JPH11279261A5 - - Google Patents
Info
- Publication number
- JPH11279261A5 JPH11279261A5 JP1998087062A JP8706298A JPH11279261A5 JP H11279261 A5 JPH11279261 A5 JP H11279261A5 JP 1998087062 A JP1998087062 A JP 1998087062A JP 8706298 A JP8706298 A JP 8706298A JP H11279261 A5 JPH11279261 A5 JP H11279261A5
- Authority
- JP
- Japan
- Prior art keywords
- weight
- epoxy resin
- parts
- bisphenol
- type
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8706298A JPH11279261A (ja) | 1998-03-31 | 1998-03-31 | 繊維強化複合材料用耐熱性エポキシ樹脂組成物 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8706298A JPH11279261A (ja) | 1998-03-31 | 1998-03-31 | 繊維強化複合材料用耐熱性エポキシ樹脂組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH11279261A JPH11279261A (ja) | 1999-10-12 |
| JPH11279261A5 true JPH11279261A5 (fr) | 2005-09-15 |
Family
ID=13904464
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8706298A Pending JPH11279261A (ja) | 1998-03-31 | 1998-03-31 | 繊維強化複合材料用耐熱性エポキシ樹脂組成物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH11279261A (fr) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| ES2281412T3 (es) | 2000-04-21 | 2007-10-01 | Mitsubishi Rayon Co., Ltd. | Composicion de resina epoxi y prepreg fabricado con la composicion de resina epoxi. |
| JP4583563B2 (ja) * | 2000-08-29 | 2010-11-17 | 三菱レイヨン株式会社 | 繊維強化樹脂製管状体 |
| JP4553595B2 (ja) * | 2004-01-29 | 2010-09-29 | 株式会社有沢製作所 | プリプレグ用樹脂組成物およびこれを用いたプリプレグ |
| US7270845B2 (en) * | 2004-03-31 | 2007-09-18 | Endicott Interconnect Technologies, Inc. | Dielectric composition for forming dielectric layer for use in circuitized substrates |
| JP4687224B2 (ja) * | 2004-04-23 | 2011-05-25 | 東レ株式会社 | エポキシ樹脂組成物、プリプレグおよび繊維強化複合材料 |
| JP4743824B2 (ja) * | 2004-06-10 | 2011-08-10 | 日本化薬株式会社 | 液状エポキシ樹脂、エポキシ樹脂組成物及びその硬化物 |
| JP5057714B2 (ja) * | 2006-07-07 | 2012-10-24 | 三菱レイヨン株式会社 | 繊維強化複合材料用エポキシ樹脂組成物および繊維強化複合材料中間体 |
| KR101911861B1 (ko) * | 2016-11-24 | 2018-10-29 | 한국기계연구원 | 탄소섬유 강화 고분자 복합재료용 계면 접착력 강화 조성물, 이를 적용한 복합재료 및 이의 제조방법 |
-
1998
- 1998-03-31 JP JP8706298A patent/JPH11279261A/ja active Pending
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