JPH11265955A - Package for piezoelectric device and method of manufacturing the same - Google Patents

Package for piezoelectric device and method of manufacturing the same

Info

Publication number
JPH11265955A
JPH11265955A JP10066642A JP6664298A JPH11265955A JP H11265955 A JPH11265955 A JP H11265955A JP 10066642 A JP10066642 A JP 10066642A JP 6664298 A JP6664298 A JP 6664298A JP H11265955 A JPH11265955 A JP H11265955A
Authority
JP
Japan
Prior art keywords
package
piezoelectric device
piezoelectric
plate member
insulating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10066642A
Other languages
Japanese (ja)
Other versions
JP3834417B2 (en
Inventor
Shigeki Kawamura
茂樹 河村
Yusuke Sugimoto
裕介 杉本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyo Communication Equipment Co Ltd
Sumitomo Metal SMI Electronics Device Inc
Original Assignee
Toyo Communication Equipment Co Ltd
Sumitomo Metal SMI Electronics Device Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyo Communication Equipment Co Ltd, Sumitomo Metal SMI Electronics Device Inc filed Critical Toyo Communication Equipment Co Ltd
Priority to JP06664298A priority Critical patent/JP3834417B2/en
Publication of JPH11265955A publication Critical patent/JPH11265955A/en
Application granted granted Critical
Publication of JP3834417B2 publication Critical patent/JP3834417B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
    • H03H9/1021—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being of the cantilever type

Landscapes

  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)

Abstract

(57)【要約】 【課題】 圧電デバイス用パッケージにおいて、セラミ
ックケース内にメタライズを施すことなく保持電極およ
び枕部材を形成する。 【解決手段】 セラミックケースは、ケース底面を形成
する第１のセラミック層と、ケース側壁を形成する第２
のセラミック層と、この第１及び第２セラミック層の間
に挿入される絶縁層とによって構成される積層体であっ
て、絶縁層はケース内の所定位置まで延在しており、一
方の絶縁層の上面には保持電極を形成し、この保持電極
上に圧電素子の一端が接着固定される。また他方の絶縁
層は導電性接着剤によって固定されない圧電素子他端に
対応する枕部材として作用する。(57) Abstract: In a package for a piezoelectric device, a holding electrode and a pillow member are formed in a ceramic case without metallizing. A ceramic case has a first ceramic layer forming a case bottom surface and a second ceramic layer forming a case side wall.
And an insulating layer interposed between the first and second ceramic layers, wherein the insulating layer extends to a predetermined position in the case, and one of the insulating layers A holding electrode is formed on the upper surface of the layer, and one end of the piezoelectric element is bonded and fixed on the holding electrode. Further, the other insulating layer functions as a pillow member corresponding to the other end of the piezoelectric element which is not fixed by the conductive adhesive.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【０００１】[0001]

【発明の属する技術分野】本発明は、表面実装型圧電部
品に関し、特に圧電振動子等の圧電デバイスを収容する
パッケージの構造、このパッケージの製造方法およびこ
のパッケージを用いた圧電部品に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface mount type piezoelectric component, and more particularly, to a structure of a package for accommodating a piezoelectric device such as a piezoelectric vibrator, a method of manufacturing the package, and a piezoelectric component using the package.

【０００２】[0002]

【従来の技術】従来より、表面実装型の圧電部品は、セ
ラミックス等の絶縁材料からなる容器（以下、「容器」
をパッケージという）の内部に水晶振動子等の圧電素子
を収容し、金属製あるいはセラミックス製の蓋部材を用
いて気密に封止する構成のものが一般に知られている。2. Description of the Related Art Conventionally, a surface mount type piezoelectric component is a container made of an insulating material such as ceramics (hereinafter, referred to as a container).
In general, a structure in which a piezoelectric element such as a quartz oscillator is housed inside a package) and hermetically sealed using a metal or ceramic lid member is known.

【０００３】図９は上記パッケージの構造を示す側面断
面図である。一般にセラミックス製のパッケージは、底
部を構成する板部材１６と、胴部を構成する下枠部材１
７および上枠部材１８とを積層し、これらを焼成して一
体化することによって製造される。また、セラミックは
表面が粗い物質であるため、板部材と枠部材との積層間
には、そのすき間を埋めるためにアルミナ等の絶縁材料
による絶縁膜１９、２０が介挿される場合がある。この
ようなパッケージを圧電素子用のパッケージとして利用
する場合、圧電素子をパッケージ内に固定する方式とし
て、いわゆる両持ち方式と片持ち方式とがある。FIG. 9 is a side sectional view showing the structure of the package. In general, a ceramic package includes a plate member 16 forming a bottom portion and a lower frame member 1 forming a body portion.
7 and the upper frame member 18 are laminated, and they are fired to be integrated to be manufactured. Further, since ceramic has a rough surface, insulating films 19 and 20 made of an insulating material such as alumina may be interposed between the lamination of the plate member and the frame member in order to fill the gap. When such a package is used as a package for a piezoelectric element, there are a so-called double-sided system and a cantilevered system for fixing the piezoelectric element in the package.

【０００４】両持ち方式の表面実装型圧電部品は図１０
に示すように、パッケージ内に収容される圧電素子２１
の一対のリード電極２１ａ、２１ｂが圧電素子両端に延
在するよう形成するとともに、下枠部材１７の上面の一
部をパッケージ内部に露出せしめ、その露出した下枠部
材の上面に圧電素子２１のリード電極２１ａ、ｂに対応
して一対の固定電極２２ａ、２２ｂを設け、前記リード
電極２１ａ、２１ｂとを接続することによって、圧電素
子を両端固定により保持する。FIG. 10 shows a double-sided surface mount type piezoelectric component.
As shown in the figure, the piezoelectric element 21 accommodated in the package
Are formed so as to extend to both ends of the piezoelectric element, a part of the upper surface of the lower frame member 17 is exposed inside the package, and the upper surface of the piezoelectric element 21 is A pair of fixed electrodes 22a and 22b are provided corresponding to the lead electrodes 21a and 21b, and the piezoelectric elements are fixed and fixed at both ends by connecting to the lead electrodes 21a and 21b.

【０００５】しかしながら、セラミックス等のパッケー
ジと水晶振動子等の圧電素子とは熱膨張係数が異なるた
め、圧電素子を保持したパッケージ周囲の雰囲気温度が
変化すると、温度変化による熱膨張に起因して圧電素子
に応力が生じ、それにより周波数変化が生じて周波数温
度特性に影響を及ぼすという問題点があり、最悪の場合
には圧電素子に生じた熱応力により圧電素子が破壊され
る。However, since a package made of ceramics or the like and a piezoelectric element such as a quartz oscillator have different coefficients of thermal expansion, if the ambient temperature around the package holding the piezoelectric element changes, the piezoelectric expansion due to the temperature change will occur. There is a problem that stress is generated in the element, which causes a frequency change to affect frequency temperature characteristics. In the worst case, the piezoelectric element is destroyed by thermal stress generated in the piezoelectric element.

【０００６】一方、片持ち方式の表面実装型圧電部品は
図１１に示すように、パッケージ内に収容される圧電素
子２３の一対のリード電極２３ａ、２３ｂが共に素子の
一端に延在するよう形成され、これに対応して下枠部材
の一方の表面には一対の固定電極２４ａ、２４ｂが設け
られ、前記リード電極２３ａ、２３ｂと固定電極２４
ａ、２４ｂとが接続されることによって、圧電素子の一
辺のみが保持される。したがって、片持ち方式では水晶
振動子が自由に振動できるのみならず、温度変化による
熱応力に起因した周波数温度特性に及ぼす影響はほとん
どない。ただし圧電素子の保持部に応力が集中するた
め、耐振性と耐衝撃製の点で問題がある。そこで、圧電
素子の自由端である他端の下方に下枠部材の他方を枕部
材として配設し、圧電素子の自由端の変位を制限するこ
とによって振動、衝撃等を吸収している。On the other hand, as shown in FIG. 11, a cantilever type surface mount type piezoelectric component is formed such that a pair of lead electrodes 23a and 23b of a piezoelectric element 23 housed in a package extend to one end of the element. Correspondingly, a pair of fixed electrodes 24a and 24b are provided on one surface of the lower frame member, and the lead electrodes 23a and 23b and the fixed electrode 24
a, 24b, only one side of the piezoelectric element is held. Therefore, in the cantilever method, not only can the quartz resonator freely vibrate, but also there is almost no influence on the frequency-temperature characteristic caused by the thermal stress due to the temperature change. However, since stress concentrates on the holding portion of the piezoelectric element, there is a problem in terms of vibration resistance and shock resistance. Therefore, the other of the lower frame members is provided as a pillow member below the other end, which is the free end of the piezoelectric element, and vibrations, shocks, and the like are absorbed by limiting the displacement of the free end of the piezoelectric element.

【０００７】以上のような特徴から、表面実装型圧電部
品としては片持ち方式のものが比較的優れており、主流
となっている。[0007] From the above-mentioned features, a cantilever type is relatively superior as a surface mount type piezoelectric component, and has become mainstream.

【０００８】[0008]

【発明が解決しようとする課題】上述した従来の表面実
装型圧電部品のパッケージは、両持ち方式にあっては固
定電極を、片持ち方式にあっては固定電極および枕部材
を構成するため下枠部材を設け、上枠部材、下枠部材お
よび板部材の三層構造で構成されている。しかしなが
ら、三層構造であるため大型化を招き、例えば実装部品
の低背化が要求される移動体通信用には不適であるとい
う問題があった。The above-mentioned conventional surface mount type piezoelectric component package comprises a fixed electrode in the case of a double-sided system, and a fixed electrode and a pillow member in the case of a cantilevered system. A frame member is provided, and has a three-layer structure of an upper frame member, a lower frame member, and a plate member. However, there is a problem that the three-layer structure causes an increase in size and is unsuitable, for example, for mobile communication requiring a reduction in height of mounted components.

【０００９】また、特開平３−８８３７３号公報には、
例えば図１２に示すように、板部材１６の表面に固定電
極２５および枕部材２６をメタライズにより直接形成
し、片持ち構造の圧電素子の一端を導電性接着剤を介し
て固定電極に接続して保持する構成の表面実装型圧電装
置が開示されている。このように構成された圧電部品に
あっては、圧電素子の自由端である他端の下には枕部材
２６を配設しているので、振動、衝撃等が作用した場
合、他端の変位を制限することができ、一端と固定電極
との接続部の損傷を防止することができる。また、前記
下枠部材が不要となり、パッケージ厚みを比較的薄くす
ることができるので、低背性が要求される移動体通信機
器等には好適である。Further, Japanese Patent Application Laid-Open No. 3-88373 discloses that
For example, as shown in FIG. 12, a fixed electrode 25 and a pillow member 26 are directly formed on the surface of the plate member 16 by metallizing, and one end of a cantilevered piezoelectric element is connected to the fixed electrode via a conductive adhesive. A surface mount type piezoelectric device having a holding configuration is disclosed. In the piezoelectric component configured as described above, the pillow member 26 is provided below the other end, which is the free end of the piezoelectric element. Can be limited, and damage to the connection between one end and the fixed electrode can be prevented. Further, since the lower frame member becomes unnecessary and the package thickness can be made relatively thin, it is suitable for a mobile communication device or the like that requires a low profile.

【００１０】しかしながら、板部材１６上にメタライズ
により金属層を形成する場合、金属層の層厚を大きくす
ることができず、したがって、板部材に反り等が生じる
可能性がある場合、板部材と圧電素子との接触を避ける
ため、固定電極および枕部材を所望の高さを有するよう
に構成する必要があるが、メタライズのみでは、固定電
極および枕部材の厚みを厚く設定したり、自由に設定す
ることが困難であるとともに、メタライズ工程という余
分な製造工程を要するという問題点があった。However, when a metal layer is formed on the plate member 16 by metallizing, the thickness of the metal layer cannot be increased, and therefore, when the plate member may be warped or the like, the metal member may not be formed. In order to avoid contact with the piezoelectric element, it is necessary to configure the fixed electrode and the pillow member to have a desired height. However, with metallization only, the thickness of the fixed electrode and the pillow member can be set to be thick or set freely. However, there is a problem in that it is difficult to perform the process, and an extra manufacturing process called a metallizing process is required.

【００１１】本発明は、このような問題を解決するため
になされたものであり、圧電素子の特性に影響を及ぼす
ことなくパッケージ厚みを薄くすることができる耐振性
と耐衝撃性が良好な圧電部品を提供することを目的とす
る。SUMMARY OF THE INVENTION The present invention has been made to solve such a problem, and a piezoelectric device having good vibration resistance and impact resistance capable of reducing the package thickness without affecting the characteristics of the piezoelectric element. The purpose is to provide parts.

【００１２】[0012]

【課題を解決するための手段】上記目的を達成するため
本発明の請求項１記載の圧電デバイス用パッケージは、
当該パッケージの底部を構成する板部材と、当該パッケ
ージの胴部を構成する枠部材と、前記板部材と枠部材と
の間に設けられ、パッケージ外周からパッケージ内部の
所定位置に至るまで形成される絶縁膜と、この絶縁膜上
のパッケージ内部にて露出する面に形成される固定電極
とを備えることを特徴としている。According to a first aspect of the present invention, there is provided a package for a piezoelectric device.
A plate member that forms the bottom of the package, a frame member that forms the body of the package, and is provided between the plate member and the frame member, and is formed from the outer periphery of the package to a predetermined position inside the package. It is characterized by comprising an insulating film and a fixed electrode formed on a surface of the insulating film exposed inside the package.

【００１３】また、本発明の請求項２記載の圧電デバイ
ス用パッケージは、前記パッケージ内部の所定位置は、
少なくとも圧電デバイスを収容した場合における当該デ
バイスの長手方向端部に相当する位置であることを特徴
としている。また、本発明の請求項３記載の圧電デバイ
ス用パッケージは、前記板部材、枠部材および絶縁膜は
いずれも同一の絶縁材料（セラミック材料）からなるこ
とを特徴としている。According to a second aspect of the present invention, there is provided a package for a piezoelectric device, wherein the predetermined position inside the package is:
At least a position corresponding to the longitudinal end of the piezoelectric device when the device is accommodated. In the package for a piezoelectric device according to a third aspect of the present invention, the plate member, the frame member, and the insulating film are all made of the same insulating material (ceramic material).

【００１４】また、本発明の請求項４記載の圧電部品
は、請求項１、２または３記載の圧電デバイス用パッケ
ージに圧電デバイスを収容してなる圧電部品であって、
前記圧電デバイスが両持ち構造である場合において、前
記固定電極は上記対向する絶縁膜上面の両方に形成さ
れ、前記圧電デバイスの端部に形成されたリード電極と
接続固定されることを特徴としている。According to a fourth aspect of the present invention, there is provided a piezoelectric component in which a piezoelectric device is accommodated in the piezoelectric device package according to the first, second, or third aspect.
In the case where the piezoelectric device has a double-supported structure, the fixed electrode is formed on both the upper surfaces of the opposed insulating films, and is connected and fixed to a lead electrode formed at an end of the piezoelectric device. .

【００１５】また、本発明の請求項５記載の圧電部品
は、請求項１、２または３記載の圧電デバイス用パッケ
ージに圧電デバイスを収容してなる圧電部品であって、
前記圧電デバイスが片持ち構造である場合において、前
記固定電極は上記対向する絶縁膜上面の一方に形成さ
れ、前記圧電デバイスの端部に形成されたリード電極と
接続固定されるとともに、前記対向する絶縁膜上面の他
方を前記圧電デバイスの枕部材となることを特徴として
いる。According to a fifth aspect of the present invention, there is provided a piezoelectric component in which a piezoelectric device is housed in the piezoelectric device package according to the first, second, or third aspect.
In a case where the piezoelectric device has a cantilever structure, the fixed electrode is formed on one of the upper surfaces of the opposed insulating films, and is connected and fixed to a lead electrode formed at an end of the piezoelectric device. The other of the upper surfaces of the insulating films serves as a pillow member of the piezoelectric device.

【００１６】また、本発明の請求項６記載の圧電デバイ
ス用パッケージの製造方法は、前記パッケージの底部を
構成する板部材の表面に絶縁パターンを形成する工程
と、前記絶縁膜の表面に電極パターンを形成する工程
と、前記板部材と前記パッケージの胴部を構成する枠部
材とを一体化し、積層部材を形成する工程と、前記積層
部材を焼成することで、前記絶縁パターンと前記電極パ
ターンとを熱処理し、一体化後のパッケージの底部表面
に絶縁膜と固定電極とを形成する工程とを含むことを特
徴としている。According to a sixth aspect of the present invention, there is provided a method for manufacturing a package for a piezoelectric device, comprising: forming an insulating pattern on a surface of a plate member forming a bottom of the package; Forming, and integrating the plate member and a frame member constituting the body of the package to form a laminated member, and baking the laminated member, the insulating pattern and the electrode pattern In which an insulating film and a fixed electrode are formed on the bottom surface of the integrated package.

【００１７】[0017]

【発明の実施の形態】以下、本発明の実施例を図面に基
づいて詳細に説明する。 （第１実施例）本発明に係わる圧電デバイス用パッケー
ジを片持ち方式の圧電振動子に適用した第１実施例につ
いて、図１から図６を用いて説明する。Embodiments of the present invention will be described below in detail with reference to the drawings. (First Embodiment) A first embodiment in which the package for a piezoelectric device according to the present invention is applied to a cantilever type piezoelectric vibrator will be described with reference to FIGS.

【００１８】図１に示すように、表面実装型圧電振動子
は、水晶振動子１と、この水晶振動子１を収容するパッ
ケージ２と、パッケージ２を気密封止する蓋部材３とを
有している。パッケージ２は、アルミナ製であり、底部
を構成する板部材４と、胴部を構成する枠部材５とを有
し、板部材４と枠部材５との間には絶縁膜６が設けられ
ており、この絶縁膜６の一部はパッケージ内部にて露出
している。As shown in FIG. 1, the surface-mount type piezoelectric vibrator has a crystal resonator 1, a package 2 for accommodating the crystal resonator 1, and a lid member 3 for hermetically sealing the package 2. ing. The package 2 is made of alumina, and has a plate member 4 forming a bottom portion and a frame member 5 forming a body portion. An insulating film 6 is provided between the plate member 4 and the frame member 5. Thus, a part of the insulating film 6 is exposed inside the package.

【００１９】この露出した絶縁膜６のうち、水晶振動子
の一端１ａに対応する一方の絶縁膜６ａ表面には、一対
の固定電極７ａ、７ｂが設けられ、また、前記露出した
絶縁膜６のうち、水晶振動子１の他端１ｂに対応する他
方の絶縁膜６ｂは、この水晶振動子１の自由端の下方に
位置しており、これが枕部材として作用する。固定電極
７ａ、７ｂは、水晶振動子１に形成されたリード電極
（図示せず）に導電性接着剤８等により電気的に接続さ
れ、水晶振動子１を片持ち状態で保持するとともに、板
部材４の裏面に設けられたプリント基板等に搭載するた
めの接続電極９と電気的導通のとれた状態となってい
る。また、パッケージ胴部を構成する枠部材５の上端部
にはパッケージ２の内部を気密封止する蓋部材３が封止
用低融点ガラス１０により接着されている。A pair of fixed electrodes 7a and 7b are provided on the surface of one of the exposed insulating films 6 corresponding to one end 1a of the crystal unit. The other insulating film 6b corresponding to the other end 1b of the crystal unit 1 is located below a free end of the crystal unit 1, and functions as a pillow member. The fixed electrodes 7a and 7b are electrically connected to a lead electrode (not shown) formed on the crystal unit 1 by a conductive adhesive 8 or the like, thereby holding the crystal unit 1 in a cantilever state and a plate. It is in a state of being electrically connected to the connection electrode 9 for mounting on a printed board or the like provided on the back surface of the member 4. Further, a lid member 3 for hermetically sealing the inside of the package 2 is adhered to an upper end portion of the frame member 5 constituting the package body with a low-melting glass 10 for sealing.

【００２０】以上のように構成した表面実装型圧電振動
子は、板部材４と枠部材５とからなる２層構造であり、
しかも固定電極７ａ、７ｂが絶縁膜６ａ上に形成されて
いるので、パッケージ内底面である板部材４上から一定
の厚みをもって形成されており、かつ枕部材として作用
する絶縁膜６ｂの厚みを自由に設定することができるた
め、板部材が多少反っていても振動子がパッケージ底面
に接触する恐れはないとともに、メタライズの工程が不
要となり、安価にパッケージおよび圧電デバイスを製造
することができる。The surface mount type piezoelectric vibrator constructed as described above has a two-layer structure composed of a plate member 4 and a frame member 5.
Moreover, since the fixed electrodes 7a and 7b are formed on the insulating film 6a, the fixed electrodes 7a and 7b are formed with a certain thickness from the plate member 4 which is the bottom surface in the package, and the thickness of the insulating film 6b acting as a pillow member can be freely set. Therefore, even if the plate member is slightly warped, there is no possibility that the vibrator contacts the bottom surface of the package, and the metallization step is not required, so that the package and the piezoelectric device can be manufactured at low cost.

【００２１】次に上記パッケージの作製方法について説
明する。 (1) アルミナ粉末にマグネシア、シリカ、カルシア等の
焼結助剤を少量加えた粉体に、ジオクチルフタレート等
の可塑剤、アクリル樹脂等のバインダおよびトルエン、
キシレン、アルコール類等の溶剤を加え、十分に混練し
て粘度２０００〜４００００ｃｐｓのスラリを作製し、
ドクターブレード法によって例えば０．３ｍｍ厚の複数
枚のアルミナのグリーンシートを形成する。Next, a method of manufacturing the above package will be described. (1) A powder obtained by adding a small amount of a sintering aid such as magnesia, silica and calcia to alumina powder, a plasticizer such as dioctyl phthalate, a binder such as an acrylic resin and toluene,
A solvent such as xylene and alcohol is added and sufficiently kneaded to produce a slurry having a viscosity of 2000 to 40000 cps.
A plurality of 0.3 mm-thick alumina green sheets are formed by a doctor blade method, for example.

【００２２】(2) 各グリーンシートに打ち抜き型やパン
チングマシーン等を用いて所望の形状に打ち抜き加工し
て、板部材４となるグリーンシートと、枠部材５となる
グリーンシートとを作製する。 (3) 図２に示すように、板部材４となるグリーンシート
の表面外周近傍に、上記の(1) で作製したアルミナのス
ラリと同様のアルミナペーストを印刷し、約３０μｍ厚
の絶縁パターン６を形成する。(2) Each green sheet is punched into a desired shape by using a punching die, a punching machine, or the like, to produce a green sheet serving as the plate member 4 and a green sheet serving as the frame member 5. (3) As shown in FIG. 2, an alumina paste similar to the alumina slurry prepared in the above (1) is printed in the vicinity of the outer periphery of the surface of the green sheet to become the plate member 4, and an insulating pattern 6 having a thickness of about 30 μm is formed. To form

【００２３】(4) 図３に示すように、絶縁パターン６の
一端側の表面にタングステンやモリブデンの高融点金属
の導体ペーストを印刷し、約３０μｍ厚の電極パターン
７ａ、７ｂを形成する。ここで、電極パターン７ａは、
絶縁パターン６の表面から端面４ａを経由して板部材４
となるグリーンシートの裏面まで形成される。また、電
極パターン７ｂは、絶縁パターン６の表面から端面４ｂ
を経由して板部材４となるグリーンシートの裏面まで形
成される。(4) As shown in FIG. 3, a conductor paste of a refractory metal such as tungsten or molybdenum is printed on one end surface of the insulating pattern 6 to form electrode patterns 7a and 7b having a thickness of about 30 μm. Here, the electrode pattern 7a is
From the surface of the insulating pattern 6 to the plate member 4 via the end face 4a
To the back of the green sheet to be formed. The electrode pattern 7b extends from the surface of the insulating pattern 6 to the end face 4b.
Is formed up to the back surface of the green sheet that becomes the plate member 4.

【００２４】(5) 絶縁パターン６と電極パターン７ａ、
７ｂとを形成したグリーンシート（図３参照）と、枠部
材となるグリーンシート（図示せず）とを積層し、この
グリーンシート積層体を例えば８０〜１５０℃、５０〜
２５０ｋｇ／ｃｍ2 の条件で熱圧着して一体化する。 (6) 上記の(1) 〜(5) で作製したグリーンシート積層体
を１４００〜１６００℃で焼成することにより、図４お
よび図５に示すように、アルミナ製パッケージが得られ
る。アルミナ製パッケージ２は、板部材４と枠部材５の
間に絶縁膜６が形成され、絶縁膜６の一端側の上面に固
定電極７が形成され、さらに板部材４の裏面には固定電
極７ａ、７ｂに導通する接続電極９ａ、９ｂが形成され
ている。固定電極７ａ、７ｂおよび接続電極９ａ、９ｂ
の表面には、通常、ニッケルまたは金、あるいはその両
方がメッキ等にて形成される。図４に示すように、アル
ミナ製パッケージ２は、固定電極７ａと固定電極７ｂと
の水平方向の距離が比較的離れているので、両電極間の
容量を低減することができる。(5) Insulating pattern 6 and electrode pattern 7a,
7b and a green sheet (not shown) serving as a frame member are laminated, and the green sheet laminate is formed, for example, at 80 to 150 ° C. and 50 to 50 ° C.
It is integrated by thermocompression bonding under the condition of 250 kg / cm 2 . (6) By firing the green sheet laminate produced in the above (1) to (5) at 1400 to 1600 ° C., an alumina package is obtained as shown in FIGS. In the package 2 made of alumina, an insulating film 6 is formed between a plate member 4 and a frame member 5, a fixed electrode 7 is formed on an upper surface on one end side of the insulating film 6, and a fixed electrode 7a is formed on the back surface of the plate member 4. , 7b are formed with connection electrodes 9a, 9b. Fixed electrodes 7a, 7b and connection electrodes 9a, 9b
Is usually formed by plating or the like with nickel or gold, or both. As shown in FIG. 4, in the package 2 made of alumina, the horizontal distance between the fixed electrode 7a and the fixed electrode 7b is relatively large, so that the capacitance between the two electrodes can be reduced.

【００２５】(7) 図６に示すように、アルミナ製パッケ
ージの固定電極７ａ、７ｂには水晶振動子１のリード電
極を導通性接着剤８などにより接着して固定する。 (8) 水晶振動子１を収容したアルミナ製パッケージ２の
開口端部にはアルミナ等のセラミックス製蓋部材３を封
止用低融点ガラス１０を用いて接着し、水晶振動子１を
気密封止する。(7) As shown in FIG. 6, the lead electrodes of the crystal unit 1 are adhered and fixed to the fixed electrodes 7a and 7b of the package made of alumina with the conductive adhesive 8 or the like. (8) A ceramic lid member 3 made of alumina or the like is adhered to the opening end of the alumina package 2 containing the crystal unit 1 using a low-melting glass 10 for sealing, and the crystal unit 1 is hermetically sealed. I do.

【００２６】以上の(1) 〜(8) の工程により、図１に示
すような表面実装型水晶振動子が得られる。このように
製造されたパッケージでは、板部材と枠部材とを一体化
する上で必要な絶縁膜を利用して、製造工数を増やすこ
となく固定電極面の高さを一定量確保することができ
る。 （第２実施例）本発明を表面実装型水晶振動子に適用し
た第２実施例について、図７を用いて説明する。By the above steps (1) to (8), a surface-mount type crystal unit as shown in FIG. 1 is obtained. In the package manufactured in this manner, a fixed amount of the height of the fixed electrode surface can be secured without increasing the number of manufacturing steps by using an insulating film necessary for integrating the plate member and the frame member. . (Second Embodiment) A second embodiment in which the present invention is applied to a surface mount type crystal unit will be described with reference to FIG.

【００２７】第２実施例の水晶振動子は、水晶振動子の
他端に対応する絶縁膜の他端側６ｂの表面に、さらに約
３０μｍ厚の絶縁膜１４を設けている。その他の構成は
第１実施例と同様である。第１実施例と実質的に同一構
成部分に同一符号を付す。このパッケージの場合、上記
(3) の工程の後に再度アルミナペーストを印刷すればよ
く、(3) の工程を２回繰り返せばよいので製造は極めて
簡単である。In the crystal oscillator of the second embodiment, an insulation film 14 having a thickness of about 30 μm is further provided on the surface of the other end 6b of the insulation film corresponding to the other end of the crystal oscillator. Other configurations are the same as in the first embodiment. Components that are substantially the same as those in the first embodiment are denoted by the same reference numerals. For this package,
After the step (3), the alumina paste may be printed again, and the step (3) may be repeated twice, so that the production is extremely simple.

【００２８】第２実施例においては、簡単な製造工程を
追加するだけで枕部材の高さを微妙に高くすることがで
きるので、振動、衝撃等が作用した場合、水晶振動子の
他端の変位をさらに制限することができ、水晶振動子の
一端と固定電極との接続部の損傷をさらに防止すること
ができる。 （第３実施例）本発明を表面実装型水晶振動子に適用し
た第３実施例について、図８を用いて説明する。In the second embodiment, the height of the pillow member can be slightly increased only by adding a simple manufacturing process. Displacement can be further restricted, and damage to the connection between one end of the crystal unit and the fixed electrode can be further prevented. Third Embodiment A third embodiment in which the present invention is applied to a surface-mount type crystal unit will be described with reference to FIG.

【００２９】第３実施例の水晶振動子は、水晶振動子の
他端に対応する絶縁膜の他端側６ｂの表面に、さらに約
３０μｍ厚のダミー電極１５を設けている。その他の構
成は第１実施例と同様である。第１実施例と実質的に同
一構成部分に同一符号を付す。このパッケージの場合、
上記(4) の工程の際に固定電極７と同時にダミー電極１
５を形成することが可能であるので、製造工程を増やす
ことなく簡便に製造することができる。In the crystal resonator of the third embodiment, a dummy electrode 15 having a thickness of about 30 μm is further provided on the surface of the other end 6b of the insulating film corresponding to the other end of the crystal resonator. Other configurations are the same as in the first embodiment. Components that are substantially the same as those in the first embodiment are denoted by the same reference numerals. For this package,
In the above step (4), the dummy electrode 1 and the fixed electrode 7 are simultaneously formed.
Since it is possible to form No. 5, it can be easily manufactured without increasing the number of manufacturing steps.

【００３０】第３実施例においては、既存の製造工程で
枕部材の高さを微妙に高くすることができるので、振
動、衝撃等が作用した場合、水晶振動子の他端の変位を
さらに制限することができ、水晶振動子の一端と固定電
極との接続部の損傷をさらに防止することができる。な
お本発明の複数の実施例では、アルミナ等のセラミック
ス製蓋部材および封止用低融点ガラスを用いて水晶振動
子を気密封止したが、本発明では、パッケージの開口端
部に設けたコバール等のシールリングと、ニッケル、ス
テンレス、コバール、４２アロイ等の金属からなる蓋部
材とを溶接することにより、水晶振動子を気密封止して
もよい。また、パッケージの開口部に設けたタングステ
ン等の金属層にニッケルメッキまたは金メッキを施し、
鉛錫共晶はんだ、金錫共晶はんだ、あるいは鉛と錫等の
材料の比率を変更した高温はんだを封止用はんだとして
用いてコバール、４２アロイ等の金属からなる蓋部材
や、封止部材となるところに導体ペーストが印刷、焼成
されたセラミックス製蓋部材を接着することにより、水
晶振動子を気密封止してもよい。In the third embodiment, the height of the pillow member can be delicately increased in the existing manufacturing process, so that the displacement of the other end of the crystal unit is further limited when vibration, impact, etc. act. This can further prevent damage to the connection between one end of the crystal unit and the fixed electrode. In the embodiments of the present invention, the quartz oscillator is hermetically sealed using a ceramic lid member made of alumina or the like and a low-melting glass for sealing. In the present invention, however, the Kovar provided at the open end of the package is used. May be hermetically sealed by welding a seal ring made of a metal such as nickel, stainless steel, Kovar, or 42 alloy. Also, nickel or gold plating is applied to the metal layer such as tungsten provided in the opening of the package,
A lid member or a sealing member made of metal such as Kovar or 42 alloy by using a lead-tin eutectic solder, a gold-tin eutectic solder, or a high-temperature solder having a changed ratio of materials such as lead and tin as a sealing solder. The quartz crystal resonator may be hermetically sealed by bonding a ceramic lid member on which a conductive paste is printed and fired at a location where.

【００３１】また本発明の複数の実施例では、アルミナ
製パッケージを用いたが、本発明はアルミナに限らず、
窒化アルミ、ムライト、ガラス等のセラミックあるいは
その他の絶縁材料製のパッケージを用いていもよい。ま
た本発明の複数の実施例では、圧電素子として表面実装
型水晶振動子を例に説明したが、本発明はこれに限定さ
れるものではなく、タンタル酸リチウム、ニオブ酸リチ
ウム、四ほう酸リチウムもしくは圧電セラミックで構成
する圧電振動子、弾性表面波素子等を用いた共振子もし
くはフィルタにも適用可能である。Although the plurality of embodiments of the present invention use an alumina package, the present invention is not limited to alumina.
A package made of ceramic such as aluminum nitride, mullite, glass, or other insulating materials may be used. Further, in the embodiments of the present invention, a surface-mounted crystal resonator is described as an example of the piezoelectric element, but the present invention is not limited to this, and lithium tantalate, lithium niobate, lithium tetraborate or The present invention is also applicable to a resonator or a filter using a piezoelectric vibrator, a surface acoustic wave element, or the like made of a piezoelectric ceramic.

【００３２】また本発明の複数の実施例では、パッケー
ジ内に圧電素子を単体で収容したものを例に説明した
が、本発明はこれに限定されるものではなく、パッケー
ジ内に圧電素子とともにＩＣ等の発振回路を備えて構成
した発振器等の圧電部品に適用してもよい。In the embodiments of the present invention, the case where the piezoelectric element is housed alone in the package has been described as an example. However, the present invention is not limited to this. The present invention may be applied to a piezoelectric component such as an oscillator configured with an oscillation circuit such as.

【図面の簡単な説明】[Brief description of the drawings]

【図１】本発明に係わる圧電振動子パッケージの構成を
示す断面図である。FIG. 1 is a sectional view showing a configuration of a piezoelectric vibrator package according to the present invention.

【図２】本発明に係わる圧電振動子パッケージの構成を
説明するための平面図である。FIG. 2 is a plan view for explaining a configuration of a piezoelectric vibrator package according to the present invention.

【図３】本発明の第１実施例の製造方法を説明するため
の平面図である。FIG. 3 is a plan view for explaining the manufacturing method according to the first embodiment of the present invention.

【図４】本発明の第１実施例のアルミナ製パッケージを
示す平面図である。FIG. 4 is a plan view showing an alumina package according to the first embodiment of the present invention.

【図５】図４のＶ−Ｖ線断面図である。FIG. 5 is a sectional view taken along line VV of FIG. 4;

【図６】本発明の第１実施例のアルミナ製パッケージに
水晶振動子片を搭載した状態を示す断面図である。FIG. 6 is a cross-sectional view showing a state in which a quartz oscillator piece is mounted on the alumina package according to the first embodiment of the present invention.

【図７】本発明を表面実装型水晶振動子に適用した第２
実施例を示す断面図である。FIG. 7 shows a second embodiment in which the present invention is applied to a surface-mount type crystal unit.
It is sectional drawing which shows an Example.

【図８】本発明を表面実装型水晶振動子に適用した第３
実施例を示す断面図である。FIG. 8 shows a third embodiment in which the present invention is applied to a surface-mount type crystal unit.
It is sectional drawing which shows an Example.

【図９】従来の表面実装型圧電装置を示す断面図であ
る。FIG. 9 is a cross-sectional view showing a conventional surface mount type piezoelectric device.

【図１０】従来の表面実装型圧電装置を示す断面図であ
る。FIG. 10 is a sectional view showing a conventional surface mount type piezoelectric device.

【図１１】従来の表面実装型圧電装置を示す断面図であ
る。FIG. 11 is a sectional view showing a conventional surface mount type piezoelectric device.

【図１２】従来の表面実装型圧電装置を示す断面図であ
る。FIG. 12 is a cross-sectional view showing a conventional surface mount type piezoelectric device.

【符号の説明】[Explanation of symbols]

１ 水晶振動子 ２ パッケージ ３ 蓋部材 ４ 第１のセラミック層（板部材） ５ 第２のセラミック層（枠部材） ６ａ 絶縁膜（台座） ６ｂ 絶縁膜（枕部材） ７ 固定電極 ９ 接続電極 REFERENCE SIGNS LIST 1 crystal resonator 2 package 3 lid member 4 first ceramic layer (plate member) 5 second ceramic layer (frame member) 6 a insulating film (pedestal) 6 b insulating film (pillow member) 7 fixed electrode 9 connection electrode

Claims (6)

【特許請求の範囲】[Claims] 【請求項１】 圧電デバイスを収容するパッケージであ
って、 当該パッケージの底部を構成する板部材と、 当該パッケージの胴部を構成する枠部材と、 前記板部材と枠部材との間に設けられ、パッケージ外周
からパッケージ内部の所定位置に至るまで形成される絶
縁膜と、 この絶縁膜上のパッケージ内部にて露出する面に形成さ
れる固定電極と、 を備えることを特徴とする圧電デバイス用パッケージ。1. A package accommodating a piezoelectric device, comprising: a plate member forming a bottom of the package; a frame member forming a body of the package; and a package member provided between the plate member and the frame member. A package for a piezoelectric device, comprising: an insulating film formed from the package outer periphery to a predetermined position inside the package; and a fixed electrode formed on a surface of the insulating film exposed inside the package. . 【請求項２】 前記パッケージ内部の所定位置は、少な
くとも圧電デバイスを収容した場合における当該デバイ
スの長手方向端部に相当する位置であることを特徴とす
る請求項１記載の圧電デバイス用パッケージ。2. The package for a piezoelectric device according to claim 1, wherein the predetermined position inside the package is a position corresponding to at least a longitudinal end of the piezoelectric device when the device is housed. 【請求項３】 前記板部材、枠部材および絶縁膜はいず
れも同一の絶縁材料からなることを特徴とする請求項１
または２記載の圧電デバイス用パッケージ。3. The apparatus according to claim 1, wherein said plate member, frame member and insulating film are all made of the same insulating material.
Or the package for a piezoelectric device according to 2. 【請求項４】 請求項１、２または３記載の圧電デバイ
ス用パッケージに圧電デバイスを収容してなる圧電部品
であって、 前記圧電デバイスが両持ち構造である場合において、 前記固定電極は上記絶縁膜上面の両方に形成され、前記
圧電デバイスの端部に形成されたリード電極と接続固定
されることを特徴とする圧電部品。4. A piezoelectric component in which a piezoelectric device is accommodated in the package for a piezoelectric device according to claim 1, 2 or 3, wherein the piezoelectric device has a double-supported structure, wherein the fixed electrode is the insulating material. A piezoelectric component formed on both upper surfaces of a film and fixedly connected to a lead electrode formed at an end of the piezoelectric device. 【請求項５】 請求項１、２または３記載の圧電デバイ
ス用パッケージに圧電デバイスを収容してなる圧電部品
であって、 前記圧電デバイスが片持ち構造である場合において、 前記固定電極は上記絶縁膜上面の一方に形成され、前記
圧電デバイスの端部に形成されたリード電極と接続固定
されるとともに、前記絶縁膜上面の他方を前記圧電デバ
イスの枕部材としたことを特徴とする圧電部品。5. A piezoelectric component in which a piezoelectric device is housed in the piezoelectric device package according to claim 1, wherein the piezoelectric device has a cantilever structure, wherein the fixed electrode is the insulating material. A piezoelectric component formed on one of the film upper surfaces and connected and fixed to a lead electrode formed at an end of the piezoelectric device, and the other of the insulating film upper surfaces is used as a pillow member of the piezoelectric device. 【請求項６】 圧電デバイスを収容するパッケージを製
造する方法であって、 前記パッケージの底部を構成する板部材の表面に絶縁パ
ターンを形成する工程と、 前記絶縁膜の表面に電極パターンを形成する工程と、 前記板部材と前記パッケージの胴部を構成する枠部材と
を一体化し、積層体を形成する工程と、 前記積層体を焼成することで、前記絶縁パターンと前記
電極パターンとを熱処理し、一体化後のパッケージの底
部表面に絶縁膜と固定電極とを形成する工程と、 を含むことを特徴とする圧電デバイス用パッケージの製
造方法。6. A method for manufacturing a package accommodating a piezoelectric device, comprising: forming an insulating pattern on a surface of a plate member constituting a bottom of the package; and forming an electrode pattern on a surface of the insulating film. A step of integrating the plate member and a frame member forming the body of the package to form a laminate, and baking the laminate to heat-treat the insulating pattern and the electrode pattern. Forming a dielectric film and a fixed electrode on the bottom surface of the integrated package. A method for manufacturing a package for a piezoelectric device, comprising:
JP06664298A 1998-03-17 1998-03-17 Package for piezoelectric device and method for manufacturing the same Expired - Lifetime JP3834417B2 (en)

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US7350988B2 (en) 2005-11-18 2008-04-01 Seiko Epson Corporation Optical module and method of manufacturing the same
US7364372B2 (en) 2005-11-18 2008-04-29 Seiko Epson Corporation Method of manufacturing optical module
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JP2014236514A (en) * 2013-06-03 2014-12-15 サムソン エレクトロ−メカニックス カンパニーリミテッド． Piezoelectric element package and manufacturing method therefor

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007037458A1 (en) * 2005-09-27 2007-04-05 Epson Toyocom Corporation Package and electronic device
US7350988B2 (en) 2005-11-18 2008-04-01 Seiko Epson Corporation Optical module and method of manufacturing the same
US7364372B2 (en) 2005-11-18 2008-04-29 Seiko Epson Corporation Method of manufacturing optical module
JP2007150759A (en) * 2005-11-28 2007-06-14 Kyocera Corp Piezoelectric vibrator storage package and piezoelectric vibration device
JP2010087929A (en) * 2008-09-30 2010-04-15 Citizen Finetech Miyota Co Ltd Piezoelectric device
JP2012209764A (en) * 2011-03-30 2012-10-25 Nippon Dempa Kogyo Co Ltd Piezoelectric device
JP2014236514A (en) * 2013-06-03 2014-12-15 サムソン エレクトロ−メカニックス カンパニーリミテッド． Piezoelectric element package and manufacturing method therefor
CN104218144A (en) * 2013-06-03 2014-12-17 三星电机株式会社 Piezoelectric device package and method of fabricating the same
US9929337B2 (en) 2013-06-03 2018-03-27 Samsung Electro-Mechanics Co., Ltd. Piezoelectric device package and method of fabricating the same

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