JPH1060138A - Printed wiring board material - Google Patents
Printed wiring board materialInfo
- Publication number
- JPH1060138A JPH1060138A JP22484296A JP22484296A JPH1060138A JP H1060138 A JPH1060138 A JP H1060138A JP 22484296 A JP22484296 A JP 22484296A JP 22484296 A JP22484296 A JP 22484296A JP H1060138 A JPH1060138 A JP H1060138A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- wiring board
- board material
- polybutadiene
- epoxy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 title claims abstract description 56
- 229920005989 resin Polymers 0.000 claims abstract description 75
- 239000011347 resin Substances 0.000 claims abstract description 75
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 37
- 239000003822 epoxy resin Substances 0.000 claims abstract description 35
- 229920001955 polyphenylene ether Polymers 0.000 claims abstract description 32
- 238000004132 cross linking Methods 0.000 claims abstract description 25
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 21
- 239000004020 conductor Substances 0.000 claims abstract description 13
- 229920002589 poly(vinylethylene) polymer Polymers 0.000 claims abstract description 12
- -1 ester acrylate Chemical class 0.000 claims abstract description 8
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims abstract description 4
- 229920003048 styrene butadiene rubber Polymers 0.000 claims abstract description 4
- 239000005062 Polybutadiene Substances 0.000 claims abstract description 3
- 239000002174 Styrene-butadiene Substances 0.000 claims abstract description 3
- 229920000180 alkyd Polymers 0.000 claims abstract description 3
- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical compound C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 claims abstract description 3
- 229920001971 elastomer Polymers 0.000 claims abstract description 3
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 claims abstract description 3
- 229920002857 polybutadiene Polymers 0.000 claims abstract description 3
- QCTJRYGLPAFRMS-UHFFFAOYSA-N prop-2-enoic acid;1,3,5-triazine-2,4,6-triamine Chemical compound OC(=O)C=C.NC1=NC(N)=NC(N)=N1 QCTJRYGLPAFRMS-UHFFFAOYSA-N 0.000 claims abstract description 3
- 239000005060 rubber Substances 0.000 claims abstract description 3
- 239000011115 styrene butadiene Substances 0.000 claims abstract description 3
- 239000011342 resin composition Substances 0.000 claims description 35
- 239000011256 inorganic filler Substances 0.000 claims description 24
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 24
- 239000000919 ceramic Substances 0.000 claims description 21
- 239000004971 Cross linker Substances 0.000 claims description 9
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 8
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 6
- KOMNUTZXSVSERR-UHFFFAOYSA-N 1,3,5-tris(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical compound C=CCN1C(=O)N(CC=C)C(=O)N(CC=C)C1=O KOMNUTZXSVSERR-UHFFFAOYSA-N 0.000 claims description 5
- 239000004593 Epoxy Substances 0.000 claims description 5
- 239000003999 initiator Substances 0.000 claims description 5
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 claims description 4
- 150000001252 acrylic acid derivatives Chemical class 0.000 claims description 4
- BJELTSYBAHKXRW-UHFFFAOYSA-N 2,4,6-triallyloxy-1,3,5-triazine Chemical compound C=CCOC1=NC(OCC=C)=NC(OCC=C)=N1 BJELTSYBAHKXRW-UHFFFAOYSA-N 0.000 claims description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 3
- 125000003700 epoxy group Chemical group 0.000 claims description 3
- 239000004408 titanium dioxide Substances 0.000 claims description 3
- DBCAQXHNJOFNGC-UHFFFAOYSA-N 4-bromo-1,1,1-trifluorobutane Chemical compound FC(F)(F)CCCBr DBCAQXHNJOFNGC-UHFFFAOYSA-N 0.000 claims description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 2
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 claims description 2
- 229910002113 barium titanate Inorganic materials 0.000 claims description 2
- 229910002115 bismuth titanate Inorganic materials 0.000 claims description 2
- MPMBRWOOISTHJV-UHFFFAOYSA-N but-1-enylbenzene Chemical compound CCC=CC1=CC=CC=C1 MPMBRWOOISTHJV-UHFFFAOYSA-N 0.000 claims description 2
- AOWKSNWVBZGMTJ-UHFFFAOYSA-N calcium titanate Chemical compound [Ca+2].[O-][Ti]([O-])=O AOWKSNWVBZGMTJ-UHFFFAOYSA-N 0.000 claims description 2
- NKZSPGSOXYXWQA-UHFFFAOYSA-N dioxido(oxo)titanium;lead(2+) Chemical compound [Pb+2].[O-][Ti]([O-])=O NKZSPGSOXYXWQA-UHFFFAOYSA-N 0.000 claims description 2
- STVZJERGLQHEKB-UHFFFAOYSA-N ethylene glycol dimethacrylate Substances CC(=C)C(=O)OCCOC(=O)C(C)=C STVZJERGLQHEKB-UHFFFAOYSA-N 0.000 claims description 2
- PYGSKMBEVAICCR-UHFFFAOYSA-N hexa-1,5-diene Chemical group C=CCCC=C PYGSKMBEVAICCR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052749 magnesium Inorganic materials 0.000 claims description 2
- 239000011777 magnesium Substances 0.000 claims description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-L phthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC=C1C([O-])=O XNGIFLGASWRNHJ-UHFFFAOYSA-L 0.000 claims description 2
- 229920000314 poly p-methyl styrene Polymers 0.000 claims description 2
- SOGFHWHHBILCSX-UHFFFAOYSA-J prop-2-enoate silicon(4+) Chemical class [Si+4].[O-]C(=O)C=C.[O-]C(=O)C=C.[O-]C(=O)C=C.[O-]C(=O)C=C SOGFHWHHBILCSX-UHFFFAOYSA-J 0.000 claims description 2
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 claims description 2
- VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 claims description 2
- 238000002156 mixing Methods 0.000 abstract description 5
- 239000000203 mixture Substances 0.000 abstract description 5
- 239000011248 coating agent Substances 0.000 abstract description 3
- 238000000576 coating method Methods 0.000 abstract description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 abstract 2
- 239000000945 filler Substances 0.000 abstract 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 abstract 1
- 238000000926 separation method Methods 0.000 abstract 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 20
- 229920013636 polyphenyl ether polymer Polymers 0.000 description 19
- 239000002904 solvent Substances 0.000 description 10
- 238000000034 method Methods 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 7
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 239000003153 chemical reaction reagent Substances 0.000 description 6
- 150000001875 compounds Chemical class 0.000 description 6
- 239000002585 base Substances 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 4
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 3
- 239000004744 fabric Substances 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- WTEOIRVLGSZEPR-UHFFFAOYSA-N boron trifluoride Chemical compound FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 description 2
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- IMNIMPAHZVJRPE-UHFFFAOYSA-N triethylenediamine Chemical compound C1CN2CCN1CC2 IMNIMPAHZVJRPE-UHFFFAOYSA-N 0.000 description 2
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 2
- DPZSNGJNFHWQDC-ARJAWSKDSA-N (z)-2,3-diaminobut-2-enedinitrile Chemical compound N#CC(/N)=C(/N)C#N DPZSNGJNFHWQDC-ARJAWSKDSA-N 0.000 description 1
- OUPZKGBUJRBPGC-UHFFFAOYSA-N 1,3,5-tris(oxiran-2-ylmethyl)-1,3,5-triazinane-2,4,6-trione Chemical compound O=C1N(CC2OC2)C(=O)N(CC2OC2)C(=O)N1CC1CO1 OUPZKGBUJRBPGC-UHFFFAOYSA-N 0.000 description 1
- CWJHMZONBMHMEI-UHFFFAOYSA-N 1-tert-butylperoxy-3-propan-2-ylbenzene Chemical compound CC(C)C1=CC=CC(OOC(C)(C)C)=C1 CWJHMZONBMHMEI-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- GQHTUMJGOHRCHB-UHFFFAOYSA-N 2,3,4,6,7,8,9,10-octahydropyrimido[1,2-a]azepine Chemical compound C1CCCCN2CCCN=C21 GQHTUMJGOHRCHB-UHFFFAOYSA-N 0.000 description 1
- ZJRAAAWYHORFHN-UHFFFAOYSA-N 2-[[2,6-dibromo-4-[2-[3,5-dibromo-4-(oxiran-2-ylmethoxy)phenyl]propan-2-yl]phenoxy]methyl]oxirane Chemical compound C=1C(Br)=C(OCC2OC2)C(Br)=CC=1C(C)(C)C(C=C1Br)=CC(Br)=C1OCC1CO1 ZJRAAAWYHORFHN-UHFFFAOYSA-N 0.000 description 1
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 1
- BIISIZOQPWZPPS-UHFFFAOYSA-N 2-tert-butylperoxypropan-2-ylbenzene Chemical compound CC(C)(C)OOC(C)(C)C1=CC=CC=C1 BIISIZOQPWZPPS-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- 239000004953 Aliphatic polyamide Substances 0.000 description 1
- 229910015900 BF3 Inorganic materials 0.000 description 1
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 1
- 235000010724 Wisteria floribunda Nutrition 0.000 description 1
- MOVRNJGDXREIBM-UHFFFAOYSA-N aid-1 Chemical compound O=C1NC(=O)C(C)=CN1C1OC(COP(O)(=O)OC2C(OC(C2)N2C3=C(C(NC(N)=N3)=O)N=C2)COP(O)(=O)OC2C(OC(C2)N2C3=C(C(NC(N)=N3)=O)N=C2)COP(O)(=O)OC2C(OC(C2)N2C3=C(C(NC(N)=N3)=O)N=C2)COP(O)(=O)OC2C(OC(C2)N2C(NC(=O)C(C)=C2)=O)COP(O)(=O)OC2C(OC(C2)N2C3=C(C(NC(N)=N3)=O)N=C2)COP(O)(=O)OC2C(OC(C2)N2C3=C(C(NC(N)=N3)=O)N=C2)COP(O)(=O)OC2C(OC(C2)N2C3=C(C(NC(N)=N3)=O)N=C2)COP(O)(=O)OC2C(OC(C2)N2C(NC(=O)C(C)=C2)=O)COP(O)(=O)OC2C(OC(C2)N2C3=C(C(NC(N)=N3)=O)N=C2)COP(O)(=O)OC2C(OC(C2)N2C3=C(C(NC(N)=N3)=O)N=C2)COP(O)(=O)OC2C(OC(C2)N2C3=C(C(NC(N)=N3)=O)N=C2)COP(O)(=O)OC2C(OC(C2)N2C(NC(=O)C(C)=C2)=O)COP(O)(=O)OC2C(OC(C2)N2C3=C(C(NC(N)=N3)=O)N=C2)COP(O)(=O)OC2C(OC(C2)N2C3=C(C(NC(N)=N3)=O)N=C2)COP(O)(=O)OC2C(OC(C2)N2C3=C(C(NC(N)=N3)=O)N=C2)CO)C(O)C1 MOVRNJGDXREIBM-UHFFFAOYSA-N 0.000 description 1
- 229920003231 aliphatic polyamide Polymers 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 150000004982 aromatic amines Chemical class 0.000 description 1
- XUCHXOAWJMEFLF-UHFFFAOYSA-N bisphenol F diglycidyl ether Chemical compound C1OC1COC(C=C1)=CC=C1CC(C=C1)=CC=C1OCC1CO1 XUCHXOAWJMEFLF-UHFFFAOYSA-N 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 230000002140 halogenating effect Effects 0.000 description 1
- 150000002430 hydrocarbons Chemical group 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- XLSZMDLNRCVEIJ-UHFFFAOYSA-N methylimidazole Natural products CC1=CNC=N1 XLSZMDLNRCVEIJ-UHFFFAOYSA-N 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- IGALFTFNPPBUDN-UHFFFAOYSA-N phenyl-[2,3,4,5-tetrakis(oxiran-2-ylmethyl)phenyl]methanediamine Chemical compound C=1C(CC2OC2)=C(CC2OC2)C(CC2OC2)=C(CC2OC2)C=1C(N)(N)C1=CC=CC=C1 IGALFTFNPPBUDN-UHFFFAOYSA-N 0.000 description 1
- 150000003003 phosphines Chemical class 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920002852 poly(2,6-dimethyl-1,4-phenylene oxide) polymer Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 229920001021 polysulfide Polymers 0.000 description 1
- 239000005077 polysulfide Substances 0.000 description 1
- 150000008117 polysulfides Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- TUQOTMZNTHZOKS-UHFFFAOYSA-N tributylphosphine Chemical compound CCCCP(CCCC)CCCC TUQOTMZNTHZOKS-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
Landscapes
- Reinforced Plastic Materials (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、プリント配線板の
製造に用いられる、配線基板材料に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wiring board material used for manufacturing a printed wiring board.
【０００２】[0002]
【従来の技術】従来より電気・電子機器等に、プリント
配線板が使用されている。このプリント配線板の製造に
用いられる積層板は、例えばガラスクロス等の基材に、
エポキシ樹脂及びその硬化剤等を含有する樹脂組成物を
含浸した後、乾燥して半硬化させることによって、一般
にプリプレグと呼ばれる配線基板材料を製造し、厚みを
調整するために、この配線基板材料を所要枚数重ねると
ともに、必要に応じて銅箔等の金属箔をその片側又は両
側に配して積層した後、加熱加圧して製造されている。2. Description of the Related Art Conventionally, printed wiring boards have been used for electric and electronic devices. The laminated board used in the manufacture of this printed wiring board is, for example, a substrate such as a glass cloth,
After impregnating with a resin composition containing an epoxy resin and its curing agent and the like, by drying and semi-curing to produce a wiring board material generally called a prepreg, and to adjust the thickness, this wiring board material is used. It is manufactured by stacking a required number of sheets and, if necessary, laminating metal foils such as copper foils on one or both sides thereof, and then heating and pressing.
【０００３】なお、高周波領域で使用する積層板は、優
れた高周波特性を得るために、例えば特公昭６４−３２
２３号に記載されているような、ポリフェニレンエーテ
ル樹脂を含有する樹脂組成物や、セラミック粉末等の無
機充填材を含有する樹脂組成物を用いて、配線基板材料
を製造し、誘電率を調整することが検討されている。[0003] In order to obtain excellent high-frequency characteristics, a laminated plate used in a high-frequency region is manufactured, for example, in Japanese Patent Publication No. 64-32.
Using a resin composition containing a polyphenylene ether resin or a resin composition containing an inorganic filler such as a ceramic powder as described in No. 23, a wiring board material is manufactured, and the dielectric constant is adjusted. That is being considered.
【０００４】しかし、無機充填材の含有量をある程度以
上の比率に増やして、誘電率を更に調整しようとする
と、配線基板材料の取り扱い等において付着した樹脂が
基材から剥離しやすくなり、均一な樹脂付着量の配線基
板材料が得にくくなるという問題があった。そして、こ
の付着樹脂の剥離が発生した配線基板材料を用いて製造
したプリント配線板は、均一な特性が得にくくなるとい
う問題があった。However, if the dielectric constant is further adjusted by increasing the content of the inorganic filler to a certain degree or more, the resin adhered to the wiring substrate material is easily peeled off from the base material, and the uniformity is increased. There is a problem that it is difficult to obtain a wiring board material having a resin adhesion amount. A printed wiring board manufactured using a wiring board material from which the adhered resin has been peeled off has a problem in that it is difficult to obtain uniform characteristics.
【０００５】一方、上記樹脂組成物は、特公昭６４−３
２２３号の実施例に記載されているように、基材内部に
まで含浸するのに適する粘度にするために溶剤を含有さ
せて粘度調整することが一般に行われている。しかし、
溶剤を含有させて粘度調整した樹脂組成物を用いる場
合、配線基板材料を製造するときに、溶剤を大気中に拡
散して除去する場合が多く、環境への影響やエネルギー
コストの点で問題があった。On the other hand, the above resin composition is disclosed in
As described in the example of No. 223, it is common practice to adjust the viscosity by including a solvent in order to obtain a viscosity suitable for impregnating the inside of the substrate. But,
When using a resin composition containing a solvent and adjusting the viscosity, when manufacturing a wiring board material, the solvent is often diffused and removed in the air, which poses a problem in terms of environmental impact and energy cost. there were.
【０００６】そのため、無機充填材の含有比率が高くて
も付着樹脂の剥離が発生しにくい配線基板材料であっ
て、かつ、実質的に無溶剤の樹脂組成物を用いた配線基
板材料が望まれている。[0006] Therefore, a wiring board material that does not easily peel off the adhered resin even when the content ratio of the inorganic filler is high and that uses a substantially solvent-free resin composition is desired. ing.
【０００７】[0007]
【発明が解決しようとする課題】本発明は上記問題点を
改善するために成されたもので、その目的とするところ
は、エポキシ樹脂、ポリフェニレンエーテル樹脂及び硬
化剤を含みエポキシ樹脂を主成分とする樹脂成分と、無
機充填材とを含有する実質的に無溶剤の樹脂組成物を用
いた配線基板材料であって、無機充填材の含有比率が高
くても、付着樹脂の剥離が発生しにくい配線基板材料を
提供することにある。SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object of the present invention is to provide an epoxy resin containing an epoxy resin, a polyphenylene ether resin and a curing agent, and containing the epoxy resin as a main component. Resin material, and a wiring board material using a substantially solvent-free resin composition containing an inorganic filler, even if the content ratio of the inorganic filler is high, peeling of the adhered resin hardly occurs It is to provide a wiring board material.
【０００８】[0008]
【課題を解決するための手段】本発明の請求項１に係る
配線基板材料は、エポキシ樹脂、ポリフェニレンエーテ
ル樹脂、下記（Ａ）の架橋性樹脂、下記（Ｂ）の架橋助
剤及び硬化剤を含みエポキシ樹脂を主成分とする樹脂成
分と、無機充填材とを含有する実質的に無溶剤の樹脂組
成物を、導電体の少なくとも一面に塗布して成ることを
特徴とする。 （Ａ）１，２−ポリブタジエン、１，４−ポリブタジエ
ン、スチレンブタジエン、マレイン変性１，２−ポリブ
タジエン、アクリル変性１，２−ポリブタジエン、エポ
キシ変性１，２−ポリブタジエン及びゴム類からなる群
の中から選ばれた少なくとも１種。 （Ｂ）エステルアクリレート類、エポキシアクリレート
類、ウレタンアクリレート類、エーテルアクリレート
類、メラミンアクリレート類、アルキドアクリレート
類、シリコンアクリレート類、トリアリルシアヌレー
ト、トリアリルイソシアヌレート、エチレングリコール
ジメタクリレート、ジビニルベンゼン、ジアリルフタレ
ート、ビニルトルエン、エチルビニルベンゼン、スチレ
ン、ポリパラメチルスチレン及び多官能エポキシ類から
なる群の中から選ばれた少なくとも１種。According to a first aspect of the present invention, there is provided a wiring board material comprising an epoxy resin, a polyphenylene ether resin, a crosslinkable resin of the following (A), a crosslinking assistant and a curing agent of the following (B). A substantially solvent-free resin composition containing a resin component containing an epoxy resin as a main component and an inorganic filler is applied to at least one surface of the conductor. (A) From the group consisting of 1,2-polybutadiene, 1,4-polybutadiene, styrene-butadiene, maleic-modified 1,2-polybutadiene, acrylic-modified 1,2-polybutadiene, epoxy-modified 1,2-polybutadiene and rubbers At least one selected. (B) Ester acrylates, epoxy acrylates, urethane acrylates, ether acrylates, melamine acrylates, alkyd acrylates, silicon acrylates, triallyl cyanurate, triallyl isocyanurate, ethylene glycol dimethacrylate, divinylbenzene, diallyl At least one selected from the group consisting of phthalate, vinyltoluene, ethylvinylbenzene, styrene, polyparamethylstyrene, and polyfunctional epoxies.
【０００９】本発明の請求項２に係る配線基板材料は、
請求項１記載の配線基板材料において、エポキシ樹脂及
びポリフェニレンエーテル樹脂の合計１００重量部中
に、エポキシ樹脂を５０〜９０重量部含むことを特徴と
する。The wiring board material according to claim 2 of the present invention is
2. The wiring board material according to claim 1, wherein the epoxy resin and the polyphenylene ether resin each include 50 to 90 parts by weight of epoxy resin in total 100 parts by weight.
【００１０】本発明の請求項３に係る配線基板材料は、
請求項１又は請求項２記載の配線基板材料において、無
機充填材が、下記（Ｃ）のセラミックを含むことを特徴
とする。 （Ｃ）二酸化チタン系セラミック、チタン酸バリウム系
セラミック、チタン酸鉛系セラミック、チタン酸ストロ
ンチウム系セラミック、チタン酸カルシウム系セラミッ
ク、チタン酸ビスマス系セラミック、チタン酸マグネシ
ウム系セラミック及びジルコン酸鉛系セラミックからな
る群の中から選ばれた少なくとも１種。The wiring board material according to claim 3 of the present invention is:
The wiring substrate material according to claim 1 or 2, wherein the inorganic filler contains the following ceramic (C). (C) From titanium dioxide ceramic, barium titanate ceramic, lead titanate ceramic, strontium titanate ceramic, calcium titanate ceramic, bismuth titanate ceramic, magnesium titanate ceramic and lead zirconate ceramic At least one selected from the group consisting of:
【００１１】本発明の請求項４に係る配線基板材料は、
請求項１から請求項３までのいずれかに記載の配線基板
材料において、エポキシ樹脂、ポリフェニレンエーテル
樹脂、架橋性樹脂及び架橋助剤の合計１００重量部に対
し、無機充填材を１０〜２００重量部含有することを特
徴とする。The wiring board material according to claim 4 of the present invention is:
4. The wiring board material according to claim 1, wherein the inorganic filler is 10 to 200 parts by weight based on 100 parts by weight of the epoxy resin, the polyphenylene ether resin, the crosslinkable resin and the crosslinking assistant in total. It is characterized by containing.
【００１２】本発明の請求項５に係る配線基板材料は、
請求項１から請求項４までのいずれかに記載の配線基板
材料において、硬化剤として、架橋開始剤を含むことを
特徴とする。According to a fifth aspect of the present invention, there is provided a wiring board material comprising:
The wiring substrate material according to any one of claims 1 to 4, wherein a crosslinking initiator is included as a curing agent.
【００１３】本発明によると、樹脂組成物の樹脂成分
に、上記（Ａ）の架橋性樹脂及び上記（Ｂ）の架橋助剤
を含有しているため、これらの架橋性樹脂及び架橋助剤
がＰＰＥと架橋するとともに、エポキシ樹脂とも反応し
ていると考えられ、その結果樹脂全体の接着強度が向上
し、付着樹脂の剥離が発生しにくくなると考えられる。
また、架橋性樹脂及び架橋助剤及び無機充填材を含有し
ているため、導電体に塗布すると、均一な特性の樹脂組
成物層を形成することができ、基材を用いなくとも配線
基板材料を得ることができる。According to the present invention, since the resin component of the resin composition contains the crosslinkable resin (A) and the crosslinker (B), the crosslinkable resin and the crosslinker are used. It is considered that the resin is crosslinked with PPE and also reacts with the epoxy resin. As a result, it is considered that the adhesive strength of the entire resin is improved, and peeling of the adhered resin is less likely to occur.
In addition, since it contains a crosslinkable resin, a crosslinker, and an inorganic filler, it can form a resin composition layer having uniform properties when applied to a conductor, and can be used as a wiring board material without using a base material. Can be obtained.
【００１４】[0014]
【発明の実施の形態】本発明に係る配線基板材料は、エ
ポキシ樹脂、ポリフェニレンエーテル樹脂、上記（Ａ）
の架橋性樹脂、上記（Ｂ）の架橋助剤及び硬化剤を含む
樹脂成分と、無機充填材とを含有する実質的に無溶剤の
樹脂組成物を、導電体の少なくとも一面に塗布して製造
される。DESCRIPTION OF THE PREFERRED EMBODIMENTS The wiring board material according to the present invention is an epoxy resin, a polyphenylene ether resin,
A substantially solvent-free resin composition containing a crosslinkable resin of the above (B), a resin component containing a crosslinker and a curing agent, and an inorganic filler is applied to at least one surface of a conductor. Is done.
【００１５】本発明で用いるエポキシ樹脂としては、１
分子内にエポキシ基を２個以上有するエポキシ樹脂であ
ればどのようなものでもよく、例えば、ビスフェノール
Ａジグリシジルエーテル、ビスフェノールＦジグリシジ
ルエーテル、ノボラックグリシジルエーテル、テトラグ
リシジルジアミノジフェニルメタン、トリグリシジルイ
ソシアヌレート及びこれらのエポキシ樹脂構造体中の水
素原子の一部をハロゲン化することにより難燃化したエ
ポキシ樹脂等の単独、変性物、混合物が挙げられる。The epoxy resin used in the present invention includes 1
Any epoxy resin having two or more epoxy groups in the molecule may be used, for example, bisphenol A diglycidyl ether, bisphenol F diglycidyl ether, novolak glycidyl ether, tetraglycidyl diaminodiphenylmethane, triglycidyl isocyanurate and A single, modified, or mixture of an epoxy resin or the like which is made flame-retardant by partially halogenating hydrogen atoms in these epoxy resin structures is exemplified.
【００１６】本発明で用いるポリフェニレンエーテル樹
脂（以下ＰＰＥと記す）は、別名ポリフェニレンオキサ
イド樹脂とも呼ばれ、例えば下記の一般式（ａ）で表さ
れるものである。なお、一般式（ａ）中、Ｒは水素又は
炭素数１〜３の炭化水素基を表し、各Ｒは同じであって
もよく、異なっていても良い。また、ｎは繰り返し数を
表す正数である。The polyphenylene ether resin (hereinafter, referred to as PPE) used in the present invention is also called polyphenylene oxide resin, and is represented by, for example, the following general formula (a). In the general formula (a), R represents hydrogen or a hydrocarbon group having 1 to 3 carbon atoms, and each R may be the same or different. N is a positive number representing the number of repetitions.
【００１７】[0017]
【化１】 Embedded image
【００１８】ＰＰＥの一例としては、ポリ（２，６−ジ
メチル−１，４−フェニレンオキサイド）が挙げられ
る。このようなＰＰＥは、例えば、ＵＳＰ４０５９５６
８号明細書に開示されている方法で合成することができ
る。なお、特に限定するものではないが、例えば、重量
平均分子量が約５万、重量平均分子量／数平均分子量＝
約４．２のポリマーが好ましく使用される。An example of the PPE is poly (2,6-dimethyl-1,4-phenylene oxide). Such PPE is described, for example, in US Pat.
No. 8 can be synthesized by the method disclosed in the specification. Note that, although not particularly limited, for example, the weight average molecular weight is about 50,000, and the weight average molecular weight / number average molecular weight =
About 4.2 polymers are preferably used.
【００１９】本発明で用いる架橋性樹脂は、ＰＰＥに架
橋性を有する化合物であり、上記（Ａ）のものが使用さ
れる。また、架橋助剤は、上記架橋性樹脂と同時に用い
てＰＰＥに架橋性を有する化合物であり、上記（Ｂ）の
ものが使用される。なお、架橋助剤としては、上記
（Ｂ）中のトリアリルシアヌレート又はトリアリルイソ
シアヌレートがＰＰＥと相溶性が良く、架橋性、耐熱性
及び誘電特性の面で好ましい。The crosslinkable resin used in the present invention is a compound having a crosslinkability to PPE, and the above (A) is used. The crosslinking aid is a compound having a crosslinking property to PPE when used simultaneously with the crosslinking resin, and the one described in (B) above is used. As the crosslinking aid, triallyl cyanurate or triallyl isocyanurate in the above (B) has good compatibility with PPE, and is preferred in terms of crosslinking properties, heat resistance and dielectric properties.
【００２０】本発明で用いる樹脂組成物は、エポキシ樹
脂及びポリフェニレンエーテル樹脂を含む樹脂成分に、
上記（Ａ）の架橋性樹脂及び上記（Ｂ）の架橋助剤を含
有しているため、これらの架橋性樹脂及び架橋助剤がＰ
ＰＥと架橋するとともに、エポキシ樹脂とも反応してい
ると考えられ、その結果樹脂全体の接着強度が向上し、
付着樹脂の剥離が発生しにくくなると考えられる。The resin composition used in the present invention comprises a resin component containing an epoxy resin and a polyphenylene ether resin,
Since the crosslinkable resin of (A) and the crosslinker of (B) are contained, the crosslinkable resin and the crosslinker are
It is thought that it cross-links with PE and also reacts with epoxy resin. As a result, the adhesive strength of the whole resin is improved,
It is considered that the detachment of the adhered resin hardly occurs.
【００２１】本発明で用いる硬化剤としては、エポキシ
樹脂を硬化させる硬化剤と、ＰＰＥを硬化させる架橋開
始剤を含有し、必要に応じて硬化促進剤等を含有するこ
とができる。The curing agent used in the present invention contains a curing agent for curing an epoxy resin, a crosslinking initiator for curing PPE, and may contain a curing accelerator, if necessary.
【００２２】エポキシ樹脂を硬化させる硬化剤として
は、例えば、ジシアンジアミド、脂肪族ポリアミド等の
アミド系硬化剤や、芳香族アミン等のアミン系硬化剤
や、ジアミノマレオニトリル、ヒドラジド化合物、ポリ
カルボン酸無水物、ポリスルフィド、ポリメルカプタ
ン、三フッ化ホウ素コンプレックス、フェノール樹脂等
が挙げられ、これらを併用することもできる。Examples of the curing agent for curing the epoxy resin include amide-based curing agents such as dicyandiamide and aliphatic polyamide, amine-based curing agents such as aromatic amines, diaminomaleonitrile, hydrazide compounds, and polycarboxylic anhydrides. Products, polysulfide, polymercaptan, boron trifluoride complex, phenol resin and the like, and these can be used in combination.
【００２３】また、ＰＰＥを硬化させる架橋開始剤とし
ては、例えば、ジクミルパーオキサイド、ｔ−ブチルク
ミルパーオキサイド、ジ−ｔ−ブチルパーオキサイド、
２，５−ジメチル−２，５−ジ−ｔ−ブチルパーオキシ
ヘキシン−３、２，５−ジ−ｔ−ブチルパーオキシヘキ
サン、α，α’−ビス（ｔ−ブチルパーオキシ−ｍ−イ
ソプロピル）ベンゼン［１，４（又は１，３）−ビス
（ｔ−ブチルパーオキシイソプロピル）ベンゼンともい
う。］などの過酸化物が挙げられ、これらを併用するこ
ともできる。Examples of the crosslinking initiator for curing PPE include dicumyl peroxide, t-butylcumyl peroxide, di-t-butyl peroxide,
2,5-dimethyl-2,5-di-t-butylperoxyhexyne-3, 2,5-di-t-butylperoxyhexane, α, α′-bis (t-butylperoxy-m- Isopropyl) benzene [1,4 (or 1,3) -bis (t-butylperoxyisopropyl) benzene] And the like, and these can be used in combination.
【００２４】また、硬化促進剤としては、例えば、２−
メチルイミダゾール、２−エチル−４−メチルイミダゾ
ール、２−フェニルイミダゾール等のイミダゾール類、
１，８−ジアザ−ビシクロ［５．４．０］ウンデセン−
７、トリエチレンジアミン、ベンジルジメチルアミン等
の三級アミン類、トリブチルホスフィン、トリフェニル
ホスフィン等の有機ホスフィン類、テトラフェニルホス
ホニウムテトラフェニルボレート、トリフェニルホスフ
ィンテトラフェニルボレート等のテトラフェニルボロン
塩等が挙げられ、これらを併用することもできる。Further, as the curing accelerator, for example, 2-
Imidazoles such as methylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole,
1,8-diaza-bicyclo [5.4.0] undecene-
7, tertiary amines such as triethylenediamine and benzyldimethylamine; organic phosphines such as tributylphosphine and triphenylphosphine; and tetraphenylboron salts such as tetraphenylphosphonium tetraphenylborate and triphenylphosphine tetraphenylborate. These can be used in combination.
【００２５】本発明で用いる無機充填材としては、上記
（Ｃ）のセラミックや、シリカ、水酸化アルミニウム、
タルク、ガラス繊維等が挙げられる。なお、上記（Ｃ）
のセラミックを用いると、配線基板材料の誘電率を調整
しやすく好ましい。これらは１種に限定されるものでは
なく、２種以上組み合わせても良い。また、無機充填材
の径は、０．１〜５０μｍであると、得られる樹脂組成
物中の無機充填材の分散が優れ好ましい。The inorganic filler used in the present invention includes the above-mentioned ceramic (C), silica, aluminum hydroxide,
Examples include talc and glass fiber. The above (C)
The use of the ceramic is preferred because the dielectric constant of the wiring board material can be easily adjusted. These are not limited to one kind, and two or more kinds may be combined. Further, when the diameter of the inorganic filler is 0.1 to 50 μm, the dispersion of the inorganic filler in the obtained resin composition is excellent and preferable.
【００２６】以上の成分の配合割合は、特に限定される
ものではないが、エポキシ樹脂及びＰＰＥの合計１００
重量部中に、エポキシ樹脂を５０〜９０重量部含むよう
にすると、得られる配線基板材料から付着樹脂の剥離
が、特に発生しにくくなり好ましい。また、架橋性樹脂
及び架橋助剤の配合割合は、特に限定されるものではな
いが、ＰＰＥ及び架橋性樹脂及び架橋助剤の合計１００
重量部中に、ＰＰＥを２０〜９０重量部、架橋性樹脂を
５〜６０重量部、架橋助剤を１〜５０重量部の割合で含
むようにすると、得られる配線基板材料から付着樹脂の
剥離が、特に発生しにくくなり好ましい。The mixing ratio of the above components is not particularly limited, but the total amount of the epoxy resin and PPE is 100%.
It is preferable that the epoxy resin is included in the weight part in an amount of 50 to 90 parts by weight, because the adhesion resin is hardly peeled off from the obtained wiring board material. The mixing ratio of the crosslinkable resin and the crosslinking auxiliary is not particularly limited, but the total of PPE, the crosslinkable resin and the crosslinking auxiliary is 100%.
When the content of PPE is 20 to 90 parts by weight, the amount of the crosslinkable resin is 5 to 60 parts by weight, and the amount of the crosslinking aid is 1 to 50 parts by weight, the adhesion resin is separated from the obtained wiring board material. However, it is particularly preferable because it hardly occurs.
【００２７】また、無機充填材の配合割合は、エポキシ
樹脂、ＰＰＥ、架橋性樹脂及び架橋助剤の合計１００重
量部に対し、無機充填材が１０〜２００重量部、より好
ましくは３０〜１５０重量部の範囲内にあると、得られ
る配線基板材料から付着樹脂の剥離が発生しにくく、か
つ、優れた高周波特性の配線基板材料が得やすく好まし
い。The compounding ratio of the inorganic filler is 10 to 200 parts by weight, more preferably 30 to 150 parts by weight, based on 100 parts by weight of the epoxy resin, PPE, crosslinkable resin and crosslinking aid in total. When it is within the range of the part, peeling of the adhered resin hardly occurs from the obtained wiring board material, and a wiring board material having excellent high frequency characteristics is easily obtained, which is preferable.
【００２８】なお、本発明に用いる樹脂組成物は、実質
的に無溶剤の樹脂組成物であり、この樹脂組成物を用い
て配線基板材料を製造する時等に、大気中に拡散してほ
とんど失われるような化合物は含まないことが重要であ
る。なお本発明でいう実質的に無溶剤とは、スチレン
等、他の反応では溶剤として用いられる場合がある化合
物であっても、反応して樹脂成分に取り込まれる化合物
については、溶剤に含めないことを表している。The resin composition used in the present invention is a substantially solvent-free resin composition. When a resin composition is used to produce a wiring board material, the resin composition is almost completely dispersed in the air. It is important not to include compounds that would be lost. The term "substantially solvent-free" in the present invention means that even if a compound such as styrene may be used as a solvent in another reaction, a compound which reacts and is taken into a resin component should not be included in the solvent. Is represented.
【００２９】本発明に用いる樹脂組成物は、上記各原料
を混合撹拌することによって得られる。なお、必要に応
じて樹脂成分を加熱溶融させ、混合するようにしてもよ
い。また、樹脂成分を予め混合した後、無機充填材を追
加して混合するようにしてもよい。The resin composition used in the present invention can be obtained by mixing and stirring each of the above-mentioned raw materials. In addition, you may make it heat-melt and mix a resin component as needed. After the resin components are mixed in advance, an inorganic filler may be added and mixed.
【００３０】本発明に係る配線基板材料は、上記樹脂組
成物を、導電体の片面又は両面に塗布して製造する。上
記樹脂組成物は、上記（Ａ）の架橋性樹脂及び上記
（Ｂ）の架橋助剤及び無機充填材を含有しているため、
導電体に塗布すると、均一な特性の樹脂組成物層を形成
することができ、基材を用いなくとも配線基板材料を得
ることができる。The wiring board material according to the present invention is produced by applying the above resin composition to one or both surfaces of a conductor. Since the resin composition contains the crosslinkable resin (A) and the crosslinker and the inorganic filler (B),
When applied to a conductor, a resin composition layer having uniform characteristics can be formed, and a wiring board material can be obtained without using a base material.
【００３１】なお、本発明で用いる導電体としては、特
に限定するものではなく、銅箔、アルミニウム箔、ニッ
ケル箔や、これらの複合箔等が挙げられるが、銅箔を用
いると電気特性が優れ好ましい。また、樹脂組成物を、
導電体に塗布する方法としても特に限定するものではな
く、ロールコーター法や、カーテンコーター法や、ダイ
コーター法や、浸漬法や、電着法等が挙げられる。The conductor used in the present invention is not particularly limited, and examples thereof include a copper foil, an aluminum foil, a nickel foil, and a composite foil thereof. preferable. Further, the resin composition,
The method of coating the conductor is not particularly limited, and examples thereof include a roll coater method, a curtain coater method, a die coater method, an immersion method, and an electrodeposition method.
【００３２】また、樹脂組成物を導電体に塗布する厚み
としては、特には限定するものではなく、任意の厚み塗
布して、樹脂組成物層を形成することができるが、１０
〜３００μｍ程度が好ましい。本発明で塗布する樹脂組
成物は、実質的に無溶剤の樹脂組成物であるため、溶剤
が揮発することがなく、塗布した厚みと、得られる配線
基板材料の樹脂層の厚みの差が小さいため、塗布する厚
みを制御することにより、厚み偏差の小さい配線基板材
料を容易に得ることができるという効果も得られる。ま
た、基材を用いていないため、基材の厚みに樹脂層の厚
みが制限されることがなく、樹脂層の薄い配線基板材料
を容易に得ることができるという効果も得られる。The thickness of the resin composition applied to the conductor is not particularly limited. The resin composition layer can be formed by applying an arbitrary thickness.
About 300 μm is preferable. Since the resin composition applied in the present invention is a substantially solvent-free resin composition, the solvent does not evaporate, and the difference between the applied thickness and the thickness of the resin layer of the obtained wiring board material is small. Therefore, by controlling the thickness to be applied, it is possible to easily obtain a wiring board material having a small thickness deviation. Further, since the base material is not used, the thickness of the resin layer is not limited by the thickness of the base material, and an effect that a wiring board material having a thin resin layer can be easily obtained is also obtained.
【００３３】[0033]
（実施例１〜３）導電体に塗布する樹脂組成物の原料と
して、下記のエポキシ樹脂、ＰＰＥ、架橋性樹脂、２種
類の架橋助剤、２種類の硬化剤、硬化促進剤及び無機充
填材を使用した。 ・エポキシ樹脂：エポキシ当量が５００であるテトラブ
ロモビスフェノールＡジグリシジルエーテル［東都化成
株式会社製、商品名ＹＤＢ−５００］ ・ＰＰＥ：重量平均分子量が５４０００のポリ（２，６
−ジメチル−１，４−フェニレンオキサイド）［日本
Ｇ．Ｅ．プラスチック株式会社製］ ・架橋性樹脂：スチレンブタジエンコポリマー（ＳＢ
Ｓ）［旭化成工業株式会社製、商品名 アサプレン］ ・架橋助剤１：トリアリルイソシアヌレート（ＴＡＩ
Ｃ）［日本化成株式会社製］ ・架橋助剤２：スチレン［試薬を使用］ ・硬化剤１：エポキシ樹脂を硬化させる硬化剤として、
ジシアンジアミド［試薬を使用］ ・硬化剤２：ＰＰＥを硬化させる架橋開始剤として、ジ
クミルパーオキサイド（ＤＣＰ）［試薬を使用］ ・硬化促進剤：２−メチルイミダゾール［試薬を使用］ ・無機充填材：平均粒径０．３μｍの二酸化チタン［富
士チタン工業株式会社製、商品名 ＴＲ−８４０］。(Examples 1 to 3) The following epoxy resin, PPE, crosslinkable resin, two kinds of crosslinking assistants, two kinds of curing agents, curing accelerators and inorganic fillers were used as raw materials for the resin composition applied to the conductor. It was used. Epoxy resin: tetrabromobisphenol A diglycidyl ether having an epoxy equivalent of 500 [YDB-500, manufactured by Toto Kasei Co., Ltd.] PPE: poly (2,6) having a weight average molecular weight of 54,000
-Dimethyl-1,4-phenylene oxide) [G. E. FIG. Plastic Co., Ltd.]-Crosslinkable resin: Styrene butadiene copolymer (SB
S) [Asaprene, trade name, manufactured by Asahi Kasei Kogyo Co., Ltd.]-Crosslinking aid 1: triallyl isocyanurate (TAI)
C) [manufactured by Nippon Kasei Co., Ltd.]-Crosslinking aid 2: Styrene [use reagent]-Curing agent 1: As a curing agent for curing epoxy resin,
Dicyandiamide [use reagent] ・ Curing agent 2: Dicumyl peroxide (DCP) [use reagent] as a crosslinking initiator for curing PPE ・ Curing accelerator: 2-methylimidazole [use reagent] ・ Inorganic filler : Titanium dioxide having an average particle size of 0.3 μm [trade name: TR-840, manufactured by Fuji Titanium Industry Co., Ltd.].
【００３４】これらのエポキシ樹脂、ＰＰＥ、架橋性樹
脂、２種類の架橋助剤、２種類の硬化剤及び硬化促進剤
を、表１に示す重量部配合してセパラブルフラスコに入
れ、撹拌しながらオイルバスで８０℃まで加温した。８
０℃で２時間加温した後、無機充填材を表１に示す重量
部添加した。次いで、ディスパーで５分間撹拌した後、
バスケットミルで１時間撹拌して樹脂組成物を得た。These epoxy resin, PPE, crosslinkable resin, two kinds of crosslinking assistants, two kinds of curing agents and a curing accelerator are blended in parts by weight as shown in Table 1 and put into a separable flask. The mixture was heated to 80 ° C. in an oil bath. 8
After heating at 0 ° C. for 2 hours, the inorganic filler was added by weight as shown in Table 1. Then, after stirring with a disper for 5 minutes,
The mixture was stirred for 1 hour in a basket mill to obtain a resin composition.
【００３５】[0035]
【表１】 [Table 1]
【００３６】得られた樹脂組成物を、厚み９μｍの銅箔
の片面に５０μｍ塗布し、１６０℃で５分処理して配線
基板材料を得た。The obtained resin composition was applied on one surface of a copper foil having a thickness of 9 μm to a thickness of 50 μm, and treated at 160 ° C. for 5 minutes to obtain a wiring board material.
【００３７】また、この配線基板材料の樹脂層に厚み９
μｍの銅箔を重ね合わせ、次いで１８０℃、圧力２ＭＰ
ａで６０分圧締して両面銅張り積層板を得た。The resin layer of the wiring board material has a thickness of 9 mm.
μm copper foil, then 180 ℃, pressure 2MP
a) for 60 minutes to obtain a double-sided copper-clad laminate.
【００３８】（比較例１）エポキシ樹脂、ＰＰＥ、架橋
性樹脂、２種類の架橋助剤、２種類の硬化剤及び硬化促
進剤を配合するとき、溶剤としてトルエン［試薬を使
用］をも、表１に示す重量部配合したこと、及び無機充
填材の配合量を表１に示す重量部に変更して配合したこ
と、以外は実施例２と同様にして樹脂組成物を得た。(Comparative Example 1) When an epoxy resin, PPE, a crosslinkable resin, two kinds of crosslinking assistants, two kinds of curing agents and a curing accelerator are compounded, toluene (using a reagent) is also used as a solvent. A resin composition was obtained in the same manner as in Example 2, except that it was blended by weight as shown in Table 1 and that the blending amount of the inorganic filler was changed to that shown in Table 1.
【００３９】得られた樹脂組成物を、厚み５０μｍのガ
ラスクロス［旭シュエーベル株式会社製、商品名 １０
８０］に、溶剤除去後の樹脂含有率が７０％となるよう
調整して含浸し、１２０℃で３分処理して配線基板材料
を得た。次いで実施例１〜３と同様にして両面銅張り積
層板を得た。The obtained resin composition was coated with a 50 μm-thick glass cloth [manufactured by Asahi Schubel Co., Ltd., trade name 10
80], and impregnated so as to have a resin content of 70% after solvent removal, and treated at 120 ° C. for 3 minutes to obtain a wiring board material. Next, a double-sided copper-clad laminate was obtained in the same manner as in Examples 1 to 3.
【００４０】（比較例２）エポキシ樹脂、ＰＰＥ、架橋
性樹脂、２種類の架橋助剤、２種類の硬化剤及び硬化促
進剤を配合するとき、溶剤としてトルエン［試薬を使
用］をも、表１に示す重量部配合したこと以外は実施例
２と同様にして樹脂組成物を得た。(Comparative Example 2) When an epoxy resin, PPE, a crosslinkable resin, two kinds of crosslinking assistants, two kinds of curing agents and a curing accelerator are compounded, toluene (using a reagent) is also used as a solvent. A resin composition was obtained in the same manner as in Example 2, except that the parts by weight shown in No. 1 were blended.
【００４１】得られた樹脂組成物を、比較例１と同様の
ガラスクロスに、溶剤除去後の樹脂含有率が７０％とな
るよう調整して含浸し、１２０℃で３分処理して配線基
板材料を得た。The obtained resin composition was impregnated and impregnated in the same glass cloth as in Comparative Example 1 so that the resin content after removing the solvent was 70%, and treated at 120 ° C. for 3 minutes to obtain a wiring board. The material was obtained.
【００４２】なお、この比較例２の場合は、配線基板材
料の取り扱いにおいて付着樹脂の剥離が多く発生し、均
一な樹脂付着量の配線基板材料が得られなかったため、
両面銅張り積層板の製造は行わなかった。In the case of Comparative Example 2, since the adhered resin was largely peeled off during the handling of the wiring board material, a wiring board material having a uniform resin adhesion amount could not be obtained.
No double-sided copper-clad laminates were produced.
【００４３】（評価、結果）実施例１〜３及び比較例１
で得られた両面銅張り積層板の、半田耐熱性、誘電率及
び誘電正接を評価した。その評価方法は、半田耐熱性、
誘電率及び誘電正接共に、ＪＩＳ規格Ｃ６４８１の方法
により評価した。(Evaluation and Results) Examples 1 to 3 and Comparative Example 1
The double-sided copper-clad laminate obtained in the above was evaluated for solder heat resistance, dielectric constant and dielectric loss tangent. The evaluation method is solder heat resistance,
Both the dielectric constant and the dielectric loss tangent were evaluated by the method of JIS standard C6481.
【００４４】結果は表１に示すように、各実施例で得ら
れた両面銅張り積層板は、比較例１で得られた両面銅張
り積層板と比較して誘電率が高く、誘電率の調整がされ
ていることが確認された。また、各実施例で得られた両
面銅張り積層板は、比較例１で得られた両面銅張り積層
板と比較して、半田耐熱性と誘電正接が同等であること
が確認された。すなわち、各実施例は高周波用途に適し
ていて、かつ、均一な樹脂付着量の配線基板材料が得ら
れることが確認された。The results are shown in Table 1. As shown in Table 1, the double-sided copper-clad laminate obtained in each Example has a higher dielectric constant than the double-sided copper-clad laminate obtained in Comparative Example 1, and has a higher dielectric constant. It was confirmed that the adjustment was made. In addition, it was confirmed that the double-sided copper-clad laminate obtained in each example had the same solder heat resistance and dielectric loss tangent as those of the double-sided copper-clad laminate obtained in Comparative Example 1. That is, it was confirmed that each of the examples is suitable for high-frequency applications and that a wiring board material having a uniform resin adhesion amount can be obtained.
【００４５】[0045]
【発明の効果】本発明に係る配線基板材料は、上記
（Ａ）の架橋性樹脂及び上記（Ｂ）の架橋助剤を含有し
た樹脂組成物を導電体に塗布して成るため、無機充填材
の含有比率が高くても、付着樹脂の剥離が発生しにくい
配線基板材料となる。The wiring board material according to the present invention is obtained by applying a resin composition containing the crosslinkable resin (A) and the crosslinker of the above (B) to a conductor. Even if the content ratio is high, a wiring board material in which peeling of the adhered resin hardly occurs is obtained.
Claims (5)
樹脂、下記（Ａ）の架橋性樹脂、下記（Ｂ）の架橋助剤
及び硬化剤を含みエポキシ樹脂を主成分とする樹脂成分
と、無機充填材とを含有する実質的に無溶剤の樹脂組成
物を、導電体の少なくとも一面に塗布して成ることを特
徴とする配線基板材料。 （Ａ）１，２−ポリブタジエン、１，４−ポリブタジエ
ン、スチレンブタジエン、マレイン変性１，２−ポリブ
タジエン、アクリル変性１，２−ポリブタジエン、エポ
キシ変性１，２−ポリブタジエン及びゴム類からなる群
の中から選ばれた少なくとも１種。 （Ｂ）エステルアクリレート類、エポキシアクリレート
類、ウレタンアクリレート類、エーテルアクリレート
類、メラミンアクリレート類、アルキドアクリレート
類、シリコンアクリレート類、トリアリルシアヌレー
ト、トリアリルイソシアヌレート、エチレングリコール
ジメタクリレート、ジビニルベンゼン、ジアリルフタレ
ート、ビニルトルエン、エチルビニルベンゼン、スチレ
ン、ポリパラメチルスチレン及び多官能エポキシ類から
なる群の中から選ばれた少なくとも１種。1. An inorganic filler comprising an epoxy resin, a polyphenylene ether resin, a crosslinkable resin of the following (A), a crosslinker and a curing agent of the following (B), a resin component containing an epoxy resin as a main component, and an inorganic filler. A wiring board material comprising a substantially solvent-free resin composition contained on at least one surface of a conductor. (A) From the group consisting of 1,2-polybutadiene, 1,4-polybutadiene, styrene-butadiene, maleic-modified 1,2-polybutadiene, acrylic-modified 1,2-polybutadiene, epoxy-modified 1,2-polybutadiene and rubbers At least one selected. (B) Ester acrylates, epoxy acrylates, urethane acrylates, ether acrylates, melamine acrylates, alkyd acrylates, silicon acrylates, triallyl cyanurate, triallyl isocyanurate, ethylene glycol dimethacrylate, divinylbenzene, diallyl At least one selected from the group consisting of phthalate, vinyltoluene, ethylvinylbenzene, styrene, polyparamethylstyrene and polyfunctional epoxies.
ル樹脂の合計１００重量部中に、エポキシ樹脂を５０〜
９０重量部含むことを特徴とする請求項１記載の配線基
板材料。2. An epoxy resin and a polyphenylene ether resin in a total of 100 parts by weight,
2. The wiring board material according to claim 1, comprising 90 parts by weight.
を含むことを特徴とする請求項１又は請求項２記載の配
線基板材料。 （Ｃ）二酸化チタン系セラミック、チタン酸バリウム系
セラミック、チタン酸鉛系セラミック、チタン酸ストロ
ンチウム系セラミック、チタン酸カルシウム系セラミッ
ク、チタン酸ビスマス系セラミック、チタン酸マグネシ
ウム系セラミック及びジルコン酸鉛系セラミックからな
る群の中から選ばれた少なくとも１種。3. The wiring board material according to claim 1, wherein the inorganic filler contains the following ceramic (C). (C) From titanium dioxide ceramic, barium titanate ceramic, lead titanate ceramic, strontium titanate ceramic, calcium titanate ceramic, bismuth titanate ceramic, magnesium titanate ceramic and lead zirconate ceramic At least one selected from the group consisting of:
樹脂、架橋性樹脂及び架橋助剤の合計１００重量部に対
し、無機充填材を１０〜２００重量部含有することを特
徴とする請求項１から請求項３までのいずれかに記載の
配線基板材料。4. An inorganic filler is contained in an amount of 10 to 200 parts by weight based on a total of 100 parts by weight of an epoxy resin, a polyphenylene ether resin, a crosslinkable resin and a crosslinking aid. The wiring board material according to any of the above.
特徴とする請求項１から請求項４までのいずれかに記載
の配線基板材料。5. The wiring board material according to claim 1, further comprising a crosslinking initiator as a curing agent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22484296A JPH1060138A (en) | 1996-08-27 | 1996-08-27 | Printed wiring board material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22484296A JPH1060138A (en) | 1996-08-27 | 1996-08-27 | Printed wiring board material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH1060138A true JPH1060138A (en) | 1998-03-03 |
Family
ID=16820035
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22484296A Pending JPH1060138A (en) | 1996-08-27 | 1996-08-27 | Printed wiring board material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH1060138A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6306963B1 (en) * | 2000-05-08 | 2001-10-23 | General Electric Co. | Thermosetting resins and laminates |
| JP2002060715A (en) * | 2000-07-07 | 2002-02-26 | Natl Starch & Chem Investment Holding Corp | Die-bonding adhesive containing epoxy resin having allyl group or vinyl group |
| EP1146101A4 (en) * | 1998-12-22 | 2002-07-31 | Hitachi Chemical Co Ltd | Adhesive-coated copper foil, and copper-clad laminate and printed circuit board both obtained with the same |
| EP1715004A1 (en) * | 2005-04-18 | 2006-10-25 | National Starch and Chemical Investment Holding Corporation | Die attach adhesives with improved stress performance |
| US9642249B2 (en) | 2013-04-30 | 2017-05-02 | Industrial Technology Research Institute | Resin composition, prepreg, and substrate employing the same |
| WO2020157828A1 (en) * | 2019-01-29 | 2020-08-06 | 日立化成株式会社 | Resin composition, method for manufacturing semiconductor device, and semiconductor device |
| CN114207021A (en) * | 2019-07-17 | 2022-03-18 | 松下知识产权经营株式会社 | Resin composition, prepreg, film with resin, metal foil with resin, metal-foil-clad laminate, and wiring board |
| CN117004270A (en) * | 2023-08-10 | 2023-11-07 | 鹤山市炎墨科技有限公司 | Anti-welding ink based on polyphenyl ether resin, and preparation method and application thereof |
-
1996
- 1996-08-27 JP JP22484296A patent/JPH1060138A/en active Pending
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1146101A4 (en) * | 1998-12-22 | 2002-07-31 | Hitachi Chemical Co Ltd | Adhesive-coated copper foil, and copper-clad laminate and printed circuit board both obtained with the same |
| US6558797B1 (en) | 1998-12-22 | 2003-05-06 | Hitachi Chemical Company, Ltd. | Adhesive-coated copper foil, and copper-clad laminate and printed circuit board both obtained with the same |
| US6306963B1 (en) * | 2000-05-08 | 2001-10-23 | General Electric Co. | Thermosetting resins and laminates |
| JP2002060715A (en) * | 2000-07-07 | 2002-02-26 | Natl Starch & Chem Investment Holding Corp | Die-bonding adhesive containing epoxy resin having allyl group or vinyl group |
| EP1170346A3 (en) * | 2000-07-07 | 2002-07-24 | National Starch and Chemical Investment Holding Corporation | Die attach adhesives with epoxy resin having allyl or vinyl groups |
| US6750301B1 (en) | 2000-07-07 | 2004-06-15 | National Starch And Chemical Investment Holding Corporation | Die attach adhesives with epoxy compound or resin having allyl or vinyl groups |
| EP1715004A1 (en) * | 2005-04-18 | 2006-10-25 | National Starch and Chemical Investment Holding Corporation | Die attach adhesives with improved stress performance |
| US9642249B2 (en) | 2013-04-30 | 2017-05-02 | Industrial Technology Research Institute | Resin composition, prepreg, and substrate employing the same |
| WO2020157828A1 (en) * | 2019-01-29 | 2020-08-06 | 日立化成株式会社 | Resin composition, method for manufacturing semiconductor device, and semiconductor device |
| CN114207021A (en) * | 2019-07-17 | 2022-03-18 | 松下知识产权经营株式会社 | Resin composition, prepreg, film with resin, metal foil with resin, metal-foil-clad laminate, and wiring board |
| CN114207021B (en) * | 2019-07-17 | 2024-06-11 | 松下知识产权经营株式会社 | Resin composition, prepreg, film with resin, metal foil with resin, metal foil-clad laminate, and wiring board |
| CN117004270A (en) * | 2023-08-10 | 2023-11-07 | 鹤山市炎墨科技有限公司 | Anti-welding ink based on polyphenyl ether resin, and preparation method and application thereof |
| CN117004270B (en) * | 2023-08-10 | 2024-01-05 | 鹤山市炎墨科技有限公司 | Anti-welding ink based on polyphenyl ether resin, and preparation method and application thereof |
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