JPH11144614A - Manufacturing method of impregnated cathode for electron tube - Google Patents

Manufacturing method of impregnated cathode for electron tube

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Publication number
JPH11144614A
JPH11144614A JP31200997A JP31200997A JPH11144614A JP H11144614 A JPH11144614 A JP H11144614A JP 31200997 A JP31200997 A JP 31200997A JP 31200997 A JP31200997 A JP 31200997A JP H11144614 A JPH11144614 A JP H11144614A
Authority
JP
Japan
Prior art keywords
cathode
electron tube
impregnated
impregnated cathode
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP31200997A
Other languages
Japanese (ja)
Inventor
Takeshi Kodama
健 児玉
Michio Hara
通雄 原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP31200997A priority Critical patent/JPH11144614A/en
Publication of JPH11144614A publication Critical patent/JPH11144614A/en
Pending legal-status Critical Current

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Abstract

(57)【要約】 【課題】 電子管用含浸型陰極の量産性を高めることが
できる製造方法を提供すること。 【解決手段】 多孔質高融点金属基体である多孔質タン
グステンディスク10に、電子放射物質11(例えばB
a)が例えば1650℃で含浸され、その後、洗浄工程
30で洗浄される。次に、多孔質タングステンディスク
10の表面にIr膜が形成される。得られた陰極はその
後、真空加熱処理工程40で、例えば1650℃のもと
で5分間真空加熱処理が施され、陰極が活性化される。
続いて、キャップ50およびスリーブ60がろう付けさ
れ、完成した内スリーブ80が得られる。
(57) [Problem] To provide a manufacturing method capable of improving the mass productivity of an impregnated cathode for an electron tube. SOLUTION: An electron emitting substance 11 (for example, B) is provided on a porous tungsten disk 10 which is a porous high melting point metal substrate.
a) is impregnated at, for example, 1650 ° C. and then washed in a washing step 30. Next, an Ir film is formed on the surface of the porous tungsten disk 10. The obtained cathode is then subjected to a vacuum heat treatment in a vacuum heat treatment step 40, for example, at 1650 ° C. for 5 minutes to activate the cathode.
Subsequently, the cap 50 and the sleeve 60 are brazed to obtain a completed inner sleeve 80.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、電子管用含浸型陰
極の製造方法に関するものであり、詳しくは量産性に優
れ、かつ効率的に被覆膜、例えばIr膜の十分な膜厚を
得ることができ、しかも被覆膜の膜厚の増大による陰極
のエミッション特性の劣化も防止することのできる電子
管用含浸型陰極の製造方法に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing an impregnated cathode for an electron tube, and more particularly to a method for producing a coating film, for example, an Ir film, which is excellent in mass productivity and efficiently. The present invention relates to a method for manufacturing an impregnated cathode for an electron tube, which can prevent deterioration of the emission characteristics of the cathode due to an increase in the thickness of the coating film.

【0002】[0002]

【従来の技術】従来の電子管用含浸型陰極は、陰極から
電子放射物質、例えばBaが蒸発し、これがGUNパー
ツに付着して第一グリッド(G1)孔径や板厚のディメ
ンジョンを変化させている。このため、カットオフ電圧
が変動してしまい、CRTにてライフ中にホワイトバラ
ンスが崩れ、またグリッドエミッションを引き起こし画
像に乱れを生じさせるという問題点があった。
2. Description of the Related Art In a conventional impregnated cathode for an electron tube, an electron-emitting substance, for example, Ba, evaporates from the cathode and adheres to a GUN part to change the dimension of the first grid (G1) hole diameter and plate thickness. . For this reason, there has been a problem that the cutoff voltage fluctuates, the white balance is lost during the life of the CRT, and the image is disturbed by causing grid emission.

【0003】この問題点を解決するためには、陰極から
蒸発するBa量を抑制することが有効であり、例えば従
来では陰極の表面に被覆膜、例えばIr(イリジウム)
膜を被覆する手法が採用されている。図2は、このよう
なIr膜を設けた従来の陰極の概略図である。多孔質高
融点金属基体、例えば多孔質タングステンディスク10
には、電子放射物質11(例えばBa)が含浸されてい
る。多孔質タングステンディスク10の上部表面には、
Ir膜12が設けられている。Ir膜12の存在によ
り、陰極から蒸発するBa量が抑制され、第一グリッド
20の孔径や板厚のディメンジョンの変化も抑制され
る。このようなIr膜12を厚くすればするほど、陰極
から蒸発するBa量も減少することが知られている。し
かし、Ir膜厚12が厚くなり過ぎる(300nm以
上)と、陰極のエミッション特性が劣化し、CRTへの
使用が不可能となる。
In order to solve this problem, it is effective to suppress the amount of Ba evaporating from the cathode. For example, conventionally, a coating film such as Ir (iridium)
A technique of coating a film is employed. FIG. 2 is a schematic view of a conventional cathode provided with such an Ir film. Porous refractory metal substrate, such as porous tungsten disk 10
Is impregnated with an electron-emitting substance 11 (for example, Ba). On the upper surface of the porous tungsten disk 10,
An Ir film 12 is provided. Due to the presence of the Ir film 12, the amount of Ba evaporating from the cathode is suppressed, and the change in the hole diameter and the thickness of the first grid 20 are also suppressed. It is known that as the thickness of the Ir film 12 increases, the amount of Ba evaporating from the cathode decreases. However, if the Ir film thickness 12 is too thick (300 nm or more), the emission characteristics of the cathode deteriorate, making it impossible to use it for a CRT.

【0004】従来の電子管用含浸型陰極の製造方法の一
例を、フローチャートとして図3に示す。多孔質高融点
金属基体、例えば多孔質タングステンディスク10は、
電子放射物質11(例えばBa)が、例えば1650℃
で含浸され、洗浄工程30で洗浄される。得られた陰極
はその後、真空加熱処理工程40で、例えば1650℃
で5分間真空加熱処理が施され、陰極が活性化される。
続いて、キャップ50およびスリーブ60がろう付けさ
れ、組立済内スリーブ70となり、次に電子放射物質1
1の表面は例えばIr膜の成膜処理(Ir膜付)が施さ
れ、内スリーブ80が完成する。このように従来の電子
管用含浸型陰極の製造は、電子放射物質を含浸させた多
孔質高融点金属基体を真空加熱処理に施し、組立済内ス
リーブとした後Ir膜を成膜していた。
FIG. 3 is a flowchart showing an example of a conventional method for manufacturing an impregnated cathode for an electron tube. A porous refractory metal substrate, for example, a porous tungsten disk 10
The electron emitting substance 11 (for example, Ba) is, for example, 1650 ° C.
And is washed in a washing step 30. The obtained cathode is then subjected to, for example, 1650 ° C.
For 5 minutes to activate the cathode.
Subsequently, the cap 50 and the sleeve 60 are brazed to form the assembled inner sleeve 70, and then the electron emitting material 1
For example, the surface of the substrate 1 is subjected to an Ir film deposition process (with an Ir film), and the inner sleeve 80 is completed. As described above, in manufacturing a conventional impregnated cathode for an electron tube, a porous high-melting-point metal substrate impregnated with an electron-emitting substance was subjected to a vacuum heating treatment to form an assembled inner sleeve, and then an Ir film was formed.

【0005】[0005]

【発明が解決しようとする課題】したがって、Ir膜の
成膜を行う際には組立済内スリーブともどもIr膜の成
膜処理に施す必要があり、十分な量産性が得られないと
いう欠点があった。さらに前記のように、陰極のエミッ
ション特性の劣化は、Ir膜厚が300nm以上で見ら
れるが、最大限の300nmまでIr膜厚を厚くして
も、今だ十分に陰極から蒸発するBa量を抑制すること
ができなかった。本発明は上記のような従来の課題を解
決し、量産性に優れ、かつ効率的に被覆膜、例えばIr
膜の十分な膜厚を得ることができ、しかも被覆膜の膜厚
の増大による陰極のエミッション特性の劣化も防止する
ことのできる電子管用含浸型陰極の製造方法の提供を目
的とする。
Therefore, when forming an Ir film, it is necessary to perform the Ir film forming process together with the assembled inner sleeve, and there is a disadvantage that sufficient mass productivity cannot be obtained. Was. Further, as described above, the deterioration of the emission characteristics of the cathode is observed when the Ir film thickness is 300 nm or more. Even when the Ir film thickness is increased to the maximum of 300 nm, the amount of Ba evaporating from the cathode is still sufficiently reduced. Could not be suppressed. The present invention solves the conventional problems as described above, is excellent in mass productivity, and efficiently forms a coating film, for example, Ir.
It is an object of the present invention to provide a method of manufacturing an impregnated cathode for an electron tube, which can obtain a sufficient film thickness of the film and can prevent deterioration of the emission characteristics of the cathode due to an increase in the film thickness of the coating film.

【0006】[0006]

【課題を解決するための手段】本発明者らは鋭意研究を
重ねた結果、上記のような従来の課題を解決することを
得た。すなわち本発明は、電子放射物質を含浸させた多
孔質高融点金属基体を有する電子管用含浸型陰極の製造
方法において、前記電子管用含浸型陰極の表面に被覆膜
を成膜した後、電子管に組み込む前に前記多孔質高融点
金属基体を真空中または非酸化性雰囲気中で加熱するよ
うにしたことを特徴とする。
Means for Solving the Problems As a result of intensive studies, the present inventors have solved the above-mentioned conventional problems. That is, the present invention relates to a method for manufacturing an impregnated cathode for an electron tube having a porous high-melting metal substrate impregnated with an electron emitting material, wherein a coating film is formed on the surface of the impregnated cathode for an electron tube, Before the incorporation, the porous high melting point metal substrate is heated in a vacuum or in a non-oxidizing atmosphere.

【0007】本発明では、電子放射物質を含浸させた多
孔質高融点金属基体の表面に被覆膜を成膜し、その後真
空加熱処理を行うので、多孔質高融点金属基体を単体で
加熱することができ、電子管用陰極の量産性に優れる。
また、被覆膜成膜後に真空加熱処理し陰極の活性を行う
ことにより、従来技術と同じ被覆膜厚なら活性時間が短
くなり、逆に同じ活性時間なら被覆膜厚を増加でき、製
造効率に優れる。
In the present invention, a coating film is formed on the surface of a porous high-melting-point metal substrate impregnated with an electron-emitting substance, and then a vacuum heating treatment is performed. It is excellent in mass productivity of cathodes for electron tubes.
In addition, by performing a vacuum heating treatment after forming a coating film to activate the cathode, the activation time can be shortened if the coating thickness is the same as the conventional technology, and the coating thickness can be increased if the same activation time is used. Excellent efficiency.

【0008】[0008]

【発明の実施の形態】本発明の電子管用含浸型陰極の製
造方法の一実施態様を、フローチャートとして図1に示
す。多孔質高融点金属基体、例えば多孔質タングステン
ディスク10は、電子放射物質11(例えばBa)が、
例えば1650℃で含浸され、洗浄工程30で洗浄され
る。次に、多孔質タングステンディスク10の表面にI
r膜が形成される。この工程の順が本発明の特徴であ
り、図1において、Ir膜の成膜工程をIr膜付1とし
て示した。得られた陰極はその後、真空加熱処理工程4
0で、例えば1650℃のもとで5分間真空加熱処理が
施され、陰極が活性化される。続いて、キャップ50お
よびスリーブ60がろう付けされ、完成した内スリーブ
80が得られ、陰極が電子管に組み込まれる。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a flow chart showing one embodiment of a method for producing an impregnated cathode for an electron tube according to the present invention. A porous refractory metal substrate, for example, a porous tungsten disk 10 is made of an electron emitting material 11 (for example, Ba).
For example, it is impregnated at 1650 ° C. and washed in the washing step 30. Next, the surface of the porous tungsten disk 10
An r film is formed. The order of these steps is a feature of the present invention. In FIG. 1, the step of forming an Ir film is shown as Ir film-added 1. The obtained cathode is then subjected to a vacuum heat treatment step 4
At 0, for example, a vacuum heat treatment is performed at 1650 ° C. for 5 minutes to activate the cathode. Subsequently, the cap 50 and the sleeve 60 are brazed to obtain a completed inner sleeve 80, and the cathode is incorporated into the electron tube.

【0009】前記の真空加熱処理工程40は、一実施態
様として1650℃、5分を例示したが、この条件以外
にも、加熱温度として1400〜1800℃の範囲が採
用でき、また加熱時間も0.1分〜60分の範囲で適宜
選択することができる。なお、電子放射物質の蒸発量を
一層抑制するためには加熱温度を1650℃以下、かつ
加熱時間を5分以下にするのがよい。また真空加熱処理
40は、真空中または非酸化性雰囲気中、例えば窒素等
の不活性雰囲気中で行うのがよい。また、前述では被覆
膜の材質としてIrを例示したが、この他にもOsやR
u等の白金族の金属を好適に使用することができる。
In the vacuum heat treatment step 40, 1650 ° C. and 5 minutes are exemplified as one embodiment, but besides this condition, a heating temperature in the range of 1400 to 1800 ° C. can be adopted, and the heating time is also 0 hour. It can be appropriately selected within a range of 1 minute to 60 minutes. In order to further suppress the amount of evaporation of the electron emitting material, it is preferable that the heating temperature be 1650 ° C. or less and the heating time be 5 minutes or less. The vacuum heat treatment 40 is preferably performed in a vacuum or in a non-oxidizing atmosphere, for example, in an inert atmosphere such as nitrogen. In the above description, Ir is exemplified as a material of the coating film.
A platinum group metal such as u can be suitably used.

【0010】本発明においては、電子放射物質を含浸さ
せた多孔質高融点金属基体の表面に被覆膜を成膜し、そ
の後真空加熱処理を行っているために、多孔質高融点金
属基体を単体で加熱することができ、組立済内スリーブ
ともどもIr膜の成膜処理に施す必要がないので、電子
管用陰極の量産性に優れるという利点がある。また、被
覆膜成膜後に真空加熱処理し陰極の活性を行うことによ
り、従来技術と同じ被覆膜厚、例えばIr膜厚なら活性
時間が短くなり、逆に同じ活性時間ならIr膜厚を増加
することができる。この点においても優れた製造効率が
認められる。さらに本発明において好ましい真空加熱処
理条件である、1650℃以下、かつ5分以下の加熱を
行っても十分に活性することが確認できた。
In the present invention, a coating film is formed on the surface of a porous refractory metal substrate impregnated with an electron-emitting substance, and then a vacuum heat treatment is performed. Since it can be heated alone and does not need to be subjected to the Ir film forming process together with the assembled inner sleeve, there is an advantage that the mass productivity of the cathode for an electron tube is excellent. In addition, by performing a vacuum heating treatment after forming the coating film to activate the cathode, the activation time is shortened if the coating film thickness is the same as that of the related art, for example, the Ir film thickness, and conversely, the Ir film thickness is reduced if the same activation time is used. Can be increased. Also in this respect, excellent production efficiency is recognized. Further, it was confirmed that sufficient activity was obtained even when heating was performed at 1650 ° C. or lower for 5 minutes or less, which is a preferable vacuum heat treatment condition in the present invention.

【0011】また、理由は明らかにされなかったが、被
覆膜成膜後に真空加熱処理し陰極の活性を行うことによ
り、被覆膜厚を厚くした場合、例えば、Ir膜厚を30
0nm以上に設定した場合でも陰極のエミッション特性
の劣化を防止することができた。本発明によれば、被覆
膜の厚さは10nm〜1000nmの範囲で適宜選択す
ることができ、被覆膜厚を厚くしても陰極のエミッショ
ン特性の劣化を防止することができる。
Although the reason has not been clarified, when the coating film thickness is increased by, for example, increasing the coating film thickness by performing a vacuum heating treatment and activating the cathode after the coating film formation,
Even when the thickness was set to 0 nm or more, deterioration of the emission characteristics of the cathode could be prevented. According to the present invention, the thickness of the coating film can be appropriately selected in the range of 10 nm to 1000 nm, and even if the coating film thickness is increased, deterioration of the emission characteristics of the cathode can be prevented.

【0012】[0012]

【発明の効果】以上の説明で明らかなように本発明は、
電子放射物質を含浸させた多孔質高融点金属基体を有す
る電子管用含浸型陰極の製造方法において、前記電子管
用含浸型陰極の表面に被覆膜を成膜した後、電子管に組
み込む前に前記多孔質高融点金属基体を真空中または非
酸化性雰囲気中で加熱するようにした。そのため、量産
性に優れ、かつ効率的に被覆膜、例えばIr膜の十分な
膜厚を得ることができ、しかも被覆膜の膜厚の増大によ
る陰極のエミッション特性の劣化も防止することができ
る。
As is clear from the above description, the present invention
In the method for manufacturing an impregnated cathode for an electron tube having a porous high-melting metal substrate impregnated with an electron emitting material, a coating film is formed on the surface of the impregnated cathode for an electron tube, and the porous film is impregnated before being incorporated into the electron tube. The refractory metal substrate was heated in a vacuum or in a non-oxidizing atmosphere. Therefore, it is possible to obtain a sufficient thickness of the coating film, for example, an Ir film, with excellent mass productivity and efficiently, and also to prevent deterioration of the emission characteristics of the cathode due to an increase in the thickness of the coating film. it can.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の電子管用含浸型陰極の製造方法の一実
施態様を説明するためのフローチャートである。
FIG. 1 is a flowchart illustrating one embodiment of a method for producing an impregnated cathode for an electron tube according to the present invention.

【図2】Ir膜を設けた従来の陰極の概略図である。FIG. 2 is a schematic view of a conventional cathode provided with an Ir film.

【図3】従来の電子管用含浸型陰極の製造方法の一例を
説明するためのフローチャートである。
FIG. 3 is a flowchart illustrating an example of a conventional method for manufacturing an impregnated cathode for an electron tube.

【符号の説明】[Explanation of symbols]

1,100……Ir膜付、10……多孔質タングステン
ディスク、11……電子放射物質、12……Ir膜、2
0……第一グリッド、30……洗浄工程、40……真空
加熱処理、50……キャップ、60……スリーブ、70
……組立済内スリーブ、80……内スリーブ。
1,100 with Ir film, 10 with porous tungsten disk, 11 with electron emitting material, 12 with Ir film, 2
0: First grid, 30: Cleaning step, 40: Vacuum heat treatment, 50: Cap, 60: Sleeve, 70
... Assembled inner sleeve, 80 ... Inner sleeve.

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】 電子放射物質を含浸させた多孔質高融点
金属基体を有する電子管用含浸型陰極の製造方法におい
て、 前記電子管用含浸型陰極の表面に被覆膜を成膜した後、
電子管に組み込む前に、前記多孔質高融点金属基体を真
空中または非酸化性雰囲気中で加熱するようにした、 ことを特徴とする電子管用含浸型陰極の製造方法。
1. A method for manufacturing an impregnated cathode for an electron tube having a porous refractory metal substrate impregnated with an electron emitting material, comprising: forming a coating film on the surface of the impregnated cathode for an electron tube;
A method for producing an impregnated cathode for an electron tube, wherein the porous high-melting metal substrate is heated in a vacuum or in a non-oxidizing atmosphere before being incorporated into the electron tube.
【請求項2】 前記多孔質高融点金属基体を真空中また
は非酸化性雰囲気中で加熱する際の加熱温度が、140
0〜1800℃の範囲であり、かつ、加熱時間が0.1
分〜60分の範囲であることを特徴とする請求項1記載
の電子管用含浸型陰極の製造方法。
2. A heating temperature for heating the porous refractory metal substrate in a vacuum or a non-oxidizing atmosphere is 140.
0-1800 ° C., and the heating time is 0.1
The method for producing an impregnated cathode for an electron tube according to claim 1, wherein the time is in the range of minutes to 60 minutes.
【請求項3】 前記加熱する工程では多孔質高融点金属
基体を単体で加熱することを特徴とする請求項1記載の
電子管用含浸型陰極の製造方法。
3. The method for producing an impregnated cathode for an electron tube according to claim 1, wherein in the heating step, the porous high melting point metal substrate is heated alone.
【請求項4】 前記被覆膜がIr、OsまたはRuの白
金族の金属であることを特徴とする請求項1記載の電子
管用含浸型陰極の製造方法。
4. The method for producing an impregnated cathode for an electron tube according to claim 1, wherein the coating film is a platinum group metal of Ir, Os or Ru.
【請求項5】 前記被覆膜の厚さが10nm〜1000
nmの範囲であることを特徴とする請求項1記載の電子
管用含浸型陰極の製造方法。
5. The method according to claim 1, wherein said coating film has a thickness of 10 nm to 1000 nm.
The method for producing an impregnated cathode for an electron tube according to claim 1, wherein the diameter is in the range of nm.
JP31200997A 1997-11-13 1997-11-13 Manufacturing method of impregnated cathode for electron tube Pending JPH11144614A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP31200997A JPH11144614A (en) 1997-11-13 1997-11-13 Manufacturing method of impregnated cathode for electron tube

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JP31200997A JPH11144614A (en) 1997-11-13 1997-11-13 Manufacturing method of impregnated cathode for electron tube

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