JPH1092625A - Electronic part - Google Patents
Electronic partInfo
- Publication number
- JPH1092625A JPH1092625A JP8240750A JP24075096A JPH1092625A JP H1092625 A JPH1092625 A JP H1092625A JP 8240750 A JP8240750 A JP 8240750A JP 24075096 A JP24075096 A JP 24075096A JP H1092625 A JPH1092625 A JP H1092625A
- Authority
- JP
- Japan
- Prior art keywords
- insulating resin
- electronic component
- wire
- conductive wire
- winding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920005989 resin Polymers 0.000 claims abstract description 81
- 239000011347 resin Substances 0.000 claims abstract description 81
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 40
- 238000004804 winding Methods 0.000 claims abstract description 39
- 229920001169 thermoplastic Polymers 0.000 claims abstract description 23
- 239000004416 thermosoftening plastic Substances 0.000 claims abstract description 23
- 239000012212 insulator Substances 0.000 claims abstract description 21
- 239000000696 magnetic material Substances 0.000 claims abstract description 4
- 239000011248 coating agent Substances 0.000 claims description 25
- 238000000576 coating method Methods 0.000 claims description 25
- 238000004519 manufacturing process Methods 0.000 claims description 17
- 238000000034 method Methods 0.000 claims description 11
- 239000000126 substance Substances 0.000 claims description 8
- 229920000728 polyester Polymers 0.000 claims description 5
- 238000000465 moulding Methods 0.000 abstract description 34
- 239000004020 conductor Substances 0.000 abstract description 19
- 238000009413 insulation Methods 0.000 abstract description 5
- 229920002635 polyurethane Polymers 0.000 abstract description 4
- 239000004814 polyurethane Substances 0.000 abstract description 4
- 229910000859 α-Fe Inorganic materials 0.000 abstract description 2
- 230000004927 fusion Effects 0.000 description 10
- 239000007788 liquid Substances 0.000 description 7
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 6
- 229920005992 thermoplastic resin Polymers 0.000 description 6
- 238000005476 soldering Methods 0.000 description 5
- 238000004140 cleaning Methods 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 230000035882 stress Effects 0.000 description 4
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229920000106 Liquid crystal polymer Polymers 0.000 description 2
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000006355 external stress Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- SOGFHWHHBILCSX-UHFFFAOYSA-J prop-2-enoate silicon(4+) Chemical compound [Si+4].[O-]C(=O)C=C.[O-]C(=O)C=C.[O-]C(=O)C=C.[O-]C(=O)C=C SOGFHWHHBILCSX-UHFFFAOYSA-J 0.000 description 1
- 230000002040 relaxant effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Insulating Of Coils (AREA)
- Coils Or Transformers For Communication (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、各種コイル装置、
トランス等を含む電子部品及びその製造方法に関する。[0001] The present invention relates to various coil devices,
The present invention relates to an electronic component including a transformer and a method for manufacturing the same.
【０００２】[0002]
【従来の技術】従来のこの種の電子部品は、周知のよう
に、例えばコアやボビン等の支持部材上に導電線を巻き
つけ、全体を外装絶縁樹脂で被覆した構造をとるのが一
般的である。導電線としては、銅線等でなる導電芯線の
周りに絶縁皮膜を有し、絶縁皮膜の上に、融着被膜を設
けた線材が知られている。かかる構成の導電線を用いた
場合、外装絶縁樹脂としては、熱硬化性絶縁樹脂を用い
る。また、導電線を巻き付けて構成した巻線部と、外装
絶縁樹脂との間には、緩衝層となるアンダーコート層と
して、シリコン樹脂を塗布することも知られている。2. Description of the Related Art As is well known, a conventional electronic component of this type generally has a structure in which a conductive wire is wound around a support member such as a core or a bobbin and the whole is covered with an exterior insulating resin. It is. As the conductive wire, a wire material having an insulating film around a conductive core wire made of a copper wire or the like and providing a fusion coating on the insulating film is known. When a conductive wire having such a configuration is used, a thermosetting insulating resin is used as the exterior insulating resin. It is also known to apply a silicon resin as an undercoat layer serving as a buffer layer between a winding portion formed by winding a conductive wire and an exterior insulating resin.
【０００３】上述した従来の電子部品の問題点は、外装
絶縁樹脂として、熱硬化性絶縁樹脂を用いているため、
外装絶縁樹脂の成型に当たり、射出保持時間と、硬化時
間に長時間を要し、生産性が上がらないことである。熱
硬化性樹脂の成型に要する時間は、熱可塑性樹脂の成型
に要する時間の約７倍程度にもなる。A problem with the above-mentioned conventional electronic parts is that a thermosetting insulating resin is used as an exterior insulating resin.
In molding the exterior insulating resin, a long time is required for the injection holding time and the curing time, and the productivity is not improved. The time required for molding the thermosetting resin is about seven times as long as the time required for molding the thermoplastic resin.
【０００４】この問題を解決する手段として、外装絶縁
樹脂を熱可塑性樹脂で構成することはこれまで検討され
てきた。しかしながら、熱可塑性樹脂の成型温度は、例
えば約３６０℃前後にもなる。これは、熱硬化性樹脂の
成型温度が約８５℃前後であるのに対し、約２５０℃も
高くなることを意味する。しかも、熱可塑性樹脂の成型
圧力は、４９０kgf/cm2にもなり、熱硬化性樹脂の成型
に要する圧力２２kgf/cm2の約２０倍にもなる。熱可塑
性樹脂の高い成型温度及び成型圧力は、巻線部を構成す
る導電線に大きなストレスを与える。このストレスは、
導電線に付着された絶縁皮膜の破壊、導体の変形もしく
は断線、または導体間の短絡など、巻線部にきわめて深
刻な影響を与える。また、高い成型圧力が加わると、導
電線が過度に動き易い状態になるため、巻き姿態が変化
し、インダクタンス値が変動する。[0004] As a means for solving this problem, it has been studied to form the exterior insulating resin with a thermoplastic resin. However, the molding temperature of the thermoplastic resin is, for example, about 360 ° C. This means that the molding temperature of the thermosetting resin is about 85 ° C., whereas it is about 250 ° C. higher. In addition, the molding pressure of the thermoplastic resin is 490 kgf / cm 2, which is about 20 times the pressure required for molding the thermosetting resin of 22 kgf / cm 2 . The high molding temperature and molding pressure of the thermoplastic resin give a large stress to the conductive wire constituting the winding part. This stress is
It has a very serious effect on the winding part, such as destruction of the insulating film attached to the conductive wire, deformation or disconnection of the conductor, or short circuit between the conductors. In addition, when a high molding pressure is applied, the conductive wire is excessively easily moved, so that the winding state changes and the inductance value changes.
【０００５】従来、巻線部と外装絶縁体との間に、緩衝
層となるアンダーコート層として、シリコン樹脂を塗布
していたが、かかるアンダーコート層を有していても、
外装絶縁樹脂として、熱可塑性樹脂を用いた場合、巻線
部の保護に充分なストレス緩和作用を得ることができな
い。Conventionally, a silicone resin has been applied as an undercoat layer serving as a buffer layer between the winding portion and the exterior insulator, but even if such an undercoat layer is provided,
When a thermoplastic resin is used as the exterior insulating resin, it is not possible to obtain a sufficient stress relaxing action for protecting the winding part.
【０００６】特に、導電線として、銅線等でなる導体の
周りに絶縁皮膜を有し、絶縁皮膜の上に、融着被膜を設
けた線材を用いた場合、熱可塑性絶縁樹脂を成型する際
の高温度のために融着被膜が溶融し、その溶融状態に高
い成型圧力が加わるという状態になるため、導電線に付
着された絶縁皮膜の破壊、導体の変形もしくは断線また
は導体間の短絡等の事故をきわめて生じ易くなる。In particular, when a wire having an insulating film around a conductor made of a copper wire or the like as a conductive wire and using a fused film provided on the insulating film is used, when a thermoplastic insulating resin is molded. Due to the high temperature of the molten film, the fused film is melted and a high molding pressure is applied to the molten state, so that the insulating film attached to the conductive wire is broken, the conductor is deformed or broken, or the conductor is short-circuited. Accidents are very likely to occur.
【０００７】[0007]
【発明が解決しようとする課題】本発明の課題は、外装
体成型に要する時間を短縮し、生産性を向上させた電子
部品を提供することである。SUMMARY OF THE INVENTION An object of the present invention is to provide an electronic component in which the time required for molding an outer package is reduced and the productivity is improved.
【０００８】本発明のもう一つの課題は、電子部品に高
い圧力や温度を加えても、導電線に付着された絶縁皮膜
の破壊、導体芯線の変形もしくは断線、または導体芯線
間の短絡等の事故を確実に阻止し得る高信頼度の電子部
品を提供することである。Another object of the present invention is to provide an electronic component that can be subjected to a high pressure or temperature even if a high pressure or temperature is applied thereto, such as destruction of an insulating film attached to a conductive wire, deformation or disconnection of a conductor core wire, or short-circuit between conductor core wires. An object of the present invention is to provide a highly reliable electronic component capable of reliably preventing an accident.
【０００９】本発明の更にもう一つの課題は、安定した
インダクタンス値を確保し得る電子部品を提供すること
である。[0009] Still another object of the present invention is to provide an electronic component capable of securing a stable inductance value.
【００１０】[0010]
【課題を解決するための手段】上述した課題を解決する
ため、本発明に係る電子部品は、巻線部と、支持部材
と、線間絶縁物と、外装体とを含む。前記巻線部は、前
記支持部材に導電線を巻装して構成されている。前記線
間絶縁物は、熱硬化性絶縁樹脂でなり、前記導電線の間
に生じる隙間を埋めている。前記外装体は、全体を被覆
する絶縁樹脂成型体でなる。In order to solve the above-mentioned problems, an electronic component according to the present invention includes a winding part, a support member, a line insulator, and an exterior body. The winding portion is configured by winding a conductive wire around the support member. The interline insulator is made of a thermosetting insulating resin and fills a gap generated between the conductive lines. The exterior body is an insulating resin molded body that covers the entire body.
【００１１】本発明に係る電子部品は、巻線部が熱硬化
性絶縁樹脂でなる線間絶縁物で覆われているから、巻線
部及び熱硬化性絶縁樹脂が一体化された状態で、外部か
ら加わるストレスに対抗する。このため、外装体とし
て、熱可塑性絶縁樹脂を用いた場合でも、高温度及び高
圧力の条件で行なわれる成型工程において、導電線に付
着された絶縁皮膜の破壊、導体芯線の変形もしくは断
線、または導体芯線の短絡などを、熱硬化性絶縁樹脂で
なる線間絶縁物によって、確実に阻止することができ
る。そのため、電子部品全体を熱可塑性絶縁樹脂でなる
外装体で被覆することができる。In the electronic component according to the present invention, since the winding portion is covered with a line insulating material made of a thermosetting insulating resin, the winding portion and the thermosetting insulating resin are integrated. Counter external stress. For this reason, even when a thermoplastic insulating resin is used as the exterior body, in the molding process performed under high temperature and high pressure conditions, the insulating film attached to the conductive wire is broken, the conductor core wire is deformed or broken, or Short-circuiting of the conductor core wire and the like can be reliably prevented by the line insulator made of thermosetting insulating resin. Therefore, the entire electronic component can be covered with the exterior body made of the thermoplastic insulating resin.
【００１２】また、巻線部が熱硬化性絶縁樹脂で構成さ
れた線間絶縁物と一体化されるので、外装体の成型時に
導電線が動くことがない。このため、巻き姿態を良好に
保ち、安定したインダクタンス値を確保し得る。Further, since the winding portion is integrated with the interline insulator made of the thermosetting insulating resin, the conductive wire does not move during molding of the exterior body. For this reason, it is possible to maintain a good winding state and secure a stable inductance value.
【００１３】電子部品全体を熱可塑性絶縁樹脂でなる外
装体で成型した場合、熱可塑性絶縁樹脂の成型に要する
時間は、前述したように、熱硬化性絶縁樹脂の成型に要
する時間よりも著しく短くなる。従って、外装体とし
て、熱可塑性絶縁樹脂を用いることにより、熱硬化性絶
縁樹脂を用いていた従来品に比較して、外装体の成型に
要する時間を著しく短縮し、生産性を向上させることが
できる。熱可塑性絶縁樹脂としては、当該電子部品の使
用温度を考慮し、それに充分に耐え得る溶融温度を有す
るものを使用する。[0013] When the entire electronic component is molded with an exterior body made of a thermoplastic insulating resin, the time required for molding the thermoplastic insulating resin is significantly shorter than the time required for molding the thermosetting insulating resin, as described above. Become. Therefore, by using a thermoplastic insulating resin as the exterior body, it is possible to significantly reduce the time required for molding the exterior body and improve productivity, as compared with a conventional product using a thermosetting insulating resin. it can. As the thermoplastic insulating resin, a resin having a melting temperature sufficient to withstand the use temperature of the electronic component is used.
【００１４】上述した電子部品を製造するための本発明
に係る製造方法は、次のようなプロセスをとる。まず、
導電線を支持部材上に巻装する。このとき、前記導電線
として、導電芯線の周りに絶縁皮膜を有すると共に、前
記絶縁皮膜の上に化学的処理によって除去可能な被覆を
有する線材を用いる。次に、化学的処理によって前記被
覆を除去する。次に、前記被覆を除去した後に生じる隙
間に、熱硬化性絶縁樹脂を塗布し、含浸させ、硬化させ
る。次に、全体を被覆する外装体を、絶縁樹脂を用いて
成型する。この製造方法によれば、本発明に係る電子部
品を容易に製造することができる。The manufacturing method according to the present invention for manufacturing the above-described electronic component employs the following process. First,
The conductive wire is wound on the support member. At this time, a wire having an insulating coating around the conductive core wire and having a coating removable on the insulating coating by a chemical treatment is used as the conductive wire. Next, the coating is removed by a chemical treatment. Next, a thermosetting insulating resin is applied to a gap formed after removing the coating, impregnated, and cured. Next, an exterior body covering the whole is molded using an insulating resin. According to this manufacturing method, the electronic component according to the present invention can be easily manufactured.
【００１５】本発明の他の目的、手段及び利点は実施例
たる添付図面を参照して、更に詳しく説明する。実施例
は本発明の保護範囲について、何ら限定を伴うものでは
ない。Other objects, means and advantages of the present invention will be described in more detail with reference to the accompanying drawings as embodiments. The examples do not limit the scope of protection of the present invention in any way.
【００１６】[0016]
【発明の実施の形態】図１は本発明に係る電子部品の部
分断面図である。本発明に係る電子部品は、巻線部１
と、支持部材２と、線間絶縁物３と、外装体４とを含
む。巻線部１は、支持部材２に導電線５を巻装して構成
される。支持部材２はコア、ボビンまたはそれらの組み
合わせ等であり、任意の形状及び構造をとることができ
る。実施例に示す支持部材２はフェライト磁性材料等を
用いて成型されたコアであり、中間部２１を細くし、そ
の両端につば部２２、２３を設けたいわゆるドラム状の
形状を有する。FIG. 1 is a partial sectional view of an electronic component according to the present invention. The electronic component according to the present invention includes the winding part 1.
, A support member 2, an interline insulator 3, and an exterior body 4. The winding part 1 is configured by winding a conductive wire 5 around a support member 2. The support member 2 is a core, a bobbin, a combination thereof, or the like, and can have any shape and structure. The support member 2 shown in the embodiment is a core molded using a ferrite magnetic material or the like, and has a so-called drum shape in which an intermediate portion 21 is made thin and flange portions 22 and 23 are provided at both ends thereof.
【００１７】導電線５は、芯線となる導体を、絶縁皮膜
によって被覆した構造のものが用いられる。絶縁皮膜の
例としては、ポリウレタン等がある。導電線５の端末50
1、 502は、端子６、７に半田付け等の手段によって接続
されている。端子６、７は上部６１、７１が支持部材２
のつば部２２、２３の外壁面に沿って配置されると共
に、外装体４の内部に固定されている。端子６、７の下
端部６２、７２は、外装体４の外部に導かれており、回
路基板等に面実装された時の半田付け部分として用いら
れる。The conductive wire 5 has a structure in which a conductor serving as a core wire is covered with an insulating film. Examples of the insulating film include polyurethane and the like. Terminal 50 of conductive wire 5
1, 502 are connected to the terminals 6, 7 by means such as soldering. Terminals 6 and 7 have upper portions 61 and 71 supporting members 2.
They are arranged along the outer wall surfaces of the flange portions 22 and 23 and are fixed inside the exterior body 4. The lower ends 62 and 72 of the terminals 6 and 7 are guided to the outside of the exterior body 4 and are used as soldered portions when the semiconductor device is surface-mounted on a circuit board or the like.
【００１８】支持部材２のつば部２２、２３の側端面に
は、電極部２４、２５が形成されており、電極部分２
４、２５に、導電線５の端末501、 502及び端子６、７が
半田付けされている。Electrodes 24 and 25 are formed on the side end surfaces of the flanges 22 and 23 of the support member 2.
Terminals 501 and 502 of the conductive wire 5 and terminals 6 and 7 are soldered to 4 and 25, respectively.
【００１９】線間絶縁物３は、熱硬化性絶縁樹脂でな
り、導電線５の間に生じる隙間を埋めている。線間絶縁
物３を構成する熱硬化性絶縁樹脂の好ましい具体例とし
ては、例えばシリコーンアクリレート絶縁樹脂を挙げる
ことができる。導電線５の間に生じる隙間は、巻線工程
において自然に発生する隙間の他、意図的に生じさせた
隙間も含まれる。隙間を意図的に発生させる手段につい
ては、本発明に係る製造方法の実施例において、詳しく
説明する。The interline insulator 3 is made of a thermosetting insulating resin, and fills a gap formed between the conductive wires 5. Preferable specific examples of the thermosetting insulating resin constituting the line insulator 3 include, for example, a silicone acrylate insulating resin. The gaps generated between the conductive wires 5 include gaps naturally generated in the winding process and gaps intentionally generated. Means for intentionally generating a gap will be described in detail in an embodiment of the manufacturing method according to the present invention.
【００２０】外装体４は熱可塑性絶縁樹脂でなり、全体
を被覆している。外装体４を構成する熱可塑性絶縁樹脂
の具体例としては、液晶ポリマーであるEC301B（日本石
油株式会社製）を挙げることができる。この熱可塑性絶
縁樹脂は、溶融温度が高く、耐熱性に優れている。The exterior body 4 is made of a thermoplastic insulating resin and covers the whole. As a specific example of the thermoplastic insulating resin constituting the exterior body 4, EC301B (manufactured by Nippon Oil Co., Ltd.), which is a liquid crystal polymer, can be mentioned. This thermoplastic insulating resin has a high melting temperature and excellent heat resistance.
【００２１】上述したように、巻線部１が熱硬化性絶縁
樹脂でなる線間絶縁物３で覆われているため、巻線部及
び熱硬化性絶縁樹脂が一体化された状態で、外部から加
わるストレスに対抗する。このため、外装体４として、
熱可塑性絶縁樹脂を用いた場合でも、高温度及び高圧力
の条件で行なわれる熱可塑性絶縁樹脂成型工程におい
て、導電線５に付着された絶縁皮膜の破壊、導体芯線の
変形もしくは断線、または導体芯線の短絡などを、熱硬
化性絶縁樹脂でなる線間絶縁物３によって、確実に阻止
することができる。そのため、上述したように、電子部
品全体を熱可塑性絶縁樹脂でなる外装体４で被覆するこ
とができるようになる。As described above, since the winding portion 1 is covered with the line insulator 3 made of a thermosetting insulating resin, the winding portion and the thermosetting insulating resin are integrated with each other, Against the stress from For this reason, as the exterior body 4,
Even when a thermoplastic insulating resin is used, in the thermoplastic insulating resin molding step performed under high temperature and high pressure conditions, the insulation film attached to the conductive wire 5 is broken, the conductor core wire is deformed or broken, or the conductor core wire is deformed. Can be reliably prevented by the line insulator 3 made of thermosetting insulating resin. Therefore, as described above, the entire electronic component can be covered with the exterior body 4 made of the thermoplastic insulating resin.
【００２２】しかも、巻線部１が熱硬化性絶縁樹脂でな
る線間絶縁物３と一体化されているから、外装体４の成
型時に導電線５が動くことがない。このため、巻線部１
の巻き姿態を良好に保ち、安定したインダクタンス値を
確保し得る。In addition, since the winding portion 1 is integrated with the line insulator 3 made of a thermosetting insulating resin, the conductive wire 5 does not move when the exterior body 4 is molded. Therefore, the winding part 1
Can be maintained in a good winding state and a stable inductance value can be secured.
【００２３】更に、熱可塑性絶縁樹脂の成型に要する時
間は、前述したように、熱硬化性絶縁樹脂の成型に要す
る時間の約1/7倍程度である。従って、外装体４とし
て、熱可塑性絶縁樹脂を用いることにより、熱硬化性絶
縁樹脂を用いていた従来品に比較して、外装体４の成型
に要する時間を約1/7程度に短縮し、生産性を向上させ
ることができる。Further, as described above, the time required for molding the thermoplastic insulating resin is about 1/7 times the time required for molding the thermosetting insulating resin. Therefore, by using a thermoplastic insulating resin as the exterior body 4, the time required for molding the exterior body 4 can be reduced to about 1/7 compared to a conventional product using a thermosetting insulating resin. Productivity can be improved.
【００２４】次に、図２〜図８を参照して、上述した電
子部品を製造するための方法について説明する。Next, a method for manufacturing the above-described electronic component will be described with reference to FIGS.
【００２５】＜巻線工程＞まず、図２に示すように、導
電線５を支持部材２上に巻装する。導電線５としては、
図３に示すように、導電芯線５１の周りに絶縁皮膜５２
を有すると共に、絶縁皮膜５２の上に化学的処理によっ
て除去可能な融着被膜５３を有する線材を用いる。絶縁
皮膜５２の代表例はポリウレタンであり、融着被膜５３
の代表例はポリエステルである。融着被膜５３は自己融
着層と称されることがある。融着被膜５３は、化学的処
理によって除去可能であればよいので、必ずしも、ポリ
エステルである必要はない。実施例では、次のような導
電線５を用いた。 2CWーN4E（理研電線株式会社製） 線径：０．０３mm 導電芯線５１：導線 絶縁皮膜５２：膜厚２μmのポリウレタン 融着被膜５３：膜厚２μmのポリエステル 溶融温度９
０℃<Winding Step> First, as shown in FIG. 2, the conductive wire 5 is wound on the support member 2. As the conductive wire 5,
As shown in FIG.
And a wire having a fusion coating 53 removable on the insulating coating 52 by a chemical treatment. A typical example of the insulating film 52 is polyurethane,
Is a polyester. The fusion coating 53 may be referred to as a self-fusion layer. The fusion coating 53 need not necessarily be polyester, as long as it can be removed by a chemical treatment. In the example, the following conductive wire 5 was used. 2CW-N4E (manufactured by Riken Electric Cable Co., Ltd.) Wire diameter: 0.03 mm Conductive core wire 51: Conductive wire Insulating coating 52: Polyurethane having a thickness of 2 μm Fusion coating 53: Polyester having a thickness of 2 μm Melting temperature 9
0 ° C
【００２６】＜半田付け工程＞次に、図２において、リ
ードフレーム８を切り起して形成された端子６ー７間
に、導電線５を巻装した支持部材２を搭載し、支持部材
２のつば部２２、２３の側端面に形成された電極部２
４、２５にクリ−ムハンダを塗布し、電極部分２４、２
５と、導電線５の端末501、 502と、端子６、７とを、半
田付けにより接続する。図示は省略されているが、前記
リードフレーム８には、その長さ方向（紙面に対して垂
直方向）に沿って、同様の端子６、７が間隔を隔て多数
形成されている。<Soldering Step> Next, in FIG. 2, the support member 2 on which the conductive wire 5 is wound is mounted between terminals 6-7 formed by cutting and raising the lead frame 8. Electrode portion 2 formed on side end surfaces of flange portions 22 and 23
Apply cream solder to 4 and 25, and apply electrode parts 24 and 2
5, the terminals 501 and 502 of the conductive wire 5 and the terminals 6 and 7 are connected by soldering. Although not shown, the lead frame 8 is formed with a large number of similar terminals 6 and 7 at intervals along its length direction (perpendicular to the paper).
【００２７】＜洗浄工程＞次に、化学的処理によって前
記融着被膜５３を除去する。例えば、図４に示すよう
に、シャワー９で塩化メチレン等の洗浄液を巻線部１に
浴びせ、前記融着被膜５３を除去する。この洗浄工程に
おいて、半田工程において付着したフラックス等も洗浄
する。融着被膜５３が除去された後の様子を図５に示
す。間隔Ｇが融着被膜５３の除去によって生じた隙間で
ある。洗浄液として、塩化メチレンを用いた場合、液温
約４０℃で、約３分間の洗浄を行なう。<Cleaning Step> Next, the fused film 53 is removed by a chemical treatment. For example, as shown in FIG. 4, a washing liquid such as methylene chloride is applied to the winding part 1 by a shower 9 to remove the fusion coating 53. In this cleaning step, the flux and the like attached in the soldering step are also cleaned. FIG. 5 shows a state after the fusion coating 53 has been removed. The gap G is a gap generated by removing the fusion coating 53. When methylene chloride is used as the washing solution, washing is performed at a solution temperature of about 40 ° C. for about 3 minutes.
【００２８】＜線間絶縁樹脂塗布工程＞次に、前記融着
被膜５３を除去した後に生じる隙間Ｇに、液状熱硬化性
絶縁樹脂を塗布し、硬化させることにより、線間絶縁物
３を形成する。例えば、図６に示すように、先端に液状
熱硬化性絶縁樹脂３を載せたピン１０を矢印ａ１の方向
に押し上げて、巻線部１の表面に、液状熱硬化性絶縁樹
脂３を塗布する。塗布が終わった後、ピン１０は矢印ｂ
１の方向に降下させる。図７はこのようにして液状熱硬
化絶縁樹脂を塗布した後の状態を示している。<Line Insulating Resin Application Step> Next, a liquid thermosetting insulating resin is applied to the gap G formed after the fusion coating 53 is removed and cured to form the line insulating material 3. I do. For example, as shown in FIG. 6, a pin 10 having a liquid thermosetting insulating resin 3 placed on its tip is pushed up in the direction of arrow a1 to apply the liquid thermosetting insulating resin 3 to the surface of the winding portion 1. . After the application is completed, the pin 10 moves to the arrow b
Lower in the direction of 1. FIG. 7 shows a state after the liquid thermosetting insulating resin is applied in this manner.
【００２９】次に、塗布後に、加熱処理を行ない、巻線
部１に対し、熱硬化性絶縁樹脂３を含浸Ｐ１させる。そ
の後、熱硬化性絶縁樹脂の熱硬化処理を行ない、線間絶
縁物３を形成する。図８は熱硬化処理を終了した後の状
態を示している。Next, after the application, a heat treatment is performed to impregnate the winding portion 1 with the thermosetting insulating resin 3 (P1). Thereafter, a thermosetting treatment of the thermosetting insulating resin is performed to form the line insulator 3. FIG. 8 shows a state after the completion of the thermosetting treatment.
【００３０】熱硬化性絶縁樹脂として、シリコンアクリ
レート絶縁樹脂を用いた実施例において、含浸工程で
は、加熱温度１００℃、加熱時間２０秒の熱処理を行な
い、熱硬化処理工程では、紫外線を15秒間照射した後、
１５０℃で１０分間の加熱硬化処理を行なった。用いら
れたシリコンアクリレート絶縁樹脂は粘度２５０mpa・S
の液状絶縁樹脂である。In the embodiment using a silicon acrylate insulating resin as the thermosetting insulating resin, a heat treatment at a heating temperature of 100 ° C. and a heating time of 20 seconds is performed in the impregnation step, and ultraviolet rays are irradiated for 15 seconds in the thermosetting processing step. After doing
A heat curing treatment was performed at 150 ° C. for 10 minutes. The used silicone acrylate insulating resin has a viscosity of 250 mpa · S
Liquid insulating resin.
【００３１】＜成型工程＞次に、全体を熱可塑性絶縁樹
脂でなる外装体４を成型する。例えば、図９に示すよう
に、熱硬化性絶縁樹脂の熱硬化処理後に、端子６、７の
先端部分６２、７２を除いた全体を熱可塑性絶縁樹脂で
包み込んで、外装体４を成型する。実施例において採用
された成型プロセス条件は次の通りである。 成型条件：インジェクション成型 射出速度：５０mm/s 成型圧力：４９０kg/cm2 シリンダ温度：３６０℃ 金型温度：１１５℃ 成型サイクルタイム：１０秒 熱可塑性絶縁樹脂：液晶ポリマ EC301B（日本石油株式
会社製） 上記プロセス条件に見られるように、熱可塑性絶縁樹脂
の成型に要する時間は１０秒という短い時間である。<Molding Step> Next, the exterior body 4 made entirely of a thermoplastic insulating resin is molded. For example, as shown in FIG. 9, after the thermosetting insulating resin is subjected to the thermosetting treatment, the entirety of the terminals 6 and 7 excluding the tip portions 62 and 72 is wrapped with the thermoplastic insulating resin, and the exterior body 4 is molded. The molding process conditions employed in the examples are as follows. Molding condition: Injection molding Injection speed: 50 mm / s Molding pressure: 490 kg / cm 2 Cylinder temperature: 360 ° C Mold temperature: 115 ° C Molding cycle time: 10 seconds Thermoplastic insulating resin: Liquid crystal polymer EC301B (Nippon Oil Co., Ltd.) As can be seen from the above process conditions, the time required for molding the thermoplastic insulating resin is as short as 10 seconds.
【００３２】熱可塑性絶縁樹脂成型工程では、既に、導
電線５の間に生じる隙間が、熱硬化性絶縁樹脂でなる線
間絶縁物３で埋められているので、導電線５及び熱硬化
性絶縁樹脂でなる線間絶縁物３が一体化された状態で、
上述した高い成型圧力(４９０kg/cm2)及び成型温度(３
６０℃)に起因して発生するストレスに対抗する。この
ため、導電線５に付着された絶縁皮膜５２の破壊、導体
芯線５１（図３参照）の変形もしくは断線、または導体
芯線５１の短絡などを、確実に阻止することができる。
しかも、導電線５が熱硬化性絶縁樹脂でなる線間絶縁物
３と一体化されるので、外装体４の成型時に導電線５が
動くことがない。このため、巻線部１の巻き姿態を良好
に保ち、安定したインダクタンス値を確保し得る。In the thermoplastic insulating resin molding step, the gaps between the conductive wires 5 have already been filled with the line insulator 3 made of a thermosetting insulating resin. In a state where the line insulator 3 made of resin is integrated,
The high molding pressure (490 kg / cm 2 ) and molding temperature (3
60 ° C.). For this reason, it is possible to reliably prevent breakage of the insulating film 52 attached to the conductive wire 5, deformation or disconnection of the conductor core wire 51 (see FIG. 3), or short-circuit of the conductor core wire 51.
In addition, since the conductive wire 5 is integrated with the interline insulator 3 made of a thermosetting insulating resin, the conductive wire 5 does not move when the outer package 4 is molded. For this reason, the winding state of the winding part 1 can be kept good, and a stable inductance value can be secured.
【００３３】最後に、端子６、７を前記リードフレーム
８から切り取れば、図１に示す本発明に係る電子部品を
製造できる。Finally, if the terminals 6 and 7 are cut from the lead frame 8, the electronic component according to the present invention shown in FIG. 1 can be manufactured.
【００３４】[0034]
【発明の効果】以上述べたように、本発明によれば、次
のような効果を得ることができる。 （ａ）外装体の成型に要する時間を短縮し、生産性を向
上させた電子部品を提供することができる。 （ｂ）導電線に付着された絶縁皮膜の破壊、導体芯線の
変形もしくは断線または導体芯線の短絡等の事故を確実
に阻止し得る高信頼度の電子部品を提供することができ
る。 （ｃ）安定したインダクタンス値を確保し得る電子部品
を提供することができる （ｄ）上述した電子部品を製造するのに適した方法を提
供することができる。As described above, according to the present invention, the following effects can be obtained. (A) It is possible to provide an electronic component in which the time required for molding the exterior body is reduced and productivity is improved. (B) It is possible to provide a highly reliable electronic component capable of reliably preventing an accident such as breakage of an insulating film attached to a conductive wire, deformation or disconnection of a conductor core wire, or short circuit of a conductor core wire. (C) An electronic component capable of ensuring a stable inductance value can be provided. (D) A method suitable for manufacturing the above-described electronic component can be provided.
【図１】本発明に係る電子部品の正面部分断面図であ
る。FIG. 1 is a front partial sectional view of an electronic component according to the present invention.
【図２】本発明に係る製造方法において、巻線工程及び
ハンダ付工程の終了後に得られる電子部品の正面部分断
面図である。FIG. 2 is a front partial cross-sectional view of an electronic component obtained after a winding step and a soldering step in the manufacturing method according to the present invention.
【図３】本発明に係る製造方法に用いられる導電線の正
面断面図である。FIG. 3 is a front sectional view of a conductive wire used in the manufacturing method according to the present invention.
【図４】本発明に係る製造方法の洗浄工程を示す正面部
分断面図である。FIG. 4 is a front partial sectional view showing a cleaning step of the manufacturing method according to the present invention.
【図５】本発明に係る製造方法において、洗浄工程終了
後に得られる電子部品の正面部分断面図である。FIG. 5 is a front partial cross-sectional view of an electronic component obtained after a cleaning step is completed in the manufacturing method according to the present invention.
【図６】本発明に係る製造方法の線間絶縁樹脂塗布工程
を示す正面部分断面図である。FIG. 6 is a partial front sectional view showing a step of applying a line insulating resin in the manufacturing method according to the present invention.
【図７】液状熱硬化絶縁樹脂を塗布した後の状態を示す
正面部分断面図である。FIG. 7 is a partial front sectional view showing a state after a liquid thermosetting insulating resin is applied.
【図８】本発明に係る製造方法において、線間絶縁樹脂
塗布工程終了後に得られる電子部品の正面部分断面図で
ある。FIG. 8 is a front partial cross-sectional view of the electronic component obtained after the inter-line insulating resin application step in the manufacturing method according to the present invention.
【図９】本発明に係る製造方法において、成型工程終了
後に得られる電子部品の正面部分断面図である。FIG. 9 is a front partial cross-sectional view of the electronic component obtained after the completion of the molding step in the manufacturing method according to the present invention.
１ 巻線部 ２ 支持部材 ３ 線間絶縁物 ４ 外装体 ５ 導電線 ５１ 導電芯線 ５２ 絶縁皮膜 ５３ 融着被膜 DESCRIPTION OF SYMBOLS 1 Winding part 2 Supporting member 3 Interline insulator 4 Outer body 5 Conductive wire 51 Conductive core wire 52 Insulating coating 53 Fusion coating
Claims (9)
外装体とを含む電子部品であって、 前記巻線部は、前記支持部材に導電線を巻装して構成さ
れ、 前記線間絶縁物は、熱硬化性絶縁樹脂でなり、前記導電
線の間に生じる隙間を埋めており、 前記外装体は、絶縁樹脂成型体でなり、全体を被覆して
いる電子部品。1. A winding part, a support member, a wire insulator,
An electronic component including an exterior body, wherein the winding portion is configured by winding a conductive wire on the support member, wherein the interline insulator is made of a thermosetting insulating resin, An electronic component which fills a gap generated therebetween, and wherein the exterior body is made of an insulating resin molded body and covers the whole.
て、 前記外装体は、熱可塑性絶縁樹脂でなる電子部品。2. The electronic component according to claim 1, wherein the exterior body is made of a thermoplastic insulating resin.
て、 前記導電線は、導電芯線の周りに絶縁皮膜を有し、前記
絶縁皮膜の上に、化学的処理によって除去可能な被覆を
有する線材を出発線材としており、 前記線間絶縁物は、前記出発線材の前記被覆を除去した
後に生じる隙間を埋めている電子部品。3. The electronic component according to claim 1, wherein the conductive wire has an insulating film around a conductive core wire, and a coating that can be removed by a chemical treatment on the insulating film. An electronic component, wherein a wire having the same is used as a starting wire, and the interline insulator fills a gap generated after removing the coating of the starting wire.
て、 前記被覆は、ポリエステルでなる電子部品。4. The electronic component according to claim 3, wherein the coating is made of polyester.
て、 前記支持部材は、磁性材料を含む電子部品。5. The electronic component according to claim 1, wherein the support member includes a magnetic material.
て、導電芯線の周りに絶縁皮膜を有すると共に、前記絶
縁皮膜の上に化学的処理によって除去可能な被覆を有す
るものを用い、 次に、化学的処理によって前記被覆を除去し、 次に、前記被覆を除去した後に生じる隙間に、熱硬化性
絶縁樹脂を塗布し、含浸させ、硬化させ、 次に、全体を被覆する外装体を、絶縁樹脂を用いて成型
する電子部品の製造方法。6. A method for manufacturing an electronic component, comprising: winding a conductive wire on a support member, wherein the conductive wire has an insulating film around a conductive core wire, and Using a coating having a coating that can be removed by a chemical treatment, and then removing the coating by a chemical treatment, and then applying a thermosetting insulating resin to a gap formed after removing the coating, Impregnating and curing, and then a method of manufacturing an electronic component in which an exterior body covering the entire body is molded using an insulating resin.
て、 前記外装体は、熱可塑性絶縁樹脂を用いて成型する7. The manufacturing method according to claim 6, wherein the exterior body is molded using a thermoplastic insulating resin.
て、 前記導電線の前記被覆は、ポリエステルでなる電子部品
の製造方法。8. The method according to claim 6, wherein the covering of the conductive wire is made of polyester.
て、 前記支持部材は、磁性材料を含む電子部品の製造方法。9. The method according to claim 6, wherein the support member includes a magnetic material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24075096A JP3516374B2 (en) | 1996-09-11 | 1996-09-11 | Electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24075096A JP3516374B2 (en) | 1996-09-11 | 1996-09-11 | Electronic components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH1092625A true JPH1092625A (en) | 1998-04-10 |
| JP3516374B2 JP3516374B2 (en) | 2004-04-05 |
Family
ID=17064158
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24075096A Expired - Lifetime JP3516374B2 (en) | 1996-09-11 | 1996-09-11 | Electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3516374B2 (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002343654A (en) * | 2001-05-18 | 2002-11-29 | Matsushita Electric Works Ltd | High-voltage pulse generator and method for manufacturing the same |
| US6956015B2 (en) | 2003-09-16 | 2005-10-18 | Kaneko Chemical Co., Ltd. | Solvent composition for dissolving plastic |
| JP2007096073A (en) * | 2005-09-29 | 2007-04-12 | Tdk Corp | Coil device |
| US7427909B2 (en) | 2003-06-12 | 2008-09-23 | Nec Tokin Corporation | Coil component and fabrication method of the same |
| US7551053B2 (en) | 2003-11-05 | 2009-06-23 | Tdk Corporation | Coil device |
| US7746207B2 (en) | 2003-11-05 | 2010-06-29 | Tdk Corporation | Coil device |
| JP2010225963A (en) * | 2009-03-25 | 2010-10-07 | Sumitomo Electric Ind Ltd | Reactor |
| JP2015230968A (en) * | 2014-06-05 | 2015-12-21 | Tdk株式会社 | Coil component and method of manufacturing the same |
| CN110660568A (en) * | 2018-06-29 | 2020-01-07 | 株式会社村田制作所 | Coil component |
-
1996
- 1996-09-11 JP JP24075096A patent/JP3516374B2/en not_active Expired - Lifetime
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002343654A (en) * | 2001-05-18 | 2002-11-29 | Matsushita Electric Works Ltd | High-voltage pulse generator and method for manufacturing the same |
| US7427909B2 (en) | 2003-06-12 | 2008-09-23 | Nec Tokin Corporation | Coil component and fabrication method of the same |
| US6956015B2 (en) | 2003-09-16 | 2005-10-18 | Kaneko Chemical Co., Ltd. | Solvent composition for dissolving plastic |
| US7551053B2 (en) | 2003-11-05 | 2009-06-23 | Tdk Corporation | Coil device |
| US7746207B2 (en) | 2003-11-05 | 2010-06-29 | Tdk Corporation | Coil device |
| JP2007096073A (en) * | 2005-09-29 | 2007-04-12 | Tdk Corp | Coil device |
| JP2010225963A (en) * | 2009-03-25 | 2010-10-07 | Sumitomo Electric Ind Ltd | Reactor |
| JP2015230968A (en) * | 2014-06-05 | 2015-12-21 | Tdk株式会社 | Coil component and method of manufacturing the same |
| CN110660568A (en) * | 2018-06-29 | 2020-01-07 | 株式会社村田制作所 | Coil component |
| CN110660568B (en) * | 2018-06-29 | 2022-08-23 | 株式会社村田制作所 | Coil component |
| US11476029B2 (en) | 2018-06-29 | 2022-10-18 | Murata Manufacturing Co., Ltd. | Coil component |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3516374B2 (en) | 2004-04-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5099159A (en) | High-voltage insulating system for electric machines | |
| US4616407A (en) | Insulating method for rotary electric machine | |
| JPH06325938A (en) | Winding type coil | |
| CN102347296A (en) | Ceramic chip assembly | |
| JP3516374B2 (en) | Electronic components | |
| JP3301384B2 (en) | Method of manufacturing bead inductor and bead inductor | |
| KR100258675B1 (en) | Coil component and manufacturing method for the same | |
| US3315198A (en) | Coil and lead-in wire connection | |
| CA1036434A (en) | Encapsulation method | |
| US3783181A (en) | Electrical bushing having a stress relieving shield and method of constructing same | |
| FI79419B (en) | METALLFILMSKONDENSATOR SAMT FOERFARANDE FOER FAESTANDE AV LEDARE I ETT POROEST METALLMATERIAL. | |
| JPS5868913A (en) | Inductance element and manufacture thereof | |
| US6337615B1 (en) | Electrical coil, especially for a relay, and method for producing the same | |
| US3047935A (en) | Method of making toroidal coils | |
| JP2930273B2 (en) | Manufacturing method for windings of electromagnetic induction equipment | |
| JP2985757B2 (en) | Method of assembling feed-through ceramic capacitor | |
| JP2677869B2 (en) | Assembling method of connection box for power cable | |
| EP1178502A2 (en) | Improved high voltage transformer | |
| JP2001028854A (en) | Stator coil for rotating electric machine | |
| JPS5843152A (en) | Coil for high voltage rotary electric machine | |
| JPS6025866Y2 (en) | inductance element | |
| JPH0770388B2 (en) | coil | |
| JPH0963863A (en) | Converter transformer | |
| JPH0436905A (en) | Shielding wire for pressure welding | |
| JPH0318253A (en) | Connecting method for lead wire |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20040114 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20040116 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090130 Year of fee payment: 5 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100130 Year of fee payment: 6 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110130 Year of fee payment: 7 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110130 Year of fee payment: 7 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120130 Year of fee payment: 8 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120130 Year of fee payment: 8 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130130 Year of fee payment: 9 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130130 Year of fee payment: 9 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140130 Year of fee payment: 10 |
|
| EXPY | Cancellation because of completion of term |