JPH11163364A5 - - Google Patents

Info

Publication number
JPH11163364A5
JPH11163364A5 JP1997344350A JP34435097A JPH11163364A5 JP H11163364 A5 JPH11163364 A5 JP H11163364A5 JP 1997344350 A JP1997344350 A JP 1997344350A JP 34435097 A JP34435097 A JP 34435097A JP H11163364 A5 JPH11163364 A5 JP H11163364A5
Authority
JP
Japan
Prior art keywords
film
interlayer insulating
insulating film
organic resin
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1997344350A
Other languages
English (en)
Japanese (ja)
Other versions
JPH11163364A (ja
JP4202454B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP34435097A priority Critical patent/JP4202454B2/ja
Priority claimed from JP34435097A external-priority patent/JP4202454B2/ja
Priority to US09/197,767 priority patent/US7202497B2/en
Publication of JPH11163364A publication Critical patent/JPH11163364A/ja
Priority to US09/550,598 priority patent/US7192865B1/en
Publication of JPH11163364A5 publication Critical patent/JPH11163364A5/ja
Priority to US11/713,619 priority patent/US8440509B2/en
Application granted granted Critical
Publication of JP4202454B2 publication Critical patent/JP4202454B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP34435097A 1997-11-27 1997-11-27 半導体装置およびその作製方法 Expired - Fee Related JP4202454B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP34435097A JP4202454B2 (ja) 1997-11-27 1997-11-27 半導体装置およびその作製方法
US09/197,767 US7202497B2 (en) 1997-11-27 1998-11-23 Semiconductor device
US09/550,598 US7192865B1 (en) 1997-11-27 2000-04-17 Semiconductor device and process for producing the same
US11/713,619 US8440509B2 (en) 1997-11-27 2007-03-05 Method for producing a semiconductor device by etch back process

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP34435097A JP4202454B2 (ja) 1997-11-27 1997-11-27 半導体装置およびその作製方法

Publications (3)

Publication Number Publication Date
JPH11163364A JPH11163364A (ja) 1999-06-18
JPH11163364A5 true JPH11163364A5 (2) 2005-07-14
JP4202454B2 JP4202454B2 (ja) 2008-12-24

Family

ID=18368566

Family Applications (1)

Application Number Title Priority Date Filing Date
JP34435097A Expired - Fee Related JP4202454B2 (ja) 1997-11-27 1997-11-27 半導体装置およびその作製方法

Country Status (1)

Country Link
JP (1) JP4202454B2 (2)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4619050B2 (ja) * 2003-06-30 2011-01-26 株式会社半導体エネルギー研究所 表示装置の作製方法
KR101137873B1 (ko) 2005-04-11 2012-04-20 엘지디스플레이 주식회사 패드전극 형성방법, 그를 이용한 액정표시소자의 제조방법,및 그 방법에 의해 제조된 액정표시소자
JP5258277B2 (ja) 2006-12-26 2013-08-07 株式会社半導体エネルギー研究所 液晶表示装置
CN111886699B (zh) * 2018-03-28 2024-06-14 堺显示器制品株式会社 有机el显示装置及其制造方法

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