JPH1092980A - Wireless card and method of manufacturing the same - Google Patents

Abstract

(57) [Problem] To provide a wireless card having high mechanical strength, excellent surface flatness, and sufficient flexibility. SOLUTION: An internal module section including an IC module (3) and an antenna (1), a first resin layer disposed on the internal module section, and a second resin layer disposed below the internal module section. And a resin layer. At least one of the first and second resin layers contains fibers made of an inorganic or organic material.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wireless card capable of transmitting and receiving various types of information data and a method for manufacturing the same.

[0002]

2. Description of the Related Art Conventionally, IC cards and magnetic cards have been known as cards for transmitting and receiving information data. Recently, wireless cards capable of transmitting and receiving more information data have begun to spread. Generally, as shown in FIGS. 3 and 4, a wireless card has an I-card inside a flat card body.
In this configuration, a C module 3 and an antenna 1 in which a conductive wire is wound a plurality of times in a coil shape are sealed with a resin 4. Examples of a method for manufacturing such a wireless card include a method in which an IC module 3, an antenna 1, and a resin 4 are arranged between two films 2 each having a printing surface on the surface, and compression molding is performed using a mold heated from above and below. There are known transfer molding and injection molding methods.

As a card material constituting a conventional IC card, magnetic card or other information card, a rigid vinyl chloride laminate, which is a thermoplastic resin, is used. For example, an IC card is embedded in the card material. The recess is formed, and the IC module is buried in the recess. Since the recess for embedding here is formed by using a means such as an end mill, there is a problem that cutting is required, and the production efficiency is low. To solve this problem,
It has been proposed to produce an IC card material by an injection molding method (Japanese Patent Application Laid-Open No. 5-286292). However, when a thin product such as a wireless card is manufactured using transfer molding or injection molding, it is necessary to form a recess for embedding an IC module. Must be devised complicatedly. Also, when manufacturing wireless cards,
There is a disadvantage that there is a high risk that the antenna and the wiring of the IC chip to be housed inside are damaged or damaged during molding due to the flow of the molten resin. Considering these, the compression molding method is most preferable in the production of the wireless card from the viewpoint that no complicated device is required for the cavity of the mold and the like, and there is no possibility that the antenna or the like is damaged by the molten resin.

On the other hand, conventionally, as a resin material used for encapsulating a semiconductor chip, an epoxy molding material mainly composed of an epoxy resin and a filler (composition ratio: 10: 90% by weight) has been known. It is generally manufactured by a transfer molding method in which a resin is heated and melted. The resin-curable semiconductor device manufactured by this method has high reliability because the semiconductor chip is completely covered with the epoxy resin composition, has a good appearance, and has no problem. As described above, the epoxy resin is an extremely useful resin as a resin for semiconductor encapsulation, and therefore, it is considered that the epoxy resin is also applied to the manufacture of a wireless card.

[0005]

However, since a wireless card needs to be displayed and printed on the card surface, the card surface is required to have high-precision flatness without unevenness. Furthermore, since the wireless card is likely to be handled in the same manner as a general card, the wireless card needs to have strength and restoring force that can endure even when a considerable bending load is applied. Is required.

That is, unlike a resin-encapsulated semiconductor device, a wireless card having a small thickness requires flatness and flexibility on the surface in addition to mechanical strength. For this reason,
Even if a method of manufacturing a resin-sealed semiconductor device using an epoxy resin is applied, it has been difficult to manufacture a wireless card having satisfactory characteristics.

[0007] When a wireless card is manufactured by the compression molding method, an uncured thermosetting resin sheet conveyed up and down the IC module is wound into a roll before molding in order to improve production efficiency. There is a need. Although the production efficiency is improved by continuously supplying the resin sheet wound in a roll shape as described above, the roll-shaped resin sheet may cause blocking.

An object of the present invention is to solve the above-mentioned problems and to provide a wireless card having high mechanical strength, excellent surface flatness, and sufficient flexibility. Another object of the present invention is to provide a method for efficiently manufacturing a wireless card having high mechanical strength and excellent surface flatness and flexibility by a heat compression molding method using a thermoplastic resin.

[0009]

According to the present invention, there is provided an internal module portion including a semiconductor element and an antenna, a first resin layer disposed on the internal module portion, A second resin layer disposed below the internal module portion, wherein at least one of the first and second resin layers contains a fiber made of an inorganic or organic material. A wireless card is provided.

[0010] The present invention also provides a step of applying a resin or a resin composition containing a resin and an inorganic filler to a fiber woven fabric made of an inorganic or organic material to form a composite sheet; A step of arranging the composite sheet so that the fiber layer is on the module section side above and below the internal module section including the module section, to obtain a composite sheet / internal module section / composite sheet laminated structure;
Subjecting the laminated structure of the composite sheet / internal module / composite sheet to heat and pressure treatment to embed and integrate the internal module in a resin or a resin composition containing a resin and an inorganic filler. A method for manufacturing a wireless card is provided.

Hereinafter, the present invention will be described in detail. FIG.
It is sectional drawing which shows an example of the wireless card of this invention typically. As shown, in the wireless card of the present invention, I
The C module 3 and the antenna 1 are arranged in a resin layer 6 including a fiber layer 5, and the outermost surface is covered with a film 2.

Such a wireless card can be manufactured using the fiber layer 5 and the resin layer 6, for example, as shown in FIG. That is, the IC module 3 and the antenna 1 serving as the internal module are arranged at predetermined positions, and a composite sheet having a laminated structure of the fiber layer 5 and the resin layer 6 is supplied to the upper and lower portions thereof by rollers (not shown).

When the composite sheet is arranged above and below the internal module portion, the sheet is cut into a predetermined card size by, for example, a punching cutter or the like, and then heated and compressed to be integrally formed. The size of the card can be, for example, 70 × 100 mm, but is not limited thereto, and can be appropriately selected according to the size of the card to be applied.
In addition, the conditions of heating and compression depend on the thickness and dimensions of the card, the type of resin used, and the like, but are usually 90 to 180 ° C and 1 to 1 ° C.
It is about 10 HPa.

Finally, the wireless card is completed by covering the film 2 on the upper and lower sides. As shown in the figure, the composite sheet composed of the fiber layer 5 and the resin layer 6 before molding is wound in a roll, but in the present invention, the fiber layer 5 is always sandwiched between the resin layers. There is no risk of blocking. Moreover, since the composite sheet can be continuously supplied by being wound into a roll, a wireless card can be manufactured efficiently.

Although the resin layer 6 is a single layer in the example shown in FIG. 2, the present invention is not limited to this, and a plurality of resin sheets may be used in a multi-layer form. For example, a thermosetting resin can be disposed on the side that is in contact with the fiber layer 5, and a thermosetting resin film having various characteristics can be used on the side that is not in contact with the fiber layer 5.

In the wireless card of the present invention, the main matrix of the resin composition constituting the resin layers disposed above and below the IC module is not particularly limited, and any resin can be used. From the viewpoint, a thermosetting resin is desirable. Furthermore, in the resin composition,
Various other additives such as a curing agent, a curing accelerator, an inorganic filler, a low stress additive, a flame retardant, a release agent, and a colorant may be blended.

The thermoplastic resin is not particularly limited as long as it produces a three-dimensionally cross-linked cured product by heating, but is preferably an epoxy-based or maleimide-based resin, or a thermoset of these composites. Resins.

Here, any epoxy resin may be used as long as it has two or more epoxy groups in one molecule. For example, biphenyl type epoxy resin, phenol novolak type epoxy resin, cresol novolak type epoxy resin, naphthol novolak type epoxy resin, bisphenol A type epoxy resin, glycidyl ester type epoxy resin, glycidylamine type epoxy resin, alicyclic epoxy resin, phenol Or a tris (hydroxyphenyl) alkane-based epoxy resin, a tetra (hydroxyphenyl) alkane-based epoxy resin obtained by epoxidizing a condensate of an alkylphenol and a hydroxybenzaldehyde, 2,2
', 4,4'-tetraglycidylbenzophenone, triglycidyl ether of para-aminophenol, 1,3
5-triglycidyl etherified benzene, and 2,2
', 4,4'-tetraglycididoxybenzene and the like. These resins may be used alone or in combination of two or more.

On the other hand, as the maleimide resin, any resin can be used as long as it has two or more imide groups in one molecule. For example, N, N represented by the following general formula (1) can be used. '-Substituted bismaleimide compounds and poly (phenylmethylene) polymaleimides represented by the following general formula (2).

[0020]

Embedded image

In the above general formula (1), X is an alkylene group,
It is a divalent hydrocarbon group linked by a divalent atomic group such as a cycloalkylene group, a monocyclic or polycyclic arylene group.

[0022]

Embedded image

In the general formula (2), n is an integer of 1 to 6. More specifically, N, N'-phenylenebismaleimide, N, N'-hexamethylenebismaleimide,
N, N'-oxy-di-p-phenylene bismaleimide, N, N'-4,4'-benzophenone bismaleimide, N, N'-p-diphenylene sulfone bismaleimide, and poly (phenylmethylene) polymaleimide And the like.

In the present invention, the above-described epoxy resin and maleimide resin may be used alone or in combination with each other.
These resins may be used in combination, or a curing agent may be added to these resins. In this case, the curing agent is not particularly limited, and examples thereof include a phenol resin, an organic acid anhydride, and amines.

The amount of the epoxy resin and the curing agent such as a phenol resin is such that the ratio of the reactive functional group equivalent of the curing agent to the epoxy equivalent of the epoxy resin (reactive functional group equivalent / epoxy equivalent) is 0.5 or more. It is preferable that the content is defined so as to fall within the range of 1.5 or less. If this value is less than 0.5, the curing reaction is unlikely to occur sufficiently, while if it exceeds 1.5,
The properties of the cured resin, especially the moisture resistance, are likely to deteriorate. The reactive functional group equivalent of the curing agent is a phenolic hydroxyl group equivalent when the curing agent is a phenol resin, and an active hydrogen equivalent when the curing agent is an amine compound.

Further, when a maleimide resin is used by being mixed with an epoxy resin, the compounding amount is preferably 20 to 80% by volume based on the total amount of the resin matrix containing the epoxy resin and the curing agent. preferable. When the content is less than 20% by volume, it is difficult to sufficiently obtain the effect of blending the imide matrix such as the heat resistance of the cured product.
If the ratio exceeds the above range, the curing reaction of the epoxy resin-curing agent system may be inhibited, and the moldability of the resin composition may be reduced.

A curing catalyst may be further added to such a resin in order to accelerate the curing reaction. The curing catalyst is not particularly limited, for example, various amines,
Examples include imidazoles, diazabicycloalkenes, organic phosphines, zirconium alcoholates, zirconium chelates, and the like. Specifically, the amines include N, N'-dimethylcyclohexylamine, N
-Methyldicyclohexylamine, triethylenediamine, diaminodiphenylsulfone, dimethylaminomethylphenol, benzyldimethylamine, and trisdimethylaminomethylphenol, and the like, and as imidazoles, 2-methylimidazole, 2-phenylimidazole, heptadecylimidazole , 2-heptadecylimidazole, 2-ethylimidazole, 2-ethyl-4-methylimidazole and the like. Further, as diazabicycloalkenes, 1,8
-Diazabicyclo (5,4,0) undecene-7 (DB
U), and phenol salts of DBU (eg, U-CA
TSA No. 1) and the like, and examples of the organic phosphine include triphenylphosphine (TPP), tributylphosphine, tricyclohexylphosphine, and methyldiphenylphosphine. Among these curing accelerators, triphenylphosphine and heptadecyl imidazole are particularly preferred from the viewpoint of electrical properties.

The amount of the curing agent is 0.1 to 10% by volume based on the resin matrix containing the epoxy resin and the curing agent.
And more preferably 1.0 to 5.0% by volume. If the content is less than 0.1% by volume, it is difficult to sufficiently promote the curing reaction rate, and the moldability may be reduced. On the other hand, if it exceeds 10% by volume, the heat resistance, moisture resistance and electrical properties of the cured resin will be significantly reduced, and will also adversely affect the maleimide cured system, leading to a reduction in moldability.

It is preferable that the thermosetting resin used in the present invention contains a powdery inorganic filler because the flatness of the card surface is improved. Examples of the inorganic filler that can be used include quartz glass, crystalline silica, fused silica, glass, alumina, calcium silicate, barium sulfate, magnesia, silicon nitride, aluminum nitride, aluminum oxide, magnesium oxide, mica, and metal. No. These shapes can be determined according to the purpose. In order to reduce the viscosity of the resin, it is preferable to use a spherical or subspherical shape, while, in order to further improve the strength of the resin, crushing It is preferred to use fumed silica. At the time of melt molding, it is preferable to use a filler having a particle size of 100 μm or more cut so that the resin composition is easily impregnated into the fiber layer.

The amount of the filler is preferably 20% by volume or more in the resin composition. If it is less than 20% by volume, it is difficult to make the card surface sufficiently flat, and the average surface roughness may exceed 50 μm. If the surface average roughness of the card surface exceeds 50 μm, a problem occurs when printing is performed on the card surface. As described above, since the addition of the inorganic filler has an effect of contributing to the flatness of the card surface, for example, a plurality of resin sheets prepared by changing the content of the filler are prepared, and the vicinity of the card surface is prepared. The sheet may be multi-layered so that the content of the inorganic filler increases as the sheet becomes, and a laminated resin sheet in which the filler content is inclined may be used.

Further, in the present invention, a low-stress additive may be used in order to relieve the mechanical stress and thermal stress accompanying the curing or thermal shrinkage of the resin, and a synthetic rubber is usually used. Examples of the synthetic rubber include butadiene styrene rubber, butyl rubber, nitrile rubber, chloroprene rubber, urethane rubber, silicone rubber, fluorine rubber and stereo rubber, and these can be used alone or in combination of two or more.

The amount of the low-stress additive varies depending on the specifications of the card to be applied and the like. Generally, when the epoxy resin plus the inorganic filler is 100% by volume,
It is about 1 to 90% by volume, preferably about 20 to 80% by volume. If the amount of the synthetic rubber is too large, the flatness and mechanical strength of the surface of the card forming the molded body tend to decrease. On the other hand, when the composition is not added or the addition amount is too small, the composition is rigid and loses flexibility, and the flexural strength and flexibility determined as a wireless card are reduced, so that the composition may not be satisfied. In addition, the standard is a long side of 20 mm and a short side of 10 m in JIS × 6303.
The function is not affected even if bending is performed 1,000 times in total, 250 times on the front and back sides in m.

In the present invention, a flame retardant may be added to the resin composition, and examples thereof include halogen-based, phosphorus-based and inorganic flame retardants. Halogen-based flame retardants are mainly classified into bromine-based and chlorine-based flame retardants, and bromine-based flame retardants have the advantage of a higher flame-retardant effect than chlorine-based flame retardants, and have a greater effect of being used in combination with antimony trioxide. Chlorine-based paraffins are mentioned as preferred chlorine-based flame retardants. As the halogen-based flame retardant, a brominated bisphenol A type epoxy resin is particularly preferable from the viewpoint of card moldability.

The amount of the flame retardant was 100% by volume of the total composition.
Is preferably about 1 to 10% by volume.
The resin sheet used in the present invention can be easily prepared by sufficiently mixing the above-described components with a mixer such as a Henschel mixer to obtain a resin composition, and then performing a melt-mixing process using a hot roll. it can. The thickness of the resin sheet can be appropriately determined according to the standard of the card to be applied, and is usually about 0.05 to 0.30 mm. The sheet thickness can be controlled by adjusting the gap between the rolls.

Next, the fibers contained in the resin layer of the wireless card of the present invention will be described in detail. The fibers contained in the resin layer are not particularly limited as long as they are fibers generally called compound fibers and inorganic fibers.Specifically, acrylic fibers, acetate fibers, aramid fibers, nylon, novoloid fibers, Examples include pulp, rayon, vinylidene fiber, vinylon, fluorine fiber, promix fiber, polyacetal fiber, polyurethane fiber, polyester fiber, polyethylene fiber, polyvinyl chloride fiber, polyclar fiber, polynosic fiber, polypropylene fiber and various polymer fibers. Also,
As inorganic fibers, alumina fibers, glass fibers,
Examples thereof include silicon carbide fibers, carbon fibers, boron fibers, and various ceramic fibers.

In the wireless card of the present invention, even when these fibers are present alone in the resin layer, if the fibers penetrate from the end face of the card to the opposite end face,
This is effective because it is possible to detect forgery of the card by observing the end face.

However, when the above-mentioned fibers are contained in the resin layer alone or at a low fiber density, or when the fibers are contained in the resin layer in a random state,
It is difficult to sufficiently obtain the effects claimed in the present invention. Thus, in the present invention, the fibers are preferably present in a layered form in the resin layer of the wireless card, and most preferably, woven or nonwoven fibers are used. Among the above, considering the thermal stress applied to the inside of the card, inorganic fibers are more preferable than organic fibers,
Glass woven fabrics are most preferred because they are available at low cost.

Examples of the glass woven fabric include various glass materials and fiber diameters. For use in the thin wireless card of the present invention, a finely woven and thin glass woven fabric is desirable. Table 1 below shows specific examples of such a glass woven fabric.
And 2.

[0039]

[Table 1]

[0040]

[Table 2]

In Table 2, the strength is the tensile strength against the shear strength. In addition, these glass woven fabrics are usually used after being subjected to a surface treatment with a coupling agent or the like to increase wettability with a resin. As coupling agents, epoxy silane, methacryl silane, amino silane,
And heat-resistant silanes.

The content of the fiber as described above is desirably set so as to be 20% by volume or less in the entire resin composition occupying the inside of the card. If the content exceeds 20% by volume, the fiber layer may undulate during the pressure molding step, and the flatness of the card surface may be reduced. If the flatness of the card surface is reduced, it becomes difficult to print well on the surface.

The wireless card of the present invention can be printed using various methods suitable for the layer to be printed, such as a method using a ribbon or the like, a thermal transfer method, an ink jet method, and the like. Also when used, the surface average roughness of the card surface is preferably 50 μm or less. 50
If it exceeds μm, when printing at a density exceeding 400 dpi, there is a possibility that printouts, photographs, etc. may be missing and noticeable omissions may occur.

It should be noted that the I used for the wireless card of the present invention
Normal TCP or TS as C module and antenna
A thin package such as an OP provided with a winding coil can be used.

Since the wireless card of the present invention contains fibers in the resin layer, the flatness of the surface is large, and display and printing can be performed well. In addition, since it has sufficient flexibility, it can withstand a considerable bending load during use and can be restored without any damage.

In particular, when a woven or nonwoven fabric is used as the fiber layer, the semiconductor element and the antenna element to be embedded can be prevented from being inclined and exposed to the surface during molding, and can be completely embedded.

Further, since the composite sheet including the resin sheet and the fiber layer does not cause any blocking even when wound in a roll shape, after continuously supplying such a composite sheet onto the IC module, it is heated and compressed. By doing so, a wireless card excellent in flatness and flexibility can be efficiently manufactured.

[0048]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in more detail with reference to examples and comparative examples. First, a resin composition was prepared using the following components. First epoxy resin: Epicoat 825 (manufactured by Yuka Shell Epoxy, bisphenol A type), epoxy equivalent 172 to 178 Second epoxy resin: YX-4000H (manufactured by Yuka Shell Epoxy, biphenyl type), epoxy Equivalent 192 Maleimide resin: MB-3000H (manufactured by Mitsubishi Chemical Corporation) Acid anhydride: MH-700 (manufactured by Shin Nippon Rika Co., Ltd., methylhexahydrophthalic anhydride), equivalent weight 85 Phenol resin: BRG-555 (manufactured by Showa Polymer Co., Ltd.) , Novolak resin) Hydroxy group equivalent 104 Curing accelerator: N, N'-dimethylbenzylamine (DMBA) Fused silica: GR-80AK Low stress additive: TSF-451 (manufactured by Toshiba Silicone Co., Ltd., silicone rubber) , The mixing ratio (% by volume) shown in Table 3 below
Were mixed by using the above-mentioned procedures to obtain ten kinds of resin compositions of Resin A to Resin J. After sufficiently mixing using a Henschel mixer, the mixture was melt-kneaded by a heated roll. At this time, the sheet thickness is adjusted to 0.1 to 0.25 by adjusting the gap between the rolls.
mm.

[0049]

[Table 3]

The obtained resin is combined with a glass woven fabric or a polyester non-woven fabric as a fiber layer 5 as shown in Tables 4 to 6 below to form a composite sheet, and as shown in FIG. Arranged up and down. After that, the composite sheet is 70
The wireless cards of Examples 1 to 12 were cut to a size of × 100 mm and heated and compressed under the conditions shown in the table.

The glass woven fabric LPC100 used here as the fiber layer 5 has the properties shown in Tables 1 and 2, and the polyester nonwoven fabric has a thickness of 0.07 mm and an apparent density of 0.3. 43 g / cm ³ of H81
03 (manufactured by Japan Vilene Co., Ltd.). Also, semiconductor IC
, And a coil was used as the antenna.

[0052]

[Table 4]

[0053]

[Table 5]

[0054]

[Table 6]

Further, resin F containing a large amount of fused silica
And cards of Comparative Examples 1 and 2, respectively, using only the sheet of resin G and the conditions shown in Table 6.
The flatness and flexibility of the surfaces of the wireless cards of Examples 1 to 12 and Comparative Examples 1 and 2 produced as described above were evaluated by the following method, and the surfaces were observed. (1) Measurement of surface flatness: A card after thermosetting molding was placed on a standard, and a gap was measured on the card surface from four directions using a gap gauge. (2) Flexibility test: 20 m in the long side direction of the molded card
m, bending of 10 mm in the short side direction was observed 250 times on each of the front and back sides, and occurrence of cracks and bending of the card were observed for each resin. After the test, the one that did not change from the state before the test was “OK”, and the one in which the card was broken or cracked was “NG”. (3) Surface observation: The surface and side surfaces of the molded card were visually observed to determine whether the antenna was exposed.

Further, the resin / glass woven fabric sheet was wound into a roll and left at 40 ° C. for 168 hours, and the presence or absence of blocking was observed. In the comparative example, only the resin sheet was observed in the form of a roll. The obtained result is
Table 7 below summarizes the evaluation results.

[0057]

[Table 7]

As shown in Table 7, the present invention (Examples 1 to 5)
Most of the wireless cards 12) are highly filled resin compositions (F, G) by blending a large amount of fused silica.
The surface flatness is equal to or better than that of the comparative example using. In particular, the samples of Examples 6 and 7 using the resin sheet containing the same amount of the inorganic filler as the comparative example are:
The gap gauge showed 20 μm or less, and the surface flatness was extremely good.

Further, it can be seen that the wireless card of the present invention has sufficient flexibility, no blocking occurs at all, and the effect of the fiber layer is large. Further, since the antenna is sandwiched from above and below by a fiber layer such as a glass woven fabric, the antenna is not exposed at all. Therefore, a highly reliable wireless card without distortion or the like was obtained.

On the other hand, the sample of the comparative example having no fiber layer is inferior in flexibility and also has blocking. In the sample of Comparative Example 1, exposure of the antenna was observed.

[0061]

As described in detail above, according to the present invention,
A wireless card having high mechanical strength, excellent surface flatness, and sufficient flexibility is provided. Further, according to the present invention, there is provided a manufacturing method capable of efficiently manufacturing a wireless card satisfying all the conditions of mechanical strength, surface flatness, and flexibility by continuous heating and compression molding. INDUSTRIAL APPLICABILITY The wireless card of the present invention can be displayed and printed well on its surface and has high reliability, and is effective for transmitting and receiving information data.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view illustrating an example of a wireless card of the present invention.

FIG. 2 is a schematic view for explaining a method of manufacturing a wireless card according to the present invention.

FIG. 3 is a perspective view showing a configuration of a conventional wireless card.

FIG. 4 is a sectional view showing a configuration of a conventional wireless card.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Antenna 2 ... Surface film 3 ... IC module 4 ... Card molding resin 5 ... Fiber layer 6 ... Resin layer

 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Tetsuo Okuyama 1 Toshiba-cho, Komukai Toshiba-cho, Saisaki-ku, Kawasaki-shi, Kanagawa Inside the R & D Center of Toshiba Corporation

Claims (4)

[Claims] 1. An internal module section including a semiconductor element and an antenna, a first resin layer disposed on the internal module section, and a second resin layer disposed under the internal module section. A wireless card comprising: at least one of the first and second resin layers containing a fiber made of an inorganic or organic material. 2. An inorganic filler made of fine particles is contained in at least one of the first and second resin layers.
The wireless card according to claim 1, wherein the content of the wireless card is 0% by volume or more. 3. The wireless card according to claim 1, wherein the occupation ratio of the fibers contained in the resin layer is 20% by volume or less. 4. A step of applying a resin or a resin composition containing a resin and an inorganic filler on a fiber layer made of an inorganic or organic material to produce a composite sheet; and an internal module portion including a semiconductor element and an antenna. A step of arranging the composite sheet so that the fiber layer is on the module section side above and below to obtain a composite sheet / internal module section / composite sheet laminated structure; and the composite sheet / internal module section / composite. Heat and pressure treatment is applied to the laminated structure of the sheet to make the internal module part,
Embedding and integrating in a resin or a resin composition containing a resin and an inorganic filler.