JPH11181122A - Insulation adhesive material and multilayer printed wiring board prepared by using the same - Google Patents
Insulation adhesive material and multilayer printed wiring board prepared by using the sameInfo
- Publication number
- JPH11181122A JPH11181122A JP35850797A JP35850797A JPH11181122A JP H11181122 A JPH11181122 A JP H11181122A JP 35850797 A JP35850797 A JP 35850797A JP 35850797 A JP35850797 A JP 35850797A JP H11181122 A JPH11181122 A JP H11181122A
- Authority
- JP
- Japan
- Prior art keywords
- insulation adhesive
- printed wiring
- wiring board
- flow
- prepreg
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 43
- 239000000853 adhesive Substances 0.000 title claims abstract description 42
- 239000000463 material Substances 0.000 title claims abstract description 30
- 238000009413 insulation Methods 0.000 title abstract description 8
- 229920005989 resin Polymers 0.000 claims abstract description 46
- 239000011347 resin Substances 0.000 claims abstract description 46
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 25
- 239000003822 epoxy resin Substances 0.000 abstract description 10
- 239000004744 fabric Substances 0.000 abstract description 10
- 239000011521 glass Substances 0.000 abstract description 10
- 229920000647 polyepoxide Polymers 0.000 abstract description 10
- 239000000470 constituent Substances 0.000 abstract description 9
- 238000010438 heat treatment Methods 0.000 abstract description 8
- 239000011342 resin composition Substances 0.000 abstract description 6
- 239000004593 Epoxy Substances 0.000 abstract description 3
- 229920000642 polymer Polymers 0.000 abstract description 3
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 abstract description 2
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 abstract description 2
- 229920003192 poly(bis maleimide) Polymers 0.000 abstract description 2
- 229920001721 polyimide Polymers 0.000 abstract description 2
- 239000009719 polyimide resin Substances 0.000 abstract description 2
- 238000003825 pressing Methods 0.000 abstract description 2
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 229920005992 thermoplastic resin Polymers 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 34
- 238000010030 laminating Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000011230 binding agent Substances 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000002759 woven fabric Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 2
- 239000012784 inorganic fiber Substances 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、絶縁接着材料及び
これを用いた多層プリント配線板に関する。The present invention relates to an insulating adhesive material and a multilayer printed wiring board using the same.
【０００２】[0002]
【従来の技術】従来、４層プリント配線板は、両面銅張
積層板の両面に回路加工を施した基板及び外層用の銅は
くを構成材とし、基板の両面にシート状の絶縁接着材料
を介して外層用の銅はくを接着一体化して製造されてい
た。そして、シート状の絶縁接着材料としては、熱硬化
性樹脂プリプレグ、特に、ガラス布基材エポキシ樹脂プ
リプレグが広く用いられていた。２枚以上の基板を構成
材として用いることにより４層を超える多層プリント配
線板が得られる。多層プリント配線板において、層を異
にする回路間の接続はスルーホール接続によっている。
近年高密度配線が要求されるようになり、多層プリント
配線板を貫通しない穴、すなわちＩＶＨによる層間接続
が広く採用されるようになってきている。例えば、４層
プリント配線板は、２枚の両面銅張積層板の片面に内層
回路を形成するとともにＩＶＨを形成した基板を構成材
として用い、この構成材をシート状の絶縁接着材料で接
着一体化して製造される。このとき、従来と同様に熱硬
化性樹脂プリプレグを絶縁接着材料として用いると、構
成材に設けられたＩＶＨから溶融した熱硬化性樹脂組成
物が表面にしみだし、多層プリント配線板の表面及び鏡
板に付着し、これを除去する工程が必要となることがあ
った。また、熱硬化性樹脂プリプレグからは樹脂粉が脱
落して粉塵となりやすく、衛生上問題があった。また、
熱硬化性樹脂プリプレグは織布を基材とするため薄型化
には限界があることから、織布を基材として用いない
で、かつ、接着一体化する工程における流動性を小さく
したローフロー絶縁接着シートが使用されるようになっ
てきている。2. Description of the Related Art Conventionally, a four-layer printed wiring board is composed of a board having a circuit processed on both sides of a double-sided copper-clad laminate and a copper foil for an outer layer as a constituent material, and a sheet-like insulating adhesive material on both sides of the board. And a copper foil for the outer layer is bonded and integrated through the above. As a sheet-like insulating adhesive material, a thermosetting resin prepreg, particularly an epoxy resin prepreg based on a glass cloth, has been widely used. By using two or more substrates as components, a multilayer printed wiring board having more than four layers can be obtained. In a multilayer printed wiring board, connections between circuits having different layers are formed by through-hole connections.
In recent years, high-density wiring has been required, and a hole that does not penetrate a multilayer printed wiring board, that is, an interlayer connection by IVH has been widely adopted. For example, in a four-layer printed wiring board, an inner layer circuit is formed on one side of two double-sided copper-clad laminates, and a substrate on which an IVH is formed is used as a constituent material, and this constituent material is integrally bonded with a sheet-like insulating adhesive material. Manufactured. At this time, when the thermosetting resin prepreg is used as the insulating adhesive material as in the conventional case, the thermosetting resin composition melted from the IVH provided on the constituent material seeps onto the surface, and is applied to the surface of the multilayer printed wiring board and the mirror plate. In some cases, a step of removing the particles was required. In addition, resin powder is likely to fall off from the thermosetting resin prepreg and become dust, which has a problem in hygiene. Also,
Since thermosetting resin prepregs use a woven fabric as a base material, there is a limit to the reduction in thickness. Therefore, low-flow insulation bonding that does not use a woven fabric as a base material and has reduced fluidity in the bonding and integration process Sheets are being used.
【０００３】[0003]
【発明が解決しようとする課題】ところが、ローフロー
絶縁接着シートを用いて構成材を接着一体化すると、内
層回路の凹みを埋めることができないため、ボイドが発
生したり内層回路の凹凸形状が外層表面に現われて外層
表面の平滑性を損なったりすることがあった。However, if the components are bonded and integrated using a low-flow insulating adhesive sheet, the dents of the inner layer circuit cannot be filled, so that voids are generated or the unevenness of the inner layer circuit becomes uneven. And the smoothness of the outer layer surface may be impaired.
【０００４】請求項１に記載の発明は、構成材のＩＶＨ
からの樹脂のしみだしがなく、また、内層回路の凹みを
埋めることができ、したがって、ボイドの発生や外層表
面を平滑にできる絶縁接着材料を提供することを目的と
する。また、請求項２に記載の発明は、請求項１に記載
の発明の目的に加えて、構成材に形成された内層回路相
互間の位置を合わせて重ねる作業を容易にし、熱硬化性
樹脂プリプレグからの樹脂粉の脱落を防止することを目
的とする。また、請求項３に記載の発明は、ボイドの発
生がなく、外層表面が平滑な多層プリント配線板を提供
することを目的とする。[0004] According to the first aspect of the present invention, the IVH
It is an object of the present invention to provide an insulating adhesive material that does not exude resin from the inside, and that can fill the recess of the inner layer circuit, and thus can generate voids and smooth the outer layer surface. According to a second aspect of the present invention, in addition to the object of the first aspect, the work of aligning and overlapping the inner layer circuits formed on the constituent material is facilitated, and a thermosetting resin prepreg is provided. It is intended to prevent resin powder from falling off. Another object of the present invention is to provide a multilayer printed wiring board in which voids are not generated and the outer layer surface is smooth.
【０００５】[0005]
【課題を解決するための手段】請求項１に記載の発明
は、熱硬化性樹脂プリプレグを、ローフロー絶縁接着シ
ートで挟んでなる絶縁接着材料である。The invention according to claim 1 is an insulating adhesive material comprising a thermosetting resin prepreg sandwiched between low-flow insulating adhesive sheets.
【０００６】ここで、ローフローとは、樹脂流れが３％
以下であることを意味する。樹脂流れが３％を超える
と、ＩＶＨから樹脂がしみだすようになる。なお、樹脂
流れは、ＭＩＬ規格（Military Specification）に準拠
し、１０２×１０２ｍｍの試料を用意して、試料の重量
を０．０１ｇまで秤量し（これを初期重量とする）、温
度１７１０±２．８℃、圧力１３８０±７０ｋＰａの条
件で１０分間加熱加圧した後、試料中央部から直径９
１．１±０．２５ｍｍの円板を切取り、０．００５ｇま
で秤量する（これを円板重量とする）。そして次の数１
の（１）式により求められる。Here, low flow means that the resin flow is 3%
It means the following. When the resin flow exceeds 3%, the resin begins to exude from the IVH. The resin flow conforms to the MIL standard (Military Specification), a sample of 102 × 102 mm is prepared, the weight of the sample is weighed to 0.01 g (this is referred to as an initial weight), and the temperature is 1710 ± 2. After heating and pressurizing at 8 ° C. and a pressure of 1380 ± 70 kPa for 10 minutes, a diameter of 9 mm was measured from the center of the sample.
A disc of 1.1 ± 0.25 mm is cut out and weighed to 0.005 g (this is referred to as the disc weight). And the next number 1
(1).
【数１】樹脂流れ（％）＝１００×（初期重量−２×円
板重量）／初期重量## EQU1 ## Resin flow (%) = 100 × (initial weight−2 × disc weight) / initial weight
【０００７】多層プリント配線板を製造するときの加熱
により、熱硬化性樹脂プリプレグの熱硬化性樹脂組成物
は溶融して流動してクッションの作用をしてローフロー
絶縁接着シートが内層回路の凹凸に追従するのを助け
る。そして、熱硬化性樹脂プリプレグを挟んでいるロー
フロー絶縁接着シートで熱硬化性樹脂組成物がＩＶＨか
らしみだすのを抑える。これにより、ＩＶＨからの樹脂
のしみだしをなくし、かつ、外層表面も平滑になる。[0007] By heating during the production of a multilayer printed wiring board, the thermosetting resin composition of the thermosetting resin prepreg melts and flows to act as a cushion, causing the low-flow insulating adhesive sheet to become uneven on the inner layer circuit. Help to follow. The low-flow insulating adhesive sheet sandwiching the thermosetting resin prepreg prevents the thermosetting resin composition from seeping out of the IVH. Thereby, exudation of the resin from the IVH is eliminated, and the outer layer surface is also smoothed.
【０００８】多層プリント配線板は、所定の構成材の間
に絶縁接着材料を挟み、構成材に形成された内層回路相
互間の位置を合わせて重ね、加熱加圧して製造される。
この位置を合わせて重ねる作業を容易にすることと、熱
硬化性樹脂プリプレグから樹脂粉の脱落を防止すること
から、熱硬化性樹脂プリプレグを、ローフロー絶縁接着
シートで挟みラミネートしておくのが好ましい。すなわ
ち、請求項２に記載の発明は、熱硬化性樹脂プリプレグ
を、ローフロー絶縁接着シートで挟みラミネートしてな
る請求項１に記載の絶縁接着材料である。[0008] The multilayer printed wiring board is manufactured by sandwiching an insulating adhesive material between predetermined components, overlapping the inner layers formed on the components, aligning them, and applying heat and pressure.
It is preferable that the thermosetting resin prepreg be sandwiched between the low-flow insulating adhesive sheets and laminated so as to facilitate the work of aligning and overlapping the positions and to prevent the resin powder from falling off from the thermosetting resin prepreg. . That is, the invention according to claim 2 is the insulating adhesive material according to claim 1, wherein the thermosetting resin prepreg is sandwiched between low-flow insulating adhesive sheets and laminated.
【０００９】また、請求項３に記載の発明は、請求項１
又は２に記載の絶縁接着材料を用いて、構成材を接着一
体化してなる多層プリント配線板である。[0009] The invention described in claim 3 is the first invention.
Or a multilayer printed wiring board obtained by bonding and integrating components using the insulating adhesive material described in 2.
【００１０】[0010]
【発明の実施の形態】本発明において用いられる熱硬化
性樹脂プリプレグとしては、公知の多層プリント配線板
用プリプレグを用いることができ特に制限はない。例え
ば、ＪＩＳに多層プリント配線板用として規定されてい
るような、ガラス布基材エポキシ樹脂プリプレグ、ガラ
ス布基材ポリイミド樹脂プリプレグ、ガラス布基材ビス
マレイミド／トリアジン／エポキシ樹脂プリプレグ等を
挙げることができる。DESCRIPTION OF THE PREFERRED EMBODIMENTS As a thermosetting resin prepreg used in the present invention, a known prepreg for a multilayer printed wiring board can be used without any particular limitation. For example, a glass cloth base epoxy resin prepreg, a glass cloth base polyimide resin prepreg, a glass cloth base bismaleimide / triazine / epoxy resin prepreg, etc. as specified in JIS for a multilayer printed wiring board may be mentioned. it can.
【００１１】本発明において用いられるローフロー絶縁
接着シートとしては、多層プリント配線板を薄型化する
ことから、ガラス布のような織布基材を含まないものが
好ましい。このようなローフロー絶縁接着シートとして
は、例えば、フィルム形成能を有する高分子量エポキシ
重合体及び接着性を有するエポキシ樹脂を必須成分とす
る樹脂組成物をシート化した絶縁接着シート、無機繊維
及び熱硬化性樹脂粒子を含むスラリーを抄造し、抄造し
て得られたシートに硬化性バインダー樹脂を塗布し、次
いで加熱乾燥して硬化性バインダー樹脂を硬化させて得
られる絶縁接着シートを挙げることができる。ここで、
フィルム形成能を有するとは、例えば、溶剤に溶解した
樹脂を基材上に流延したときに、フィルムが形成でき、
形成されたフィルムが、搬送、切断及び積層等の工程中
において、割れや欠落等のトラブルを生じにくいもので
あることを意味する。フィルム形成能を有する高分子量
エポキシ重合体及び接着性を有するエポキシ樹脂を必須
成分とする樹脂組成物をシート化した絶縁接着シート
は、ＡＳ−３０００という商品名で日立化成工業株式会
社から市販されている。また、無機繊維及び熱硬化性樹
脂粒子を含むスラリーを抄造し、抄造して得られたシー
トに硬化性バインダー樹脂を塗布し、次いで加熱乾燥し
て硬化性バインダー樹脂を硬化させて得られる絶縁接着
シートは、ＧＥＡ−６７９Ｐという商品名で、これも日
立化成工業株式会社から市販されている。The low-flow insulating adhesive sheet used in the present invention preferably does not contain a woven fabric base material such as glass cloth in order to reduce the thickness of the multilayer printed wiring board. Examples of such a low-flow insulating adhesive sheet include, for example, an insulating adhesive sheet in which a resin composition containing a high molecular weight epoxy polymer having a film forming ability and an epoxy resin having an adhesive property as an essential component, inorganic fibers, and thermosetting. An insulating adhesive sheet obtained by forming a slurry containing the curable resin particles, applying a curable binder resin to a sheet obtained by the forming, and then heating and drying to cure the curable binder resin. here,
Having film-forming ability, for example, when a resin dissolved in a solvent is cast on a substrate, a film can be formed,
This means that the formed film is unlikely to cause troubles such as cracks or missing during the steps of transporting, cutting and laminating. An insulating adhesive sheet made of a resin composition containing a high molecular weight epoxy polymer having film forming ability and an epoxy resin having adhesiveness as an essential component is commercially available from Hitachi Chemical Co., Ltd. under the trade name of AS-3000. I have. Also, a slurry containing inorganic fibers and thermosetting resin particles is formed into a sheet, a curable binder resin is applied to a sheet obtained by the forming, and then heated and dried to cure the curable binder resin, thereby obtaining an insulating adhesive. The sheet is a trade name GEA-679P, which is also commercially available from Hitachi Chemical Co., Ltd.
【００１２】熱硬化性樹脂プリプレグをローフロー絶縁
接着シートで挟んでラミネートする方法としては、内部
に空気を巻き込まないようにすることから、ロールラミ
ネートによるのが好ましい。ロールラミネートするとき
の温度は、熱硬化性樹脂プリプレグ及びローフロー絶縁
接着シートが軟化するが硬化反応が進まない温度が選定
される。前記ＡＳ−３０００は、キャリヤシート付で提
供されるが、キャリヤシート付付のままでキャリヤシー
トが外側になるようにして熱硬化性樹脂プリプレグとラ
ミネートし、使用直前にキャリヤシートを剥離するのが
好ましい。キャリヤシートにより絶縁接着材料を保護す
ることができるからである。As a method of laminating the thermosetting resin prepreg with a low-flow insulating adhesive sheet, it is preferable to use a roll lamination in order to prevent air from being trapped inside. As the temperature for roll lamination, a temperature at which the thermosetting resin prepreg and the low-flow insulating adhesive sheet are softened but the curing reaction does not proceed is selected. The AS-3000 is provided with a carrier sheet, but it is preferred that the carrier sheet be laminated with a thermosetting resin prepreg so that the carrier sheet is outside with the carrier sheet attached, and the carrier sheet be peeled off immediately before use. preferable. This is because the insulating adhesive material can be protected by the carrier sheet.
【００１３】多層プリント配線板の製造時の加熱温度は
通常１６０〜１８０℃の範囲で、場合によっては１３０
〜２００℃の範囲で、また、圧力は通常、１〜４ＭＰａ
の範囲で、場合によっては、０．５〜１０ＭＰａの範囲
で、また時間は通常１０〜１００分間の範囲とされる。
これらの条件はプレス機の能力、目的とする多層プリン
ト配線板の厚さ等により適宜選択される。The heating temperature at the time of manufacturing a multilayer printed wiring board is usually in the range of 160 to 180 ° C., and sometimes 130 ° C.
~ 200 ° C, and the pressure is usually 1-4MPa
In some cases, in the range of 0.5 to 10 MPa, and the time is usually in the range of 10 to 100 minutes.
These conditions are appropriately selected depending on the capacity of the press machine, the desired thickness of the multilayer printed wiring board, and the like.
【００１４】[0014]
【実施例】実施例１ 厚さ０．１ｍｍのガラス布基材エポキシ樹脂プリプレグ
（日立化成工業株式会社製、ＧＥＡ−６７Ｎ（商品名）
を使用した）の両面に、厚さ０．０５ｍｍ、樹脂流れ
０．５％の絶縁接着シート（日立化成工業株式会社製、
ＡＳ−３０００（商品名）を使用した）をキャリヤシー
ト付のままでキャリヤシートが外側となるように配し、
ロールラミネーターを使用し、ロール温度１５０℃、ラ
ミネート速度０．２ｍ／分、線圧２３５．２Ｎ／ｃｍで
ラミネートすることにより、シート状の絶縁接着材料Ａ
を作製した。EXAMPLES Example 1 Glass cloth-based epoxy resin prepreg having a thickness of 0.1 mm (GEA-67N (trade name) manufactured by Hitachi Chemical Co., Ltd.)
On both sides of the sheet, an insulating adhesive sheet (manufactured by Hitachi Chemical Co., Ltd.) having a thickness of 0.05 mm and a resin flow of 0.5%
AS-3000 (trade name)) is arranged so that the carrier sheet is outside with the carrier sheet attached,
By laminating using a roll laminator at a roll temperature of 150 ° C., a laminating speed of 0.2 m / min, and a linear pressure of 235.2 N / cm, a sheet-like insulating adhesive material A
Was prepared.
【００１５】これとは別に、銅はく厚さ１８μｍ、厚さ
０．１ｍｍの両面銅張り積層板（日立化成工業株式会社
製、ＭＣＬ−Ｅ−６７（商品名）を使用した）の片面に
内層用の回路を形成し、さらに、所定の箇所に直径０．
１５ｍｍの貫通穴を設けてＩＶＨ付のプリント配線板Ａ
を作製した。Separately, on one side of a copper-clad laminate (MCL-E-67 (trade name) manufactured by Hitachi Chemical Co., Ltd.) having a copper foil thickness of 18 μm and a thickness of 0.1 mm. A circuit for the inner layer is formed, and a circuit having a diameter of 0.
Printed wiring board A with IVH with 15mm through hole
Was prepared.
【００１６】前記で得られたプリント配線板Ａ２枚を、
回路加工を施した面を内側にし、その間に前記で得られ
たキャリヤシートを除いた絶縁接着材料Ａを挿み、厚さ
１ｍｍのステンレス製鏡板で挟み、１７０℃、４ＭＰａ
の条件で６０分間加熱加圧して４層プリント配線板Ａを
作製した。この４層プリント配線板Ａは、ＩＶＨからの
樹脂のしみだしがなく、また、表面に内層用の回路の凹
凸が現われることもなく平滑であった。The two printed wiring boards A obtained above are
The surface subjected to the circuit processing is turned inside, the insulating adhesive material A excluding the carrier sheet obtained above is inserted between the surfaces, and sandwiched between stainless steel end plates having a thickness of 1 mm, at 170 ° C., 4 MPa
The heating and pressurization was performed for 60 minutes under the conditions described above to produce a four-layer printed wiring board A. The four-layer printed wiring board A was smooth without exudation of the resin from the IVH and without showing any unevenness of the inner layer circuit on the surface.
【００１７】実施例２ ＡＳ−３０００に代えて、あらかじめ１５０℃で３〜４
分間乾燥機中で加熱して得られた、厚さ０．０５ｍｍ、
樹脂流れ２．３％の絶縁接着シート（日立化成工業株式
会社製、ＧＥＡ−６７９Ｐ（商品名）を使用した）をガ
ラス布基材エポキシ樹脂プリプレグとラミネートしない
で用い、１７０℃、２．５ＭＰａの条件で４５分間加熱
加圧したほかは、実施例１と同様にして４層プリント配
線板Ｂを作製した。この４層プリント配線板Ｂは、ＩＶ
Ｈからの樹脂のしみだしがなく、また、表面に内層用の
回路の凹凸が現われることもなく平滑であった。Example 2 In place of AS-3000, 3 to 4 at 150 ° C.
0.05 mm thick, obtained by heating in a dryer for
Using a 2.3% resin-flow insulating adhesive sheet (GEA-679P (trade name), manufactured by Hitachi Chemical Co., Ltd.) without laminating with a glass cloth base epoxy resin prepreg, at 170 ° C. and 2.5 MPa A four-layer printed wiring board B was produced in the same manner as in Example 1 except that heating and pressing were performed under the conditions for 45 minutes. This four-layer printed wiring board B has an IV
The resin was smooth without any exudation of the resin from H and no unevenness of the circuit for the inner layer appeared on the surface.
【００１８】比較例１ ＡＳ−３０００を使用せず、ＧＥＡ−６７Ｎ２枚を重ね
て用いたほかは実施例１と同様にして４層プリント配線
板Ｃを作製した。この４層プリント配線板Ｃは、表面に
内層用の回路の凹凸が現われることがなく平滑であった
が、ＩＶＨからの樹脂のしみだしがあり、鏡板に樹脂が
付着していた。Comparative Example 1 A four-layer printed wiring board C was prepared in the same manner as in Example 1 except that two sheets of GEA-67N were used without using AS-3000. The four-layer printed wiring board C was smooth without any surface irregularities on the inner layer, but had resin seepage from the IVH, and the resin had adhered to the mirror plate.
【００１９】比較例２ ＧＥＡ−６７Ｎを使用せず、ＡＳ−３０００を１枚のみ
用いたほかは実施例１と同様にして４層プリント配線板
Ｄを作製した。この４層プリント配線板Ｄは、ＩＶＨか
らの樹脂のしみだしがなかったが、表面に内層用の回路
の凹凸が現われ、さらに、表面の銅はくを全面エッチン
グ除去して肉眼で観察したところ、多数のボイドが認め
られた。Comparative Example 2 A four-layer printed wiring board D was produced in the same manner as in Example 1 except that only one AS-3000 was used without using GEA-67N. In this four-layer printed wiring board D, no resin seeped out from the IVH, but irregularities of the circuit for the inner layer appeared on the surface, and further, the copper foil on the surface was removed by etching all over and visually observed. And many voids were observed.
【００２０】[0020]
【発明の効果】請求項１に記載の発明によれば、構成材
のＩＶＨからの樹脂のしみだしがなく、また、内層回路
の凹み埋めることができ、ボイドの発生や多層プリント
配線板の外層表面を平滑にできるという効果を奏する。
請求項２に記載の発明によれば、請求項１に記載の発明
の効果に加えて、構成材に形成された内層回路相互間の
位置を合わせる作業を容易にでき、熱硬化性樹脂プリプ
レグからの樹脂粉の脱落を防止できるという効果を奏す
る。また、請求項３に記載の発明によれば、ボイドの発
生がなく、外層表面が平滑な多層プリント配線板を提供
できる。According to the first aspect of the present invention, the resin does not exude from the IVH of the constituent material, the dent of the inner layer circuit can be filled, the occurrence of voids and the outer layer of the multilayer printed wiring board can be prevented. This has the effect that the surface can be smoothed.
According to the second aspect of the invention, in addition to the effects of the first aspect, the operation of aligning the positions of the inner layer circuits formed on the constituent material can be facilitated, and the thermosetting resin prepreg can be used. This has the effect of preventing the resin powder from falling off. According to the third aspect of the present invention, it is possible to provide a multilayer printed wiring board having no voids and a smooth outer layer surface.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 田邊 貴弘 茨城県下館市大字小川1500番地 日立化成 工業株式会社下館工場内 ──────────────────────────────────────────────────続 き Continuing from the front page (72) Inventor Takahiro Tanabe 1500 Ogawa Oji, Shimodate City, Ibaraki Pref.Hitachi Chemical Industry Co., Ltd.
Claims (3)
縁接着シートで挟んでなる絶縁接着材料。1. An insulating adhesive material comprising a thermosetting resin prepreg sandwiched between low-flow insulating adhesive sheets.
縁接着シートで挟みラミネートしてなる請求項１に記載
の絶縁接着材料。2. The insulating adhesive material according to claim 1, wherein the thermosetting resin prepreg is sandwiched between low-flow insulating adhesive sheets and laminated.
用いて、構成材を接着一体化してなる多層プリント配線
板。3. A multilayer printed wiring board obtained by bonding and integrating components using the insulating adhesive material according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP35850797A JPH11181122A (en) | 1997-12-25 | 1997-12-25 | Insulation adhesive material and multilayer printed wiring board prepared by using the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP35850797A JPH11181122A (en) | 1997-12-25 | 1997-12-25 | Insulation adhesive material and multilayer printed wiring board prepared by using the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH11181122A true JPH11181122A (en) | 1999-07-06 |
Family
ID=18459679
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP35850797A Pending JPH11181122A (en) | 1997-12-25 | 1997-12-25 | Insulation adhesive material and multilayer printed wiring board prepared by using the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH11181122A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008129784A1 (en) * | 2007-03-20 | 2008-10-30 | Sumitomo Bakelite Co., Ltd. | Method for manufacturing laminated board, and laminated board |
| JP2009231240A (en) * | 2008-03-25 | 2009-10-08 | Ajinomoto Co Inc | Method of manufacturing multilayer printed wiring board |
-
1997
- 1997-12-25 JP JP35850797A patent/JPH11181122A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008129784A1 (en) * | 2007-03-20 | 2008-10-30 | Sumitomo Bakelite Co., Ltd. | Method for manufacturing laminated board, and laminated board |
| JPWO2008129784A1 (en) * | 2007-03-20 | 2010-07-22 | 住友ベークライト株式会社 | Laminate production method and laminate |
| US20100297420A1 (en) * | 2007-03-20 | 2010-11-25 | Kazuyuki Yoshizaki | Method for manufacturing laminated board, and laminated board |
| KR101165935B1 (en) * | 2007-03-20 | 2012-07-19 | 스미토모 베이클리트 컴퍼니 리미티드 | Method for manufacturing laminated board, and laminated board |
| JP5251866B2 (en) * | 2007-03-20 | 2013-07-31 | 住友ベークライト株式会社 | Laminate production method and laminate |
| US8636868B2 (en) | 2007-03-20 | 2014-01-28 | Sumitomo Bakelite Co., Ltd. | Method for manufacturing laminated board, and laminated board |
| JP2009231240A (en) * | 2008-03-25 | 2009-10-08 | Ajinomoto Co Inc | Method of manufacturing multilayer printed wiring board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0781501B1 (en) | Monolithic lcp polymer microelectronic wiring modules | |
| JP5251866B2 (en) | Laminate production method and laminate | |
| KR100599020B1 (en) | Method of vacuum-laminating adhesive film | |
| JP2012015562A (en) | Method of manufacturing circuit board | |
| JP2817947B2 (en) | Adhesive sheet for multilayer printed circuit board | |
| JP3944921B2 (en) | Manufacturing method of multilayer wiring board | |
| JPH11181122A (en) | Insulation adhesive material and multilayer printed wiring board prepared by using the same | |
| JP3698863B2 (en) | Bonding material for single-sided metal-clad laminate production | |
| JP3145079B2 (en) | Method and apparatus for manufacturing multilayer printed circuit board | |
| JPH09100357A (en) | Production of no-flow prepreg | |
| JPH05167250A (en) | Method of manufacturing multilayer printed wiring board | |
| JP4747619B2 (en) | Coverlay film and flexible wiring board | |
| WO2002085621A1 (en) | Laminated plate and part using the laminated plate | |
| EP0771181B1 (en) | Sheets with high temperature stable protective coating | |
| JPH10261872A (en) | Material for multilayer wiring board, its manufacture, and manufacture of multilayer wiring board using it | |
| JPH06334B2 (en) | Prepreg manufacturing method | |
| JP3280604B2 (en) | Method of manufacturing metal-clad laminate, method of manufacturing printed wiring board, and method of manufacturing multilayer board | |
| JPH11214844A (en) | Production of multilayer board | |
| JPH08148836A (en) | Multilayered flexrigid wiring board | |
| JPH04165690A (en) | Manufacture of single-sided copper-clad laminated board | |
| JP2000196236A (en) | Double-sided flash printed wiring board and manufacture thereof | |
| JP4661264B2 (en) | Coverlay film and flexible wiring board | |
| JP2003332740A (en) | Method of manufacturing multilayered wiring board | |
| JPH0730210A (en) | Rigid flex printed wiring board and manufacturing method thereof | |
| JPH0768654A (en) | Laminatedplate molding release sheet and manufacture of multilayer plate using the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20040805 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20051216 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20060104 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20060606 |