JPH10512326A - 曲面又は扇状エンド・マグネットを持つ回転式マグネトロン - Google Patents

曲面又は扇状エンド・マグネットを持つ回転式マグネトロン

Info

Publication number
JPH10512326A
JPH10512326A JP8521825A JP52182596A JPH10512326A JP H10512326 A JPH10512326 A JP H10512326A JP 8521825 A JP8521825 A JP 8521825A JP 52182596 A JP52182596 A JP 52182596A JP H10512326 A JPH10512326 A JP H10512326A
Authority
JP
Japan
Prior art keywords
magnet
cylindrical
central
magnetron
target
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8521825A
Other languages
English (en)
Japanese (ja)
Inventor
ジョン ピー レハン
ヘンリー バイリューム
Original Assignee
ザ ビーオーシー グループ インコーポレイテッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ザ ビーオーシー グループ インコーポレイテッド filed Critical ザ ビーオーシー グループ インコーポレイテッド
Publication of JPH10512326A publication Critical patent/JPH10512326A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
    • H01J37/3452—Magnet distribution
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
    • H01J37/3455—Movable magnets

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
JP8521825A 1995-01-12 1996-01-11 曲面又は扇状エンド・マグネットを持つ回転式マグネトロン Pending JPH10512326A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US37202395A 1995-01-12 1995-01-12
US08/372,023 1995-01-12
PCT/US1996/000409 WO1996021750A1 (fr) 1995-01-12 1996-01-11 Magnetron a aimants d'extremites courbes ou segmentes

Publications (1)

Publication Number Publication Date
JPH10512326A true JPH10512326A (ja) 1998-11-24

Family

ID=23466389

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8521825A Pending JPH10512326A (ja) 1995-01-12 1996-01-11 曲面又は扇状エンド・マグネットを持つ回転式マグネトロン

Country Status (4)

Country Link
EP (1) EP0805880A4 (fr)
JP (1) JPH10512326A (fr)
AU (1) AU4855696A (fr)
WO (1) WO1996021750A1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013508565A (ja) * 2009-10-26 2013-03-07 ジェネラル・プラズマ・インコーポレーテッド ロータリーマグネトロンマグネットバー、およびこれを含む高いターゲット利用のための装置
JP2013524016A (ja) * 2010-04-02 2013-06-17 ヌボサン， インコーポレイテッド 回転式マグネトロンのための標的利用改善
JP2013534568A (ja) * 2010-07-16 2013-09-05 アプライド マテリアルズ インコーポレイテッド ターゲットバッキングチューブ用の磁石構成体、磁石構成体を含むターゲットバッキングチューブ、円筒形ターゲットアセンブリ、およびスパッタリングシステム
WO2014010148A1 (fr) * 2012-07-11 2014-01-16 キヤノンアネルバ株式会社 Dispositif de pulvérisation et unité à aimants

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1196169C (zh) * 1998-04-16 2005-04-06 贝克尔特Vds股份有限公司 磁控管中用于控制目标冲蚀和溅射的装置
DE69937948D1 (de) 1999-06-21 2008-02-21 Bekaert Advanced Coatings N V Magnetron mit beweglicher Magnetanordnung zur Kompensation des Erosionsprofils
IE20000425A1 (en) * 1999-08-19 2001-03-07 Praxair Technology Inc Low permeability non-planar ferromagnetic sputter targets
DE102004007813A1 (de) * 2004-02-18 2005-09-08 Applied Films Gmbh & Co. Kg Sputtervorrichtung mit einem Magnetron und einem Target
CA2567372A1 (fr) 2004-07-01 2006-01-19 Cardinal Cg Company Cible cylindrique a aimant oscillant pour pulverisation cathodique magnetron
DE102009005512B4 (de) 2009-01-20 2017-01-26 Von Ardenne Gmbh Verfahren zum Betrieb einer Rohrmagnetronanordnung zum Sputtern
EP2306490A1 (fr) * 2009-10-02 2011-04-06 Applied Materials, Inc. Agencement d'aimant pour tube de support de cible et tube de support de cible le comprenant
US8900428B2 (en) * 2011-01-06 2014-12-02 Sputtering Components, Inc. Sputtering apparatus
DE102011077297A1 (de) * 2011-02-15 2012-08-16 Von Ardenne Anlagentechnik Gmbh Magnetronsputtereinrichtung
US9758862B2 (en) 2012-09-04 2017-09-12 Sputtering Components, Inc. Sputtering apparatus
DE102012109424A1 (de) 2012-10-04 2014-04-10 Von Ardenne Anlagentechnik Gmbh Sputtermagnetron und Verfahren zur dynamischen Magnetfeldbeeinflussung

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2707144A1 (de) * 1976-02-19 1977-08-25 Sloan Technology Corp Kathodenzerstaeubungsvorrichtung
US4525264A (en) * 1981-12-07 1985-06-25 Ford Motor Company Cylindrical post magnetron sputtering system
EP0451642B1 (fr) * 1990-03-30 1996-08-21 Applied Materials, Inc. Système de pulvérisation
KR930700695A (ko) * 1990-06-16 1993-03-15 원본미기재 금속화 장치
US5427665A (en) * 1990-07-11 1995-06-27 Leybold Aktiengesellschaft Process and apparatus for reactive coating of a substrate
FR2668171B1 (fr) * 1990-10-18 1992-12-04 Cit Alcatel Machine de depot par pulverisation cathodique.
US5364518A (en) * 1991-05-28 1994-11-15 Leybold Aktiengesellschaft Magnetron cathode for a rotating target
DE4117367C2 (de) * 1991-05-28 1999-11-04 Leybold Ag Verfahren zur Erzeugung eines homogenen Abtragprofils auf einem rotierenden Target einer Sputtervorrichtung

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013508565A (ja) * 2009-10-26 2013-03-07 ジェネラル・プラズマ・インコーポレーテッド ロータリーマグネトロンマグネットバー、およびこれを含む高いターゲット利用のための装置
JP2013524016A (ja) * 2010-04-02 2013-06-17 ヌボサン， インコーポレイテッド 回転式マグネトロンのための標的利用改善
JP2013534568A (ja) * 2010-07-16 2013-09-05 アプライド マテリアルズ インコーポレイテッド ターゲットバッキングチューブ用の磁石構成体、磁石構成体を含むターゲットバッキングチューブ、円筒形ターゲットアセンブリ、およびスパッタリングシステム
WO2014010148A1 (fr) * 2012-07-11 2014-01-16 キヤノンアネルバ株式会社 Dispositif de pulvérisation et unité à aimants
JP5873557B2 (ja) * 2012-07-11 2016-03-01 キヤノンアネルバ株式会社 スパッタリング装置および磁石ユニット
US9761423B2 (en) 2012-07-11 2017-09-12 Canon Anelva Corporation Sputtering apparatus and magnet unit

Also Published As

Publication number Publication date
EP0805880A4 (fr) 1998-05-06
EP0805880A1 (fr) 1997-11-12
WO1996021750A1 (fr) 1996-07-18
AU4855696A (en) 1996-07-31

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