JPH11265965A - Hybrid integrated circuit device and method of manufacturing the same - Google Patents

Abstract

(57) [Summary] [PROBLEMS] Conventional molding methods using a thermosetting resin require a long cycle time, and molding of a thermoplastic resin having a short cycle time requires high melting temperature and high injection pressure. There was a difficult problem. SOLUTION: A first support member 12 is molded in advance, a hybrid integrated circuit board 1 is mounted thereon, and the first support member 12 on which the hybrid integrated circuit board 1 is mounted is molded by a mold. And molded with the thermoplastic resin 2 again. The injected high-heat thermoplastic resin 2 hits the first support member 12, and the surface of the hit portion melts. Therefore, full molding covering the back surface of the substrate becomes possible. Moreover, the step
By providing the means 30 for preventing warpage in the 28, the first support member 20 can be fully molded without warping.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hybrid integrated circuit device employing a thermoplastic resin having a short solidification time, and a method of manufacturing the same.

[0002]

2. Description of the Related Art Generally, there are mainly two types of sealing methods adopted as a hybrid integrated circuit device. One is a means for covering a hybrid integrated circuit board on which a circuit element such as a semiconductor element is mounted, and a means for sealing by employing what is generally called a case material. . This structure includes a hollow structure and a structure in which a resin is separately injected therein.

[0003] The second is transfer molding, which is famous as a molding method for semiconductor ICs. This transfer mold generally employs a thermosetting resin, raises the mold to about 180 degrees, maintains the temperature to cure (hereinafter, refers to the phenomenon of reacting with heat and polymerizing and solidifying), and thereafter. It is taken out of the mold to form a sealed body. Here, the solder used for this mounting is generally high-temperature solder,
There is no problem of solder melting.

[0004] However, the sealing structure using the case material has a problem that a margin is provided on the substrate so that the element in the case material does not come into contact with the element in the case material, and the external size becomes large. On the other hand, the transfer mold has a problem in that, as can be understood from the above description, a long time is required for this step in order to cure while applying heat, and the productivity cannot be improved.

Therefore, the present applicant has focused on a thermoplastic resin which does not take much time. This does not cause a curing reaction,
It melts when heat is applied, and solidifies when cooled (refers to the phenomenon of solidifying without reacting). Therefore, after being molded, if it is cooled, it is solidified, and sealing can be realized in a short time. However, when the thermoplastic resin is sealed with, for example, an injection mold, the injection temperature is as high as about 300 ° C., and there is a problem that the solder is melted and the electrical connection of the circuit element mounted on the hybrid integrated circuit board becomes defective. Was.

Here, a high-temperature solder may be used, but a low-melting-point solder is preferable in consideration of deterioration of the insulating resin under the conductive pattern. Therefore, the present invention will be described below on the assumption that solder of about 180 to 250 degrees is employed. To solve these problems, Japanese Patent Application No. Hei 9-1782 was filed by the present application.
No. 46 has been filed. Although this is omitted in the drawings, if a substrate made of a material having excellent heat conductivity, for example, a metal substrate is used, the injected heat is immediately absorbed by the metal substrate, so that it acts as a heat sink. It can suppress the melting of the solder on the hybrid integrated circuit board.

[0007]

This is advantageous in that a substrate having excellent heat conduction, such as a metal substrate, is adopted. However, the back surface of the hybrid integrated circuit board is exposed, and the hybrid integrated circuit board and the mounting chassis are mounted. (Attachment to the hybrid integrated circuit device). Further, there is a problem in moisture resistance due to infiltration of moisture through the interface between the exposed back surface of the hybrid integrated circuit substrate and the thermoplastic resin located around the back surface.

If a substrate having poor heat conductivity, such as a printed substrate, a flexible sheet, a glass substrate, or a ceramic substrate, is used, there is a problem that the solder is melted. In the case of full mold using transfer mold,
In order to allow the resin to flow around the back surface of the island of the lead frame, and to provide a space between the back surface of the island on which the chip is mounted and the mold, a pin is used or the space is provided by sandwiching the lead frame with the mold. Was. However, in an injection mold using a thermoplastic resin, since the injection pressure is as high as 50 to 200 kg / cm 2, there have been problems such as bending of the lead frame and cutting of a bonding wire. This problem occurs not only in a lead frame but also in a hybrid integrated circuit board such as a metal board or a printed board.

[0009]

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned conventional drawbacks. First, a step is provided around the back surface of a first support member for locking with the sealing member. This problem can be solved by providing a warp preventing means at the step.
While preventing the first support member from warping, the back surface of the hybrid integrated circuit board is covered with the first support member and can be reliably inserted into the injected thermoplastic resin.

Second, the problem can be solved by providing a projection-like warp preventing means over the entire periphery of the back surface of the first support member at the step. Third, mounting the hybrid integrated circuit board,
A first support member made of a thermoplastic resin having a step on a back surface, wherein the first support member is held by one of the molds in a state in which a protrusion provided on the step is in contact with the first mold and the other mold; Is solved by injecting a melted thermoplastic resin into the space formed by the above, and melting the contact portion of the first support member by the melted heat to integrally mold.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Before describing the embodiments of the present invention, a point of interest when molding with a thermoplastic resin will be briefly described. Injection molding time The epoxy resin used in the transfer mold needs to be left in the mold while undergoing a thermosetting reaction, but the thermoplastic resin can be cooled simply by cooling the resin, and the molding time can be shortened. In the literature, one cycle of epoxy is 30-18
The time is 0 to 10 seconds for the thermoplastic resin of PPS.

Resin yield The thermosetting type cannot be reused, but the thermoplasticity can be reused by applying heat, and the yield can be improved by collecting and reusing the resin in a runner or the like. Injection molding conditions Cylinder temperature: substantially the same as the melting temperature of the resin, about 290 to 320 degrees.

Mold temperature: about 140-150 degrees for solidification. Injection pressure: 50 to 200 Kg / cm2 If the problem caused by the injection pressure can be cleared, the cost can be greatly reduced. PPS (Polyphenylene Sulfide): One of Thermoplastic Resins This resin has no hydrophilic group and therefore has a water absorption of half that of an epoxy resin, but its adhesion to leads and elements is inferior to that of an epoxy resin.

Here, in the conventional transfer mold, a gap must be provided between the back surface of the substrate and the mold in order to allow the resin to flow around the back surface of the substrate. However, there is a problem that the substrate is warped by the injection pressure. Therefore, the first support member 12 is molded in advance, and the hybrid integrated circuit board 1 is mounted thereon, and the hybrid integrated circuit board 1 is mounted thereon. The first support member 12 was placed in a mold and molded with the thermoplastic resin 2 again. Injected high heat thermoplastic resin 2
Abuts on the first support member 12, and the surface of the contacted portion is melted out. Therefore, full molding covering the back surface of the substrate becomes possible.

Hereinafter, a hybrid integrated circuit device according to a first embodiment of the present invention will be described with reference to FIGS. FIG. 2 shows the first support member 12 having a hybrid integrated circuit board.
1 indicates that it is incorporated. FIG. 1 shows a structure in which the structure shown in FIG. 2 is arranged in a mold and molded with a thermoplastic resin. The hybrid integrated circuit board may be a ceramic, a metal, a printed board, a glass board, a flexible sheet, or the like. Here, an aluminum substrate is used as the metal board.

That is, as the hybrid integrated circuit board 1, a metal substrate or an insulating substrate having a thermal conductivity close to that of the metal substrate is employed here. Although the details of the reason will be described later, since the injection temperature of the thermoplastic resin 2 used in the present invention is high, the substrate temperature rises in the mold. For example, if a metal substrate is used,
To act as a heat sink, the hybrid integrated circuit board 1
The above temperature rise can be suppressed and the solders 3 and 4 can be prevented from melting.

As the metal substrate, Cu, Fe,
A compound made of Al or a metal having excellent conductivity can be considered. The surface of the Al substrate 1 is anodically oxidized to form an oxide, and a resin 5 having further excellent insulating properties is applied over the entire surface. However, this metal oxide may be omitted if the withstand voltage is not considered.

Then, conductive patterns 6 and 7 made of, for example, Cu are formed on the resin 5, and transistors and ICs are formed.
Active devices 8 such as chip resistors and passive elements 9 such as chip resistors and chip capacitors are mounted via solder to realize a predetermined circuit. Here, the solder may be partially connected and may be electrically connected with a silver paste or the like. When the semiconductor element 8 is mounted face-up, it is connected via a thin metal wire 10 by bonding. Further, external leads 11 are connected via the solder 4 and are led out of the sealing resin 2 to the outside.

Here, the thermoplastic resin 2 for sealing is realized by, for example, injection molding, the injection temperature of the resin is as high as about 300 ° C., and the hybrid integrated circuit board 1 having circuit elements mounted with solder is used. In the case of being integrally molded by being inserted into a mold, there is a problem that the solder is melted by the high-temperature resin and solder failure of the element occurs. In particular, a material having a low thermal conductivity such as a resin-based printed circuit board is remarkable. However, in the present application, since a material having a high thermal conductivity is used, the substrate 1 functions as a heat sink, so that the temperature rise on the substrate surface can be suppressed and these problems can be eliminated. The thermoplastic resin used here is called PPS (polyphenyl sulfide). The Al substrate is
A 1.5 mm thick one was adopted.

The temperature of the mold is considerably lower than the mold temperature of the transfer mold, about 130 ° C. or less. A 300 ° C. liquid resin is poured into the mold, and the mold is cooled and solidified quickly by the low temperature mold. You. This cycle is
It takes about 10 to 20 seconds, and can be greatly reduced as compared with the transfer mold cycle (30 to 180 seconds).

When the hybrid integrated circuit board 1 on which the circuit elements are mounted is molded with the thermoplastic resin 2, the solder joints 3, 4 and the bonding wire and the bare chip are previously formed with the thermosetting resin 13 (for example, epoxy resin). Potting is good. Further, the thermosetting resin preferably has the same thermal expansion coefficient as that of the hybrid integrated circuit board. That is, the above-described countermeasure has an effect of preventing the metal thin wire (100 μm or less) from falling down or breaking due to the pressure of the injected resin during molding of the thermoplastic resin 2. Also, thermoplastic resin 2
After molding, it is only in close contact with the hybrid integrated circuit board 1,
Reacts with substrate and does not adhere. Therefore thermoplastic resin
When 2 is in direct contact with the circuit element, the thermal shock causes a mismatch between the thermoplastic resin 2 and the mounted components 8 and 9, and the thermal expansion coefficient between the hybrid integrated circuit board 1 and the thermoplastic resin 2. Stress is generated at the wire connection portion including the thick line and the thick line, and disconnection or the like occurs. These problems can be solved by the potting resin 13. Further, at the time of molding, the thermoplastic resin 2 does not come into direct contact with the solder, so that a rise in the temperature of the solder portion can be suppressed. When a metal substrate is used as described above, it acts as a heat sink, but if the resin is further coated on the solder,
The melting of the solder can be more reliably prevented. In the case of a printed circuit board, a ceramic substrate, or the like having poor conductivity, a resin is coated on the solder, and the melting of the solder can be prevented by adjusting the resin thickness and the resin injection temperature.

Although the cause is not clear, it has been found that the solder connection portion of the external lead 11 attached to the metal substrate does not cause any failure without potting the resin as a result of the heat cycle. This is because the solder does not melt because the external lead conducts heat to the outside, the resin is engaged in the shape of L at the portion A, so that the resin and the substrate are less displaced, and the external lead suppresses the peeling of the resin (anchor Effect). That is, when potting is partially performed, the potting of the lead portion may be omitted from this phenomenon. However, when applying resin to the entire surface, this omission may not be considered from the viewpoint of workability.

Further, as is apparent from FIG. 2, a step 14 is provided around the back surface of the substrate, which improves the adhesiveness with the injected thermoplastic resin. Next, a second embodiment will be described. FIGS. 3 and 4 are views of the first support member 20 viewed from the front side and the back side. FIG. 5 is a view similar to FIG. 5 is a drawing when the hybrid integrated circuit board 21 is mounted on one support member.

The first support member 20 is just like a wooden case without a lid, and the side surface excluding the bottom surface 22 is such that when the thermoplastic resin is injected by a mold described later, the resin turns to the bottom surface. An ablation region 23 is provided partially so as to be able to fit. Also, the depth d of this case 20 depends on the hybrid integrated circuit board.
Same thickness as 21 but slightly smaller.

In FIG. 3, four side surfaces may be constituted by the side surfaces indicated by the reference numeral 24, or four side surfaces may be constituted by the side surface 25 having the cutout region 23. Therefore two types of side 2
4,25 is illustrated. The inner side surface 26 (shown by B) of this side surface is in contact with the side surface of the hybrid integrated circuit board 21 and has dimensional accuracy such that there is no play.

In particular, this side surface is merely a means of a stopper for the hybrid integrated circuit board, and may be anything as long as the hybrid integrated circuit board can be attached to the first support member 20. However, since the injection pressure of the resin is high, it is necessary to design the hybrid integrated circuit board so as not to come off from the first support member 20. As will be described later, the surface 27 (indicated by S) is in contact with the mold.
The side surface 25 has a shape as if a plate having a thickness E is attached to a square plate. In other words, the resection area here
Since the gap 23 is provided at the interval 23, the resin flows around the step 28 in FIG.

On the other hand, the provision of the step 28 as shown by the reference numeral 14 in FIG. 2 improves the adhesiveness with the injected resin, but the first support member 20 is made of a thermoplastic resin. Therefore, when the mounting resin is injected into the mold, there is a problem that the resin is deformed due to a gap at the step portion. Therefore, a protrusion having the same plane as the back surface 28, that is, a warp preventing means 30 is attached. This warpage prevention means 30
Is provided over the entire circumference of the step portion. The size, shape, number, and the like are determined in consideration of the size, injection pressure, and the like of the hybrid integrated circuit device, and are not limited thereto.

FIG. 5 shows a state in which the hybrid integrated circuit board 21 is attached to the first support member 20, and reference numeral 31 is a potting resin for preventing melting of solder and cutting or bending of thin metal wires. 6 and 7, the hybrid integrated circuit board 21
The state when the first support member 20 to which is attached is attached to the molds 40 and 41 will be described. FIG. 6 shows a state in which the surfaces S of the side surfaces 24 and 25 of the first support member are in surface contact,
FIG. 7 shows the one that is substantially in line contact. In terms of strength, the surface is stronger, so that the line-contacting portion may be chamfered as shown by a wavy line to form a trapezoidal sectional view. In particular, FIG. 7 shows a shape in consideration of moisture resistance. The thermoplastic resin entered from the inlet G comes into contact with the first support member 20 at P1 and P2. In other words, the moisture path P1 is P2
, The moisture resistance can be improved.

In FIGS. 2 and 3, a substantially hemispherical projection may be formed on the side surface of the first support member to take the form of point contact. In this case, when a thermoplastic resin is separately injected and molded as shown in FIG. 1, the point of contact with the mold becomes a point, so that the degree of exposure is further smaller than that of surface or line contact. FIG.
FIG. 9 is an overall view when the first support member is attached to a mold, injected with resin, and integrally molded. In FIG. 8, a rim 43 is formed so that a screw is attached to a place hatched with a cross. The portion indicated by the dashed line indicates a portion where the back surface of the first support member is exposed. FIG.
Is a portion where the edge is omitted, and a dashed line also shows an exposed portion on the back surface.

FIG. 10 is a sectional view of the mold shown in FIG.
It is the drawing seen from the line. Reference numeral 20 denotes a first support member, 44 denotes a hybrid integrated circuit board, 45 denotes an external lead, 46 denotes a potting resin, and 47 denotes a space where an edge 43 is formed. In addition, the portions indicated by the three-dot chain lines may be cut at the corners to improve the moisture resistance in the same manner as described in P2 of FIG. Finally, the first
As can be said in both the first embodiment and the second embodiment, the first support member is provided with a filler for improving the thermal conductivity in consideration of the temperature rise of the substrate due to the injected resin 2. It may be mixed. For example, alumina, Si or the like is mixed. Further, if the first support member is integrally molded with the hybrid integrated circuit board and a mold together, there is a problem that the heat conductivity is excellent and heat is absorbed by the mold at the time of molding, so that the first support member does not reach the entire back surface of the substrate. Therefore, it is important to prepare the first support member in advance. In addition, the injection resin 2 has this problem, and conversely, a thermoplastic resin into which no filler is mixed is used. This is because the heat of the injected resin 2 is removed by the mold and solidified in the middle of the hybrid integrated circuit board.

[0031]

As described above, first, the first
And a sealing member made of a thermoplastic resin in which the exposed portion of the supporting member is melted and integrated, whereby the hybrid integrated circuit board is integrally molded with the first supporting member and the injected thermoplastic resin. Since the back surface of the hybrid integrated circuit board is not exposed, the withstand voltage characteristics and the moisture resistance are improved, and the warpage of the first support member due to heat or injection pressure can be prevented.

Secondly, by providing a projection-like warpage preventing means over the entire periphery of the back surface of the first support member at the step, the engagement with the injection resin is good, and the warpage of this part is reduced. Can be prevented.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view of a hybrid integrated circuit device according to a first embodiment of the present invention.

FIG. 2 is a diagram illustrating a relationship between a first support member of FIG. 1 and a hybrid integrated circuit board.

FIG. 3 is a perspective view illustrating a first support member according to a second embodiment of the present invention.

FIG. 4 is a perspective view illustrating a first support member according to a second embodiment of the present invention.

FIG. 5 is a perspective view illustrating a state where a hybrid integrated circuit board is attached to the first support member of FIG. 3;

FIG. 6 is a diagram illustrating a state where FIG. 5 is attached to a mold.

FIG. 7 is a diagram illustrating line contact between a first support member and a mold.

FIG. 8 is a diagram illustrating a hybrid integrated circuit device.

FIG. 9 is a diagram illustrating a hybrid integrated circuit device.

FIG. 10 is a view for explaining the sealing method of FIG. 8;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Hybrid integrated circuit board 2 Thermoplastic resin 3, 4 Solder 5 Resin 6, 7 Conductive pattern 8 Semiconductor element 9 Passive element 10 Fine metal wire 11 External lead 12 First support member 13 Potting resin 14 Stepped portion 20 First support member DESCRIPTION OF SYMBOLS 21 Hybrid integrated circuit board 23 Cutting area 24, 25 Side surface 30 Warpage prevention means

Claims (3)

[Claims] A first support member made of a thermoplastic resin having at least a groove for locking a substrate; and a semiconductor element locked in the groove and electrically connected to a conductive pattern provided on a surface. A hybrid integrated circuit board having passive elements and / or the first integrated circuit board so as to substantially seal the hybrid integrated circuit board.
A sealing member made of a thermoplastic resin in which a contact portion with the supporting member is melted and integrated at the time of mold molding; and a sealing member around the back surface of the first supporting member. A hybrid integrated circuit device having a step for locking, wherein a warp preventing means is provided at the step. 2. The method according to claim 1, wherein the step is provided over the entire periphery of the back surface of the first support member, and the step is provided with a warp preventing means having a projecting shape over the entire periphery. The hybrid integrated circuit device according to claim 1. 3. A surface having an insulated surface, a conductive pattern provided thereon, a semiconductor element or a passive element connected to the conductive pattern via solder, and electrically connected to the conductive pattern. Or a first support member made of a thermoplastic resin having a hybrid integrated circuit board having a conductive means extending to the outside as an input, mounting the hybrid integrated circuit board, and having a step on the back surface. Holding the projection provided on the step in one of the molds in a contact state, in a space formed by the one mold and the other mold,
A method for manufacturing a hybrid integrated circuit device, comprising: injecting a molten thermoplastic resin; melting the contact portion of the first support member with the melted heat;