JPH11207693A - Laminate cutting method, laminate cutting apparatus, semiconductor device manufacturing method, and semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a cutting method for a laminated plate, which has a high positioning accuracy in the processing after the cutting and has less erroneous recognition, and a method of cutting the laminated plate, in a process of cutting a laminated plate including a rigid member layer and an elastic member layer. Provided is a semiconductor device formed using a device, a method for manufacturing a semiconductor device, and a method for cutting a laminated board. SOLUTION: This is a method for cutting a laminate 10 including a rigid member layer 3 and an elastic member layer 2. Before cutting the laminate base material 10, the elastic member layer 3 is pressed by a flow preventing means (a sharp blade 20) for suppressing the flow of the elastic member 2. Product). The laminated board can be processed in a state in which the positioning accuracy in the processing after cutting is good and erroneous recognition is small.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to processing of a laminate used for a semiconductor device in which a soft layer made of an elastic material such as an adhesive is laminated on a hard substrate such as a metal plate, and more particularly to a method of cutting the laminate. It is.

[0002]

2. Description of the Related Art Conventionally, a semiconductor device is protected by a metal plate. Especially TBGA (Tape Ball Grid Array), FCB
A semiconductor substrate mounted on a circuit board to which ball-shaped external terminals such as a GA (Flip chip Ball Grid Array) are attached is protected and reinforced by a metal plate. The metal plate is composed of a metal plate such as copper and an adhesive layer formed by applying an adhesive to one surface of the metal plate, and has a structure for covering and protecting the semiconductor substrate on the circuit board. Such a laminated board in which a hard substrate such as a metal plate and a soft layer made of an elastic material such as an adhesive are laminated is usually formed by cutting a flat laminated body with a die punch and covering and protecting the semiconductor substrate. It is manufactured by molding. 17 is a cross-sectional view of a conventional laminate, FIG. 18 is a cross-sectional view and a side view of the laminate cut by a conventional cutting method,
FIG. 19 is a sectional view of a processing apparatus provided with a die punch for performing a conventional cutting method. The laminated plate is used, for example, as a cap for protecting a chip of a semiconductor device. FIG.
Is a laminate used as a cap for covering and protecting an FCBGA type substrate on a circuit board. The laminated plate 4 is formed by bonding a metal plate 3 made of copper or the like having a thickness of, for example, 100 to 350 μm and an epoxy resin formed on the metal plate 3 having a thickness of about 100 μm, for example. It comprises an agent layer 2 and a protective film 1 such as polyethylene terephthalate (PET) which covers the adhesive layer. The laminate shown in FIG. 17 has an ideal shape.

However, when a conventional cutting method is used as shown in FIG. 18, the cut surface is in a state in which the adhesive layer 2 covers the side surface of the metal plate 3 (see FIG. 18B). In a plan view, the adhesive layer 2 protrudes from the outer shape of the metal plate 3 (see FIG. 18A). Next, a method of cutting a laminated plate using a conventionally used mold shown in FIG. 19 will be described. The main parts of the mold comprise a die 5, a punch 6, a stripper 7 and a knockout 8. The laminate base material 10 is placed on the die 5 fixed on the lower side, and is fixed by the knockout 8 and the stripper 7. In this state, the punch 6 is lowered and the laminate base material 10 is cut. According to this method, stress concentration does not occur at the corner of the protective film 1 or the adhesive layer 2 where the punch 6 comes into contact, and the cutting is performed not by shearing but by pulling. Since the adhesive layer 2 is more malleable than the metal plate 3, it will break after being stretched, and as a result, the adhesive layer 2
Covers the cut surface of the metal plate 3 or protrudes from the cut surface. While the metal plate 3 is a rigid body layer, the adhesive layer 2 can be an elastic body layer.

[0004]

The phenomenon that occurs when the laminate is cut by the above-described conventional method will be described with reference to FIGS. First, the laminate base material 10 is placed on the die 5 and fixed with the stripper 7. Next, the punch 6 descends, and the adhesive of the lower adhesive layer 2 of the punch 6 moves under the left stripper 7 by the pressure of the punch 6 (FIG. 20). When the punch 6 further descends, the laminate base material 10 on the left side of the punch 6 jumps up due to the deformation resistance, and the adhesive moves to the right this time (FIG. 21A). Thereafter, the protective tape 1 and the adhesive layer 2 are cut (FIG. 21B). Subsequently, the metal plate 3 is cut (FIG. 22).
(A)). Finally, the punch 6 and the stripper 7 are raised (FIG. 22B). In the above process, the adhesive flowing in FIG. 20B was compressed by the punch 6 in the laminate on the left side of FIG.
Rises to elastic recovery and comes out of the end face of the metal plate 3. In the laminated plate on the right side of the drawing, the adhesive compressed by the punch 6 elastically recovers in the thickness direction. The end face of the adhesive layer 2 moves inward from the end face of the metal plate 3. However, since a concentrated load is not applied to the metal plate 3, burrs are generated on the cut surface of the metal plate 3.

When positioning the laminated board formed by such a conventional method on the basis of the outer shape, the positioning accuracy is deteriorated by the protruding adhesive. For example, when positioning is performed by contact, the accuracy is deteriorated by a protruding adhesive, or the positioning component is adhered to a positioning component, resulting in poor positioning. Further, even in non-contact processing such as image processing, an erroneous recognition is caused by an adhesive protruding in recognizing the outer shape. This is the cause of the deterioration of the yield in the process of handling the laminate and the deterioration of the equipment operation rate. The present invention has been made in view of such circumstances, and in a process of cutting a laminated board including a rigid member layer and an elastic member layer, cutting of the laminated board with good positioning accuracy in the post-cutting processing and less erroneous recognition. Provided are a method, a device for cutting a laminate, a method for manufacturing a semiconductor device, and a semiconductor device using a laminate formed by the method for cutting a laminate.

[0006]

According to the present invention, there is provided a method for cutting a laminate including a rigid member layer and an elastic member layer, wherein the elastic member layer is subjected to flow of the elastic member before cutting the laminate base material. It is characterized in that the laminate is formed by cutting the laminate base material while pressing with a flow inhibiting means for suppressing the pressure. The laminated board can be processed in a state in which the positioning accuracy in the processing after cutting is good and erroneous recognition is small. The method for cutting a laminate according to the present invention includes a die for supporting a laminate base material having at least one rigid member layer and at least one elastic member layer, a stripper for pressing the laminate base material during a cutting process, and the laminate plate. A step of placing the laminate base material on the die of a cutting device having a punch for cutting the base material such that the rigid member layer abuts on the die, and before cutting the laminate base material, The flow preventing means presses the elastic member layer existing at or below the boundary between the punch and the stripper at the time of the cutting process or below the boundary directly or via another layer. A step of suppressing the flow of the elastic member by pressing, a step of pressing and fixing the laminate base material placed on the die by the stripper, and a step of cutting the laminate base material by the punch to form a laminate. In that it comprises the steps are the first feature. The flow preventing means may be attached to a surface of the stripper that comes into contact with the laminate base material.

Further, according to the method for cutting a laminate of the present invention, a die for supporting a laminate preform having at least one rigid member layer and at least one elastic member layer, and the laminate preform is pressed during the cutting process. Stripper The knockout that presses the laminate base material during the cutting process and the die of the cutting device that includes a punch that cuts the laminate base material, the laminate base material is brought into contact with the die by the rigid member layer. And before cutting the laminate base material, at a position close to the boundary or the boundary between the punch and the stripper or the knockout at the time of the cutting process by the flow preventing means, Pressing the elastic member layer present below the stripper directly or through another layer to suppress the flow of the elastic member, and removing the laminate base material placed on the die from the stripper. A step of pressing fixed by ripper and the knockout, and by comprising a step of forming a laminate by cutting the laminate base material by the punch as the second feature. The flow preventing means may be attached to a surface of the stripper or the knockout that comes into contact with the laminate base material. The flow preventing means may have a sharp blade shape, a semicircular shape, a triangular shape or a square shape in cross section.

According to the present invention, there is provided an apparatus for cutting a laminate, comprising: a die for supporting a laminate base material provided with at least one rigid member layer and at least one elastic member layer; and a stripper for pressing the laminate base material during cutting. And before cutting the laminate base material, directly at the boundary between the punch and the stripper at the cutting process or at a position close to the boundary, and directly at the elastic member layer present under the stripper. Alternatively, it is characterized by comprising a flow preventing means for suppressing the flow of the elastic member by pressing through another layer, and a punch for cutting the laminate base material.

According to the method of manufacturing a semiconductor device of the present invention, there is provided a die for supporting a laminate base material having at least one rigid member layer and at least one elastic member layer, a stripper for pressing the laminate base material during a cutting process, and Placing the laminate base material on the die of a cutting device having a punch for cutting the laminate base material such that the rigid member layer abuts on the die; and cutting the laminate base material Before the flow preventing means, the elastic member layer present at the boundary between the punch and the stripper at the time of the cutting process or at the position close to the boundary at the time of the cutting process and under the stripper is directly or through another layer. Pressing to suppress the flow of the elastic member,
A step of pressing and fixing the laminate base material placed on the die by the stripper, a step of cutting the laminate base material with the punch to form a laminate, and a step of forming the laminate. Cutting the laminate into a predetermined shape using a mold, and using the laminate for a semiconductor device. The laminated plate may include a metal plate made of copper, an adhesive layer made of an epoxy resin formed on the metal plate, and a protective tape formed on the adhesive layer. The laminate may be used in a semiconductor device as a cap for covering a semiconductor chip. In addition, the semiconductor device of the present invention may be configured such that a laminate formed by the above-described method for cutting a laminate is formed on a circuit board on which at least one surface has a semiconductor chip or a tape on which wiring is applied,
The elastic member layer is attached so as to be in contact with the elastic member layer.

[0010]

Embodiments of the present invention will be described below with reference to the drawings. First, a first embodiment will be described with reference to FIGS. FIG. 1 is a laminate plate cutting device (die) used in this embodiment, FIG. 2 is a plan view of a die side of the die, FIG. 3 is a plan view of a punch portion of the die, and FIG. 5, FIG. 5 is an enlarged cross-sectional view of a region A of the mold shown in FIG. 1, and FIG. 6 is a plan view of the laminate base material 10 and a portion taken along line AA 'in the plan view. FIG. 7 is a cross-sectional view of a laminated plate formed from the laminated plate base material 10 and a cross-sectional view of a portion along a line AA ′ in the plan view.
FIG. 11 is a process diagram illustrating the effect of the present invention. FIG. 11 is a plan view of a cap material of a semiconductor device (FCBGA) formed by shaping a laminate formed by the method of the present invention.
Is a sectional view and a plan view of a semiconductor device having a cap formed of a cap material, and FIG. 13 shows another embodiment of the flow preventing means.

As shown in FIGS. 1 to 4, the main components of the mold of this embodiment are a die 5 supported and fixed on a fixed member 11, a punch 6 fixed and moved on a moving member 12, A stripper 7 and a knockout 8 are provided. The die 5 has a product receiving die 17 disposed at the center thereof. The stripper 7 is hollow at the center and is placed on the die 5 to hold and fix the laminate base material together with the die 5. The punch 6 is hollow inside, and moves inside the hollow portion of the stripper 7 to cut the laminate base material. Knockout 8
Is suspended in the hollow of the punch 6 by being suspended by the spring 9 from the moving member 12, and presses the laminate base material at the time of cutting.

Next, a method of cutting a laminate using this mold will be described with reference to FIGS. In FIG. 5, the flow prevention means which is a feature of the present invention is arranged on the knockout side on the product side. In this embodiment, the flow blocking means comprises a sharp blade 20. The sharp blade 20 is located at a distance of 0.2 mm (x) from the punch 6 at a position where the laminate base material 10 is being cut. This distance x is preferably about 0 to 0.2 mm. Laminate base material 10
Is a laminate of a metal plate 3 such as copper, an adhesive layer 2 containing hard rubber in epoxy resin, and a protective film 1 such as PET, which is mounted on a die 5 fixed below (the metal plate 3).
Are in contact with the die 5), and are fixed by the knockout 8 and the stripper 7. Since the sharp edge 20 is attached to the knockout 8 unlike the conventional one, when the knockout 8 presses the laminated plate 10, the sharp blade 20 bites into the adhesive layer 2 even near the metal plate 3 such as copper. . In this state, the punch 6 is lowered and the laminate base material 10 is cut. This cutting produces a waste material 10 '.

This process will be further described with reference to FIGS. Sharp blade 2 attached to knockout 8
When 0 bites into the laminate 10, blade marks 13 are formed on the protective film 1 (FIG. 6). The laminated board 4 formed by cutting the laminated board base material 10 has an end face of the adhesive layer 2 and a metal plate 3
Or the inside of the protective film 1 (FIG. 7). The phenomenon that occurs when the laminate of the present invention is cut as shown in the above embodiment will be described with reference to FIGS. The laminate base material 10 is configured by laminating a metal plate 3 as a rigid member, an adhesive layer 2 as an elastic member, and a protective film 1. First, the laminate base material 10 is placed on the die 5 and fixed with the stripper 7. The stripper 7 contacts the protective film 1, and the die 5 contacts the metal plate 3. Sharp blade 20
Is attached to the stripper 7 and is close to the punch 6 (FIG. 8A). Next, the punch 6 descends. At this time, in the related art, the adhesive of the lower surface adhesive layer 2 of the punch 6 moves under the left stripper 7 by the pressing force of the punch 6, but the movement of the adhesive is restrained by the sharp blade 20 of the stripper. The adhesive on the lower surface of the punch 6 due to the pressing force moves to the right.

For this reason, the right side of the laminate base material 10 bounces down (FIG. 8B). Further, the punch 6 descends. On the left side of the laminate base material 10, since the blade 20 of the stripper 7 directly suppresses the hard metal, the metal plate 3 is prevented from jumping up (FIG. 9A). Then, the protective tape 1 and the adhesive layer 2
Is cut off (FIG. 9B). Subsequently, the metal plate 3 is cut. The adhesive is pulled by friction on the side of the punch 6 (FIG. 10A). Finally, the punch 6 and the stripper 7 are raised (FIG. 22B). In the above process, the adhesive elastically recovers (compresses) on the left side of the laminate base material in FIG. 10B, and the adhesive does not protrude from the end surface of the metal plate 3. On the right side of the laminate base material, the adhesive compressed by the punch 6 elastically recovers in the thickness direction. The end face of the adhesive layer 2 moves inward from the end face of the metal plate 3. However, since a concentrated load is not applied to the metal plate 3, burrs are generated on the cut surface of the metal plate 3. Next, FIG.
A method of applying a laminated plate to a semiconductor device will be described with reference to FIGS.

The laminate 4 formed by cutting the laminate base material 10 with the punch 6 is cut and shaped into a predetermined shape by another mold (not shown). That is, the four corners of the laminated plate 4 are cut and removed by this shaping, and the notches 14 are formed at each corner. The laminated plate 4 having the cutouts 14 is also formed by a mold (not shown) to form a cap material for accommodating a semiconductor chip (FIG. 11). The laminated plate 4 is a square having a side of about 29 mm, and a notch is formed in the laminated plate 4 to form a cap 4 ′ having a cross section of a square having a side of about 21 mm and a height of about 1 mm. You. The cap 4 ′ covers and fixes a semiconductor chip (not shown) mounted on the circuit board 15.
Since the metal plate 3 is formed of, for example, copper, the cap 4 'also has a function as a heat sink. Circuit board 15
The first surface has the semiconductor chip mounted thereon, and the second surface has a plurality of ball-shaped external terminals 16 made of solder or the like. The circuit board 15 is a square having a side of about 31 mm.
It is electrically connected to the external terminal 16 via the internal wiring. The height of the external terminal 16 is about 0.5 mm, and the height of the circuit board 15 including the external terminal 16 and the cap 4 'is about 2.5 mm (FIG. 12).

Next, another embodiment of the flow preventing means for stopping the movement of the adhesive will be described with reference to FIG. One of them is a flow preventing means 21 having a semicircular cross section (FIG. 13A). This is, for example, attached to the knockout and placed near and around the punch to press the adhesive layer 2 of the laminate base material 10 to suppress the flow of adhesive. The flow preventing means 21 may be attached to a stripper. Further, there is a flow preventing means 22 having a triangular cross section (FIG. 13B). This is, for example, attached to the knockout and placed near and around the punch to press the adhesive layer 2 of the laminate base material 10 to suppress the flow of adhesive. The flow preventing means 22 may be attached to a stripper. Further, the flow preventing means 2 having a square cross-sectional shape.
3 (FIG. 13C). This is, for example, attached to the knockout and placed near and around the punch to press the adhesive layer 2 of the laminate base material 10 to suppress the flow of adhesive. The flow preventing means 23 may be attached to a stripper.

Next, a second embodiment will be described with reference to FIGS. FIG. 14 is an apparatus (die) for cutting a laminated plate used in this embodiment, and FIG. 15 is an enlarged sectional view of a region A of the die shown in FIG. In the above-mentioned embodiment, a sharp blade which is a flow preventing means is pressed against a part (laminate plate) of the laminate base material which will be a product (laminate plate). The feature is that the blade is pressed. In other words, the flow preventing means can press either the product side or the waste side of the laminate base material. The main parts of the mold of this embodiment are a fixing member 1
1, a product receiving die 18 disposed at the center of the die 5 and connected to the fixing member 11 via a spring 19, a punch 6 fixed to the moving member 12 and moving, and a stripper 7 is provided. The stripper 7 is hollow at the center, is placed on the die 5, and holds and fixes the laminate base material together with the die 5. Punch 6
Has a solid interior and moves inside the hollow portions of the stripper 7 and the die 5 to cut the laminate base material.

As shown in FIG. 15, a flow preventing means which is a feature of the present invention is arranged on a stripper side which is not used as a product of the laminate base material 10. In this embodiment, the flow blocking means comprises a sharp blade 20. The sharp blade 20
It is about 0.2 mm away from the punch 6 at the position where the laminate base material 10 is being cut. The laminate base material 10
A laminate of a metal plate 3 such as copper, an adhesive layer 2 containing hard rubber in an epoxy resin, and a protective film 1 such as PET;
It is placed on the die 5 fixed on the lower side (the metal plate 3 is in contact with the die 5), and is fixed by the stripper 7. Since a sharp blade 20 is attached to the stripper 7 unlike the conventional one, the sharp blade 20 bites into the adhesive layer 2 even near the metal plate 3 such as copper when the stripper 7 presses the laminate 10. . In this state, the punch 6 is lowered and the laminate base material 10 is cut.

Next, a third embodiment will be described with reference to FIG. FIG. 16 is a partial sectional view of an apparatus (die) for cutting a laminated plate used in this embodiment. The main components of the mold of this embodiment include a die 5 supported and fixed by a fixing member,
Punch 6 and stripper 7 fixed and moving on moving member
And a knockout 8. The die 5 has a product receiving die 17 disposed at the center thereof. Stripper 7
Is hollow at the center and is placed on the die 5
At the same time, the laminate base material 10 is held and fixed. Punch 6
Is hollow inside, and moves inside the hollow portion of the stripper 7 to cut the laminate base material 10. By this cutting, the waste material 1
0 'is generated. The knockout 8 is suspended by a moving member by a spring and disposed in the hollow of the punch 6 to hold the laminate base material 10 at the time of cutting.

In this embodiment, a flow preventing means, which is a feature of the present invention, is disposed on the knockout side on the product side.
The flow preventing means is constituted by a sharp blade 20. The sharp blade 20 is almost in contact with the punch 6 at a position where the laminate base material 10 is being cut. Laminate base material 10
Is a laminate of a metal plate 3 such as copper, an adhesive layer 2 containing hard rubber in epoxy resin, and a protective film 1 such as PET, which is mounted on a die 5 fixed below (the metal plate 3).
Are in contact with the die 5), and are fixed by the knockout 8 and the stripper 7. Since the sharp edge 20 is attached to the knockout 8 unlike the conventional one, when the knockout 8 presses the laminated plate 10, the sharp blade 20 bites into the adhesive layer 2 even near the metal plate 3 such as copper. .

As described above, it has been found that the adhesive layer does not protrude from the end face of the metal plate on both the product side of the laminate base material and the non-product side of the laminate. Further, the laminate of the present invention includes at least one rigid member layer and at least one elastic member layer,
Examples of the elastic member layer include an adhesive layer, and examples of the rigid member layer include a metal plate and a glass epoxy resin laminate. In addition, both the rigid member layer and the elastic member layer are 1
Not only the layers but also a plurality of layers can be stacked. The number of layers is not limited as long as the flow preventing means can prevent the flow of the elastic member in the elastic member layer.

[0022]

As described above, according to the present invention, in a processing method for cutting a laminate having at least one layer each of a rigid member layer and an elastic member layer, the positioning accuracy in the processing after the cutting is good, and the error is further improved. Processing with less recognition becomes possible.

[Brief description of the drawings]

FIG. 1 is a sectional view of an apparatus for cutting a laminated plate according to the present invention.

FIG. 2 is a plan view of a die side of the apparatus for cutting a laminate according to the present invention.

FIG. 3 is a plan view of a punch portion of the apparatus for cutting a laminated plate according to the present invention.

FIG. 4 is a plan view of a stripper section of the laminate cutting apparatus of the present invention.

FIG. 5 is an enlarged sectional view of a region A in FIG. 17;

FIG. 6 is a plan view of a laminate base material to which the cutting method of the present invention is applied, and a cross-sectional view of a portion thereof along the line AA ′.

FIG. 7 is a plan view of the laminated plate of the present invention and a cross-sectional view of a portion thereof along line AA ′.

FIG. 8 is a process cross-sectional view for explaining the cutting of the laminated board of the present invention.

FIG. 9 is a process sectional view for explaining the cutting of the laminated board of the present invention.

FIG. 10 is a process sectional view for explaining the cutting of the laminated board of the present invention.

FIG. 11 is a plan view of a cap material of a semiconductor device formed from the laminated plate of the present invention.

FIG. 12 is a sectional view and a plan view of an apparatus using the laminated plate of the present invention.

FIG. 13 is a sectional view showing a modification of the flow preventing means used in the present invention.

FIG. 14 is a sectional view of a cutting device for a laminated plate of the present invention.

FIG. 15 is an enlarged sectional view of a region B in FIG. 14;

FIG. 16 is a cross-sectional view showing a part of the laminate cutting apparatus of the present invention.

FIG. 17 is a sectional view of a laminated plate formed by a conventional method.

FIG. 18 is a sectional view and a side view of a conventional laminated plate.

FIG. 19 is a cross-sectional view showing a part of a conventional laminate cutting apparatus.

FIG. 20 is a process cross-sectional view illustrating cutting of a conventional laminated plate.

FIG. 21 is a process cross-sectional view for explaining conventional cutting of a laminate.

FIG. 22 is a process cross-sectional view illustrating cutting of a conventional laminated plate.

[Explanation of symbols]

1 ... Protective film 2 ... Adhesive layer 3
... Metal plate, 4 ... Laminated plate, 4 '... Cap, 5 ... Die, 6 ... Punch, 7 ...
Stripper, 8 ... Knockout, 9, 19 ...
・ Spring, 10 ・ ・ ・ Laminated plate base material, 10 ′
・ Waste material, 11: fixed member, 12: moving member, 13: blade mark, 14: notch,
15 ... circuit board, 16 ... external terminal, 1
7, 18 ... product receiving die, 20 ... sharp blade,
21, 22, 23 ... flow blocking means.

 ──────────────────────────────────────────────────続 き Continuing from the front page (72) Inventor Shunsuke Yoshimura 1 Komagi Toshiba-cho, Saiwai-ku, Kawasaki-shi, Kanagawa Inside the Toshiba Tamagawa Plant

Claims (10)

[Claims] 1. A die for supporting a laminate base material having at least one rigid member layer and at least one elastic member layer, a stripper for pressing the laminate base material during a cutting process, and cutting the laminate base material. Placing the laminate base material on the die of a cutting device having a punch so that the rigid member layer abuts on the die; and before cutting the laminate base material, the flow preventing means At the boundary between the punch and the stripper during the cutting process or at a position close to the boundary, the elastic member layer existing under the stripper is pressed directly or through another layer to flow the elastic member. And a step of pressing and fixing the laminate base material placed on the die with the stripper, and a step of cutting the laminate base material with the punch to form a laminate. A method for cutting a laminate, comprising: 2. The method for cutting a laminate according to claim 1, wherein the flow preventing means is attached to a surface of the stripper which comes into contact with the laminate base material. 3. A die for supporting a laminate base material having at least one rigid member layer and at least one elastic member layer, a stripper for pressing the laminate base material during a cutting process, and a cutting process for the laminate base material. Placing the laminated plate preform on the die of a cutting device having a knockout for pressing in and a punch for cutting the laminated plate preform so that the rigid member layer abuts on the die; Before cutting the plate base material, the elastic member present at the boundary between the punch and the stripper or the knockout at the time of the cutting process or at a position close to the boundary at the time of the cutting process by the flow preventing means and present below the stripper Pressing the layer directly or through another layer to suppress the flow of the elastic member, and applying the laminated base material placed on the die to the stripper and the knockout. Pressed and fixing, cutting method of a laminated plate, characterized in that it comprises a step of forming a laminate by cutting the laminate base material by the punch Ri. 4. The method for cutting a laminate according to claim 3, wherein the flow preventing means is attached to a surface of the stripper or the knockout which comes into contact with the laminate base material. 5. The flow stopping means according to claim 1, wherein the flow stopping means has a sharp blade shape and a semi-circular, triangular or quadrangular cross-sectional shape. Cutting method of laminated board. 6. A die for supporting a laminate base material provided with at least one rigid member layer and at least one elastic member layer, a stripper for pressing the laminate base material during a cutting process, and Before cutting, the elastic member layer present at the boundary between the punch and the stripper at the cutting process or at a position close to the boundary and under the stripper is pressed directly or via another layer. A cutting device for a laminate, comprising: a flow preventing means for suppressing the flow of the elastic member, and a punch for cutting the laminate base material. 7. A die for supporting a laminate base material provided with at least one rigid member layer and at least one elastic member layer, a stripper for pressing the laminate base material during a cutting process, and cutting the laminate base material. Placing the laminate base material on the die of a cutting device having a punch so that the rigid member layer abuts on the die; and before cutting the laminate base material, the flow preventing means At the boundary between the punch and the stripper during the cutting process or at a position close to the boundary, the elastic member layer existing under the stripper is pressed directly or through another layer to flow the elastic member. A step of pressing the laminate base material placed on the die with the stripper and fixing the same; and a step of cutting the laminate base material with the punch to form a laminate. Method of manufacturing a semiconductor device of the laminate formed by the cutting device to cut shaped into a predetermined shape by a die, characterized by comprising the step of using this laminate in a semiconductor device. 8. The laminated board includes: a metal plate made of copper; an adhesive layer made of an epoxy resin formed on the metal plate;
8. The method according to claim 7, comprising a protective tape formed on the adhesive layer. 9. The method of manufacturing a semiconductor device according to claim 7, wherein the laminated plate is used for a semiconductor device as a cap for covering a semiconductor chip. 10. A laminate formed by the method for cutting a laminate according to any one of claims 1 to 5,
A semiconductor device, wherein the elastic member layer is attached to at least one surface of a circuit board on which a semiconductor chip is mounted or a tape provided with wiring.