JPH11274018A5 - - Google Patents

Info

Publication number
JPH11274018A5
JPH11274018A5 JP1998288008A JP28800898A JPH11274018A5 JP H11274018 A5 JPH11274018 A5 JP H11274018A5 JP 1998288008 A JP1998288008 A JP 1998288008A JP 28800898 A JP28800898 A JP 28800898A JP H11274018 A5 JPH11274018 A5 JP H11274018A5
Authority
JP
Japan
Prior art keywords
substrate
composite member
separating
layer
crystal semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP1998288008A
Other languages
English (en)
Japanese (ja)
Other versions
JPH11274018A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP28800898A priority Critical patent/JPH11274018A/ja
Priority claimed from JP28800898A external-priority patent/JPH11274018A/ja
Publication of JPH11274018A publication Critical patent/JPH11274018A/ja
Publication of JPH11274018A5 publication Critical patent/JPH11274018A5/ja
Withdrawn legal-status Critical Current

Links

JP28800898A 1998-10-09 1998-10-09 複合部材の分離方法および半導体基体の作製方法 Withdrawn JPH11274018A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP28800898A JPH11274018A (ja) 1998-10-09 1998-10-09 複合部材の分離方法および半導体基体の作製方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP28800898A JPH11274018A (ja) 1998-10-09 1998-10-09 複合部材の分離方法および半導体基体の作製方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP7734798A Division JP2877800B2 (ja) 1997-03-27 1998-03-25 複合部材の分離方法、分離された部材、分離装置、半導体基体の作製方法および半導体基体

Publications (2)

Publication Number Publication Date
JPH11274018A JPH11274018A (ja) 1999-10-08
JPH11274018A5 true JPH11274018A5 (2) 2005-09-08

Family

ID=17724619

Family Applications (1)

Application Number Title Priority Date Filing Date
JP28800898A Withdrawn JPH11274018A (ja) 1998-10-09 1998-10-09 複合部材の分離方法および半導体基体の作製方法

Country Status (1)

Country Link
JP (1) JPH11274018A (2)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003017668A (ja) * 2001-06-29 2003-01-17 Canon Inc 部材の分離方法及び分離装置
FR2906933B1 (fr) * 2006-10-06 2009-02-13 Commissariat Energie Atomique Dispositif de separation d'une structure empilee et procede associe
JP5249511B2 (ja) * 2006-11-22 2013-07-31 信越化学工業株式会社 Ｓｏｑ基板およびｓｏｑ基板の製造方法
JP5617065B2 (ja) * 2011-09-09 2014-11-05 東京エレクトロン株式会社 剥離方法、プログラム、コンピュータ記憶媒体及び剥離システム

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