JPH11214444A - Semiconductor device and circuit board - Google Patents

Abstract

(57) [Summary] It has been difficult to realize a semiconductor device and a circuit board capable of improving workability and connection reliability. In a semiconductor device, a crawling prevention means having an outer dimension larger than the other surface is provided on the other surface of the semiconductor chip such that a peripheral portion thereof protrudes from each end of the other surface of the semiconductor chip. It was fixed. In the circuit board, on the other surface of the semiconductor chip having a plurality of protruding electrodes formed on one surface, a crawling prevention device having an outer dimension larger than the other surface of the semiconductor chip is provided on a peripheral portion of the crawling prevention device. And a printed wiring board provided so as to protrude from each end of the other surface of the semiconductor chip, and a flip-chip mounting of the semiconductor device on the printed wiring board via a sealing resin. did.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[Table of Contents] The present invention will be described in the following order.

2. Description of the Related Art Conventional technology (FIG. 3) Problems to be solved by the invention (FIG. 3) Means for solving the problems (FIG. 1) (2) Operation and effect of this embodiment (FIG. 2) (3) Other embodiments (FIGS. 1 and 2) Effects of the invention

[0003]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device and a circuit board, and is preferably applied to, for example, flip-chip mounting.

[0004]

2. Description of the Related Art In recent years, electronic devices have become lighter, thinner and smaller, and high-performance integration and high-speed signal processing have been progressing. As a result, the pitch between electrodes of semiconductor chips has also increased.
A requirement of 100 [μm] or less has been required.

In this case, it is technically extremely difficult to mount such a semiconductor chip having a narrow pitch between electrodes on a printed wiring board by using solder, and environmental resistance is regarded as important worldwide. Therefore, in recent years, methods for flip-chip mounting a semiconductor chip on a mounting surface of a printed wiring board without using solder have been actively studied.

As one of the flip chip mounting methods, there is a method using a resin such as epoxy.

In practice, in such a flip chip mounting method, first, as shown in FIG. 3A, a plating method, a vapor deposition method, or a wire method is applied to each electrode 2 formed in a predetermined pattern on one surface 1A of a semiconductor chip 1. The gold bumps 3 are formed using a bonding method or the like, and a predetermined portion of the mounting surface 4A of the printed wiring board 4 corresponding to the gold bumps 3 is formed from a liquid or film-like resin material such as epoxy containing or not containing conductive particles. The sealing resin 6 is supplied by a method such as dispense, printing, or pasting.

Next, in this state, the semiconductor chip 1 is sucked and held by the bonding tool 7 by using the mounting apparatus so that each gold bump 3 of the semiconductor chip 1 and the corresponding land 5 of the printed wiring board 4 face each other. Position.

Next, as shown in FIG. 3B, the bonding tool 7 is lowered to bring each gold bump 3 of the semiconductor chip 1 into contact with a corresponding land 5 of the printed wiring board 4, and then the bonding tool 7 The semiconductor chip 1 is pressed at a predetermined pressure in the thickness direction of the printed wiring board 4 while being heated at a predetermined temperature, and then the bonding tool 7 is moved to the semiconductor chip 1 as shown in FIG.
Remove from above.

As a result, when the heat is applied to the periphery of the semiconductor chip 1 and the cured resin 6A of the sealing resin 6 contracts and hardens, a force is applied between the semiconductor chip 1 and the printed wiring board 4 so as to be attracted. When the sealing resin 6 contains conductive particles, each gold bump 3 of the semiconductor chip 1 and each corresponding land 5 of the printed wiring board 4 are electrically connected via the conductive particles, and the sealing resin 6 Does not contain conductive particles, each gold bump 3 of the semiconductor chip 1 and each corresponding land 5 of the printed wiring board 4 are directly electrically connected, and thus the mounting surface 4A of the printed wiring board 4
The semiconductor chip 1 can be mounted on the semiconductor chip.

[0011]

However, according to such a method, when the sealing resin 6 is heated in the pressing and heating step (FIG. 3B) to reach a temperature immediately before the curing reaction starts, Since the viscosity of the sealing resin 6 suddenly decreases, the sealing resin 6 protruding outside the semiconductor chip 1 may crawl up the side surface of the semiconductor chip 1 and adhere to the bonding tool 7.

Thereafter, the sealing resin 6 attached to the bonding tool 7 separated from the semiconductor chip 1 is removed as shown in FIG.
As shown in FIG. 3C, since the adhesive adheres to the bonding tool 7 in a hardened state, the next bonding operation cannot be performed unless the bonding tool 7 is cleaned.

As one method for solving such a problem,
Step of supplying sealing resin 6 to printed wiring board 4 (FIG. 3)
Although a method of reducing the supply amount of the sealing resin 6 at the time of (A)) is conceivable, according to this method, in the pressing and heating steps (FIG. 3B), a sufficient area around the semiconductor chip 1 is provided. Since the fill 6A of the sealing resin 6 is not formed, it is difficult to electrically connect each gold bump 3 of the semiconductor chip 1 and each land 5 of the corresponding printed wiring board 4, so that the semiconductor chip 1 and the printed wiring board are hardly connected. There is a problem that the reliability of the connection with No. 4 is greatly reduced.

Further, in the flip chip mounting method described above, the semiconductor chip 1 can be mounted at a high density, but it is difficult for the semiconductor chip 1 to efficiently radiate the heat radiated from the semiconductor chip 1 to the outside. If the power consumption is high, the semiconductor chip 1 may be damaged by the heat emitted by itself.

The present invention has been made in consideration of the above points, and has as its object to realize a semiconductor device and a circuit board which can improve workability and connection reliability.

[0016]

According to the present invention, there is provided, in a semiconductor device, a semiconductor device, comprising a semiconductor chip having a crawling prevention means having an outer dimension larger than that of the other surface. The semiconductor chip is fixed so as to protrude from each end of the other surface of the semiconductor chip.

As a result, in the semiconductor device, the sealing resin that protrudes outside the semiconductor chip and creeps up on the side surface of the semiconductor chip can be damped by the rise preventing means, so that the semiconductor device can be continuously connected to the printed wiring board. Can be implemented.

According to the present invention, in the circuit board, on the other surface side of the semiconductor chip having a plurality of protruding electrodes formed on one surface side, a crawling prevention means having an outer dimension larger than the other surface of the semiconductor chip is provided. A semiconductor device and a printed wiring board, which are fixed so that the peripheral portion of the climbing-up prevention means protrudes from each end of the other surface of the semiconductor chip, are provided, and the semiconductor device is mounted on the printed wiring board with a sealing resin. The flip chip was implemented via.

As a result, in the circuit board, the sealing device that sticks out of the semiconductor chip and rises on the side surface of the semiconductor chip can be damped by the rise preventing means, so that the semiconductor device can be continuously mounted on the printed wiring board. Can be implemented.

[0020]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below in detail with reference to the drawings.

(1) Configuration of Semiconductor Device According to the Present Embodiment In FIG. 1, reference numeral 10 denotes a semiconductor device according to the present embodiment as a whole, which is opposed to one surface 1A on a semiconductor chip 1 on which electrodes 2 are formed. The crawling prevention plate 12 is fixed to the surface 1B via an adhesive 11.

In this case, the crawling prevention plate 12 is formed to have an outer dimension larger than the other surface 1B of the semiconductor chip 1 (for example, having four sides larger by 0.5 mm than the four sides of the semiconductor chip 1). The peripheral portion protrudes from each end of the other surface 1B of the semiconductor chip 1 and is fixed to the semiconductor chip 1 such that its center coincides with the other surface 1B of the semiconductor chip 1.

As a result, in this semiconductor device 10, FIG.
(A) to (C), when the semiconductor chip 1 is mounted on the printed wiring board 4 by applying the pressure and heat treatment by the flip-chip mounting method described above, the sealing resin 6 protruding from the semiconductor chip 1 is removed. The crawling up of the side surface can be blocked by the crawling up prevention plate 12. In the case of this embodiment, the crawling prevention plate 12 is made of, for example, copper having high thermal conductivity, and is made of, for example, a heat conductive material such as silver paste (silver in an epoxy resin material). It is fixed on the semiconductor chip 1 by using an adhesive 11 having a high property.

As a result, in the semiconductor device 10, the heat radiated from the semiconductor chip 1 can be efficiently radiated to the outside via the adhesive 11 and the anti-roll-up plate 12 in order, and thus the semiconductor chip 1 consumes power. The semiconductor chip 1 can be prevented from being damaged by the heat emitted by the semiconductor chip 1 even when the semiconductor chip 1 is high.

(2) Operation and Effect of the Present Embodiment In the above configuration, the semiconductor device 10 has the structure shown in FIG.
FIG. 2 in which the same reference numerals are assigned to corresponding parts to FIG.
It can be mounted on the mounting surface 4A of the printed wiring board 4 by the following procedures shown in FIGS.

That is, first, as shown in FIG. 2A, the sealing resin 6 is supplied to a corresponding position on the mounting surface 4A of the printed wiring board 4, and the semiconductor device 10 is supplied by a bonding tool 7 of the mounting device. And the semiconductor device 10 is positioned so that the gold bumps 3 of the semiconductor chip 1 and the corresponding lands 5 of the printed wiring board 4 face each other.

Subsequently, as shown in FIG. 2B, the bonding tool 7 is lowered to bring each gold bump 3 of the semiconductor chip 1 on the semiconductor device 10 into contact with a corresponding land 5 of the printed wiring board 4. After that, the semiconductor chip 1 is pressed and heated at a predetermined pressure and a predetermined temperature in a thickness direction of the printed wiring board 4 by a bonding tool 7.
The bonding tool 7 is removed from the semiconductor device 10 as shown in FIG.

As a result, a force is generated between the semiconductor device 10 and the printed wiring board 4 when the heated filler 6B of the sealing resin 6 is cured while shrinking, so that the sealing resin 6 becomes conductive. When particles are included, each gold bump 3 of the semiconductor chip 1 of the semiconductor device 10 and each corresponding land 5 of the printed wiring board 4 are electrically connected through conductive particles, and the sealing resin 6 is electrically conductive. When no particles are contained, each gold bump 3 of the semiconductor chip 1 of the semiconductor device 10 and each corresponding land 5 of the printed wiring board 4 are directly electrically connected, and thus the mounting surface 4A of the printed wiring board 4 The semiconductor device 10 is mounted.

In this case, when the semiconductor device 10 is pressurized and heated (FIG. 2B), the sealing resin 6 protruding outside the semiconductor chip 1 crawls up the side surface of the semiconductor chip 1. The resin 6 is blocked by the climb-up prevention plate 12.

Therefore, in the semiconductor device 10, it is possible to reliably prevent the sealing resin 6 from adhering to the bonding tool 7. Further, in the semiconductor device 10, since the bonding can be continuously performed on the printed wiring board 4 and the supply amount of the sealing resin 6 does not need to be reduced, a sufficient amount of the sealing resin 6 is provided around the semiconductor chip 1. Can be formed.

Further, in the semiconductor device 10, since the metal material having high thermal conductivity is used as the material of the anti-climbing plate 12, even if the semiconductor chip 1 has high power consumption, the semiconductor chip 1 can be used. The heat can be efficiently released to the outside, and accordingly, the semiconductor chip 1 can be prevented from being damaged by the heat released by itself.

According to the above configuration, the anti-roll-up plate 12 is provided on the other surface 1B of the semiconductor chip 1 opposite to the one surface 1A on which the electrodes 2 are formed. When the sealing resin 6 is mounted on the semiconductor chip 1, it is possible to prevent the sealing resin 6 from creeping up the side surface of the semiconductor chip 1 with the use of the anti-climbing plate 12, thereby reliably preventing the sealing resin 6 from adhering to the bonding tool 7. can do.
As a result, the semiconductor device 10 can be continuously bonded on the printed wiring board 4 and a sufficient sealing resin 6 is provided around the semiconductor chip 1 of the semiconductor device 10.
Thus, the semiconductor device 10 capable of improving workability and connection reliability can be realized.

(3) Other Embodiments In the above-described embodiment, a case has been described in which the anti-climbing plate 12 as anti-climbing means is formed using copper. However, the material is not limited to this, and as long as the material for forming the anti-climbing plate 12 is formed of a material having a high thermal conductivity, various other materials such as aluminum can be widely used.

Further, in the above-described embodiment, the case where the silver paste is used for the adhesive 11 has been described. However, the present invention is not limited to this, and the key is to use an adhesive material having high thermal conductivity. If so, the material can be applied to the case where various other adhesive materials are used.

Further, in the above-described embodiment, the crawling prevention plate 12 is set to be 0.5 mm more than the four sides of the semiconductor chip 1.
Although the case of forming the shape having four larger sides has been described, the present invention is not limited to this, and the point is that the peripheral portion of the crawling prevention plate 12 is formed from each end of the other surface 1B of the semiconductor chip 1 respectively. As long as the shape protrudes, various other shapes can be widely applied.

[0036]

As described above, according to the present invention, in a semiconductor device, a crawling prevention means having an outer dimension larger than the other surface is provided on the other surface of the semiconductor chip. By fixing the sealing resin so as to protrude from each end of the surface, the sealing resin that protrudes outside the semiconductor chip and rises on the side surface of the semiconductor chip can be dammed by the rise preventing means. The device can be continuously mounted on the printed wiring board, and thus a semiconductor device capable of improving workability and connection reliability can be realized.

As described above, according to the present invention, the circuit board has a larger outer dimension than the other surface of the semiconductor chip on the other surface side of the semiconductor chip having the plurality of projecting electrodes formed on one surface side. A semiconductor device fixed to the crawling prevention means such that a peripheral portion of the crawling prevention means protrudes from each end of the other surface of the semiconductor chip; and a printed wiring board, and the semiconductor device is mounted on the printed wiring board. Since the flip chip is mounted on the semiconductor chip via the sealing resin, the sealing resin that protrudes outside the semiconductor chip and crawls on the side surface of the semiconductor chip can be dammed up by the crawling prevention means. A semiconductor device mounting method which can be continuously mounted on a printed wiring board and thus can improve workability and connection reliability can be realized.

[Brief description of the drawings]

FIG. 1 is a sectional view showing a configuration of a semiconductor device according to the present embodiment.

FIG. 2 is a cross-sectional view for explaining a mounting procedure of the semiconductor device according to the present embodiment;

FIG. 3 is a cross-sectional view for explaining a mounting procedure of a semiconductor chip by a conventional flip-chip mounting method.

[Explanation of symbols]

1 ... Semiconductor chip, 1A ... One side, 1B ... Other side, 2
…… electrode, 3 …… gold bump, 4 …… printed wiring board, 4
A: mounting surface, 5: land, 6: sealing resin, 6A,
6B: Fillet, 7: Bonding tool, 10
... Semiconductor device, 11... Adhesive, 12.

Claims (6)

[Claims] 1. A semiconductor device having a semiconductor chip having a plurality of protruding electrodes formed on one surface side and being flip-chip mounted on a printed wiring board via a sealing resin, wherein the semiconductor chip is mounted on the printed wiring board with a higher height than the other surface of the semiconductor chip. The semiconductor chip has a large outer dimension, and a crawling prevention means fixed to the other surface of the semiconductor chip so that a peripheral portion protrudes from each end of the other surface of the semiconductor chip. Semiconductor device. 2. The semiconductor device according to claim 1, wherein said climb-up preventing means is made of a material having high thermal conductivity. 3. The semiconductor device according to claim 2, wherein said crawling prevention means is fixed to said other surface of said semiconductor chip using an adhesive having high thermal conductivity. 4. A semiconductor chip having a plurality of protruding electrodes formed on one surface thereof, and a creep preventing means having an outer dimension larger than the other surface of the semiconductor chip is provided on the other surface of the semiconductor chip. A semiconductor device fixed in such a manner that a portion thereof protrudes from each end of the other surface of the semiconductor chip, and a print in which a plurality of electrodes are formed on one surface side in correspondence with the respective protruding electrodes of the semiconductor chip. A wiring board, and the semiconductor device is provided with a sealing resin on the printed wiring board so that each of the protruding electrodes of the semiconductor chip of the semiconductor device is bonded to each of the corresponding electrodes of the printed wiring board. A circuit board characterized by being flip-chip mounted via the board. 5. The circuit board according to claim 4, wherein said climb-up preventing means is made of a material having high thermal conductivity. 6. The circuit board according to claim 5, wherein said climb-up preventing means is fixed to said other surface of said semiconductor chip by using an adhesive having high thermal conductivity.