JPH11103129A - 垂直空洞面発光レーザ及びその製造方法 - Google Patents
垂直空洞面発光レーザ及びその製造方法Info
- Publication number
- JPH11103129A JPH11103129A JP10218889A JP21888998A JPH11103129A JP H11103129 A JPH11103129 A JP H11103129A JP 10218889 A JP10218889 A JP 10218889A JP 21888998 A JP21888998 A JP 21888998A JP H11103129 A JPH11103129 A JP H11103129A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- mirror
- vcsel
- layers
- region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
- H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
- H01S5/18308—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL] having a special structure for lateral current or light confinement
- H01S5/18311—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL] having a special structure for lateral current or light confinement using selective oxidation
- H01S5/18313—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL] having a special structure for lateral current or light confinement using selective oxidation by oxidizing at least one of the DBR layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
- H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
- H01S5/18308—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL] having a special structure for lateral current or light confinement
- H01S5/18311—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL] having a special structure for lateral current or light confinement using selective oxidation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
- H01S5/2205—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers
- H01S5/2206—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers based on III-V materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
- H01S5/2205—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers
- H01S5/2222—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers having special electric properties
- H01S5/2227—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers having special electric properties special thin layer sequence
- H01S5/2228—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers having special electric properties special thin layer sequence quantum wells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/2054—Methods of obtaining the confinement
- H01S5/2081—Methods of obtaining the confinement using special etching techniques
- H01S5/2086—Methods of obtaining the confinement using special etching techniques lateral etch control, e.g. mask induced
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/42—Arrays of surface emitting lasers
- H01S5/423—Arrays of surface emitting lasers having a vertical cavity
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Geometry (AREA)
- Semiconductor Lasers (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US911,708 | 1986-09-26 | ||
| US08/911,708 US5896408A (en) | 1997-08-15 | 1997-08-15 | Near planar native-oxide VCSEL devices and arrays using converging oxide ringlets |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH11103129A true JPH11103129A (ja) | 1999-04-13 |
Family
ID=25430725
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10218889A Pending JPH11103129A (ja) | 1997-08-15 | 1998-08-03 | 垂直空洞面発光レーザ及びその製造方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US5896408A (fr) |
| EP (1) | EP0898344A3 (fr) |
| JP (1) | JPH11103129A (fr) |
| KR (1) | KR19990023547A (fr) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004063969A (ja) * | 2002-07-31 | 2004-02-26 | Victor Co Of Japan Ltd | 面発光レーザ |
| JP2007103544A (ja) * | 2005-10-03 | 2007-04-19 | Ricoh Co Ltd | 面発光レーザ及び面発光レーザアレイ及び光伝送システム及びレーザプリンタ書き込みシステム |
| JP2007258600A (ja) * | 2006-03-24 | 2007-10-04 | Furukawa Electric Co Ltd:The | 面発光レーザ素子および面発光レーザ素子の製造方法 |
| JP2008530774A (ja) * | 2005-02-07 | 2008-08-07 | サントル、ナショナール、ド、ラ、ルシェルシュ、シアンティフィク、(セーエヌエルエス) | 局所的な埋込み絶縁体を形成するためのプレナー酸化方法 |
| US7580436B2 (en) | 2003-09-18 | 2009-08-25 | Seiko Epson Corporation | Surface-emitting type semiconductor laser and method for manufacturing the same |
| US7879632B2 (en) | 2007-07-31 | 2011-02-01 | Canon Kabushiki Kaisha | Method for manufacturing surface-emitting laser |
Families Citing this family (85)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5719891A (en) | 1995-12-18 | 1998-02-17 | Picolight Incorporated | Conductive element with lateral oxidation barrier |
| US5978408A (en) | 1997-02-07 | 1999-11-02 | Xerox Corporation | Highly compact vertical cavity surface emitting lasers |
| US6304588B1 (en) * | 1997-02-07 | 2001-10-16 | Xerox Corporation | Method and structure for eliminating polarization instability in laterally-oxidized VCSELs |
| US6480516B1 (en) * | 1999-03-31 | 2002-11-12 | Japan As Represented By Secretary Of Agency Of Industrial Science And Technology | Surface semiconductor optical amplifier with transparent substrate |
| JP2000307190A (ja) | 1999-04-23 | 2000-11-02 | Furukawa Electric Co Ltd:The | 面発光型半導体レーザの作製方法 |
| US7881359B2 (en) * | 1999-04-23 | 2011-02-01 | The Furukawa Electric Co., Ltd | Surface-emission semiconductor laser device |
| US7368316B2 (en) * | 1999-04-23 | 2008-05-06 | The Furukawa Electric Co., Ltd. | Surface-emission semiconductor laser device |
| US7095767B1 (en) * | 1999-08-30 | 2006-08-22 | Research Investment Network, Inc. | Near field optical apparatus |
| US6411638B1 (en) | 1999-08-31 | 2002-06-25 | Honeywell Inc. | Coupled cavity anti-guided vertical-cavity surface-emitting laser |
| US6577658B1 (en) * | 1999-09-20 | 2003-06-10 | E20 Corporation, Inc. | Method and apparatus for planar index guided vertical cavity surface emitting lasers |
| US6545335B1 (en) * | 1999-12-27 | 2003-04-08 | Xerox Corporation | Structure and method for electrical isolation of optoelectronic integrated circuits |
| US6548908B2 (en) * | 1999-12-27 | 2003-04-15 | Xerox Corporation | Structure and method for planar lateral oxidation in passive devices |
| US6674090B1 (en) * | 1999-12-27 | 2004-01-06 | Xerox Corporation | Structure and method for planar lateral oxidation in active |
| US6621844B1 (en) | 2000-01-18 | 2003-09-16 | Xerox Corporation | Buried oxide photonic device with large contact and precise aperture |
| US6936900B1 (en) | 2000-05-04 | 2005-08-30 | Osemi, Inc. | Integrated transistor devices |
| NL1015714C2 (nl) * | 2000-07-14 | 2002-01-15 | Dsm Nv | Werkwijze voor het kristalliseren van enantiomeer verrijkt 2-acetylthio-3-fenylpropaanzuur. |
| US6658040B1 (en) * | 2000-07-28 | 2003-12-02 | Agilent Technologies, Inc. | High speed VCSEL |
| US6573528B2 (en) * | 2000-10-12 | 2003-06-03 | Walter David Braddock | Detector diode with internal calibration structure |
| US6990135B2 (en) * | 2002-10-28 | 2006-01-24 | Finisar Corporation | Distributed bragg reflector for optoelectronic device |
| US7065124B2 (en) * | 2000-11-28 | 2006-06-20 | Finlsar Corporation | Electron affinity engineered VCSELs |
| US6905900B1 (en) * | 2000-11-28 | 2005-06-14 | Finisar Corporation | Versatile method and system for single mode VCSELs |
| US6687268B2 (en) * | 2001-03-26 | 2004-02-03 | Seiko Epson Corporation | Surface emitting laser and photodiode, manufacturing method therefor, and optoelectric integrated circuit using the surface emitting laser and the photodiode |
| US6628694B2 (en) * | 2001-04-23 | 2003-09-30 | Agilent Technologies, Inc. | Reliability-enhancing layers for vertical cavity surface emitting lasers |
| US6534331B2 (en) | 2001-07-24 | 2003-03-18 | Luxnet Corporation | Method for making a vertical-cavity surface emitting laser with improved current confinement |
| US6680963B2 (en) | 2001-07-24 | 2004-01-20 | Lux Net Corporation | Vertical-cavity surface emitting laser utilizing a reversed biased diode for improved current confinement |
| US6553053B2 (en) | 2001-07-25 | 2003-04-22 | Luxnet Corporation | Vertical cavity surface emitting laser having improved light output function |
| US6680964B2 (en) * | 2001-12-07 | 2004-01-20 | Agilent Technologies, Inc. | Moisture passivated planar index-guided VCSEL |
| US6904072B2 (en) * | 2001-12-28 | 2005-06-07 | Finisar Corporation | Vertical cavity surface emitting laser having a gain guide aperture interior to an oxide confinement layer |
| US6724798B2 (en) * | 2001-12-31 | 2004-04-20 | Honeywell International Inc. | Optoelectronic devices and method of production |
| US6967985B2 (en) * | 2002-02-12 | 2005-11-22 | Sanyo Electric Co., Ltd. | Surface emission semiconductor laser device |
| US6949473B2 (en) * | 2002-05-24 | 2005-09-27 | Finisar Corporation | Methods for identifying and removing an oxide-induced dead zone in a semiconductor device structure |
| US6989556B2 (en) * | 2002-06-06 | 2006-01-24 | Osemi, Inc. | Metal oxide compound semiconductor integrated transistor devices with a gate insulator structure |
| DE10226320A1 (de) * | 2002-06-10 | 2004-01-08 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zur selektiven Oxidation einer Schicht in einem vertikalen Bauelement |
| US7187045B2 (en) * | 2002-07-16 | 2007-03-06 | Osemi, Inc. | Junction field effect metal oxide compound semiconductor integrated transistor devices |
| DE60214536T2 (de) * | 2002-07-30 | 2007-08-30 | Hitachi, Ltd. | Optisches Gerät |
| US6965626B2 (en) * | 2002-09-03 | 2005-11-15 | Finisar Corporation | Single mode VCSEL |
| US6813293B2 (en) * | 2002-11-21 | 2004-11-02 | Finisar Corporation | Long wavelength VCSEL with tunnel junction, and implant |
| US6819697B2 (en) * | 2003-01-13 | 2004-11-16 | Agilent Technologies, Inc. | Moisture passivated planar index-guided VCSEL |
| US20040222363A1 (en) * | 2003-05-07 | 2004-11-11 | Honeywell International Inc. | Connectorized optical component misalignment detection system |
| US20040247250A1 (en) * | 2003-06-03 | 2004-12-09 | Honeywell International Inc. | Integrated sleeve pluggable package |
| US7298942B2 (en) | 2003-06-06 | 2007-11-20 | Finisar Corporation | Pluggable optical optic system having a lens fiber stop |
| US7433381B2 (en) | 2003-06-25 | 2008-10-07 | Finisar Corporation | InP based long wavelength VCSEL |
| US7075962B2 (en) * | 2003-06-27 | 2006-07-11 | Finisar Corporation | VCSEL having thermal management |
| US7277461B2 (en) * | 2003-06-27 | 2007-10-02 | Finisar Corporation | Dielectric VCSEL gain guide |
| US7054345B2 (en) | 2003-06-27 | 2006-05-30 | Finisar Corporation | Enhanced lateral oxidation |
| US6961489B2 (en) | 2003-06-30 | 2005-11-01 | Finisar Corporation | High speed optical system |
| US7149383B2 (en) * | 2003-06-30 | 2006-12-12 | Finisar Corporation | Optical system with reduced back reflection |
| US20060056762A1 (en) * | 2003-07-02 | 2006-03-16 | Honeywell International Inc. | Lens optical coupler |
| US20050013542A1 (en) * | 2003-07-16 | 2005-01-20 | Honeywell International Inc. | Coupler having reduction of reflections to light source |
| US7210857B2 (en) * | 2003-07-16 | 2007-05-01 | Finisar Corporation | Optical coupling system |
| US20050013539A1 (en) * | 2003-07-17 | 2005-01-20 | Honeywell International Inc. | Optical coupling system |
| US6887801B2 (en) * | 2003-07-18 | 2005-05-03 | Finisar Corporation | Edge bead control method and apparatus |
| US7257141B2 (en) * | 2003-07-23 | 2007-08-14 | Palo Alto Research Center Incorporated | Phase array oxide-confined VCSELs |
| US7031363B2 (en) * | 2003-10-29 | 2006-04-18 | Finisar Corporation | Long wavelength VCSEL device processing |
| WO2005048318A2 (fr) * | 2003-11-17 | 2005-05-26 | Osemi, Inc. | Dispositifs a transistors integres a semi-conducteurs d'oxyde metallique a base de nitrure |
| US20080282983A1 (en) * | 2003-12-09 | 2008-11-20 | Braddock Iv Walter David | High Temperature Vacuum Evaporation Apparatus |
| US7058106B2 (en) * | 2003-12-10 | 2006-06-06 | Widjaja Wilson H | Screenable moisture-passivated planar index-guided VCSEL |
| US7596165B2 (en) * | 2004-08-31 | 2009-09-29 | Finisar Corporation | Distributed Bragg Reflector for optoelectronic device |
| US7920612B2 (en) * | 2004-08-31 | 2011-04-05 | Finisar Corporation | Light emitting semiconductor device having an electrical confinement barrier near the active region |
| US7829912B2 (en) * | 2006-07-31 | 2010-11-09 | Finisar Corporation | Efficient carrier injection in a semiconductor device |
| US20070019696A1 (en) * | 2005-07-22 | 2007-01-25 | Li-Hung Lai | Vertical cavity surface emitting laser and method for fabricating the same |
| US20070091961A1 (en) * | 2005-10-07 | 2007-04-26 | Chao-Kun Lin | Method and structure for low stress oxide VCSEL |
| JP2007165562A (ja) * | 2005-12-13 | 2007-06-28 | Seiko Epson Corp | 光源装置、および光源装置を備えたプロジェクタ |
| US7580434B2 (en) * | 2006-09-28 | 2009-08-25 | Finisar Corporation | Dual laser driver architecture in an optical transceiver |
| US7764885B2 (en) | 2006-09-28 | 2010-07-27 | Finisar Corporation | Asymmetric rise/fall time and duty cycle control circuit |
| JP2008177430A (ja) * | 2007-01-19 | 2008-07-31 | Sony Corp | 発光素子及びその製造方法、並びに、発光素子集合体及びその製造方法 |
| US8031752B1 (en) | 2007-04-16 | 2011-10-04 | Finisar Corporation | VCSEL optimized for high speed data |
| US7907654B2 (en) * | 2007-04-27 | 2011-03-15 | Hewlett-Packard Development Company, L.P. | Laser diode with a grating layer |
| US20130223846A1 (en) | 2009-02-17 | 2013-08-29 | Trilumina Corporation | High speed free-space optical communications |
| US8995493B2 (en) | 2009-02-17 | 2015-03-31 | Trilumina Corp. | Microlenses for multibeam arrays of optoelectronic devices for high frequency operation |
| US8995485B2 (en) | 2009-02-17 | 2015-03-31 | Trilumina Corp. | High brightness pulsed VCSEL sources |
| US10244181B2 (en) | 2009-02-17 | 2019-03-26 | Trilumina Corp. | Compact multi-zone infrared laser illuminator |
| US10038304B2 (en) | 2009-02-17 | 2018-07-31 | Trilumina Corp. | Laser arrays for variable optical properties |
| WO2011075609A1 (fr) * | 2009-12-19 | 2011-06-23 | Trilumina Corporation | Système et procédé de combinaison de réseaux de lasers pour sorties numériques |
| US8979338B2 (en) | 2009-12-19 | 2015-03-17 | Trilumina Corp. | System for combining laser array outputs into a single beam carrying digital data |
| US11095365B2 (en) | 2011-08-26 | 2021-08-17 | Lumentum Operations Llc | Wide-angle illuminator module |
| US10153615B2 (en) * | 2015-07-30 | 2018-12-11 | Optipulse, Inc. | Rigid high power and high speed lasing grid structures |
| US10630053B2 (en) | 2015-07-30 | 2020-04-21 | Optipulse Inc. | High power laser grid structure |
| DE102017108104A1 (de) * | 2017-04-13 | 2018-10-18 | Osram Opto Semiconductors Gmbh | Oberflächenemittierender Halbleiterlaser und Verfahren zu dessen Herstellung |
| US10958350B2 (en) | 2017-08-11 | 2021-03-23 | Optipulse Inc. | Laser grid structures for wireless high speed data transfers |
| US10374705B2 (en) | 2017-09-06 | 2019-08-06 | Optipulse Inc. | Method and apparatus for alignment of a line-of-sight communications link |
| US10720758B2 (en) * | 2018-03-28 | 2020-07-21 | Lumentum Operations Llc | Emitter array with shared via to an ohmic metal shared between adjacent emitters |
| US11522344B2 (en) | 2018-03-28 | 2022-12-06 | Lumentum Operations Llc | Optimizing a layout of an emitter array |
| CN112385099A (zh) | 2018-05-08 | 2021-02-19 | 加利福尼亚大学董事会 | 具有宽波长扫频的气腔占优vcsel |
| US12334711B2 (en) | 2021-05-19 | 2025-06-17 | Mellanox Technologies, Ltd. | Fabricating semiconductor devices, such as VCSELs, with an oxide confinement layer |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5262360A (en) * | 1990-12-31 | 1993-11-16 | The Board Of Trustees Of The University Of Illinois | AlGaAs native oxide |
| US5359618A (en) * | 1993-06-01 | 1994-10-25 | Motorola, Inc. | High efficiency VCSEL and method of fabrication |
| US5493577A (en) * | 1994-12-21 | 1996-02-20 | Sandia Corporation | Efficient semiconductor light-emitting device and method |
| US5719891A (en) * | 1995-12-18 | 1998-02-17 | Picolight Incorporated | Conductive element with lateral oxidation barrier |
| US5719892A (en) * | 1996-04-23 | 1998-02-17 | Motorola, Inc. | Hybrid mirror structure for a visible emitting VCSEL |
| US5978408A (en) * | 1997-02-07 | 1999-11-02 | Xerox Corporation | Highly compact vertical cavity surface emitting lasers |
-
1997
- 1997-08-15 US US08/911,708 patent/US5896408A/en not_active Expired - Lifetime
-
1998
- 1998-05-29 EP EP98109847A patent/EP0898344A3/fr not_active Withdrawn
- 1998-08-03 JP JP10218889A patent/JPH11103129A/ja active Pending
- 1998-08-12 KR KR1019980032714A patent/KR19990023547A/ko not_active Ceased
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004063969A (ja) * | 2002-07-31 | 2004-02-26 | Victor Co Of Japan Ltd | 面発光レーザ |
| US7580436B2 (en) | 2003-09-18 | 2009-08-25 | Seiko Epson Corporation | Surface-emitting type semiconductor laser and method for manufacturing the same |
| US7983319B2 (en) | 2003-09-18 | 2011-07-19 | Seiko Epson Corporation | Surface-emitting type semiconductor laser that controls polarization directions of laser light and method for manufacturing the same |
| JP2008530774A (ja) * | 2005-02-07 | 2008-08-07 | サントル、ナショナール、ド、ラ、ルシェルシュ、シアンティフィク、(セーエヌエルエス) | 局所的な埋込み絶縁体を形成するためのプレナー酸化方法 |
| JP2007103544A (ja) * | 2005-10-03 | 2007-04-19 | Ricoh Co Ltd | 面発光レーザ及び面発光レーザアレイ及び光伝送システム及びレーザプリンタ書き込みシステム |
| JP2007258600A (ja) * | 2006-03-24 | 2007-10-04 | Furukawa Electric Co Ltd:The | 面発光レーザ素子および面発光レーザ素子の製造方法 |
| US7879632B2 (en) | 2007-07-31 | 2011-02-01 | Canon Kabushiki Kaisha | Method for manufacturing surface-emitting laser |
Also Published As
| Publication number | Publication date |
|---|---|
| EP0898344A3 (fr) | 2000-04-26 |
| KR19990023547A (ko) | 1999-03-25 |
| EP0898344A2 (fr) | 1999-02-24 |
| US5896408A (en) | 1999-04-20 |
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