JPH11274778A5 - - Google Patents

Info

Publication number
JPH11274778A5
JPH11274778A5 JP1998074063A JP7406398A JPH11274778A5 JP H11274778 A5 JPH11274778 A5 JP H11274778A5 JP 1998074063 A JP1998074063 A JP 1998074063A JP 7406398 A JP7406398 A JP 7406398A JP H11274778 A5 JPH11274778 A5 JP H11274778A5
Authority
JP
Japan
Prior art keywords
heat
working fluid
plate
section
heat sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
JP1998074063A
Other languages
English (en)
Japanese (ja)
Other versions
JPH11274778A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP7406398A priority Critical patent/JPH11274778A/ja
Priority claimed from JP7406398A external-priority patent/JPH11274778A/ja
Publication of JPH11274778A publication Critical patent/JPH11274778A/ja
Publication of JPH11274778A5 publication Critical patent/JPH11274778A5/ja
Abandoned legal-status Critical Current

Links

JP7406398A 1998-03-23 1998-03-23 電子機器用放熱器 Abandoned JPH11274778A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7406398A JPH11274778A (ja) 1998-03-23 1998-03-23 電子機器用放熱器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7406398A JPH11274778A (ja) 1998-03-23 1998-03-23 電子機器用放熱器

Publications (2)

Publication Number Publication Date
JPH11274778A JPH11274778A (ja) 1999-10-08
JPH11274778A5 true JPH11274778A5 (2) 2005-09-08

Family

ID=13536372

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7406398A Abandoned JPH11274778A (ja) 1998-03-23 1998-03-23 電子機器用放熱器

Country Status (1)

Country Link
JP (1) JPH11274778A (2)

Similar Documents

Publication Publication Date Title
US7044199B2 (en) Porous media cold plate
JP7649604B2 (ja) 三次元空間で熱を方向付けるためのサーマル・インターフェース・マテリアル構造体
US7826225B2 (en) Expansion tank device, process for fabricating expansion tank device, and liquid cooling radiator
CN101193534A (zh) 散热装置
JP3041447B2 (ja) 携帯型電子機器用放熱器
JP4533725B2 (ja) 膨張タンク装置、膨張タンク装置の製造方法および液冷式放熱装置
JP4217317B2 (ja) 板状熱交換器およびその製造方法
CN2770090Y (zh) 散热装置
JP4521250B2 (ja) 放熱装置およびその製造方法
CN100432589C (zh) 膨胀箱装置,制造膨胀箱装置的方法以及液冷式散热器
CN100402965C (zh) 热管散热器组件及其制造方法
JP2007250701A (ja) 電子機器用冷却装置
JPH11274778A (ja) 電子機器用放熱器
CN114666968B (zh) 电路散热模块及电路板结构
TWI757040B (zh) 電路散熱模組及電路板結構
JPH0727634Y2 (ja) 空冷フィン構造
TWI331270B (en) Expansion tank device, process for fabricating expansion tank device, and liquid cooling radiator
TWI305132B (2)
JP4663440B2 (ja) 液冷式放熱装置
TWI755247B (zh) 電路板結構及其製造方法
CN2907191Y (zh) 具有致冷芯片的散热器
JP2000022374A5 (2)
CN111263506B (zh) 一种电路板及电子设备
JP2000022367A5 (2)
JP2000132280A (ja) 携帯型電子機器用放熱装置