JPH1119943A - Manufacture of structure and the structure - Google Patents

Abstract

PROBLEM TO BE SOLVED: To manufacture a structure having a space with a simple method. SOLUTION: The method for manufacturing a structure comprises the forming step of forming a two-dimensional continuous structure while two-dimensionally searching solder having a melting point of 80 deg.C in a generating means, then accumulating step of supplying photosetting resin only in a thickness of the continuous structure, emitting an ultraviolet ray having a wavelength of curing sensitivity of the resin to an accumulated resin, repeating the forming step and accumulating step by selecting on the continuous structure or accumulated resin, and forming a composite structure having the accumulated resin 904 around the continuous structure 901. The method further comprises the steps of heating the composite structure to 90 deg.C, removing the structure 901, alternately supplying warm water from A part and B part of the structure 901, and all removing the solder of the structure 901 to obtain the structure. Thereafter, the resin 904 having a three-dimensional continuous hollow part is cut into 902 and 903 to obtain the mold of a three-dimensional structure.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure having a space on the surface or inside, or a structure having a foreign substance on the surface or inside, and a method for producing the same, and particularly to a composite structure having a continuous structure. The present invention relates to a structure from which the continuous structure is removed and a structure in which a substance is injected into a space of the structure.

[0002]

2. Description of the Related Art Structures having voids or cavities on the surface or inside include, for example, filters such as filter paper and air filters for filtering dispersoids and dispersion media, as well as molds for producing three-dimensional structures. . In addition, as a structure including a different kind of substance, there are a wide variety of structures such as a wiring board using a conductive substance and an insulating substance, and an optical filter or a molded article using a transparent substance and an opaque substance. .

[0003]

In the above prior art,
For example, a filter is manufactured by sintering a fiber of an organic substance with a ceramic material such as glass and then baking to remove the organic substance and provide holes in the ceramic material. In such a manufacturing method, there is a problem that it is difficult to form holes uniformly in the ceramic material, and if the fibers are not uniformly dispersed, a plurality of fibers overlap in the ceramic, resulting in a hole larger than a design value. In the case of a three-dimensional structure type or the like, it is extremely difficult to create a complicated shape with high accuracy, such as a part of a micromachine, and the shape is also limited.
In addition, there is a problem that the production of the mold is expensive. Also,
For example, in the case of a wiring board as a structure having a different kind of substance, when connecting wiring patterns on the front and back or when connecting various elements to the wiring board, it is necessary to fill a hole provided in the wiring board with a conductive substance. If the conductive material is not filled well, there is a problem that connection failure and / or connection resistance increases. Further, in an optical filter as another example of a structure having a different kind of substance, it is difficult to finely adjust the optical characteristics, and a material applicable to a molded article is, for example, a low-melting point resin called a thermosetting resin or a so-called wax. There is a problem that the range of applicable materials is extremely limited because it is only a substance.

Therefore, the present invention solves the above-mentioned problems, and a method of manufacturing a structure capable of extremely easily manufacturing a structure having a void or a cavity on the surface or inside thereof and increasing the degree of freedom of the shape of the void or the void. And a method of manufacturing a structure in which the void or the cavity is replaced with another substance, and a structure.

[0005]

According to a first aspect of the present invention, there is provided a method of manufacturing a structure, comprising: forming a composite structure including a first substance and a second substance having different melting points in a solid state, at least using the composite structure. Forming a continuous structure including discharge means for discharging a first substance; and accumulating a step of supplying the second substance to the periphery of the continuous structure. The method includes a removing step of removing the continuous structure. The method for manufacturing a structure according to the present invention according to claim 2, comprising: supplying a composite structure including a first substance and a second substance having different melting points in a solid state, wherein the first substance is in a granular state. Forming a continuous structure, forming an accumulation step of supplying the second substance in a liquid state, manufacturing, including a removing step of removing the continuous structure of the composite structure, I do. The method of manufacturing a structure according to the present invention according to claim 3, wherein a material having a low melting point is supplied in a granular form by a granular generating means from among a plurality of materials having different melting points in a solid state, thereby forming a continuous structure. And forming a composite structure including a storage step of forming, in at least a region other than the continuous structure, a storage of another substance different from the substance constituting the continuous structure among the plurality of types of substances. And removing the continuous structure from the composite structure by heating at least the continuous structure to a temperature equal to or higher than the melting point of the continuous structure and equal to or lower than the melting point of the accumulation. According to a fourth aspect of the present invention, in the method of manufacturing a structure according to any one of the first to third aspects, the forming step is performed in a direction in which the continuous structure is formed. Alternatively, the method includes a step of growing a substance in at least one of the accumulation directions in the supply step to form a three-dimensional continuous structure. According to a fifth aspect of the present invention, there is provided a method of manufacturing a structure according to any one of the first to third aspects, wherein the accumulating step is performed in the accumulating direction of the accumulating step of the continuous structure. Characterized in that the method includes a step of supplying a film having a thickness of not less than. According to a sixth aspect of the present invention, in the method of manufacturing a structure according to any one of the first to third aspects, the accumulating step includes a step of flowing a liquid substance. It is characterized by the following. The method for manufacturing a structure according to the present invention according to claim 7 is the method according to claims 1 to 3,
Or in the method for producing a structure according to any one of 6
The accumulation step includes a step of solidifying a substance applied to the accumulation step. According to a method of manufacturing a structure of the present invention described in claim 8, in the method of manufacturing a structure according to any one of claims 1 to 4, the substance used in the forming step is either a metal or an alloy. It is characterized by.
According to a ninth aspect of the present invention, in the method for manufacturing a structure according to any one of the first to third or fifth to seventh aspects, the substance used in the accumulation step is a dielectric. It is characterized by. According to a tenth aspect of the present invention, there is provided a method of manufacturing a structure according to the ninth aspect, wherein the dielectric includes a photocurable resin which is three-dimensionally cured by irradiation with energy rays. Features. According to a method for manufacturing a structure of the present invention described in claim 11, in the method for manufacturing a structure according to any one of claims 1 to 3, a substance other than the continuous structure is injected after the removing step. It is characterized in that an injection step is added. According to a twelfth aspect of the present invention, in the method for manufacturing a structure according to the eleventh aspect, the implanting step also serves as the removing step. According to a thirteenth aspect of the present invention, in the method for manufacturing a structure according to any one of the eleventh and twelfth aspects, the substance used in the implantation step is any one of a metal and an alloy. It is characterized by.
The method for removing a continuous structure according to the present invention according to claim 14,
A composite material comprising a first substance and a second substance having different melting points in a solid state, wherein the first substance forms a continuous structure, and the periphery of the continuous structure is filled with the second substance. At least the continuous structure is heated from the structure, and the continuous structure is removed. The method for injecting a continuous structure according to the present invention according to claim 15, comprising a first substance and a second substance having different melting points in a solid state, wherein the first substance forms a continuous structure, From the composite structure having a configuration in which the periphery of the continuous structure is filled with the second substance, at least the continuous structure is heated and the continuous structure is removed. Is injected. The method for injecting a continuous structure according to the present invention described in claim 16 is characterized in that a fluid is injected into the continuous space of a structure having a groove-shaped or hole-shaped continuous space to form a continuous structure of the fluid. Features. The method for replacing a continuous structure according to the present invention according to claim 17, comprising a first substance and a second substance having different melting points in a solid state, wherein the first substance forms a continuous structure, From a composite structure having a configuration in which the periphery of the continuous structure is filled with the second substance, at least the continuous structure is heated and a fluid is injected, and the continuous structure is replaced with the fluid. . The structure of the present invention described in claim 18 is characterized in that at least the surface or inside of the structure has a void or cavity manufactured by the method for manufacturing a structure according to any one of claims 1 to 10. According to a nineteenth aspect of the present invention, there is provided a structure according to any one of the first to thirteenth aspects, wherein the structure is made of a composite material manufactured by a manufacturing method.

[0006]

BEST MODE FOR CARRYING OUT THE INVENTION A composite structure, which is a precursor of the structure of the present invention, comprises at least a plurality of kinds of substances having different melting points in a solid state. A composite is obtained by supplying at least one of the plurality of types of substances by a discharging unit or a granular generation unit or the like to a continuous structure and supplying a substance other than the substance provided to the continuous structure to the periphery of the structure. A structure is created, and the continuous structure of the composite structure is removed to manufacture the structure of the present invention.

[0007] The continuous structure in the present invention is a structure in which one of a substance discharged intermittently or continuously by a discharge means or a substance supplied in a granular form by a granular generation means is connected to one of the substances continuously. A one-dimensional string-shaped continuous structure (also referred to as a string or a rope depending on the thickness of the continuous structure, but is generally referred to as a string in the present invention), a two-dimensional surface Continuous structure (also referred to as a plate shape or the like depending on the thickness of the continuous structure, but is generally referred to as a planar shape in the present invention), and a three-dimensional continuous structure (the string-like continuous structure and / or the planar continuous structure) (A continuous structure in which the structures are three-dimensionally assembled). Therefore, a three-dimensional continuous structure can be created by growing the substance in at least one of the formation direction of the continuous structure formation step and the accumulation direction of the supply step.

However, when a continuous structure is prepared by intermittently discharging or supplying the particles in a so-called granular form using a granular generation means, the string-shaped continuous structure is formed in the longitudinal direction of the string-shaped continuous structure. The supply interval may be appropriately controlled, and when forming the planar continuous structure, the supply interval in the two-dimensional direction of the planar continuous structure may be appropriately controlled. Similarly, when forming the three-dimensional continuous structure, The supply intervals in all directions can be appropriately controlled according to the shape, and the diameter, thickness, and the like of the continuous structure can be freely set by controlling the supply amount of the substance.

As a method of creating this continuous structure,
This can be achieved by supplying a material constituting a continuous structure onto a predetermined supporting substrate, a continuous structure, or a storage through a discharge unit or a granulation unit that extrudes a substance. The state of the substance from the two to the continuous structure) may be granular or continuous, but the granular state is generally preferred when the forming step and the accumulating step are repeated. . In addition,
As the substance constituting the continuous structure of the present invention, any of an organic substance and an inorganic substance can be applied.
If one is a metal or an alloy, for example, conductivity,
It is preferable in terms of functions such as an energy conversion function and / or control of a melting point.

[0010] The accumulating step is to supply a substance to the periphery of the continuous structure. When the substance to be supplied to the accumulating step comes into contact with the continuous structure, a substance different from the substance supplied to the continuous structure is applied. I do. If the supply amount in the accumulation step is larger than the thickness of the continuous structure in the accumulation direction, the continuous structure can be isolated by the accumulation. If the continuous structure is removed from the composite structure in which the continuous structure is isolated, for example, a porous structure or a structure having a three-dimensional cavity can be obtained, and the filter, the formed object, or the formed object can be obtained. You can create the type of object. Note that if the supply amount in the accumulation step is equal to or less than the thickness of the accumulation method of the continuous structure, only the continuous structure appears on the surface of the composite structure, and if the continuous structure existing on the surface is removed, Of course, grooves can be formed on the surface of the accumulation, and the structure of the present invention can be applied in any case. In addition, the accumulation means in the accumulation step includes:
In addition to the generating means in the forming step described above, various printing methods or so-called vapor deposition methods such as vapor deposition and sputtering can be applied. For example, a method capable of continuously supplying a substance applicable to the accumulation step as in the discharging means described above. However, the process time can be reduced.

It is preferable to apply a liquid substance to the accumulation step at least in the atmosphere of the accumulation step because the accumulation step can be performed by a simple method of flowing the liquid substance.
The liquid substance includes, for example, a melt, a solution, a dispersion, a low molecular weight substance (monomer or oligomer) and the like. If a step of solidifying by a method such as evaporation, cooling, curing or the like as appropriate according to the liquid substance to be applied is included. Good. In addition, as the electrical characteristics of the substance provided for the accumulation step, any of a conductor and a dielectric (including an insulator) can be applied, but in general, a substance having a dielectric property for protecting a continuous structure is preferable. In particular, a photocurable resin that is three-dimensionally cured by irradiation with energy rays such as ultraviolet rays or X-rays is preferable in terms of work because it can eliminate an increase in steps such as evaporation or cooling. A composite structure, which is a precursor of the structure of the present invention, can be formed by the formation step and the accumulation step described above, and the structure of the present invention can be manufactured by a step of removing the continuous structure provided in the composite structure. .

The continuous structure may be removed from the composite structure by dry etching, wet etching, or the like, depending on the diameter, thickness, size, material, and / or location of the continuous structure. Or a method of removing the external force such as dropping, inclining, suctioning or pushing out alone or as appropriate as necessary after the phase change of the continuous structure such as melting, melting, etc. It can be selected and applied as appropriate. However, of the above-described removal methods, at least selectively heating the continuous structure to be removed, melting at least an interface between the continuous structure and a substance existing around the continuous structure, and applying an external force. Is preferable as a means for removing the three-dimensional continuous structure. As a method of selectively heating the continuous structure, a method of directly heating the continuous structure, a method of heating a material around the continuous structure, and heating using heat conduction of the material, or the like. There is
It can be selected as needed.

Further, as the pressure source applied to the internal extrusion of the external force, a gas or a liquid can be appropriately selected and used, and the extrusion pressure may be set as required. For example, a discharging means in a forming process can be applied. When the continuous structure provided in the composite structure is removed in this manner, voids, spaces, cavities, grooves, holes or holes (hereinafter, these are referred to as spaces)
Can be produced in a composite structure. The removal step in the present invention is preferably performed by adding a removal step such as etching, so that the removal step can be performed more completely. In response to a request for surface property modification of the material of the continuous structure to be removed or the wall surface of the space. It is good to select appropriately.

Next, a structure provided with another substance in the space of such a structure will be described. As a means for providing the substance, it is basically sufficient to inject or fill the substance into the space (hereinafter, these are referred to as “injection”). Means can be applied, and when the space is exposed on the surface of the structure, it is a matter of course that a method similar to the accumulation step can be used other than the printing or generating means. In the case where the space exists inside the structure, a discharging means generally applied in the forming step is applied. In particular, by applying the generation means of the above-described injection method, the supply amount of the substance can be appropriately controlled, so that the amount of the substance can be supplied in consideration of the volume of the hole, for example, wiring provided on the front and back of the insulating substrate can be provided. It is preferable that the conductive substance can be injected in accordance with the volume of the hole when electrically connecting or when electrically connecting the wiring of the wiring board and the electric element. Further, it is desirable that the generating means and the injection port of the space be brought into close contact with each other, because the injection can be performed while applying a predetermined pressure to the substance to be injected.

The above-described implantation step may be performed after removing the continuous structure of the composite structure, or may be performed simultaneously with the removal of the continuous structure (that is, the implantation step also serves as the removal step). For example, when a substance having no reactivity or the like with the substance constituting the continuous structure is injected, the step can be simplified by performing a so-called substance replacement in which the injection step also serves as a removal step. As described above, the substance to be injected is preferably in a liquid state similarly to the substance applied in the step of forming the composite structure, and the liquefaction means is preferably melted, which is the same as in the formation step. In addition, it is preferable to use a metal as the substance to be implanted in the same manner as the substance of the continuous structure in terms of the conductivity, the energy conversion function, and the like.

[0016]

First, the concept of the composite structure of the precursor of the structure manufactured by the manufacturing method of the present invention and the concept of the basic structure of the structure of the present invention are applied to two kinds of substances having different melting points in the solid state. The case will be described as an example with reference to the drawings. 1 to 4 are conceptual process diagrams illustrating a method for manufacturing a composite structure of a precursor of a structure of the present invention, and FIG. 5 is a partial cross-sectional perspective view illustrating a removal process for removing a continuous structure of the composite structure. FIG. 6 is a partial sectional perspective view showing a structure manufactured by this method.

According to the present invention, the first formation in which the substance once liquefied from the generating means 10 is supplied to the support 30 as the granular material 20 and fixed to the support 30 as a part (21A to 21D) of the continuous structure. Perform the process. After the first forming step is completed, the material 40 having a different solid-state melting point of the granular material 20 is supplied from the supply means 50 to a region other than a region where a part (21A to 21D) of the continuous structure is applied. The accumulation 41 of the substance 40 is provided around a part (21A to 21D) of the continuous structure, and the first accumulation step is performed. After the first accumulation step, the granular material 20 is supplied from the generating means 10 onto a part (21A to 21D) of the continuous structure in the same manner as in the first formation step, and a part of the continuous structure (22A to 22D) is supplied. 22D) is stacked, and after the second formation step, the substance 40 is accumulated around a part (22A to 22D) of the continuous structure using the same method as in the first accumulation step. A second accumulation step of providing the object 42 is performed, and the composite structure is manufactured by repeating the formation step and the accumulation step in this manner.

As a method for converting the substance supplied from the generating means 10 into a liquid state, there are techniques such as heating and melting the substance, dissolving the substance in a good solvent, and dispersing the substance in a dispersion medium. The method of heating and melting the granular material to support 30
Alternatively, it is preferable to simply cool after fixing to a part (21 or 22 or the like) of the continuous structure, and it is not necessary to remove the solvent, which is preferable. As a means for heating the substance, direct or indirect heating by a heater or the like, spark heating by electric discharge, and the like can be used. The state of liquefaction of the substance does not necessarily need to be completely liquefied, but may be such that it can be supplied as the granular material 20 from the generating means 10. The viscosity, pressure, diameter of the substance, etc. By making the volume constant, the volume of the granular material 20 can be made constant.

The pressure applying means of the generating means 10 includes a so-called piezoelectric element which operates an electrostrictive element according to an electric signal,
There are gas flow force, gravity, and the like, and a combination thereof can be appropriately selected. The appearance shape of the granular body 20 is controlled by controlling the pores, pressure, viscosity of the substance, and the like of the granularity generating means 10.
It can be set freely from a sphere to a shape with a tail.
In particular, when the granular material 20 is generated by melting the substance, the surface state of the granular material 20 has an adhesive force that can be fixed to at least the surface of the support 30 or a part (21, 22, or the like) of the continuous structure. If it does, it can be independently laminated as a continuous structure, and the outer surface shape of the laminated continuous structure can be controlled from the uneven shape to the planar shape by the temperature of the granular material 20 when it is fixed.

FIG. 1 shows a part 21 of the continuous structure of the first layer.
Are formed. That is, FIG.
This shows a state in which the formation of the third scanning line 21C from the first scanning line 21A is completed and the formation of the fourth scanning line 21D. Therefore, the generating means 10 sequentially moves in the direction perpendicular to the paper surface while supplying the granular material 20, and ends the first forming step. FIG. 2 shows that the granular material 2 after the first forming process is finished.
0 is supplied from the supply means 50 to the region other than the region where the part (21A to 21D) of the continuous structure is adhered, and the part 21 (21A) of the continuous structure is supplied.
21D) shows a state in which the periphery of the area is surrounded by the accumulation 41, the accumulation 41 is supplied to a predetermined area, and the first accumulation step is completed. FIG. 3 shows that after the first accumulation step, the granular material 20 is supplied from the generation unit 10 in the same manner as in the first formation step.
This figure shows a step of laminating a part 22 of the continuous structure on a part 21 of the continuous structure of the first layer, and the figure shows the formation of the third line of scan lines 22C from the first line of scan lines 22A. This indicates a state in which the fourth row of scanning lines 22D are being formed, and the second forming step is completed after the formation of the fourth row of scanning lines 22D. FIG. 4 shows that after the second formation step, the substance 40 is supplied from the supply means 50 to the area other than the area where the part (22A to 22D) of the continuous structure is fixed, similarly to the first accumulation step. The state in which the supply 42 is supplied and the periphery of the part 22 (22A to 22D) of the continuous structure is surrounded by the accumulation 42 is shown, the accumulation 42 is supplied to a predetermined area, and the second accumulation step is completed.

Thereafter, the formation step and the accumulation step are sequentially repeated to complete the composite structure as shown in FIG. In the above description, the case where the forming step and the accumulating step are alternately repeated in order has been described. However, for example, in the case of a continuous structure having no cavity therein as shown in FIG. If the materials that accumulate around the same are the same, it is not necessary to repeat the forming process and the accumulating process in turn, and only perform the forming process to produce a continuous structure of a predetermined shape, and then accumulate all at once. Steps can also be performed.
When manufactured by such a method, there is a preferable point that the boundary between the accumulations accumulated in different accumulation steps is eliminated, and the characteristics of the accumulations can be more uniform. Further, in the above description, one generating means is provided. However, if a multi-type having one or two-dimensional plural generating means is used, the time of the forming process is reduced, and the diameter of the hole of the generating means is further reduced. Needless to say, the present invention can be applied to a case where an independent generating means is provided according to the pressure, the heating temperature, the type of the substance, and the like.

Further, in the above description, each accumulation is formed to have a thickness substantially equal to the thickness of the continuous structure formed in one forming step. However, the accumulation is made thicker than the thickness of the continuous structure formed in each forming step. In such a case, the continuous structures formed in the respective forming steps are merely separated by the accumulation, and can be appropriately selected depending on the application. In the above description, one substance is used for each of the formation step and the accumulation step. However, needless to say, a plurality of substances may be independently used for each step. Means 60A-6 for selectively heating the continuous structures (A, B, C, D) from the composite structure prepared as described above, as shown in FIG.
Heating is performed by the heating means 60 having 0D to melt the continuous structure, and the continuous structure is removed by, for example, suctioning from the opposite surface side of the heating means 60 using suction means (not shown), and FIG. Can be manufactured.

The heating means 60 shown in FIG. 5 is provided with means 60A to 60D for selectively heating by contacting the positions of the continuous structures (A to D). The present invention is not limited to the form, and the entire composite structure may be heated. However, the heating temperature depends on the accumulation (41, 4
2) or lower than the melting point of the continuous structure (A to D). When an external force such as suction is applied to the removing means as described above, it is necessary to melt the entire continuous structure. However, it is needless to say that it is possible to cope by melting the interface between the continuous structure and the accumulation existing around the continuous structure.

Further, in the above description, the case where suction is used in combination with the heating means 60 as the removing means has been described. However, the removing means merely by dropping or tilting using gravity, the removing means by pressing force by gas or fluid, or the like. And the like. In particular, when the diameter of the continuous structure is small or the amount of the continuous structure is large, it is preferable to use both suction and pressing. Further, the means for converting the continuous structure into a liquid state in the removing step is not limited to heating and melting.For example, the composite structure is immersed in a good solvent of a constituent material of the continuous structure, heated together with the immersion, or heated. Means such as discharging the solvent while applying pressure may be used. In the above description, the removal is performed by heating and melting. However, the continuous structure can be removed by etching means such as dry etching or wet etching. Note that it is sometimes preferable to add the above-described method using a good solvent or the etching method to the removing step, since the continuous structure is completely removed. The diameter or size of the space of the structure of the present invention can be substantially the same as the diameter or size of the continuous structure, and the diameter or size of the continuous structure can be determined by the generating means used in the forming step, and the same specification Since the same continuous structure can be formed by using the generating means, for example, the diameter of the holes shown in FIG. 6 can be freely set, and the density of the holes can be formed in the composite structure at the same time. The density can be freely designed by controlling the generating means. For example, if the filter is applied to filtration, the size of the particles to be filtered can be freely selected, and the filtration efficiency can be improved.

Hereinafter, the structure of the present invention will be described in detail with reference to examples. FIG. 6 is a diagram showing a configuration of a filtration filter according to an embodiment of the structure of the present invention. First, as shown in FIG. 1, a low melting solder having a melting point of 80 ° C. is melted by a heating means (not shown), and a molten solder 20 having a diameter of 10 μm is applied from a generating means 10 to a stainless steel supporting substrate 30 by 2 μm.
A forming step of supplying the paste 40 at intervals of m is performed, and as shown in FIG. 2, a paste 40 containing a B ₂ O ₃ —PbO—ZnO-based crystalline glass having a melting point of 500 ° C. as a main component and a volatile wax mixed therein is supplied. After flowing out only the thickness of part 21 of the continuous structure from 50, sintering is performed at a temperature of about 350 ° C., and molten solder 20 is laminated on part 21 of the continuous structure as shown in FIG. The paste 40 was flowed out and sintered as described above, and this process was repeated a predetermined number of times to form a composite structure of crystalline glass having a continuous structure of low-melting solder as shown in FIG. The composite structure was fired in a furnace at a temperature of about 500 ° C. to bond the crystalline glass, and then taken out of the furnace to remove and remove the low-melting solder of the continuous structure to obtain the filter shown in FIG. In the above example, crystalline glass is applied to the accumulation, but if a resin is applied to the accumulation, a porous and flexible structure can be obtained, and compressed air can be passed through the holes of the structure. The method described above can be applied to bearings that do not require lubricating oil.

Next, a discharge multiplier according to another embodiment of the structure of the present invention will be described with reference to FIGS. Approximately 1 on a fluororesin support substrate (not shown)
In an atmosphere of 5 ° C., glycerin having a particle diameter of 1 μm is supplied from the generating means at intervals of 1 μm to form solid glycerin on the support substrate, and cesium droplets having a particle diameter of 0.3 μm are formed around the glycerin from another generating means. After fixation, the temperature was returned to room temperature, and the ultraviolet acrylate resin based on oligoacrylate was accumulated around the cesium disposed around glycerin by the height of cesium, and irradiated with ultraviolet rays to crosslink the oligoacrylate. This step is repeated a predetermined number of times to obtain a composite structure having a cesium continuous structure 702 around the glycerin continuous structure 701 shown in FIG. 7 and a cured product 703 of oligoacrylate around the cesium continuous structure 702. Was.

Next, the composite structure is peeled off from the fluororesin support substrate, and the glycerin continuous structure 701 inside the cesium continuous structure 702 is removed by suction.
Cesium continuous structure 7 having a hole inside as shown in FIG.
A discharge multiplier consisting of a cross-linking accumulation product 703 of 02 and oligoacrylate was obtained. The inner diameter of the hole in the cesium continuous structure 702 and the cesium continuous structure 70
The density in the accumulation 703 of the glycerin continuous structure 7
01 is determined by the outer diameter and the formation density of the cesium continuous structure 702 since the outer diameter and the formation density can be defined by the supply amount and the position control from the generator applied when the glycerin continuous structure 701 is formed. The inner diameter and density of the holes can be appropriately set as required, and the uniformity of the inner diameter and density can be guaranteed. In addition, when dry etching was further performed by the usual method in the above-described removing step, the discharge element doubling efficiency was slightly improved. In the above-described example, the discharge multiplier is taken up. However, instead of cesium, a metal having antibacterial properties such as silver can be applied. In this case, for example, an air filter having antibacterial properties can be applied.

FIG. 9 is a perspective view of a mold of a three-dimensional structure according to another embodiment of the structure of the present invention. After a forming step of forming a two-dimensional continuous structure while two-dimensionally searching for means for generating solder having a melting point of 80 ° C., a photocurable resin is supplied by the thickness of the two-dimensional continuous structure, and the photocurable resin is supplied. The accumulation step of irradiating ultraviolet rays of the wavelength of the curing sensitivity to the accumulation is performed, and the formation step and the accumulation step in which the two-dimensional continuous structure or the accumulation is selected are repeated, and the same is shown in FIG. A composite structure having the accumulation 904 around such a three-dimensional continuous structure 901 was created. The composite structure is heated to 90 ° C. to remove the three-dimensional continuous structure 901, and hot water is alternately supplied from the A and B portions of the three-dimensional continuous structure 901 to remove the solder of the three-dimensional continuous structure. All were removed to obtain a structure. Thereafter, a stock 904 having a three-dimensional continuous hollow is stored in 902 and 9
03, to obtain a three-dimensional structure pattern shown in FIG. Although the three-dimensional structure has a complicated shape as shown in FIG. 9B, the three-dimensional structure can be formed by the above-described extremely simple manufacturing method. In the above-described example, the accumulation 904 is cut into 902 and 903 after removing the three-dimensional continuous structure 901 in advance, but the continuous structure is cut from each of the cut composite structures after cutting the composite structure. Of course, it may be removed. In the case where a continuous structure is removed from each of the cut composite structures after cutting the composite structure, the three-dimensional continuous structure 901 contains the accumulation 904.
Since a portion A and a portion B as shown in FIG. 9 are not required, a mold of a closed space can be formed.

FIG. 10 shows wiring on a printed circuit board according to an embodiment of the structure to which the injection method of the present invention is applied. Same figure
(a) shows wiring patterns 1002, 1003,
1004 and 1005 and a through hole 100 having a hole diameter of 10 μm
6, a printed board made of a polyimide substrate 1001 in which through holes 1007 and 1008 of 1 mm are formed. When connecting the wiring patterns 1002 and 1003 provided on the front and back of the printed circuit board through the through-hole 1006, for example, the discharge port of the discharge means of the generating means of the present invention is connected to the through-hole 1
While being in contact with one of the electrodes 006, a predetermined amount of, for example, molten aluminum is discharged, and an inter-phase conduction portion 1009 called a via shown in FIG. Also, when an electric element 1010 such as a capacitor is connected between the wiring patterns 1004 and 1005 formed on one surface of the polyimide substrate 1001, the through holes 1007 and 1008 into which terminal electrodes of the electric element are inserted are formed. After the electric element 1010 was inserted, the above-described discharging means was brought into contact from the opposite side of the electric element 1010, and for example, molten solder was injected into the through holes 1007 and 1008, respectively, to form the electric connection 1011.

As described above, according to the method for injecting a printed circuit board according to the present invention, a predetermined amount of a conductive substance is penetrated into a through-hole by using a discharging means to form a conductive part between phases conventionally formed by electroless plating. Therefore, the interphase conduction portion 1009 can be easily and reliably formed, the process can be simplified, and the reliability can be dramatically improved. Also,
When connecting the electric element 1010, the connection can be reliably obtained as in the case of the inter-phase conduction portion 1009 described above. Although the hole diameters in the above example were 10 μm and 1 mm, it goes without saying that the hole diameter can be appropriately changed as required, and the conductive material can be freely selected. In addition, the printed circuit board of the above example has a wiring pattern formed on the front and back sides in advance, but the printed circuit board can also be formed by the method of manufacturing a structure of the present invention, and is an example of injection using the same method as in the above example. Is shown below.

A predetermined wiring pattern 1003 is formed on the supporting substrate by, for example, molten copper by a discharge means, and an amic acid of a polyimide precursor is supplied to a region other than the wiring pattern 1003 to a thickness of the wiring pattern 1003 and then heated. Cures to form polyamide. Next, the interphase conduction portion 100
6, a molten wax is formed in the through-holes 1007 and 1008 for connecting the electric element 1010, for example, a molten wax to a predetermined thickness in a thickness direction by a discharge means. , Heat-cured, and then peeled off from the supporting substrate, and
The wax continuous structure formed in the portions 007 and 1008 is removed, and the electric element 1010 is inserted into the through holes 1007 and
The connection wiring can also be achieved by, for example, injecting molten copper while inserting the wiring into the wiring. In the above example, since the inter-phase conduction portion 1006 is formed in advance, the injection method is used only for the connection of the electric element 1010.

FIG. 11 is a process diagram for replacing a wiring board according to an embodiment of a structure to which the method for replacing a continuous structure according to the present invention is applied. That is, the drawing shows a solder wiring 11 having a melting point of 80 ° C. and a diameter of 5 μm manufactured by the same method as the above-mentioned printed wiring.
01 and a cured product 1102 of an ultraviolet curable resin accumulated around the solder wiring 1101. A step of replacing the solder wiring 1101 with aluminum in order to improve the high-frequency characteristics of the wiring board 1103 is shown. As shown in FIG. 11A, the wiring board 1103 is heated to a temperature equal to or higher than the melting point of the solder, and at the same time, one end of the solder wiring 1101 in the wiring board 1103 (A in FIG.
Part 1104 for discharging molten aluminum from
The molten aluminum was injected and replaced while making contact with the discharge port of No. 1, and the solder wiring 1101 was replaced with an aluminum wiring 1105 as shown in FIG.

By the above substitution, the electric resistance of the solder wiring 1101 can be reduced to the electric resistance of the aluminum wiring 1105, and the high-frequency characteristics have been improved. Although the above-described continuous structure has been mainly described in the case where the continuous structure exists inside the accumulation, the continuous structure of the present invention may be present not only inside the accumulation but also on the surface of the accumulation. For example,
In manufacturing a color filter applied to a liquid crystal display panel or the like, a two-dimensional continuous structure is formed on one main surface of a polyimide substrate by using a low-melting-point material (for example, solder or wax, etc.) for each pixel area by generating means. After accumulating a polyimide precursor by the thickness of the dimensional continuous structure, for example, heating and curing, and then removing the low melting point material of the dimensional continuous structure, the polyimide substrate having a concave portion corresponding to the pixel area on the surface. Can be obtained, and a color material of a filter can be injected into each pixel to flatten the concave portion to form a color filter. It should be noted that the color arrangement of the color filter can correspond to both a lattice arrangement and a delta arrangement,
For example, when a continuous structure is formed of a light-shielding material having a higher melting point than a low-melting material applied to a filter portion between adjacent pixels, a color filter having a so-called black stripe can be manufactured.

[0034]

As described above, according to the present invention, it is possible to extremely easily manufacture a structure having a void or a cavity on the surface or inside thereof, and to increase the degree of freedom of the shape of the void or the void. And a method for manufacturing a structure in which the voids or cavities are replaced with another substance, and a structure.

[Brief description of the drawings]

FIG. 1 is a conceptual cross-sectional view illustrating a first formation step of a structure according to the present invention.

FIG. 2 is a conceptual cross-sectional view illustrating a first accumulation step of a structure according to the present invention.

FIG. 3 is a conceptual cross-sectional view illustrating a second forming step of the structure of the present invention.

FIG. 4 is a conceptual cross-sectional view illustrating a second accumulation step of the structure according to the present invention.

FIG. 5 is a partial cross-sectional perspective view illustrating a step of removing a continuous structure of the composite structure.

FIG. 6 is a partial cross-sectional perspective view illustrating the configuration of an embodiment of the structure of the present invention.

FIG. 7 is a cross-sectional view of a main part illustrating a configuration of a precursor according to another embodiment of the structure of the present invention.

FIG. 8 is a cross-sectional view of a main part illustrating another embodiment of the structure of the present invention.

9A and 9B are perspective views illustrating another embodiment of the structure of the present invention. FIG. 9A is a perspective view of a composite structure of a precursor of the structure of the present invention, and FIG. Partial perspective view of the structure

FIGS. 10A and 10B are partial cross-sectional perspective views illustrating an embodiment of the structure of the present invention. FIG. 10A is a partial cross-sectional perspective view of a precursor of the structure of the present invention, and FIG. Partial sectional perspective view of body

FIGS. 11A and 11B are main-part cross-sectional views illustrating a manufacturing process of another embodiment of the structure of the present invention. FIG. 11A is a main-portion cross-sectional view of the manufacturing process of the structure of the present invention. Main part sectional view of the structure of the present invention

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Generating means 20 Granular body 21,22 Continuous structure 30 Support 41,42 Accumulated matter 50 Supply means

──────────────────────────────────────────────────続 き Continued on front page (51) Int.Cl. ⁶ Identification code FI H05K 3/00 H05K 3/00 B

Claims (19)

[Claims] A step of forming a composite structure including a first substance and a second substance having different melting points in a solid state into a continuous structure including at least discharge means for discharging the first substance; And a storage step of supplying the second substance to the periphery of the continuous structure, and a removing step of removing the continuous structure of the composite structure. . 2. A forming step of supplying a composite structure including a first substance and a second substance having different melting points in a solid state, wherein the first substance is supplied in a granular state to form a continuous structure; An accumulation step of supplying the second substance in a liquid state;
A method for manufacturing a structure, comprising a step of removing the continuous structure of the composite structure. 3. A forming step of supplying a substance having a low melting point from among a plurality of substances having different melting points in a solid state in a granular form by a granular generating means to form a continuous structure; An accumulation step of forming an accumulation of another substance different from the substance constituting the structure in at least a region other than the continuous structure to form a composite structure, and accumulating the composite structure at a melting point of the continuous structure or higher. A method of manufacturing a structure, comprising a step of heating at least the continuous structure below the melting point of the product and removing the continuous structure from the composite structure. 4. The step of forming a three-dimensional continuous structure by growing a substance in at least one of a forming direction of the forming step of the continuous structure and an accumulation direction of the supplying step. The method for manufacturing a structure according to any one of claims 1 to 3, further comprising: 5. The manufacturing method according to claim 1, wherein said accumulating step includes a step of supplying said continuous structure to a thickness in a direction of accumulation in said accumulating step. Method. 6. The method according to claim 1, wherein the accumulating step includes a step of flowing a liquid substance. 7. The method according to claim 1, wherein the accumulating step includes a step of solidifying a substance applied to the accumulating step.
7. The method for producing a structure according to any one of to 3, 5, and 6. 8. The method according to claim 1, wherein the substance used in the forming step is one of a metal and an alloy. 9. The method according to claim 1, wherein a substance used in the accumulation step is a dielectric. 10. The method according to claim 9, wherein the dielectric includes a photocurable resin that is three-dimensionally cured by irradiation with energy rays. 11. The method for manufacturing a structure according to claim 1, wherein an injection step of injecting a substance other than the continuous structure is added after the removing step. 12. The method for manufacturing a structure according to claim 11, wherein said implantation step also serves as said removal step. 13. The method for manufacturing a structure according to claim 11, wherein the substance used in the implantation step is one of a metal and an alloy. 14. A method comprising a first substance and a second substance having different melting points in a solid state, wherein the first substance forms a continuous structure, and the periphery of the continuous structure is formed by the second substance. A method for removing a continuous structure, comprising heating at least the continuous structure from the filled composite structure and removing the continuous structure. 15. A semiconductor device comprising: a first substance and a second substance having different melting points in a solid state, wherein the first substance forms a continuous structure, and the periphery of the continuous structure is formed by the second substance. From the composite structure having the filled structure, at least the continuous structure is heated, and after removing the continuous structure, a fluid is injected into a portion where the continuous structure is removed. Injection method. 16. A method for injecting a continuous structure, wherein a fluid is injected into the continuous space of a structure having a groove-shaped or hole-shaped continuous space to form a continuous structure of the fluid. 17. A method comprising a first substance and a second substance having different melting points in a solid state, wherein the first substance forms a continuous structure, and the periphery of the continuous structure is formed by the second substance. A method for replacing a continuous structure, comprising heating at least the continuous structure and injecting a fluid from the filled composite structure, and replacing the continuous structure with the fluid. 18. A structure having at least a surface or an inside of a void produced by the method for producing a structure according to claim 1. Description: 19. A structure comprising the structure according to claim 1 and a composite material manufactured by the manufacturing method.