JPH11273458A - Manufacturing method of conductive plastic - Google Patents
Manufacturing method of conductive plasticInfo
- Publication number
- JPH11273458A JPH11273458A JP9262398A JP9262398A JPH11273458A JP H11273458 A JPH11273458 A JP H11273458A JP 9262398 A JP9262398 A JP 9262398A JP 9262398 A JP9262398 A JP 9262398A JP H11273458 A JPH11273458 A JP H11273458A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- free solder
- conductive
- thermoplastic resin
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Non-Insulated Conductors (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Conductive Materials (AREA)
Abstract
(57)【要約】
【課題】 導電性が高く様々な環境下においても導電性
の低下を起こすことがなく、成形に支障をきたすような
大きな金属粒のない信頼性の高い導電性プラスチックの
製造方法を提供することを目的とする。
【解決手段】 熱可塑性樹脂と、鉛フリ−ハンダの分散
を補助する分散メディアと、前記熱可塑性樹脂の可塑化
する温度域内で溶融する鉛フリ−ハンダと、を同時に混
練して導電性樹脂組成物を得る工程と、該導電性樹脂組
成物を線状に押出成形すると共に粒状（ペレット）に切
断する工程と、を具備することを特徴とする導電性プラ
スチックの製造方法。PROBLEM TO BE SOLVED: To manufacture a highly reliable conductive plastic which has high conductivity and does not cause a decrease in conductivity even in various environments and does not have large metal particles which may hinder molding. The aim is to provide a method. SOLUTION: A conductive resin composition is prepared by simultaneously kneading a thermoplastic resin, a dispersion medium for assisting dispersion of lead-free solder, and lead-free solder melted in a temperature range in which the thermoplastic resin is plasticized. A method for producing a conductive plastic, comprising: a step of obtaining a product; and a step of extruding the conductive resin composition into a linear shape and cutting it into granules (pellets).
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、基板及び立体部品
となるフレ−ムに導電回路を形成する等の際に使用され
る導電性プラスチックの製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a conductive plastic used for forming a conductive circuit on a substrate and a frame serving as a three-dimensional component.
【０００２】[0002]
【従来の技術】従来から導電性プラスチックとして樹脂
中に金属繊維や金属繊維に低融点金属を混ぜて金属繊維
の接触抵抗を下げて信頼性を向上させた導電性プラスチ
ックは、電磁波シ−ルド等の用途ととして利用されてい
る。しかしこれまでの導電性プラスチックは、体積固有
抵抗が１０↑-↑3Ω・ｃｍ以上と抵抗が大きいため通電
を行った場合に発熱して導電性プラスチックが溶けた
り、抵抗が大きくなるため通電用途には利用できなかっ
た。また温度変化によりプラスチックと金属成分の熱膨
張差があるため高温になると樹脂の膨張に伴い金属の接
触箇所が減少しその結果として導電性が劣化するといっ
た問題も生じる。その他に樹脂中に低融点金属である共
晶ハンダを少量加えたものが知られているが、共晶ハン
ダは鉛を含んでいるためその廃棄物は環境に対して悪影
響を及ぼすという問題があった。また導電性プラスチッ
クの導電性を高めるためには、より多くの金属成分を樹
脂中に混ぜなければならないが金属繊維を多く混入する
と成形性が悪くなり射出ノズルを詰まらせたり、細い形
状に射出成形できなくなる問題がある。2. Description of the Related Art Conventionally, as a conductive plastic, a metal fiber or a low melting point metal mixed with a metal fiber in a resin to reduce the contact resistance of the metal fiber to improve reliability has been known as an electromagnetic shield. It is used as an application. However, conventional conductive plastics have a large volume resistivity of 10 ↑-↑ 3 Ω · cm or more, so they generate heat when energized, causing the conductive plastic to melt or increase the resistance. Was not available. In addition, since there is a difference in thermal expansion between the plastic and the metal component due to a change in temperature, when the temperature becomes high, there is also a problem that the contact points of the metal are reduced due to the expansion of the resin, and as a result, the conductivity is deteriorated. In addition, it is known to add a small amount of eutectic solder, which is a low-melting-point metal, to a resin.However, since eutectic solder contains lead, there is a problem that its waste has a bad effect on the environment. Was. In order to increase the conductivity of conductive plastics, more metal components must be mixed into the resin.However, if too much metal fiber is mixed, the moldability deteriorates and the injection nozzle becomes clogged or injection molding into a narrow shape is performed. There is a problem that can not be done.
【０００３】[0003]
【発明が解決しようとする課題】本発明は上記の問題に
鑑みて成されたもので、導電性が極めて高く様々な環境
下においても導電性の低下を起こすことがなく、成形に
支障をきたすような大きな金属粒がない信頼性の高い導
電性プラスチックの製造方法を提供することを目的とす
る。SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and has extremely high conductivity, does not cause a decrease in conductivity even in various environments, and hinders molding. It is an object of the present invention to provide a method for manufacturing a highly reliable conductive plastic having no such large metal particles.
【０００４】[0004]
【課題を解決するための手段】上記の目的を達成するた
めに、本発明における導電性プラスチックの製造方法
は、熱可塑性樹脂と、鉛フリ−ハンダの分散を補助する
分散メディアと、前記熱可塑性樹脂の可塑化温度域で溶
融する鉛フリ−ハンダとを同時に混練して導電性樹脂組
成物を得る工程と、該導電性樹脂組成物を線状に押出成
形すると共に粒状（ペレット）に切断する工程と、を具
備することを特徴とするものであり、さらに前記熱可塑
性樹脂が粉末にされたものであることを特徴とするもの
である。In order to achieve the above object, a method for producing a conductive plastic according to the present invention comprises a thermoplastic resin, a dispersion medium for assisting dispersion of lead-free solder, and the thermoplastic resin. A step of obtaining a conductive resin composition by simultaneously kneading lead-free solder that melts in the plasticization temperature range of the resin, and extruding the conductive resin composition into a linear shape and cutting it into granules (pellets). And a step wherein the thermoplastic resin is powdered.
【０００５】上記のようにして得られる導電性プラスチ
ックの用途の１つとして射出成形の２色成形技術による
立体回路部品の配線への適用がある。この場合フレ−ム
と導電性プラスチックとの密着性も重要視されるが熱膨
張の違い、二次転移点の違い、繰り返しの熱衝撃等によ
って接合界面に隙間、ずれ等を起こさない様にするに
は、フレ−ムと導電性プラスチックの原料に使用する樹
脂を同一にしてサ−マルマッチング性（密着性）を高め
る必要がある。例えばフレ−ムにポリプロピレン（Ｐ
Ｐ）を使用したい場合導電性プラスチックに使用する樹
脂もポリプロピレン（ＰＰ）にする。それには鉛フリ−
ハンダの融点をＰＰが熱可塑化する温度域で合金成分調
整したハンダを用いなければ良質の導電性プラスチック
を製造することができない。（例えばハンダの融点が樹
脂の融点より低い場合、混練中にハンダが先に溶けハン
ダは樹脂中に細かく分散されず大きな金属粒になってし
まう。またハンダの融点が樹脂の融点よりかけ離れて高
いと混練中に樹脂が熱分解してしまう。）[0005] One of the uses of the conductive plastic obtained as described above is to apply to wiring of three-dimensional circuit parts by a two-color molding technique of injection molding. In this case, adhesion between the frame and the conductive plastic is also regarded as important, but it is necessary to prevent a gap or a shift from occurring at the joint interface due to a difference in thermal expansion, a difference in a secondary transition point, a repeated thermal shock, or the like. For this purpose, it is necessary to increase the thermal matching property (adhesion) by using the same resin as the material of the frame and the conductive plastic. For example, in a frame, polypropylene (P
When it is desired to use P), the resin used for the conductive plastic is also polypropylene (PP). It is lead free
Good quality conductive plastics cannot be produced unless solder whose alloy component is adjusted in a temperature range where the melting point of the solder is thermoplasticized by PP is used. (For example, if the melting point of the solder is lower than the melting point of the resin, the solder melts first during kneading, and the solder is not finely dispersed in the resin and becomes large metal particles. In addition, the melting point of the solder is much higher than the melting point of the resin. The resin is thermally decomposed during kneading.)
【０００６】[0006]
【発明の実施の形態】（実施例１）熱可塑性樹脂である
粉末状ＡＢＳ樹脂４０体積％、分散メディアとしての銅
粉末（福田金属箔粉工業：ＦＣＣ−１１５）１５体積
％、鉛フリ−ハンダ（福田金属箔工業：Ｓｎ−Ｃｕ−Ｎ
ｉ−ＡＴ−１５０）４５体積％とを先端部に切断機構を
付設した２軸混練押出機に同時に投入し、スクリュ−回
転数を調整しながら１〜３分間混練して、熱可塑性樹脂
と、その融点を熱可塑性樹脂の可塑化する温度域内に合
金成分調整をした鉛フリ−ハンダと、該鉛フリ−ハンダ
を前記熱可塑性樹脂中に細かく分散させることを補助す
る分散メディアと、を含む導電性樹脂組成物を得た。得
られた導電性樹脂組成物は先端のダイスにより線状に押
出成形し、切断機構により切断して射出成形に適した粒
状（ペレット）とした。このペレットの断面を光学顕微
鏡で観察したところ樹脂中に鉛フリ−ハンダが５μｍの
大きさで均一に分散し、半溶融されたハンダが全体に亘
って鉛フリ−ハンダを連続結合させた状態になってい
た。また、このペレットを使用して射出成形品を作成
し、体積固有抵抗を測定したところ１０↑-↑5Ω・ｃｍ
オ−ダ−を示すものであった。DESCRIPTION OF THE PREFERRED EMBODIMENTS (Example 1) 40% by volume of powdered ABS resin as a thermoplastic resin, 15% by volume of copper powder (FCC-115: FCC-115) as a dispersion medium, lead-free solder (Fukuda Metal Foil Industry: Sn-Cu-N
i-AT-150) 45% by volume was simultaneously charged into a twin-screw kneading extruder equipped with a cutting mechanism at the tip, and kneaded for 1 to 3 minutes while adjusting the screw rotation speed to obtain a thermoplastic resin, A lead-free solder whose alloying point is adjusted to a temperature range in which the melting point of the thermoplastic resin is plasticized, and a dispersion medium for assisting fine dispersion of the lead-free solder in the thermoplastic resin. A resin composition was obtained. The obtained conductive resin composition was extruded linearly by a die at the tip and cut by a cutting mechanism into granules (pellets) suitable for injection molding. Observation of the cross section of the pellet with an optical microscope showed that lead-free solder was uniformly dispersed in the resin to a size of 5 μm, and the semi-molten solder was continuously bonded with lead-free solder throughout. Had become. An injection molded product was prepared using the pellets, and the volume resistivity was measured.
The order was shown.
【０００７】（実施例２）熱可塑性樹脂である粉末状Ｐ
ＢＴ樹脂４０体積％、分散メディアとしての銅粉末（福
田金属箔粉工業：ＦＣＣ−１１５）１５体積％、鉛フリ
−ハンダ（福田金属箔工業：Ｓｎ−Ｃｕ−Ｎｉ−ＡＴ−
１５０）４５体積％とを先端部に切断機構を付設した２
軸混練押出機に同時に投入し、材料温度が急激に上昇し
ないように回転数を調整して１〜３分間混練して、熱可
塑性樹脂と、その融点を熱可塑性樹脂の可塑化する温度
域内に合金成分調整をした鉛フリ−ハンダと、該鉛フリ
−ハンダを前記熱可塑性樹脂中に細かく分散させること
を補助する分散メディアと、を含む導電性樹脂組成物を
得た。得られた導電性樹脂組成物は先端のダイスにより
線状に押出成形し、切断機構により切断して射出成形に
適した粒状（ペレット）とした。このペレットは、実施
例１の場合と同様に樹脂中に鉛フリ−ハンダが５μｍの
大きさで均一に分散し、半溶融されたハンダが全体に亘
って鉛フリ−ハンダを連続結合させた状態になってい
た。また、このペレットを使用して射出成形品を作成
し、体積固有抵抗を測定した結果も１０↑-↑5Ω・ｃｍ
オ−ダ−を示すものであった。(Example 2) Powdered P as a thermoplastic resin
40% by volume of BT resin, 15% by volume of copper powder as a dispersion medium (Fukuda Metal Foil & Powder Co., Ltd .: FCC-115), lead-free solder (Fukuda Metal Foil Co., Ltd .: Sn-Cu-Ni-AT-)
150) 45% by volume with a cutting mechanism attached at the tip
Simultaneously put into the shaft kneading extruder, adjust the rotation speed so that the material temperature does not rise rapidly, knead for 1 to 3 minutes, and set the melting point of the thermoplastic resin within the temperature range where the thermoplastic resin is plasticized. A conductive resin composition comprising lead-free solder whose alloy components were adjusted and a dispersion medium for assisting fine dispersion of the lead-free solder in the thermoplastic resin was obtained. The obtained conductive resin composition was extruded linearly by a die at the tip and cut by a cutting mechanism into granules (pellets) suitable for injection molding. In this pellet, as in the case of Example 1, the lead-free solder was uniformly dispersed in the resin to a size of 5 μm, and the semi-molten solder continuously joined the lead-free solder throughout. Had become. In addition, an injection molded product was prepared using the pellets, and the volume resistivity was measured to be 10 も-も 5Ω · cm.
The order was shown.
【０００８】なお上記実施例１、２において熱可塑性樹
脂として粉末状のものを使用したのは鉛フリ−ハンダを
短時間のうちに均一に分散させるためである。また分散
メディアとしてぬれ性の最も優れた銅粉末を用いたが銅
の他にグラファイト、メッキしたグラファイト、鉄、タ
ングステン、タングステンカ−バイト、セラミック、導
電セラミック（窒化アルミ）、などぬれ性が良い粉末で
あれば使用可能である。さらに上記実施例１、２におい
ては、鉛フリ−ハンダとして錫基合金（Ｓｎ−Ｃｕ−Ｎ
ｉ）を使用したが錫単体を使用してもよい。The reason why powdery thermoplastic resin is used in Examples 1 and 2 is to uniformly disperse lead-free solder in a short time. Copper powder with the highest wettability was used as the dispersion medium, but in addition to copper, graphite, plated graphite, iron, tungsten, tungsten carbide, ceramic, conductive ceramic (aluminum nitride), and other powders with good wettability If it is, it can be used. Further, in Examples 1 and 2, a tin-based alloy (Sn-Cu-N) was used as lead-free solder.
Although i) was used, tin alone may be used.
【０００９】[0009]
【発明の効果】本発明は上記の説明から明らかなよう
に、鉛フリ−ハンダが短時間で樹脂中に細かく均一に分
散されると共に半溶融されたハンダにより分散された鉛
フリ−ハンダが全体に亘って連続結合されて、高い導電
性が得られると共に様々な環境下においても導電性の低
下を起こすことがなく、成形に支障をきたすような大き
な金属粒のない信頼性の高い導電性プラスチックを得る
ことができるという効果がある。As is apparent from the above description, the present invention provides a lead-free solder in which the lead-free solder is finely and uniformly dispersed in the resin in a short period of time, and the lead-free solder dispersed by the semi-molten solder is entirely formed. , A highly reliable conductive plastic that has high conductivity and does not cause a decrease in conductivity even in various environments, and does not have large metal particles that hinder molding. Is obtained.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 ＦＩ Ｃ０８Ｌ 101/00 Ｃ０８Ｌ 101/00 Ｈ０１Ｂ 5/16 Ｈ０１Ｂ 5/16 Ｂ２９Ｋ 103:06 (72)発明者 中川 威雄 神奈川県川崎市中原区市ノ坪223−４−416 (72)発明者 野口 裕之 千葉県千葉市稲毛区弥生町１−170−２− 306──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. 6 Identification code FI C08L 101/00 C08L 101/00 H01B 5/16 H01B 5/16 B29K 103: 06 (72) Inventor Takeo Nakagawa Nakahara, Kawasaki-shi, Kanagawa Prefecture 223-4-416, Nobotsu-ku, Ward (72) Inventor Hiroyuki Noguchi 1-170-2-306, Yayoi-cho, Inage-ku, Chiba-shi, Chiba
Claims (2)
を補助する分散メディアと、前記熱可塑性樹脂の可塑化
温度域で溶融する鉛フリ−ハンダとを同時に混練して導
電性樹脂組成物を得る工程と、該導電性樹脂組成物を線
状に押出成形すると共に粒状（ペレット）に切断する工
程と、を具備することを特徴とする導電性プラスチック
の製造方法。1. A conductive resin composition obtained by simultaneously kneading a thermoplastic resin, a dispersion medium for assisting dispersion of lead-free solder, and lead-free solder melted in a plasticizing temperature range of the thermoplastic resin. And a step of extruding the conductive resin composition into a linear shape and cutting it into granules (pellets).
あることを特徴とする請求項１記載の導電性プラスチッ
クの製造方法。2. The method for producing a conductive plastic according to claim 1, wherein said thermoplastic resin is powdered.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9262398A JPH11273458A (en) | 1998-03-20 | 1998-03-20 | Manufacturing method of conductive plastic |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9262398A JPH11273458A (en) | 1998-03-20 | 1998-03-20 | Manufacturing method of conductive plastic |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH11273458A true JPH11273458A (en) | 1999-10-08 |
Family
ID=14059578
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9262398A Pending JPH11273458A (en) | 1998-03-20 | 1998-03-20 | Manufacturing method of conductive plastic |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH11273458A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004162690A (en) * | 2002-05-31 | 2004-06-10 | Ti Group Automotive System Llc | Control of static charge for tank inner module |
| US8197730B2 (en) * | 2005-04-13 | 2012-06-12 | Cool Options, Inc. | Molding method for forming in-mold metallized polymer components |
-
1998
- 1998-03-20 JP JP9262398A patent/JPH11273458A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004162690A (en) * | 2002-05-31 | 2004-06-10 | Ti Group Automotive System Llc | Control of static charge for tank inner module |
| US8197730B2 (en) * | 2005-04-13 | 2012-06-12 | Cool Options, Inc. | Molding method for forming in-mold metallized polymer components |
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