JPH11162902A - Cleaning treatment method - Google Patents

Abstract

(57) [Summary] [PROBLEMS] To improve the throughput of a cleaning process and the product yield. SOLUTION: A plurality of processing containers for storing the same cleaning processing liquid are provided in a processing apparatus, and the processing container cannot be used as a processing container for cleaning a target object, for example, a wafer, for example, a registered processing container. If the liquid is being changed at the scheduled wafer introduction time or if the cleaning processing liquid supply pump fails, another processing container that stores the same cleaning processing liquid as this processing container is replaced with a replacement processing container. And the cleaning process is continued.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cleaning method, and more particularly, to a cleaning method, for example, a semiconductor wafer or an
The present invention relates to a cleaning method in which an object to be processed such as a glass substrate for D is immersed in a cleaning solution to perform a cleaning process.

[0002]

2. Description of the Related Art In general, in a cleaning process of a semiconductor manufacturing apparatus, an object to be processed such as a semiconductor wafer or a glass substrate for an LCD (hereinafter, referred to as a wafer) is put into a carry-in section of the cleaning apparatus to a processing section. There is a known method of transporting, immersing in a chemical solution or a rinsing liquid (cleaning liquid) stored in a processing container, performing a cleaning process or a rinsing process, and then transporting the processed wafer and the like taken out to an unloading unit and unloading. ing.

In this case, in order to maintain the quality of the cleaning process, the cleaning solution stored in the processing container is periodically replaced according to a predetermined cleaning time, the number of times of cleaning, etc. Try not to use. Therefore, in this type of conventional cleaning treatment method, a fixed cleaning time,
If the number of times of cleaning is reached and it is determined that the cleaning processing solution needs to be replaced, the cleaning processing solution is replaced based on a preset program, and the temperature condition of the cleaning processing solution is changed to the next wafer to be processed. Is maintained so that the cleaning process can be performed.

[0004]

However, during execution of a processing procedure based on a preset program, a set (registered) processing container cannot be used for any reason, for example, a cleaning process. If it is time to replace the solution, or if a failure occurs in the cleaning solution supply pump, poor temperature control of the cleaning solution, poor concentration adjustment of the cleaning solution, etc. Must be stopped. When such a situation occurs, the processing of the wafer or the like is interrupted halfway until the wafer returns to the usable state, and accordingly, the throughput is reduced, and the quality of the wafer or the like due to the interruption of the processing is reduced, that is, the yield. There is a problem that causes a decrease in

The present invention has been made in view of the above circumstances, and it is an object of the present invention to provide a cleaning method capable of improving the throughput of the cleaning process and the product yield.

[0006]

In order to achieve the above object, a cleaning processing method according to the present invention is directed to a method of cleaning an object to be processed, which is introduced into a carry-in section of a processing apparatus, using a liquid processing apparatus provided in the processing apparatus. Carrying out the cleaning process by immersing the object in a plurality of processing containers disposed in the processing unit and storing the cleaning solution, and carrying out the cleaning process. And a step of transporting the processing object to a carry-out unit, wherein a plurality of processing containers for storing the same cleaning processing liquid are provided in the processing apparatus, and the processing object is subjected to cleaning processing. When an unusable situation occurs in the processing container, the object to be processed is charged as another processing container storing the same cleaning processing liquid as this processing container as an alternative processing container. (Claim 1).

In the present invention, the unusable condition of the processing container includes the timing of replacing the cleaning processing solution in the processing container, the stoppage of the driving of the supply means of the cleaning processing solution, poor temperature adjustment of the cleaning processing solution, and cleaning. Either poor concentration of the processing liquid, impurity contamination in the cleaning processing liquid, or the like corresponds to the present invention. In this case, the timing for replacing the cleaning treatment liquid in the processing container includes a timing for periodically performing the replacement based on a program preset according to the processing time, the number of times of processing, and the like.

When the object to be processed is loaded into the alternative processing container, it is determined whether or not the object is to be processed for another object to be processed. It is preferable to put the body into an alternative processing container (claim 4). In this case, it is preferable that, after judging whether or not an alternative processing container for processing the object to be processed is usable, the object to be processed is put into an alternative processing container or the processing is made to wait (claim 5). .

According to the cleaning processing method of the present invention, when an unusable situation occurs in a processing container for cleaning an object to be processed, an alternative processing container for storing the same cleaning processing liquid as the processing container is used. By loading the object, a series of cleaning processes can be performed continuously without interruption.
Thereby, the throughput of the cleaning process can be improved, and the product yield can be improved.

[0010]

Embodiments of the present invention will be described below in detail with reference to the drawings. In this embodiment, a case where the present invention is applied to a semiconductor wafer cleaning processing system will be described.

FIG. 1 is a schematic plan view showing an example of a cleaning system to which a cleaning apparatus according to the present invention is applied.

The cleaning system includes a loading / unloading section 2 for loading / unloading a container, for example, a carrier 1 for horizontally storing a semiconductor wafer W (hereinafter, referred to as a wafer) as an object to be processed, A processing unit 3 for performing a liquid processing such as a rinsing liquid, and an interface unit 4 positioned between the loading / unloading unit 2 and the processing unit 3 for transferring the wafer W, adjusting the position, changing the attitude, and the like. Have been.

The loading / unloading section 2 comprises a loading section 5 and a loading section 6 which are provided alongside one end of the cleaning system. The loading unit 5 includes a receiving unit 5a that receives the carrier 1 from an upper transport mechanism (not shown), and a delivery unit 5b that places the carrier 1 that is horizontally transported from the receiving unit 5a. 5b, a carrier lifter 8 for transporting the carrier 1 between an upper position and a carry-in port (not shown) of the interface unit 4 is provided. A carrier lifter 8 that transports the carrier 1 between a carry-out port (not shown) of the interface unit 4 and an upper portion of the carry-out unit 6 is provided in the carry-out unit 6. 6 and transfer the empty carrier 1 to a carrier standby unit (not shown) provided above the interface unit 4 and receive the empty carrier 1 from the carrier standby unit. It is configured to be able to.

The interface section 4 includes a partition wall 4c.
First chamber 4 adjacent to the loading / unloading section 2 partitioned by
a, and a second chamber 4 b adjacent to the processing unit 3. Then, a plurality of wafers W from the carrier 1 of the loading unit 5 (specifically, the transfer unit 5b) are placed in the first chamber 4a.
Arm 10 capable of taking out and transporting wafers, capable of horizontal (X, Y directions), vertical (Z directions) and rotation (θ direction), notch aligner 11 for detecting notches provided on wafer W, and wafer A first attitude changing device 12 is provided which has an interval adjusting mechanism (not shown) for adjusting the interval between the plurality of wafers W taken out by the take-out arm 10 and converts a horizontal wafer W to a vertical state. Has been established.

In the second chamber 4b, a plurality of processed wafers W are transferred from the processing section 3 in a vertical state. Second attitude converting device 13 for converting from the horizontal to the horizontal state, and the second attitude converting device 13
Empty carrier 1 that has received a plurality of wafers W converted to a horizontal state by the
A wafer accommodating arm 15 that can be accommodated in the horizontal direction (X and Y directions), the vertical direction (Z direction) and the rotatable (θ direction) is provided. Note that the wafer receiving unit 14 is provided with a carrier lifter 8 that transports a carrier between the wafer receiving unit 14 and a carrier standby unit (not shown). In the carrier standby unit, the empty carrier 1 after the wafer W is transferred by the wafer transfer unit 5b or the carrier 1 containing the wafer W in the carrier 1 by the wafer receiving unit 14 is placed at a predetermined standby position or the wafer receiving unit. 14
A carrier transfer robot (not shown) is provided for moving the carrier 1 containing the wafer W transferred from the first unit to the carrier standby unit above the unloading unit 6.

On the other hand, the processing section 3 includes two first processing units 17a and 17b for storing the same cleaning processing liquid (chemical solution) provided for removing particles and organic substances contaminating on the wafer W; First rinsing unit 1
8a, two second processing units 19a and 19b for storing the same cleaning processing liquid (chemical liquid) provided to remove metal contamination attached to the wafer W, a second rinsing processing unit 18b, and Third to remove adhering oxide film
Of processing units 20 and chuck cleaning units 21 are linearly arranged. The third processing unit 20
A drying unit (not shown) may be provided above the unit. Further, a conveyance path 22 provided to extend from the position facing each of the units 17 to 21 to the interface section 4 is provided in the X, Y (horizontal), Z (vertical), and rotation (θ) directions. ) Possible transport means, for example a wafer transport chuck 23, are provided.

In this case, the first and second processing units 17a and 17b; 19a and 19b are described below with the first processing units 17a and 17b as representatives. ｝
As shown in FIG. 2, a cleaning solution L such as a chemical solution such as an APM solution (a mixed solution of ammonia, hydrogen peroxide and water) is used.
And a processing vessel, for example, a cleaning tank 30 for immersing the wafer W in the cleaning processing liquid L to clean the surface thereof.

In this case, the cleaning tank 30 is composed of an inner tank 31 for storing the cleaning treatment liquid L and an outer tank 32 covering the outer edge of the opening of the inner tank 31. Further, a supply source for cleaning treatment liquid (not shown) is connected to a supply port 31 a provided at the bottom of the inner tank 31 via a supply pipe 34 provided with an on-off valve 33. Further, the supply port 31a and a discharge port 32a provided at the bottom of the outer tank 32 are connected via a circulation pipe 35, and the circulation path 35 is connected from the discharge port 32a side to the supply port 31a side. The temperature detection and adjustment mechanism 36, the circulation pump 37, the damper 38, and the filter 39 are arranged in this order.
Is interposed. With this configuration, the cleaning treatment liquid (for example, the APM liquid) stored in the cleaning tank 30 is used.
To remove particles and organic contaminants adhering to the surface of the wafer W.

A bypass line 40 which opens above the outer tank 32 is connected to the circulation line 35. The bypass line 40 has a concentration detector for detecting the concentration of the cleaning solution L. 41 and a particle detector 42 for detecting impurities such as particles in the cleaning treatment liquid are provided. As described above, the concentration detector 41 and the particle detector 42 are provided in the bypass line 40 connected to the circulation line 35.
By interposing, it is possible to detect the concentration of the cleaning treatment liquid L to be subjected to the cleaning treatment and to detect the content of the particles and the like.

A drain pipe 44 is connected via a drain valve 43 to another discharge port 32b provided at the bottom of the outer tank 32. Further, a wafer boat 45 for holding the wafer W during the cleaning process is provided in the inner tank 31. The wafer boat 45 is formed so as to be able to move up and down, and is configured to transfer the wafer W to and from the above-mentioned transfer means, for example, the wafer transfer chuck 23.

The processing unit 17 configured as described above
In a (17b), the cleaning processing liquid L is exchanged based on a program predetermined according to the processing time, the number of times of processing, and the like. Further, a series of operations including the exchange of the cleaning processing liquid of the processing apparatus are performed by the host computer 25 (HC).
, Through the central processing unit 24 (CPU), each unit, ie, the loading means of the loading unit 5 of the processing apparatus, the transport means such as the wafer transport chuck 23, and the respective processing units 17 to 20
The operation is performed based on command signals to a drive unit, a control unit, a detection unit, and the like, for example, the temperature adjustment mechanism 36, the circulation pump 37, the concentration detector 41, the particle detector 42, and the like. (See FIGS. 2 and 3).

More specifically, (a) when the driving capacity is reduced or stopped due to a failure or the like of the circulating pump 37, the CPU 24 recognizes the situation and outputs the signal to the H.264. To C25, In response to a command from C25, the use of the processing unit is stopped, and the wafer W is charged into the same cleaning tank 30 (alternative cleaning tank) as a substitute for another processing unit that stores the same cleaning processing liquid L. Execute.

(B) If the temperature detecting and adjusting mechanism 36 detects that the temperature of the cleaning treatment liquid L has fallen out of the predetermined temperature range (temperature failure), the CPU 24 recognizes the situation, and
The signal is set to H.264. To C25, In response to a command from C25, the use of the processing unit is stopped, and the wafer W is loaded into the alternative cleaning tank 30 of another processing unit that stores the same cleaning processing liquid L.

(C) If the concentration detector 41 detects that the concentration of the cleaning solution L is outside the predetermined concentration (poor concentration), the CPU 24 recognizes the situation and outputs the signal to the H.264 signal. To C25, In response to a command from C25, the use of the processing unit is stopped, and the wafer W is loaded into the alternative cleaning tank 30 of another processing unit that stores the same cleaning processing liquid L.

(D) When the particle detector 42 detects that the amount of particles contained in the cleaning solution L has reached an unusable amount, the CPU 24 recognizes the situation and outputs a signal indicating the H.264 level. To C25, In response to a command from C25, the use of the processing unit is stopped, and the wafer W is loaded into the alternative cleaning tank 30 of another processing unit that stores the same cleaning processing liquid L.

(E) Further, when the cleaning tank 30 into which the wafer W to be subjected to the cleaning process is to be loaded is under liquid exchange at the time of loading the wafer W based on a preset program, H . In response to a command from C25, the use of the processing unit is stopped, and the wafer W is loaded into the alternative cleaning tank 30 of another processing unit that stores the same cleaning processing liquid L.

With the above-described configuration, any one of the processing units 17a, 17b or 19a, 19b having the cleaning processing tank 30 for storing the same cleaning processing liquid L cannot be used. Replacement time,
If a failure of the circulating pump 37 or a temperature adjustment of the cleaning liquid L occurs, the use of the cleaning tank 30 of the processing unit is stopped, and another processing liquid L is stored. The loading of the wafer W into the alternative cleaning tank 30 of the unit can be executed.

Next, the operation of the cleaning unit will be described. First, a cleaning treatment liquid L is supplied from a cleaning liquid supply source (not shown) into the inner tank 31 so that the inner tank 31 is filled with the cleaning treatment liquid L. Next, the wafer transfer chuck 2
A plurality of, for example, 50 wafers W transferred from the interface unit 4 by 3 are delivered to the wafer boat 45, held, immersed, and subjected to a cleaning process. During this time, the cleaning treatment liquid L is supplied as needed, and the cleaning treatment liquid L overflowing from the inner tank 31 flows into the outer tank 32 along with particles and contaminants floating on the surface of the cleaning treatment liquid L. The used cleaning solution L that has flowed into the outer tank 32 flows through the circulation pipe 35 and is reused. That is, the temperature is adjusted to a predetermined temperature by the temperature detecting and adjusting mechanism 36 by flowing through the circulation pipe line 35 by the circulation pump 37, and the filter 3
Particles and the like are removed by passing through No. 9.
The regenerated cleaning solution L is supplied from the supply port 31 a into the inner tank 31, while the outer tank 32 is supplied through the bypass pipe 40.
Supplied to At this time, the concentration of the cleaning liquid L is detected by the concentration detector 41 provided in the bypass conduit 40, and the cleaning liquid L is detected by the particle detector 42.
The amount of particles contained therein is detected. In this manner, the cleaning treatment liquid L is circulated and supplied while adjusting the temperature, thereby completing the cleaning treatment.

When the cleaning liquid L is to be replaced, a drain valve (not shown) connected to a discharge port (not shown) provided at the bottom of the inner tank 31 is opened to open the cleaning liquid in the inner tank 31. L and discharge the drain valve 43 to open the outer tank 3
After the cleaning treatment liquid L in 2 is discharged, the drain valve is closed.
Next, the opening / closing valve 33 is opened to supply the cleaning treatment liquid L having a predetermined concentration to the inside of the inner tank 31 from the cleaning treatment liquid supply source.

Next, an operation procedure of the entire cleaning system to which the above-described cleaning apparatus is applied will be described with reference to a flowchart shown in FIG. After the wafer W (lot) is loaded into the loading unit 5, the horizontal attitude of the wafer W is converted by the first attitude converter 12 into a vertical state. Thereafter, the wafer is transferred to the processing unit 3 by the wafer transfer chuck 23, immersed in the cleaning processing liquid L stored in the cleaning tank 30 of the first processing unit 17a or 17b, and subjected to cleaning processing.
8 for rinsing by immersing in a rinsing liquid such as pure water in the cleaning tank, and then the second processing unit 19a or 19
(b) The wafer W is sequentially immersed in the cleaning solution L in the cleaning tank 30 of the second rinsing unit 18b and the third processing unit 20 to perform the above-described cleaning process. Third
After performing a drying process in a drying unit (not shown) provided at, for example, an upper portion of the processing unit 20, the wafer is transferred to the interface unit 4 by the wafer transfer chuck 23,
The wafer W is converted from the vertical state to the horizontal state by the second attitude converter. Finally, the wafer W is unloaded from the unloading section 6, and a series of steps is completed.

In the above-mentioned cleaning process, in order to maintain the quality of the cleaning process, the cleaning processing liquid L is exchanged based on a certain processing time, the number of times of processing, and the like. Wafer W may not be able to use the processing unit at the time of cleaning liquid replacement.
Even in the case where the liquid replacement time is not reached, if the situation shown in the above (a) to (d) such as the failure of the circulation pump 37 or the temperature adjustment failure of the cleaning treatment liquid L occurs, the processing unit is not replaced. There is a possibility that the cleaning tank 30 cannot be used. Therefore, in the present invention, the wafer W is loaded into the cleaning tank 30 of the alternative processing unit based on the program of the (A) mode as shown in FIG. 5, and the predetermined processing is continued. That is, for the wafer W (lot) before the loading, for example, during the processing process (in the wafer flow)
It is determined whether or not the registered cleaning tank 30 (hereinafter simply referred to as a tank) is being replaced with a liquid at the scheduled wafer charging time and cannot be used (step). If the liquid is being changed, it is determined whether or not the unusable tank has an alternative tank (alternate tank) (step). If there is an alternative tank, it is then put into the apparatus. It is determined whether another wafer W (lot) is used during the same loading (step). Here, when another wafer W (lot) is not used, the process (flow) is changed (step) to use the alternative tank, and the preparation for loading is completed.
In addition, if there is no same tank as a substitute for the unusable tank in the step, or another wafer W (lot) in the step
Is used, it is determined whether or not to wait in the previous tank or the upstream tank (step). If standby is possible, preparation for charging is completed. If standby is not possible, execution of processing is stopped (NG). ). On the other hand, if it is determined in step that the bath registered in the wafer flow is not liquid exchange at the scheduled wafer charging time, the set program is performed and the loading preparation is completed.

In the above-mentioned steps, the condition of non-usability can be arbitrarily set by the operator who uses the apparatus.
If the temperature of the cleaning treatment liquid L is out of the proper temperature range, if the concentration of the cleaning treatment liquid L is out of the proper concentration, or if the particles in the cleaning treatment liquid L It is possible to set a case where the number exceeds the limit. In the above step,
The operator can arbitrarily set whether or not to be able to wait in the front tank or the upstream tank.

In addition to the above (A) mode, a wafer W is loaded into the cleaning tank 30 of an alternative processing unit based on a (B) mode program as shown in FIG. That is, first, it is determined whether the next tank is in a usable state (step). If it is in an unusable state, it is determined whether or not there is an alternative tank (alternate tank) in the unusable tank (step). It is determined whether or not another wafer W (lot) is used at the same scheduled injection time (step). Here, when another wafer W (lot) is not used, it is determined whether or not the substitute tank can be used (step), and if the substitute tank can be used, processing is performed so as to use the substitute tank ( The flow is changed (step), and the wafer W is loaded into the substitute tank.

In this case, there are the following two types of processing patterns. That is, (a) loading into the processing unit 3 →
Chemical treatment by the first treatment unit 17a → Rinse treatment by the first rinse treatment unit 18a → Chemical treatment by the second treatment unit 19a → Rinse treatment by the second rinse treatment unit 18b → Drying treatment → Conveyance, (A) Carrying in the processing unit 3 → Chemical processing by the first processing unit 17a → Chemical processing by another first processing unit 17b →
Rinsing processing by the first rinsing processing unit 18a → chemical processing by the second processing unit 19a → chemical processing by another second processing unit 19b → rinsing processing by the second rinsing processing unit 18b → drying processing → unloading. There are two types of processing patterns. Here, in the processing pattern (a), the wafer W is placed in the first processing unit 17a.
From the first to the next another processing unit 17b,
When the cleaning tank 30 of the first processing unit 17b cannot be used for some reason, the cleaning tank 30 of another first processing unit 17a can be used as the same substitute tank. As described above, in the case where the same substitute tank is the main tank, that is, the cleaning tank 30 currently being processed, the processing time is changed as it is, and the processing is continued as it is. Further, in the processing pattern (a), when the wafer W is transferred from the first processing unit 17a to the first rinsing processing unit 18a, the cleaning tank 30 of the first rinsing processing unit 18a may be removed for some reason. If it cannot be used, the chemical processing by the first processing unit 17a → the rinsing processing by the second rinsing processing unit 18b → the chemical processing by the second processing unit 19a → the second rinsing processing unit 18
The processing can be performed in the order of rinsing processing by b → drying processing → conveyance.

It should be noted that there is no substitute tank in the unusable tank in the step, another wafer W (lot) is at the scheduled loading time in the step, or another wafer W (lot) is used in the step. In this case, the execution of the process is stopped (NG). On the other hand, if the next tank is in a usable state in the step, the set program is completed and the preparation for charging is completed.

The modes (A) and (B) are applied when a wafer W (lot) is loaded from the loading section 5 to the processing section 3. That is, as shown in FIG. 7, it is first determined in the (A) mode whether or not the loading preparation is completed (step), and if it is determined that the loading preparation is completed, it is next determined whether or not the loading is possible (step A). Steps). If it is determined in the step that the wafer W can be loaded, the wafer W is loaded into the main tank or the alternative tank (step). If the preparation is not completed in the step, or if the preparation is impossible in the step, the determination is repeated again in the same procedure. The mode (B) is applied when the wafer W (lot) is loaded from the cleaning tank 30 of the processing unit into the cleaning tank 30 of the next processing unit. That is, as shown in FIG. 8, it is determined whether the wafer W in the previous process can be loaded in the (B) mode (step), and when it is determined that the wafer W can be loaded, the wafer W is loaded into the main tank or the alternative tank. (Step). If it is determined that the insertion is not possible in the step, the determination is repeated again in the same procedure.

In the above embodiment, the processing unit 1
7a, 17b; the case where only one type of the predetermined cleaning treatment liquid L is supplied into the cleaning tank 30 of 19a, 19b has been described. However, the present invention is not necessarily limited to such a structure. Also, the present invention can be applied to a so-called one-bath type cleaning apparatus in which the cleaning processing liquid and the rinsing liquid are performed in one processing unit.

An embodiment in which a one-bath type cleaning apparatus is applied will be described below with reference to a schematic sectional view shown in FIG. In this case, a major difference from the above embodiment is that a supply nozzle 50 for selectively supplying a cleaning treatment liquid L and a rinsing liquid, for example, pure water, is provided in the cleaning tank 30, and a flow path 60.
The tank 70 and the pure water supply source 52 for temporarily storing the cleaning treatment liquid L are provided.

As shown in FIG.
A supply nozzle 50 for selectively supplying the cleaning treatment liquid L and a rinsing liquid, for example, pure water, is provided near the bottom of the inner tank 31, and the supply nozzle 50 is connected to the discharge port 3 provided at the bottom of the outer tank 32.
The cleaning treatment liquid supply source 51 is connected to the circulation line 35A via the three-way valve 51a and the supply tube 51b, while being connected to the circulation line 35A connected to 2a. In addition, the circulation line 35
A is connected to a pure water supply source 52 via a three-way valve 52a and a supply pipe 52b. It should be noted that the temperature detection and adjustment mechanism 3 is provided in the circulation pipeline 35A in substantially the same manner as in the above embodiment.
6, a pump 37A, a damper 38 and a filter 39 are provided. Further, a concentration detector 41 and a particle detector 42 similar to those in the above-described embodiment are interposed in a bypass conduit 40 branched from the circulation conduit 35A above the outer tank 32. Thus, the flow path 60 is constituted by the circulation pipe 35A and the bypass pipe 40.

A drain pipe 58 connected to a discharge port 31b provided at the bottom of the inner tank 31 through a drain valve 57 and a discharge port 32b provided at another position at the bottom of the outer tank 32 are provided. Drain pipe 44 connected via valve 43
Are connected to the tank 70 and the drainage side via three-way valves 61 and 62, respectively. Therefore, by appropriately switching the respective three-way valves 61 and 62, the cleaning tank 30
The cleaning solution L in the inside can be returned to the tank 70 or drained. The tank 70 is connected to the circulation line 35A via the supply pipe 63 and the three-way valve 64. Thus, the cleaning treatment liquid L returned to and stored in the tank 70 can be resupplied into the cleaning tank 30.

On the other hand, the tank 70 is also connected to the cleaning treatment liquid supply source 51 by a supply pipe 65,
When the amount of the cleaning solution L in the inside is reduced, the supply pipe 6
By opening the on-off valve 66 interposed in 5, the supply amount is appropriately supplied from the cleaning treatment liquid supply source 51, and a constant amount can be maintained. In addition, a drain pipe 68 provided with a drain valve 67 is connected to a lower side of the tank 70.

Further, the outer tank 3 in the circulation line 35A is provided.
An on-off valve 69 is provided on the side of the second outlet 32a. In FIG. 9, other structures are the same as those in FIG. 2, and therefore, the same portions are denoted by the same reference numerals and description thereof will be omitted.

Next, an operation mode when applied to the one-bath type cleaning apparatus will be described. First, when performing the cleaning process, after closing the drain valves 57 and 43, the opening and closing valve 69 is opened and the three-way valves 51a and 64 are opened.
In the direction of the flow path of the circulation pipeline 35A. in this case,
The cleaning treatment liquid L flowing from the outer tank 32 to the circulation line 35A
Is flowed by a pump 37A, temperature is controlled to a predetermined temperature by a temperature detecting and adjusting mechanism 36, particles and the like are removed by a filter 39, and then supplied from the supply nozzle 50 into the inner tank 31 again.

When shifting from the cleaning process to the rinsing process, the drain valves 57 and 43 are opened and the three-way valves 61 and 62 are switched so as to flow into the tank 70. As a result, the cleaning liquid L in the inner tank 31 and the outer tank 32 is temporarily stored in the tank 70, and when the inner tank 31 is in the drained state, the drain valve 57 is closed and the three-way valve 62 is drained. If the three-way valve 52a is switched so that pure water can be supplied from the pure water supply source 52, pure water is continuously supplied to the inner tank 31, and a rinsing process is performed. The pure water flowing from the inner tank 31 to the outer tank 32 is
The liquid is drained from the drain pipe 44 through the three-way valve 62.

Thereafter, when a cleaning process is performed by loading the next wafer W to be processed, that is, when shifting from the rinsing process to the cleaning process, the drain valve 57 is opened and the three-way valve 61 is switched to drain the liquid. It can be so. Further, the three-way valve 52a is switched to release the supply state from the pure water supply source 52. Thereby, the cleaning treatment liquid L in the tank 70 is
Flows through the circulation line 35A by the pump 37A, and is supplied again into the inner tank 31 from the supply nozzle 50. The supplied cleaning treatment liquid L overflows, flows into the outer tank 32, and again passes through the above-described circulation pipeline 35A. When the cleaning treatment liquid L flowing through the circulation line 35A reaches the three-way valve 64 for the first time, the three-way valve 64 is switched so as to flow along the circulation line 35A.

Next, the case where the cleaning solution L is replaced will be described. In this case, the drain valves 57, 43, 67 are opened, and the three-way valves 61, 62 are switched in the drain direction.
Thereby, the cleaning treatment liquid L in the inner tank 31, the outer tank 32, and the tank 70 is drained, and when necessary, the drain valve 57,
By closing 62 and 67, the three-way valve 51a is switched so that the cleaning liquid L can be supplied from the cleaning liquid supply source 51. The other parts of the operation mode are the same as those of the embodiment shown in FIG.

In the above embodiment, the cleaning process of the semiconductor wafer has been described. However, it is needless to say that the present invention can be applied to, for example, an LCD substrate or the like, and can be used for other cleaning processes.

[0048]

As described above, according to the cleaning method of the present invention, when an unusable situation occurs in a processing vessel for cleaning a workpiece, the same cleaning processing as that of the processing vessel is performed. By putting the object to be processed into an alternative processing container that stores the liquid, a series of cleaning processes can be performed continuously without interruption, thereby improving the throughput of the cleaning process and improving the product yield. Can be achieved.

[Brief description of the drawings]

FIG. 1 is a schematic plan view of a cleaning system to which a cleaning apparatus according to the present invention is applied.

FIG. 2 is a schematic sectional view showing one embodiment of a cleaning apparatus according to the present invention.

FIG. 3 is a schematic plan view showing a connection state between the cleaning system and a control system.

FIG. 4 is a flowchart showing each step of a cleaning processing method according to the present invention.

FIG. 5 is a flowchart illustrating an example of a procedure of a cleaning processing method according to the present invention.

FIG. 6 is a flowchart showing another example of the procedure of the cleaning method according to the present invention.

FIG. 7 is a flowchart showing a procedure in which the object to be processed according to the present invention is loaded from a loading section into a processing container.

FIG. 8 is a flowchart showing a procedure in which an object to be processed according to the present invention is charged from a processing container to another processing container.

FIG. 9 is a schematic sectional view showing another embodiment of the cleaning apparatus according to the present invention.

[Explanation of symbols]

 W Semiconductor wafer (object to be processed) L Cleaning treatment liquid 3 Processing unit 5 Loading unit 6 Unloading unit 17a, 17b First processing unit 19a, 19b Second processing unit 23 Wafer transfer chuck (transfer unit) 24 CPU 25 Host computer Reference Signs List 30 cleaning tank (processing vessel) 31 inner tank 32 outer tank 35, 35A circulation line 36 temperature detection and adjustment mechanism 37 circulation pump 41 concentration detector 42 particle detector

Claims (5)

[Claims] 1. A process for transporting an object to be processed, which has been loaded into a loading section in a processing apparatus, to a processing section provided in the processing apparatus for performing a liquid process, and a cleaning process provided in the processing section. A step of immersing the object to be washed in a plurality of processing containers storing the liquid and performing a cleaning process, and the processed object to be processed,
Transporting to the carry-out section, wherein a plurality of processing containers for storing the same cleaning processing liquid are provided in the processing apparatus, and the processing containers are used for the processing container for cleaning the object to be processed. When an impossible situation occurs, a cleaning processing method is characterized in that the object to be processed is loaded as another processing container storing the same cleaning processing liquid as the processing container as an alternative processing container. 2. The cleaning method according to claim 1, wherein the unusable condition of the processing container includes a timing of replacing the cleaning processing solution in the processing container, a stop of the driving of the cleaning processing solution supply unit, and a cleaning process. A cleaning method characterized by any of poor temperature adjustment of the solution, poor concentration of the cleaning solution, and contamination of the cleaning solution with impurities. 3. The cleaning method according to claim 2, wherein the timing of changing the cleaning liquid in the processing container is periodically performed based on a program preset according to the processing time, the number of times of processing, and the like. A cleaning treatment method comprising a period. 4. The cleaning method according to claim 1, wherein it is determined whether or not the alternative processing container is to be used for processing another object to be processed. A cleaning method, wherein a processing body is charged into an alternative processing container. 5. The cleaning processing method according to claim 4, wherein after determining whether or not an alternative processing container for processing the object to be processed is usable, the processing object is put into an alternative processing container. A cleaning processing method characterized by waiting for processing.