JPH11273819A - Contact for electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a contact of a test head used for inspection of an IC socket or an IC, which can shorten a distance between the IC and receives no bad influence, even when a high frequency voltage or current is used in the IC. SOLUTION: This contact 1 for an electronic part to electrically connect an IC terminal 61 and an electrode 71 each other, is provided with an insulating and elastic silicone rubber sheet 10 in which plural holes 20 are bored in parallel with its thickness direction, metal wires 30 straightly passing through each hole along a direction in parallel with the thickness of the silicone rubber sheet 10, a pair of conductive pressure contact parts 40, 41 which are connected to both ends of the metal wires 30 and sandwiches the silicone rubber sheet 10, and a pair of conductive terminal parts 50, 51, which connect the IC terminal 61 to one of the pair of the pressure contact parts 40, and also connects the electrode 71 to another one of the pair of the pressure contact parts 41.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a contact of a test head used for inspecting an IC socket or an IC.
In particular, the present invention relates to a contact of an IC socket using a high-frequency voltage or current or a test head used for inspection of an IC.

[0002]

2. Description of the Related Art Generally, an IC is mounted on a circuit board in a form sealed or housed in a package for protecting an IC chip. As a form of such a package, for example, there is a package having a relatively low function and few lead pins (IC terminals) such as a dual inline package (DIP) type IC 110 shown in FIG. . There is also a high-functionality, multi-pin structure IC such as a quad flat package (QFP) IC 120 shown in FIG. 7B. In such a package form, the increase in the number of pins due to the enhancement of functions and the reduction in size due to the reduction of the mounting area on the circuit board have conflicting problems and have been difficult to realize. .

Therefore, in recent years, as shown in FIG. 7C, IC terminals 132 of solder balls and electrode pins are arranged in an area array (two-dimensional matrix) on the mounting surface of the package 131, that is, on the bottom surface. Ball grid array (BG) that can reduce the mounting area on a circuit board
A: Ball Grid Array or fine pitch BGA (F
The form of the IC 130 of a surface mount type package such as BGA (Fine-pitch BGA) has been used.

Incidentally, in order to inspect an IC or to use an IC, it is necessary to connect an IC terminal to an electric circuit. At this time, the IC terminals are often connected using an IC socket or an IC test head without directly connecting the IC terminals to the electric circuit. Since the solder balls and electrode pins of the IC terminals have slight differences in height, the IC must be pressed in the direction of the electric circuit to ensure the electrical connection between the IC and the electric circuit. Must.
Therefore, the IC socket and the test head need to have elasticity in order to cope with a change in the distance between the IC and the electric circuit due to pressure.

FIG. 8 shows an example of an IC socket and an IC test head. The IC 140 is connected to the electric circuit 150 by an IC socket 160. The IC socket 160 has terminals 161 and 162, which are conductors, and a conductive rubber 163.
The terminal 161 is connected to the IC 140 and the terminal 162 is connected to the electric circuit 15.
Connected to 0. The form of the IC 140 is a ball grid array, and the wiring of the electric circuit 150 is on the surface.

FIG. 9 is a partially enlarged view of the IC socket 160. The IC terminal 141 of the IC 140 is connected to the terminal 161, and the electrode 151 of the electric circuit 150 is connected to the terminal 162. Therefore, the IC terminal 141 of the IC 140 and the electric circuit 1
Fifty electrodes 151 are electrically connected. The conductive rubber 163 includes a conductive linear body 164 and an elastic portion 165 made of silicon rubber or the like. The conductive linear body 164 is inclined and embedded at a minute pitch in the conductive rubber 163. Thereby, the IC terminal 141 and the electrode 151 are connected one-to-one. Further, the reason why the conductive linear body 164 is inclined is as follows.
When the conductive rubber 163 is compressed due to a change in the distance between the IC 140 and the electric circuit 150 or the like, the conductive linear member 16
If 4 is upright, it will buckle or break,
To avoid it. Thereby, the IC terminal 141
And the current flowing through the electrode 151 flows through a distance D2 longer than the shortest distance D1 between the terminals 161 and 162.

Since the conductive linear member 164 is inclined, the terminals 161 connected to the conductive linear member 164,
162 must also be installed in an inclined relationship to each other. For this reason, it is difficult to install a large number of terminals in a narrow range, and it is not possible to cope with recent high-frequency ICs.

FIG. 10 shows another example of an IC socket and an IC test head. The IC 170 is an IC
It is connected by a socket 190. IC socket 190
Comprises a support 191 and a probe pin 193. The probe pin 193 has terminals 194 and 195,
4 is connected to the IC 170, and the terminal 195 is connected to the electric circuit 180. The form of the IC 170 is a ball grid array, and the wiring of the electric circuit 180 is provided on the surface. Note that a support hole 192 is formed in the support 191, and the probe pin 193 is supported by inserting the probe pin 193 into the support hole 192.

FIG. 11 is a partially enlarged view of the probe pin 193. The IC terminal 171 of the IC 170 is connected to the terminal 194,
The electrode 181 of the electric circuit 180 is connected to the terminal 195. Therefore, the IC terminal 171 of the IC 170 and the electrode 181 of the electric circuit 180 are electrically connected. A coil spring 196 which is a conductor is provided inside the probe pin 192, and ends 197 and 198 of the coil spring 196 are connected to terminals 19.
4, 195. Because of its shape, the coil spring 196 can expand and contract to some extent, and can cope with a change in the distance between the IC 170 and the electric circuit 180. However, the length of the coil spring 196 is, of course, longer than the distance between the ends 197 and 198. Therefore, the IC terminal 171 and the electrode 18
1 will flow through a path between the ends 197, 198 that is longer than the distance between the ends 197, 198.

When an IC socket or an IC test head is used for an IC using a high-frequency voltage or current, the length of the portion through which the current flows cannot be ignored. High frequency means that the cycle is short, and if the length of the portion where the current flows is long, it takes a long time for the current to flow, and it cannot be ignored with respect to the length of the cycle.

Therefore, in an IC socket or an IC test head as shown in FIGS. 8 to 11, the length of a portion through which a current flows is longer than the shortest distance, and is used for an IC using a high-frequency voltage or current. In this case, adverse effects occur.

In order to cope with such a problem, it is conceivable to use a contact (rubber connector) disclosed in Japanese Patent Application Laid-Open No. 8-138779. In FIG.
Such a contact is shown. The IC socket 200 includes a laminated portion 203 in which silicon rubber 201 as a conductive elastic body and silicon rubber 202 as an insulating elastic body are alternately laminated. Since the laminated portion 203 has high hardness, the insulating silicon rubber 206 serving as a low-hardness insulating support member is provided on both side surfaces.
(204, 205) are joined, and the insulating silicon rubber 206 supports the laminated portion 203.

FIG. 13 shows a configuration in which an IC socket as shown in FIG. 12 is used for connection between electrodes. The IC socket 200 includes the electrode 211 of the electric circuit 210 and the electric circuit 22.
0 electrode 221 is electrically connected. That is, since the laminated portion 203 is in contact with the electrodes 211 and 221 while being supported by the insulating silicon rubbers 204 and 205,
221 are electrically connected. At this time, since the laminated portion 203 connects the electrodes 211 and 221 linearly, the current flowing between the electrodes 211 and 221 flows at the shortest distance.

[0014]

Here, the electric circuit 21
0 and the electric circuit 220 may be pressurized in the directions of the arrows to shorten the distance between the electrodes.

However, the laminated portion 20 of the IC socket 200
3 is difficult to compress because of its high hardness. That is, as shown in FIG. 13, the positions of the electric circuits cannot be brought close to each other so as to shorten the distance between the electrodes.

On the other hand, in the IC socket shown in FIGS. 8 to 11, the positions of the electric circuits can be brought closer to each other so as to shorten the distance between the electrodes. However, when the IC uses a high-frequency voltage or current, it has an adverse effect. Comes out.

Accordingly, the present invention provides an IC socket which can shorten the distance between electrodes by bringing electric circuits closer to each other, and which does not adversely affect even when a high-frequency voltage or current is used in an IC. Another object is to provide a contact of a test head used for IC inspection.

[0018]

According to a first aspect of the present invention, there is provided a contact for an electronic component for electrically connecting a pair of electrodes to each other, the contact having a thickness and a plurality of holes formed in a direction parallel to the thickness. Having an insulating property, an elastic body having elasticity, a conductive wire that passes through each hole in a straight line along a direction parallel to the thickness of the elastic body, and connected to both ends of the conductive wire to form an elastic body. The pair of pressure-contact portions that are sandwiched, and have conductivity, connect one of the pair of electrodes and one of the pair of pressure-contact portions, and connect the other of the pair of electrodes and the other of the pair of pressure-contact portions to have a conductivity. And a terminal portion.

Since the conductive member is passed through the hole in a straight line parallel to the thickness direction of the elastic body, the current flowing between the electrodes flows through the shortest distance in the conductive member. Therefore, the time during which the current flows in the conductive member can be shortened, so that there is no adverse effect even when a high-frequency voltage or current is used in the IC.

Further, the conductive wire is a wire and can bend when compressed in the vertical direction, and can cope with a change in the distance between the electrodes. Strictly, the current flowing between the electrodes does not flow the shortest distance in the conductive member, but the increase in the distance due to the bending is slight, and the current can be considered to flow almost the shortest distance. Therefore, it flows over a shorter distance than the conventional example.

Further, since a plurality of holes are provided and a conductive wire is passed through each hole, the electronic component contact can connect a plurality of sets of electrodes at a time, so that the function of the IC socket can be performed as it is.

According to a second aspect of the present invention, there is provided a contact for an electronic component for electrically connecting a pair of electrodes to each other, wherein the contact has a thickness and is formed with a single hole in parallel with the thickness direction. Having, an elastic body having elasticity, a conductive wire that passes through the hole linearly along a direction parallel to the thickness of the elastic body,
A pair of pressure-contact portions having conductivity are connected to both ends of the conductive wire, sandwiching the elastic body, and one of the pair of electrodes and one of the pair of pressure-contact portions are connected, and the other of the pair of electrodes and the pair of pressure-contact portions are connected. A plurality of paired terminal portions that are connected to each other and have conductivity.

Since the conductive member is passed through the hole in a straight line parallel to the thickness direction of the elastic body, the current flowing between the electrodes flows through the shortest distance in the conductive member. Therefore, the time during which the current flows in the conductive member can be shortened, so that there is no adverse effect even when a high-frequency voltage or current is used in the IC.

Further, the conductive wire is a wire and can bend when compressed in the vertical direction, and can cope with a change in the distance between the electrodes. Strictly, the current flowing between the electrodes does not flow the shortest distance in the conductive member, but the increase in the distance due to the bending is slight, and the current can be considered to flow almost the shortest distance. Therefore, it flows over a shorter distance than the conventional example.

Further, since one hole is provided, and the conductive wire is passed through the hole, the electronic component contacts are provided for each pair of terminal portions. Therefore, the electronic component contacts are exchanged one by one. Convenience that can be achieved.

According to a third aspect of the present invention, in the electronic component contact according to the first or second aspect, the conductive wire is a bundle of metal wires.

Since a metal such as copper is often used as the electric wire, it is convenient to make the conductive wire a metal.
In addition, since the wires are bundled, current can still flow even if a part of the wires is cut.

According to a fourth aspect of the present invention, in the electronic component contact of the third aspect, the metal wire is thin enough to bend according to the compression of the elastic body in the thickness direction.

According to a fifth aspect of the present invention, in the contact for an electronic component according to the third or fourth aspect, the bundle of metal wires is twisted.

[0030]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 shows a contact for an electronic component according to a first embodiment of the present invention. The electronic component contact 1 includes a silicon rubber sheet 10, a hole 20, a metal wire 30, a press contact portion 40,
41 and terminal portions 50 and 51. The silicone rubber sheet 10 has elasticity, and has a hole 20 in the thickness direction (the direction indicated by the arrow). The silicon rubber sheet 10 is an insulator because silicon rubber is used as a material. The metal wire 30 is passed through the hole 20 along the thickness direction of the silicon rubber sheet 10. The metal wire 30
Is made of, for example, copper and has conductivity. Furthermore, the metal wire 30 is thin enough to be able to bend against vertical compression. The metal wires 30 are bundled. The press contact portions 40 and 41 are connected to both ends of the metal wire 30 by press contact, and sandwich the silicon rubber sheet 10. The press contact portions 40 and 41 have conductivity. The terminal portions 50 and 51 connect the electrodes to which the electronic component contact 1 is to be connected and the press contact portions 40 and 41, respectively.
It has conductivity. The silicon rubber sheet 10 has holes 2
The metal wire 30 is passed through each of the holes 20, and the press contact portions 40 and 41 are inserted into the metal wire 30.
Are connected, and the terminal portions 50, 5 are connected to the press contact portions 40, 41.
1 is connected. Metal wire 30, press-contact parts 40, 41
When a set of the terminal portions 50 and 51 is referred to as a contact portion, a plurality of contact portions are provided.

FIG. 2 shows a configuration when the contact for an electronic component according to the first embodiment of the present invention is used for connecting electrodes. In FIG. 2, the terminal portion 50 of the electronic component contact 1 is shown.
Is connected to an IC terminal 61 which is an electrode of the IC 60. The terminal part 51 of the electronic component contact 1 is connected to the electrode 71 of the electric circuit 70.
Is connected to Thereby, the IC 60 and the electric circuit 70
Are connected by the electronic component contact 1.

In the electronic component contact according to the first embodiment of the present invention, since the metal wire 30 is passed through the hole 20 in parallel with the thickness direction of the silicon rubber sheet 10, the IC terminal 61 The current flowing between the electrodes 71 flows through the shortest distance in the metal wire 30. Therefore,
Since the time during which the current flows in the metal wire 30 can be shortened, there is no adverse effect even when a high-frequency voltage or current is used in the IC.

Further, the metal wire 30 is a wire and can bend when compressed in the vertical direction, and can cope with a change in the distance between the IC terminal 61 and the electrode 71. When the current is bent, the current flowing between the IC terminal 61 and the electrode 71 does not flow through the shortest distance in the metal wire 30. However, the increase in the distance due to the bending is slight, and the current is considered to flow almost the shortest distance. Can be. Therefore, it flows over a shorter distance than the conventional example. 1 and 2, the metal wire 30 is shown in a slightly bent state, but the length of the metal wire 30 is longer than that of the conductive linear body 164 shown in FIG. 9 or the coil spring 196 shown in FIG. Obviously short. This also indicates that the current flows a shorter distance than the conventional example.

Further, since a plurality of holes 20 are formed and a plurality of contact portions are provided, the provision of the plurality of contact portions allows the electronic component contact 1 to connect a plurality of sets of electrodes at one time. , Can play the role of the IC socket as it is. Moreover, since the metal wires 30 are bundled, current can still flow even if a part is cut.

FIG. 3 shows a contact for an electronic component according to a second embodiment of the present invention. The electronic component contact 1 includes a silicone rubber sealing material 11, a hole 20, a metal wire 30, a pressure contact portion 40,
41 and terminal portions 50 and 51. The silicone rubber sealing material 11 has elasticity, and has a hole 20 in the thickness direction (the direction indicated by the arrow). Note that the silicone rubber sealing material 11 surrounds the metal wire 30. The silicon rubber sealing material 11 has only one hole 20 unlike the first embodiment. When a set of the metal wire 30, the press contact portions 40 and 41, and the terminal portions 50 and 51 is referred to as a contact portion,
One contact portion will be provided. The configuration of other parts is the same as that of the first embodiment.

FIG. 4 shows a configuration when a contact for an electronic component according to a second embodiment of the present invention is used for connecting electrodes. In FIG. 4, the terminal portion 50 of the electronic component contact 1 is shown.
Is connected to an IC terminal 61 which is an electrode of the IC 60. The terminal part 51 of the electronic component contact 1 is connected to the electrode 71 of the electric circuit 70.
Is connected to Thereby, the IC 60 and the electric circuit 70
Are connected by the electronic component contact 1. The electronic component contact 1 is supported by a support hole 81 formed in the support 80. A plurality of support holes 81 are provided, and if the electronic component contact 1 is inserted into each of the support holes 81, the overall I
Performs the function of a C socket.

In the contact for an electronic component according to the second embodiment of the present invention, since the metal wire 30 is passed through the hole 20 in parallel with the thickness direction of the silicon rubber sealing material 11, the IC terminal The current flowing between 61 and the electrode 71 flows through the shortest distance in the metal wire 30. Therefore,
Since the time during which the current flows in the metal wire 30 can be shortened, there is no adverse effect even when a high-frequency voltage or current is used in the IC.

The metal wire 30 is a wire and can bend when compressed in the vertical direction, and can cope with a change in the distance between the IC terminal 61 and the electrode 71. When the current is bent, the current flowing between the IC terminal 61 and the electrode 71 does not flow through the shortest distance in the metal wire 30. However, the increase in the distance due to the bending is slight, and the current is considered to flow almost the shortest distance. Can be. Therefore, it flows over a shorter distance than the conventional example. 3 and 4, the metal wire 30 is shown in a slightly bent state, but the length of the metal wire 30 is longer than that of the conductive wire 164 shown in FIG. 9 or the coil spring 196 shown in FIG. Obviously short. This also indicates that the current flows a shorter distance than the conventional example.

In addition, the provision of one contact portion provides convenience such that when the electronic component contact 1 is replaced due to a failure or the like, only the electronic component contact 1 that needs to be replaced can be replaced. .

Since the metal wires 30 are bundled, current can still flow even if a part is cut.

The metal wire 30 of the contact for electronic parts according to the first and second embodiments of the present invention is shown in FIGS.
As shown in FIG. 1, a twisted metal wire 90 may be used. An electronic component contact having such a metal wire 90 is arranged between the IC and the electric circuit, and the electronic component contact when the IC is pressed in the direction of the electric circuit to electrically connect the IC to the electric circuit. The operation of the child will be described.

When the IC is pressed in the direction of the electric circuit, the silicon rubber sheet 10 of the electronic component contact is compressed in the thickness direction because it has elasticity. Therefore, the twisted metal wire 90 is untwisted, and the terminal 50 connected to the metal wire 90 rotates.

In an IC terminal of a BGA type or FBGA type IC formed from a solder ball or the like, an oxide film is formed on the surface of the solder ball, and therefore, when connected to an electric circuit via an IC socket or the like, the efficiency is increased. The problem is that good electrical connections cannot be made. However, when the electronic component contact having the twisted metal wire 90 is used as described above, the rotation of the terminal portion 50 rubs the IC terminal of the IC and removes the oxide film formed on the IC terminal. Benefits arise.

[0045]

According to the first aspect of the present invention, since the conductive member passes through the hole in a straight line parallel to the thickness direction of the elastic body, the current flowing between the electrodes is reduced by the conductive member. It will flow the shortest distance. Therefore, the time during which the current flows in the conductive member can be shortened, so that there is no adverse effect even when a high-frequency voltage or current is used in the IC. In addition, the conductive wire is a wire and can bend when compressed in the vertical direction, and can cope with a change in the distance between the electrodes. When bent, the current flowing between the electrodes does not flow through the shortest distance in the conductive member,
The increase in distance due to deflection is small, and the current can be considered to flow almost the shortest distance. Therefore, it flows over a shorter distance than the conventional example. Furthermore, since a plurality of holes are provided and a conductive wire is passed through each of the holes, the electronic component contact can connect a plurality of sets of electrodes at a time, so that the function of the IC socket can be performed as it is.

According to the second aspect of the present invention, since the conductive member passes through the hole in a straight line parallel to the thickness direction of the elastic body, the current flowing between the electrodes is shortest in the conductive member. Will flow. Therefore, the time during which the current flows in the conductive member can be shortened, so that there is no adverse effect even when a high-frequency voltage or current is used in the IC. In addition, the conductive wire is a wire and can bend when compressed in the vertical direction, and can cope with a change in the distance between the electrodes. When the current is bent, the current flowing between the electrodes does not flow through the shortest distance in the conductive member, but the increase in the distance due to the deflection is small, and the current can be considered to flow almost the shortest distance. Therefore, it flows over a shorter distance than the conventional example. In addition, since a single hole is provided and a conductive wire is passed through the hole, a contact for electronic components is provided for each pair of terminals, so that the contacts for electronic components can be replaced one by one. Can be achieved.

According to the third aspect of the present invention, since metal such as copper is often used as the electric wire, it is convenient to use a metal as the conductive wire, and the wire is bundled. Even if a part of the wire is cut, current can still flow.

According to the fourth aspect of the present invention, since the metal wire is thin enough to bend in accordance with the compression of the elastic body, the electronic component contact is pressed to connect the IC to the electric circuit. At the time of the change in the distance between the IC and the electric circuit.

According to the fifth aspect of the present invention, since the bundle of the conductive wires is twisted, the contact for the electronic component is formed by an IC.
When it is compressed when connecting the electric circuit, the twist of the bundle of conductive wires is removed and the terminal connected to the IC rotates, so that the oxide film of the IC terminal can be removed.
The current can flow more efficiently.

[Brief description of the drawings]

FIG. 1 is a partial cross-sectional view of a contact for an electronic component according to a first embodiment of the present invention.

FIG. 2 is a partial cross-sectional view of the electronic component contact when the electronic component contact according to the first embodiment of the present invention is used for connecting electrodes.

FIG. 3 is a partial cross-sectional view of a contact for an electronic component according to a second embodiment of the present invention.

FIG. 4 is a partial cross-sectional view of a contact for an electronic component when the contact for an electronic component according to the second embodiment of the present invention is used for connecting electrodes.

FIG. 5 is a partial cross-sectional view of a modification of the electronic component contact according to the first embodiment of the present invention.

FIG. 6 is a partial cross-sectional view of a modification of the electronic component contact according to the second embodiment of the present invention.

FIG. 7 is a perspective view showing a form of a package for protecting an IC chip.

FIG. 8 is a front view of an example of a conventional IC socket or IC test head.

FIG. 9 is a partially enlarged view of an example of a conventional IC socket or IC test head.

FIG. 10 is a front view of another example of a conventional IC socket or IC test head.

FIG. 11 is a partially enlarged view of another example of a conventional IC socket or IC test head.

FIG. 12 is a perspective view of a conventional contact (rubber connector).

FIG. 13 is a partially enlarged view of an IC socket and an IC test head of a contact (rubber connector) when a conventional contact (rubber connector) is used for an IC socket and an IC test head.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Contact for electronic components 10 Silicon rubber sheet 20 Hole 30, 90 Metal wire 40, 41 Pressure contact part 50, 51 Terminal part 60 IC 61 IC terminal 70 Electric circuit 71 Electrode 80 Support 81 Support hole 110, 120, 130 IC 131 Package 132 IC terminal 140 IC 141 IC terminal 150 Electric circuit 151 Electrode 160 IC socket 161, 162 terminal 163 Conductive rubber 164 Conductive linear body 170 IC 171 IC terminal 180 Electric circuit 181 Electrode 190 IC socket 191 Support 192 Support hole 193 Probe pin 194, 195 Terminal 196 Coil spring 197, 198 End

Claims (5)

[Claims] 1. A contact for an electronic component for electrically connecting a pair of electrodes to each other, the contact having a thickness, a plurality of holes formed in parallel with the thickness direction, an insulating property, and an elasticity. An elastic body, a conductive wire that linearly passes through each of the holes along a direction parallel to the thickness of the elastic body, and is connected to both ends of the conductive wire, sandwiches the elastic body, and has conductivity. A pair of pressure contact portions, a pair of terminals having a conductive property by connecting one of the pair of electrodes and one of the pair of pressure contact portions, and connecting the other of the pair of electrodes and the other of the pair of press contact portions; And a contact for an electronic component. 2. A contact for an electronic component for electrically connecting a pair of electrodes to each other, the contact having a thickness, a hole being made in parallel with the thickness direction, an insulating property, and an elasticity. An elastic body, a conductive wire that passes straight through the hole along a direction parallel to the thickness of the elastic body, and a pair of conductive wires that are connected to both ends of the conductive wire, sandwich the elastic body, and have conductivity. A press-contact portion, a pair of conductive terminal portions that connect one of the pair of electrodes and one of the pair of press-contact portions, connect the other of the pair of electrodes and the other of the pair of press-contact portions, and A contact for an electronic component, comprising: 3. The contact according to claim 1, wherein the conductive wire is a bundle of metal wires. 4. The electronic component contact according to claim 3, wherein the metal wire is thin enough to bend in accordance with the compression of the elastic body in the thickness direction. 5. The contact according to claim 3, wherein the bundle of metal wires is twisted.