to preliminarily mount the substrate on the substrate mounting surface. The object is achieved by reducing the contact area between the substrate mounting surface and the air pressure control between the substrate mounting surface and the substrate.

That is, the present invention provides a vacuum suction groove (51a).
To 51d), and a substrate holding device having a substrate mounting surface (50) provided with vacuum evacuation means (60) for evacuating the vacuum suction grooves (51a to 51d). ) And movable members (55a to 55e) movable in a direction perpendicular to the substrate mounting surface;
a to 55e) for selectively positioning the surface (57) at a first position flush with or slightly inside the substrate mounting surface (50), and at a second position further inside the first position. It is characterized by comprising a driving means (58) and a control means (18) for controlling the driving means (58) and the evacuation means (60).

When holding the substrate (6) by vacuum suction,
The movable member (55a-55e) is positioned at the first position slightly inside the substrate mounting surface (50), and the vacuum suction groove (51
When a to 51d) are evacuated and the substrate (6) is sucked,
The Bernoulli chuck works according to Bernoulli's principle, and the substrate (6) comes into close contact with the substrate mounting surface (50) instantaneously.
When peeling the substrate (6) from the substrate mounting surface (50),
Prior to the peeling, the surface of the movable member (55a to 55e) (5
7) is lowered from the first position to a second position further inside. This lowering is preferably performed slowly in order to prevent the upper surface (57) of the movable members (55a to 55e) and the substrate (6) from separating and preventing electrification. At this time, there is a possibility that weak charging may occur, but the charging is eliminated by natural discharge.

By lowering the movable member,
The space between the upper surface (57) of the movable members (55a to 55e) and the substrate (6) is evacuated, and the substrate (6) may be deformed due to the suction force of the vacuum. In order to avoid such deformation of the substrate (6), the movable member (55a
To 55e) are holes (56a to 5e) opening to the surface (57).
6e), the pneumatic pressure adjusting means (61, 7) communicating with the holes (56a to 56e) and being controlled by the control means (18).
1, 72). Control means (1
8), when the substrate (6) mounted on the substrate mounting surface (50) is detached, the substrate (6) and the movable members (55a to 55)
e) and the air pressure adjusting means (6).
1, 71, 72). The air pressure adjusting means (61, 71, 72) can also control the air pressure in the vacuum suction grooves (51a to 51d).

The air pressure adjusting means (61, 71, 72) includes an air supply means (61) for supplying air to the hole or an opening / closing means such as a valve for communicating / cutting off the surrounding atmosphere from / to the hole. 71, 72). When the air supplied by the air supply means (61) is ionized air, the peeling charge can be further reduced. The driving means for driving the movable members (55a to 55e) can include a piezoelectric element. Further, the movable member may be driven by a motor or the like.

Further, the present invention has a step of holding the substrate (6) by vacuum suction on the substrate mounting surface (50) and a step of separating the substrate (6) from the substrate mounting surface (50). In the substrate holding method, in the step of holding the substrate by vacuum suction, a movable member (55) which constitutes a part of the substrate mounting surface (50) and is movable in a direction perpendicular to the substrate mounting surface.
a-55e) placing the surface at a first position flush with or slightly inside the substrate mounting surface (50), vacuum-sucking the substrate (6), and separating the substrate from the substrate mounting surface; In the above, the movable members (55a to 55e)
The pressure is moved to a second position further inside than the position, and the pressure of the space formed between the substrate (6) and the movable members (55a to 55e) is not lower than the pressure of the surrounding atmosphere. And

According to the present invention, there is provided an exposure apparatus for transferring an image of a pattern onto a substrate by irradiating an energy beam (IL) to the mask on which the pattern has been formed. A substrate holder (30) having a substrate mounting surface (50) to be formed, and vacuum suction grooves (51a to 51d) formed on the substrate mounting surface (50), and a substrate (6) being mounted on the substrate mounting surface (50). ) For vacuum suction (51a)
-Evacuation means (60) for evacuating the substrate mounting surface (50), and movable members (55a to 55e) which constitute a part of the substrate mounting surface (50) and are movable in a direction perpendicular to the substrate mounting surface (50). The surface (57) of the movable member (55a-55e) is selectively placed in a first position that is flush with or slightly inside the substrate mounting surface (50) and a second position that is further inside the first position. Driving means (58) for positioning the driving means, and driving means (58)
And a control unit (18) for controlling the vacuum suction means (60).

The movable member (55a-55e) has a surface (5
7) further comprising pneumatic pressure adjusting means (61, 71, 72) having holes (56a to 56e) opening to the holes and communicating with the holes (56a to 56e) and controlled by the control means (18); When detaching the substrate (6) placed on the substrate placing surface (50), the control means (18) removes the space formed between the substrate (6) and the movable members (55a to 55e). The air pressure can be adjusted by the air pressure adjusting means (61, 71, 72).

[0017]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a schematic view showing an example of an exposure apparatus incorporating a substrate holding device according to the present invention. Under illumination light IL from an illumination system IA including a light source such as a mercury lamp or an excimer laser, a fly-eye lens, and a condenser lens, the pattern on the mask 1 is, for example, 1/4 or 1 / 5 and projected onto each shot area of the substrate 6 such as a semiconductor wafer or a glass plate coated with a photoresist. In FIG. 1, a direction parallel to the optical axis AX of the projection optical system 3 is defined as a Z direction, a direction parallel to the plane of FIG. 1 is defined as an X direction in a plane perpendicular to the Z direction, and a direction perpendicular to the plane of FIG. Let it be the Y direction.

The mask 1 is held on a mask stage 32 mounted on a mask gantry 31. The mask stage 32 is configured to be able to translate in the XY plane and rotate in the θ direction (rotation direction) by a mask driving system (not shown). A moving mirror 33 is provided at the upper end of the mask stage 32 in both the X and Y directions.
The moving mirror 33 and the laser interferometer 34 fixed on the mask base 31 constantly detect the position of the mask stage 32 in the X and Y directions at a resolution of, for example, about 0.01 μm, and at the same time, the rotation angle of the mask stage 32. Has been detected. The measured value of the laser interferometer 34 is stored in the stage control system 16.
The stage control system 16 controls the mask driving system on the mask gantry 31 based on the information. Further, the laser interferometer 34 is transmitted from the stage control system 16 to the central control system 18.
, And the central control system 18 controls the stage control system 16 based on the information.

On the other hand, the substrate 6 is held by vacuum suction on a substrate mounting surface of a substrate holder 30 fixed to a sample stage 29 on the X stage 11. The sample stage 29 is the substrate 6
Of the projection optical system 3 in the optical axis AX direction (Z direction) and a Z tilt drive unit (3 in this example)
The Z-tilt drive unit 10 is fixed on an X-stage 11. The X stage 11 is the Y stage 12
The Y stage 12 is mounted on a substrate base 14 and can be moved in the X and Y directions via a substrate stage drive system (not shown). An L-shaped movable mirror 13 is fixed to the upper end of the sample table 29, and the X direction and the Y direction of the sample table 29 are determined by the movable mirror 13 and the laser interferometer 17 arranged opposite to the movable mirror 13.
The coordinates of the direction and the rotation angle are detected.

The measurement value of the laser interferometer 17 is sent to the stage control system 16, and the stage control system 16 controls the substrate stage drive system based on the information. Further, information on the measurement values of the laser interferometer 17 is supplied from the stage control system 16 to the central control system 18, and the central control system 18 controls the stage control system 16 based on the information. A substrate transfer device 39 (see FIG. 2) for transferring the substrate 6 is arranged near the substrate stage, and a substrate transfer mechanism is provided in the substrate stage as described later.

This projection exposure apparatus includes a mask 1 and a substrate 6
For example, an alignment sensor 4 of a TTL system and two alignment sensors 5a and 5b of an off-axis system are provided for performing alignment with the above. During alignment, the position of an alignment mark formed on the substrate 6 or the position of a predetermined pattern is detected by one of the alignment sensors 4, 5a, and 5b, and each shot of the substrate 6 is constantly determined based on the detection result. The pattern formed in the previous step in the region and the pattern on the mask are accurately aligned. These alignment sensors 4, 5a,
The detection signal from 5b is processed by the alignment control system 15, and the alignment control system 15 is controlled by the central control system 18. Further, a reference mark member 43 having a surface at the same height as the surface of the substrate 6 is fixed on the sample table 29, and a mark serving as a reference for alignment is formed on the surface of the reference mark member 43.

As described above, the stage control system 16 and the alignment control system 15 are controlled by the central control system 18, and the central control system 18 controls the whole of the projection exposure apparatus, and performs the exposure operation in a certain sequence. Is performed. Next, the substrate transfer system and the substrate transfer mechanism on the substrate stage will be described with reference to FIG. Note that the substrate stage is the substrate holder 30, the sample stage 2
9, a Z tilt drive unit 10, an X stage 11, a Y stage 12, and a substrate base 14.

FIG. 2A is a plan view of the configuration around the substrate transfer system and the substrate stage, and FIG. 2B is a side view thereof.
In FIG. 2A and FIG. 2B, the substrate stage
Above the X direction, a substrate transfer device 39 for transferring the substrate is arranged. The substrate transfer device 39 includes a substrate arm 21, a slider 23 for sliding the substrate arm 21 to a predetermined position, and an arm drive system (not shown) for driving the substrate arm 21. Further, the slider 23 is installed independently of the exposure apparatus main body, so that vibration when the slider 23 is driven is not transmitted to the exposure apparatus main body side. The substrate arm 21 has a U-shaped flat plate portion, on which a substrate is placed. The substrate arm 21 can unload (unload) the exposed substrate from the substrate stage and load the next substrate to be exposed onto the substrate stage.

That is, based on a command from the loader controller 24, the substrate arm 21 moves along the slider 23 to a loading position where the substrate is transferred to the substrate stage system, and moves the substrate 6 to be exposed next to the substrate stage. It moves upward and is placed on the center up 38. FIG.
(B) shows a state where the substrate 6 has been transferred from the substrate arm 21 to the tip of the center-up 38.

The center up 38 is supported by a telescopic mechanism 35 provided on the X stage 11 and has four spindle portions 38a to 38d which are loosely fitted into the openings of the sample table 29 and the substrate holder 30. The four spindle portions 38a to 38d are moved by moving the 35 in the vertical direction (Z direction).
The substrate is transferred by moving the substrate 6 up and down. At the tips of the four spindle portions 38a to 38d, suction holes for vacuum suction are provided, respectively. The tips move to a height at which the substrate can be transferred to and from the substrate arm 21 at the time of substrate transfer. When it is placed on the substrate placement surface 50 on the holder 30, it moves to a position lower than the surface of the substrate holder 30. Also, the spindle parts 38a to 3a
By sucking the tip of 8d under vacuum, the substrate 6 is prevented from shifting when the center-up 38 is moved up and down.

The telescopic mechanism 35 is rotatably supported on the XY plane about its central axis 35z.
The center-up drive means 36 provided on the upper side 1 is engaged with a drive shaft 37 which rotates, and can be rotated to a desired angle by a command from the central control system 18 for controlling the center-up drive means 36. . The rotation system including the center-up drive means 36, the drive shaft 37, and the expansion / contraction mechanism 35 has a sufficient angle setting resolution, and can rotate the substrate 6 with an accuracy of, for example, 20 μrad.

FIG. 3 is a detailed view of an example of the substrate holder 30. FIG. 3A is a plan view showing a state in which a substrate is placed on the substrate holder 30, and FIG. 3B is a sectional view taken along the line AA. 3, for the sake of simplicity, the same parts as in FIG. 7 showing the conventional example are denoted by the same reference numerals as in FIG.

As in the prior art, a plurality of vacuum suction grooves 51a to 51d are provided on the substrate mounting surface 50 on the substrate holder 30, and each of the vacuum suction grooves 51a to 51d is provided with a vacuum exhaust means such as a vacuum pump. 60 and the air pressure adjusting means 61. The substrate 6 can be held in close contact with the substrate mounting surface 50 by operating the evacuation unit 60 while the substrate 6 is mounted on the substrate mounting surface 50 of the substrate holder 30.

On the substrate mounting surface 50 of the substrate holder 30,
A plurality of grooves are provided in addition to the vacuum suction grooves 51a to 51d,
In each groove, movable members 55a to 55e constituting a part of the substrate mounting surface 50 are arranged in an airtight manner. here,
Members having a piezo effect were used as the movable members 55a to 55e. Movable members 55a to 55e having a piezo effect
Are connected to the voltage control means 58. By changing the voltage applied from the voltage control means 58 to the movable members 55a to 55e, the surface 57 of the movable members 55a to 55e is changed.
Can be positioned at a first position located on the same plane as the substrate mounting surface 50 or slightly inside the substrate holder 30, and at a second position located inside the substrate holder 30 further than the first position. . The output voltage of the voltage control means 58 is limited to a predetermined range by a limiter so that the surfaces 57 of the movable members 55a to 55e do not project upward from the substrate mounting surface 50.

The movable members 55a to 55e are provided with holes 56a to 56e which are opened on the front surface 57, and the holes 56a to 56e
Reference numeral 56e communicates with the air pressure adjusting means 61. FIG. 5 is a flowchart showing a procedure when the substrate 6 is mounted on the substrate mounting surface 50 of the substrate holder 30. First step 1
In 1, the center-up drive unit 36 raises the center-up 38 to a position above the substrate mounting surface 50. At this time, the central control system 18 instructs the voltage control means 58 to move the movable member 55 constituting a part of the substrate mounting surface 50.
The positions of a to 55e are the same as the substrate mounting surface 50, or a first position located slightly inside the substrate holder 30.
Position.

Subsequently, in step 12, the substrate 6 is received from the substrate arm 21 of the substrate transfer device 39 to the tips of the four spindles 38a to 38d of the center-up 38. In step 13, the central control system 18 sends the center-up drive means 36 To lower the center-up on which the substrate 6 is placed. By this operation, the substrate 6 is mounted on the substrate mounting surface 50 of the substrate holder 30.

Next, at step 14, the potentiometers 53a and 53b are driven to press the end surfaces of the substrate 6 against the positioning pins 52a to 52c to position the substrate 6 on the substrate mounting surface 50. That is, after the substrate 6 is placed on the substrate mounting surface 50, the substrate 6 is pressed by the potentiometer 53b in the −Y direction of FIG.
a in the −X direction of the drawing, the one end surface of the substrate 6 is brought into contact with the positioning pins 52a and 52b, and the other end surface of the substrate 6 is brought into contact with the positioning pins 52c, whereby the positioning of the substrate 6 is performed. Will be At this time, assuming that the first positions of the movable members 55 a to 55 e are slightly inside the substrate holder 30 from the substrate mounting surface 50, the position between the surface 57 of the movable members 55 a to 55 e and the bottom surface of the substrate 6 is Has a slight space.

When the positioning of the substrate 6 is completed, in step 15, the central control system 18 instructs the vacuum exhaust means 60 to evacuate the vacuum suction grooves 51a to 51d. The space formed between the front surface 57 of the movable members 55a to 55e and the bottom surface of the substrate 6 is not particularly evacuated by the evacuation means 60, but the Bernoulli chuck by the Bernoulli effect acts to move the movable members 55a to 55e. The suction force acts on the substrate 6 even at the position of. Thus, the substrate holder 30
The substrate 6 positioned on the substrate mounting surface 50 is held in close contact with the substrate mounting surface 50.

FIG. 6 is a flowchart showing a procedure when the substrate 6 is released from the substrate mounting surface 50 of the substrate holder 30 after the exposure processing for the substrate 6 is completed. First,
In step 21, the central control system 18 instructs the voltage control means 58 to control the movable members 55a to 55a having a piezo effect.
5e, the voltage applied to the movable members 55a to 55e is gradually reduced.
The surface position of 55e is further shifted from the first position by the substrate holder 3.
It is located at the second position located inside 0. By this operation, the front surface 57 of the movable members 55a to 55e is gradually separated from the bottom surface of the substrate 6. At this time, the movable members 55a to 55a
The space between the surface 57 of the substrate 5e and the substrate 6 is evacuated, and the air pressure adjusting means 61 is instructed so that the substrate 6 is not deformed due to a vacuum force acting on the substrate 6 so that the movable members 55a to 55a. 5
Air is supplied to the holes 56a to 56e that open on the surface 57 of 5e.

In the following step 22, the central control system 18 drives the center-up driving means 36 to drive the center-up 3
8 is raised. At this time, in order to facilitate the peeling of the substrate 6, the movable members 55 a to 55 e
Air is supplied to the vacuum suction grooves 51a to 51d together with the holes 56a to 56e opening on the surface of the. By this operation, the substrate 6 is peeled off from the substrate mounting surface 50 of the substrate holder 30, and the four spindles 38a to
The substrate is placed at the tip of 38d, is lifted above the substrate holder 30, is delivered to the substrate arm 21 of the substrate transfer device 39, and is carried out.

In step 22, the movable members 55a to 55e are peeled from the substrate 6 in advance in step 21 to separate the substrate 6 from the substrate mounting surface 50.
Since the contact area between the substrate 6 and the substrate mounting surface 50 is reduced by the surface integral of a to 55e, the peeling charge can be reduced. If the air supplied from the air pressure adjusting means 61 to the movable members 55a to 55e and the vacuum suction grooves 51a to 51d in step 21 and step 22 is ionized air, the peeling charge can be further reduced.

FIG. 4 is a view for explaining another example of the substrate holding apparatus according to the present invention. FIG. 4 shows a cross section of the substrate holder, and is a view corresponding to FIG. The plan view of the substrate holder is the same as that of FIG. In FIG. 4, for the sake of simplicity, the same parts as those in FIG. 3 are denoted by the same reference numerals as those in FIG.

The substrate holding device shown in FIG.
Holes 56a to 56e opening in surface 57 of 5a to 55e
Are connected to the air pressure adjusting means 61,
An on-off valve 71 is provided in a pipe communicating with 56e, and the valve 71 is opened and closed by a valve control unit 72 under the control of the central control system 18.

The substrate 6 is placed on the substrate mounting surface 5 of the substrate holder 30.
0 and the procedure for detaching the substrate 6 from the substrate mounting surface 50 are the same as those in the flowcharts shown in FIGS. However, when mounting the substrate 6 on the substrate mounting surface 50, the valve 71 is closed. By closing the valve 71, FIG.
When the vacuum suction grooves 51a to 51d are evacuated by the evacuation means 60 in step 15, the Bernoulli chuck acts due to the Bernoulli effect to move the movable members 55a to 51d.
The suction force acts on the substrate 6 even at the position 55e. The substrate 6 thus positioned on the substrate mounting surface 50 of the substrate holder 30 is held in close contact with the substrate mounting surface 50.

When the substrate 6 is detached from the substrate mounting surface 50 of the substrate holder 30, the movable members 55a to 55a in steps 21 and 22 of the flowchart of FIG.
The operation of supplying air to the upper space of 55e is performed by instructing the valve control unit 72 from the central control system 18 to open the on-off valve 71. Other operations are the same as those of the substrate holding device shown in FIG.

In the description here, the movable members 55a-55
The member having the piezo effect was used as e, and the movable member was positioned between the first position and the second position by controlling the voltage applied to the movable member. However, the mechanism for driving the movable member is not limited to the use of the piezo effect, and the movable member may be mechanically driven by a motor or the like.

[0042]

According to the present invention, it is possible to secure a wide contact area on the substrate mounting surface when the substrate is sucked, and to correct the warpage of the substrate by holding the substrate in close contact with the substrate mounting surface. be able to. On the other hand, when the substrate is peeled from the substrate mounting surface, the contact area with the substrate can be reduced, so that the peeling charge can be reduced.

Further, since the time required for peeling the substrate can be shortened, the throughput can be improved.

[Brief description of the drawings]

FIG. 1 is a schematic view showing an example of an exposure apparatus incorporating a substrate holding device according to the present invention.

2A and 2B are explanatory views of a substrate transfer system and a substrate transfer mechanism on a substrate stage, wherein FIG. 2A is a plan view of a configuration around the substrate transfer system and the substrate stage, and FIG.

3A and 3B are detailed views of an example of a substrate holder, wherein FIG. 3A is a plan view showing a state where a substrate is mounted on the substrate holder, and FIG.

FIG. 4 is a sectional view of another example of the substrate holder.

FIG. 5 is a flowchart showing a procedure for placing a substrate on a substrate placing surface of a substrate holder.

FIG. 6 is a flowchart showing a procedure when the substrate is detached from the substrate mounting surface of the substrate holder.

FIG. 7 is a view showing an example of a conventional substrate holding device;
(A) is a plan view, (b) is a sectional view.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Mask, 3 ... Projection optical system, 6 ... Substrate, 10 ... Z tilt drive part, 11 ... X stage, 12 ... Y stage, 14
... Substrate base, 15 ... Alignment control system, 16 ... Stage control system, 18 ... Central control system, 21 ... Substrate arm, 2
3 ... Slider, 29 ... Sample stand, 30 ... Substrate holder,
35 ... telescopic mechanism, 36 ... center-up drive means, 37
... Drive shaft, 38 ... Center up, 38a-38d ... Spindle part, 39 ... Substrate transfer device, 50 ... Substrate mounting surface,
51a to 51d: vacuum suction grooves, 52a to 52c: positioning pins, 53a, 53b: potentiometers, 55a to 55e
.. Movable member, 56a to 56e, hole, 57, movable member surface, 58, voltage control means, 60, evacuation means, 61
Pneumatic pressure adjusting means, 71 ... valve, 72 ... valve control unit

Claims (8)

[Claims] A substrate mounting surface provided with a vacuum suction groove;
A substrate holding device having vacuum evacuation means for evacuating the vacuum suction groove, a movable member forming a part of the substrate mounting surface and movable in a direction perpendicular to the substrate mounting surface; Driving means for selectively positioning a surface of the member at a first position flush with or slightly inside the substrate mounting surface and a second position further inside the first position; and the driving means. And a control means for controlling the vacuum evacuation means. 2. The movable member has a hole opening on a surface thereof, and further includes a pneumatic pressure adjusting means which communicates with the hole and is controlled by the control means, wherein the control means comprises a substrate mounting surface. 2. The substrate holding device according to claim 1, wherein, when the substrate placed on the substrate is detached, the air pressure in a space formed between the substrate and the movable member is adjusted by the air pressure adjusting means. . 3. The air pressure adjusting means includes an air supply means for supplying air to the hole, or an opening / closing means for communicating / blocking an ambient atmosphere with the hole. 3. The substrate holding device according to 2. 4. The substrate holding apparatus according to claim 3, wherein said air supply means supplies ionized air. 5. The substrate holding device according to claim 1, wherein said driving means includes a piezoelectric element. 6. A substrate holding method, comprising: a step of holding a substrate by vacuum suction on a substrate mounting surface; and a step of separating the substrate from the substrate mounting surface. In the steps,
A surface of a movable member which constitutes a part of the substrate mounting surface and is movable in a direction perpendicular to the substrate mounting surface is arranged at a first position on the same plane as the substrate mounting surface or slightly inside thereof. In the step of sucking the substrate under vacuum and detaching the substrate from the substrate mounting surface, the movable member is moved to a second position further inside than the first position.
A substrate holding method, wherein the pressure of the space formed between the substrate and the movable member is not lower than the pressure of the surrounding atmosphere. 7. An exposure apparatus for transferring an image of a pattern onto a substrate by irradiating an energy beam onto a mask on which a pattern is formed, wherein a substrate mounting surface on which the substrate is mounted and a substrate mounting surface formed on the substrate mounting surface. A substrate holder having a vacuum suction groove, vacuum evacuation means for evacuating the vacuum suction groove to vacuum-suck the substrate on the substrate mounting surface, and forming a part of the substrate mounting surface. A movable member movable in a direction perpendicular to the substrate mounting surface, a first position in which the surface of the movable member is flush with or slightly inside the substrate mounting surface, and a first position further inside than the first position. An exposure apparatus comprising: a driving unit for selectively positioning two positions; and a control unit that controls the driving unit and the vacuum suction unit. 8. The movable member has a hole opening on a surface thereof, and further includes a pneumatic pressure adjusting unit which communicates with the hole and is controlled by the control unit, wherein the control unit includes the substrate mounting surface. 8. The exposure apparatus according to claim 7, wherein, when the substrate placed on the substrate is detached, the air pressure in a space formed between the substrate and the movable member is adjusted by the air pressure adjusting means.