JPH11248619A - Physical property evaluation method for microscopic deposit on solid surface - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method in which various physical quantities such as adhesion of microscopic deposit on a solid board can be directly and clearly quantitated. SOLUTION: In this physical property evaluation method, the tip 4 of a microscopic elastic body 3 having exciting function is brought into contact with a microscopic deposit 2 on a solid board 1 with no load applied, a microscopic vibration to maximize an amplitude of mechanical vibration on an interface between the microscopic deposit and the solid board is applied to the microscopic deposit from the microscopic elastic body, and if the microscopic elastic body is thereby peeled off from the solid board, physical quantity of adhesion, Young's modulus and viscosity of the deposit is analyzed by the amplitude and frequency of the microscopic vibration.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for evaluating the physical properties of minute deposits on a solid substrate.
The present invention relates to an analysis method capable of clearly quantifying physical quantities such as a Young's modulus and a viscosity coefficient.

[0002]

2. Description of the Related Art Conventionally, peeling and removal of minute deposits on a solid substrate have been often performed by ultrasonic cleaning in a solution. At that time, the quantification of the adhesive force of the minute attached matter has been performed based on the ultrasonic applied power and the number and size of the removed minute attached matter. It was also possible to remove minute deposits and analyze the adhesion behavior by changing the permeation energy of the solution by placing them in solutions having different surface tensions.

[0003]

However, these means which have been conventionally used are merely indirect analysis methods, and direct physical quantities relating to the adhesive force, for example, the adhesive force (unit:
Newtons) and energy (unit: joules) could not be obtained. On the other hand, as a method of analyzing the adhesion, there is a tensile test method, but this method could not be used at all for the analysis of the adhesion behavior of a small adhered substance of a micro size or less.
SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned problems relating to quantification of physical quantities such as the adhesion of minute deposits on a solid substrate, and a novel method capable of directly and quantitatively measuring the adhesion of minute deposits. It does not provide a simple method.

[0004]

According to the present invention, a tip of a microelastic body having an excitation function is brought into contact with a microadhesion on a solid substrate without load, and the microelastic body is applied to the microadhesion against the microadhesion. When a small vibration is applied so that the amplitude of the mechanical vibration at the interface between the adhered substance and the solid substrate becomes maximum due to resonance, and when the interface is broken and the microelastic body is separated from the solid substrate, the small vibration is applied. The purpose is to analyze physical properties such as adhesion force, Young's modulus, viscosity coefficient, etc. of the micro-adhesion from the amplitude and frequency, and contact the tip of the micro-elastic body to the micro-adhesion on the solid substrate, A static load is gradually applied to the micro-adhesion from this point to measure the load when the interface between the micro-adhesion and the solid substrate is broken and the micro-adhesion is peeled off. Strength, Young's modulus, viscosity coefficient, etc. It is intended to analyze the physical properties amount.

[0005]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the invention of claim 1 of the method for evaluating the physical properties of minute deposits on a solid surface according to the present invention will be described with reference to FIG. In the figure, 1 is a solid substrate,
The fine kimono 2 adheres to the surface. Small deposit 2
Include fine particles such as organic, inorganic, and metal, organic polymers for processing masks such as semiconductor integrated electronic devices, molecules such as liquid crystals, biological cells, and general fine processed products. The tip 4 of the microelastic body 3 having the function of exciting the elastic constant K is in contact with the surface of the microadhered substance 2 without load. In the figure, reference numeral 5 denotes a vibrating portion of the microelastic body 3. In addition,
In this embodiment, the microelastic body 3 is constituted by a spring mechanism to facilitate the explanation, but a cantilever mechanism can be suitably used from the viewpoints of reliability, operability, durability, etc. You may.

In this state, a mechanical vibration having a frequency ν is applied from the microelastic body 3 to the microadhesion 2 without applying a load. FIG. 2 shows a standing wave state of the mechanical vibration generated in the minute deposit 2 at this time. In this state, the vibration at the time of excitation of the solid substrate 1 is adjusted so that the vibration amplitude at the interface of the minute attachment 2 becomes maximum due to resonance, and the amplitude is gradually increased. Then, as shown by the broken line in FIG. 2, when the amplitude becomes maximum due to repetitive deformation and resonance, the micro-adhesion 2 acts on the interface, the interface is broken, and the micro-adhesion 2 is peeled off. . By measuring the amplitude and the frequency of the tip 4 at the time when the separation occurs, physical quantities such as the adhesive force, the Young's modulus, and the viscosity coefficient of the minute adhered substance 2 are derived. In this embodiment, the application of the mechanical vibration to the minute deposit 2 is performed from above, but as shown in FIG.
Mechanical vibration may be applied from the side.

The above operation is performed not only in the atmosphere but also in a vacuum.
It is possible in any environment such as in a liquid or gas atmosphere. Further, while applying mechanical vibration to the fine deposit 2 on the solid substrate 1 in the same manner as in the above-described embodiment, as shown in FIG. By applying a static electric field or a high-frequency electric field and analyzing the minute current flowing through the tip 4, the concentration distribution and resistivity distribution of charged particles such as ions existing in the minute deposit 2 or the solid substrate 1,
In addition to analyzing the mobility and the like of the charged particles, it is also possible to control the concentration distribution of ions and the like present in the minute deposits 2 to be concentrated in an arbitrary region, for example, near the interface with the solid substrate 1. .

Next, a second embodiment of the present invention will be described with reference to FIG.
A static load F is applied to the micro-adhered substance 2 adhering to the surface by the load applying device 9. When the load F is gradually increased, the minute deposit 2 starts to be deformed by the load F as shown by 2 'in FIG. 5, and finally the interface between the solid substrate 1 and the minute deposit 2 is broken by shear stress. Peeling of the minute deposit 2 occurs. At this time, it is possible to analyze the physical quantity such as the adhesion limit and the elastic limit of the minute attachment 2 from the magnitude of the load F. At this time, stress concentration at the interface and deformation analysis of minute attachments by the finite element method may be used together.

In addition to the above operation, as shown in FIG. 6, an electrostatic field or a high-frequency electric field is applied from the power source 8 to the minute deposit 2 to analyze a minute current flowing through the tip 4 at the time of interface breakdown. In addition to analyzing the concentration distribution and resistivity distribution of charged particles such as ions existing in the minute deposit 2 or the solid substrate 1, the mobility of the charged particles, and the like, the concentration distribution of ions present in the minute deposit 2 can be analyzed. It is also possible to control so as to concentrate on an arbitrary area, for example, near the interface with the solid substrate 1.

[0010] The method for evaluating the physical properties of minute deposits on a solid substrate according to the present invention is applied to the analysis of the secondary adhesion distribution of a circuit wiring portion in highly integrated electronic devices such as semiconductor storage devices and liquid crystal displays. It is possible. That is, as shown in FIG. 7, a circuit wiring portion 6 formed on a circuit board (not shown)
Is equivalent to a minute adhering substance, the tip 4 of the minute elastic body 3 is brought into contact with each desired position 7, 7,.
By applying vibration or applying a load and applying an electrostatic field or a high-frequency electric field in addition to these, it is possible to know the adhesive force distribution and the like of the circuit wiring portion 6, and to obtain a two-dimensional circuit arrangement having a large adhesive strength. it can.

[0011]

The present invention has the structure as described above, and has physical properties such as adhesion (unit: newton), energy (unit: joule), adhesion behavior, viscoelasticity and the like of minute deposits on the solid surface. Can be clearly quantified in any environment, such as in a vacuum, liquid, or gas atmosphere. It can also be applied to the calculation of a two-dimensional circuit arrangement in a highly integrated electronic device, and is extremely practical.

[0012]

[Brief description of the drawings]

FIG. 1 is an explanatory view of an embodiment of the invention as set forth in claim 1 of the method for evaluating the physical properties of minute deposits on a solid surface according to the present invention.

FIG. 2 is an explanatory view of the vibrating state.

FIG. 3 is an explanatory diagram of another embodiment.

FIG. 4 is an explanatory view of still another embodiment.

FIG. 5 is an explanatory diagram of one embodiment of the invention described in claim 2;

FIG. 6 is an explanatory diagram of another embodiment.

FIG. 7 is an explanatory diagram when the present invention is applied to an adhesion test of a circuit wiring portion of a highly integrated electronic device.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 solid substrate 2 minute attachment 3 minute elastic body 4 point 5 vibrating section 1 ′ circuit board 6 circuit wiring section 7 each position of circuit wiring section 8 power supply 9 load load device

Claims (6)

[Claims] 1. A tip of a microelastic body having an excitation function is brought into contact with a microadhesion on a solid substrate without load, and an interface between the microadhesion and the solid substrate is applied from the microelastic body to the microadhesion. When the micro-vibration is applied so that the amplitude of the mechanical vibration in the substrate becomes maximum due to the resonance, and the interface is destroyed and the micro-elastic material peels off from the solid substrate, the micro-vibration and the frequency of the micro-vibration A method for evaluating physical properties of minute adherents on a solid surface, characterized in that physical properties such as adhesion, Young's modulus, and viscosity coefficient of a kimono are analyzed. 2. A tip of a micro elastic body is brought into contact with a minute deposit on a solid substrate, and a static load is gradually applied to the minute deposit from the tip to break an interface between the minute deposit and the solid substrate. , Measuring the load at the time of peeling of the minute deposits, and analyzing the physical properties such as the adhesive force, Young's modulus, and viscosity coefficient of the minute deposits from this load. Physical property evaluation method. 3. The physical properties of a micro-adhesion on a solid surface according to claim 1 or 2, wherein a micro-electrostatic field or a high-frequency electric field is applied to the micro-adhesion from the tip of the micro-elastic body brought into contact with the solid substrate. Evaluation methods. 4. The method according to claim 1, wherein the fine deposit is an organic polymer for a processing mask in an integrated electronic device. 5. The method according to claim 1, wherein the microelastic body comprises a cantilever mechanism. 6. The method according to claim 1, wherein the minute deposit is a circuit wiring portion in an integrated electronic device.