JPH1128432A - Ultrasonic cleaning machine - Google Patents

Ultrasonic cleaning machine

Info

Publication number
JPH1128432A
JPH1128432A JP18626397A JP18626397A JPH1128432A JP H1128432 A JPH1128432 A JP H1128432A JP 18626397 A JP18626397 A JP 18626397A JP 18626397 A JP18626397 A JP 18626397A JP H1128432 A JPH1128432 A JP H1128432A
Authority
JP
Japan
Prior art keywords
ultrasonic
cleaning
focusing
slit
horn
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18626397A
Other languages
Japanese (ja)
Inventor
Yoshihiro Moriguchi
善弘 森口
Fujio Maeda
富士男 前田
Noriyuki Shige
則幸 重
Masahiro Watanabe
正博 渡辺
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP18626397A priority Critical patent/JPH1128432A/en
Publication of JPH1128432A publication Critical patent/JPH1128432A/en
Pending legal-status Critical Current

Links

Landscapes

  • Apparatuses For Generation Of Mechanical Vibrations (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)

Abstract

(57)【要約】 【課題】少なくとも超音波発振器と超音波振動子と洗浄
液で満たされた超音波集束ホーンとから構成される超音
波洗浄機において、発振周波数が500kHz以上であ
り、超音波振動子が2枚から構成され、2枚の振動子が
超音波集束ホーンのスリット状出口部分で焦点が合うよ
うに配置されたことを特徴とした超音波洗浄機。精密電
子部品の超音波洗浄において、10〜0.1ミクロン程
度の微粒子を効率良く除去して、製品歩留まりを向上す
る。 【解決手段】発振周波数が500kHz以上の超音波振
動子を使用して、微粒子洗浄に適した超音波洗浄機およ
び前記洗浄機を使用した洗浄装置を開発した。
(57) Abstract: An ultrasonic cleaning machine comprising at least an ultrasonic oscillator, an ultrasonic vibrator, and an ultrasonic focusing horn filled with a cleaning liquid, has an oscillation frequency of 500 kHz or more, An ultrasonic cleaner comprising two transducers, wherein two transducers are arranged so as to be focused at a slit-shaped exit portion of an ultrasonic focusing horn. In ultrasonic cleaning of precision electronic parts, fine particles of about 10 to 0.1 micron are efficiently removed to improve product yield. The present invention has developed an ultrasonic cleaner suitable for fine particle cleaning using an ultrasonic oscillator having an oscillation frequency of 500 kHz or more, and a cleaning apparatus using the cleaner.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は超音波洗浄方法およ
び超音波洗浄機にかかるものであり、電子部品とくに磁
気ディスク、半導体ウェハ、液晶などの基板の洗浄に関
する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an ultrasonic cleaning method and an ultrasonic cleaning machine, and more particularly to cleaning of electronic components, particularly substrates such as magnetic disks, semiconductor wafers, and liquid crystals.

【0002】[0002]

【従来の技術】例えば特開平1−105376や特開平
1−303724に記載される従来の超音波洗浄、特に
高周波領域における超音波洗浄では、投入電力−超音波
出力(強度)の変換効率が低く、ユースポイントにおけ
る超音波出力(強度)が低いために高周波超音波洗浄が
有する洗浄効果を十分に引き出すことができず、微粒子
の残留などの洗浄不良が発生した。
2. Description of the Related Art In conventional ultrasonic cleaning described in, for example, JP-A-1-105376 and JP-A-1-303724, particularly in ultrasonic cleaning in a high-frequency region, the conversion efficiency of input power-ultrasonic output (intensity) is low. However, since the ultrasonic output (strength) at the point of use was low, the cleaning effect of the high-frequency ultrasonic cleaning could not be sufficiently brought out, and cleaning defects such as residual fine particles occurred.

【0003】[0003]

【発明が解決しようとする課題】磁気ディスク、半導体
ウェハ、液晶などに代表される電子部品において、製品
の歩留まりに大きく影響を及ぼし管理しなけれはならな
い微粒子サイズは10〜0.1ミクロン程度である。本
発明は従来技術では除去できなかったこれらの微粒子を
効率良く除去し、微粒子残留による洗浄不良を低減する
ことにある。
In electronic parts typified by magnetic disks, semiconductor wafers, liquid crystals, etc., the particle size that greatly affects the product yield and must be controlled is about 10 to 0.1 microns. . An object of the present invention is to efficiently remove these fine particles that could not be removed by the conventional technique, and to reduce poor cleaning due to residual fine particles.

【0004】[0004]

【課題を解決するための手段】高周波超音波洗浄におい
て、数ミクロン〜サブミクロンの微粒子を効率良く除去
するために、発振周波数を500kHz以上にしたうえ
で超音波出力(超音波強度)の向上を可能にする超音波
洗浄機の構成および構造を考案することで課題を達成し
た。
In the high-frequency ultrasonic cleaning, the oscillation frequency is set to 500 kHz or more and the ultrasonic output (ultrasonic intensity) is improved in order to efficiently remove fine particles of several microns to submicron. The task was achieved by devising the configuration and structure of an ultrasonic cleaning machine that makes it possible.

【0005】[0005]

【発明の実施の形態】以下、本発明の一実施例を図面に
基づいて詳述する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below in detail with reference to the drawings.

【0006】(実施例1)図1は本発明の一実施例に係
る超音波洗浄機の構成図である。超音波洗浄機は超音波
発振器1、2枚の超音波発振子を内蔵する超音波発振子
ケース2、スリット状出口部分3を有する超音波集束ホ
ーン4とから構成される。超音波発振器1と超音波発振
子ケース2とはケーブル5で接続されている。超音波集
束ホーン4の内部は水槽6に満たされる洗浄液7aと同
一の洗浄液7bで満たされている。500kHz以上の
超音波を発振すると、高周波超音波が超音波集束ホーン
4内の洗浄液7bを伝播して被洗浄物8を洗浄する。
(Embodiment 1) FIG. 1 is a configuration diagram of an ultrasonic cleaner according to an embodiment of the present invention. The ultrasonic washer comprises an ultrasonic oscillator 1, an ultrasonic oscillator case 2 containing two ultrasonic oscillators, and an ultrasonic focusing horn 4 having a slit-shaped outlet portion 3. The ultrasonic oscillator 1 and the ultrasonic oscillator case 2 are connected by a cable 5. The inside of the ultrasonic focusing horn 4 is filled with the same cleaning liquid 7 b as the cleaning liquid 7 a that is filled in the water tank 6. When an ultrasonic wave having a frequency of 500 kHz or more is oscillated, the high-frequency ultrasonic wave propagates through the cleaning liquid 7b in the ultrasonic focusing horn 4 to clean the object 8 to be cleaned.

【0007】(実施例2)図2は本発明の一実施例に係
る超音波発振子ケースの側面断面図である。図1で示し
た超音波発振子ケース2の内部は、超音波発振子9 2
枚から構成され、各々の超音波発振子9の焦点が合う、
すなわち振動子面の垂直二等分の延長線上にスリット状
出口部分3が位置するように配置した。この配置によっ
て、超音波発振子9を同一平面上に一列に並べて配置し
たときより200%以上の超音波出力(強度)の向上を
確認できた。
Embodiment 2 FIG. 2 is a side sectional view of an ultrasonic oscillator case according to one embodiment of the present invention. The inside of the ultrasonic oscillator case 2 shown in FIG.
Each ultrasonic oscillator 9 is in focus,
That is, the slit-shaped outlet portion 3 was arranged so as to be located on an extension line of the bisector perpendicular to the surface of the vibrator. With this arrangement, it was confirmed that the ultrasonic output (strength) was improved by 200% or more than when the ultrasonic oscillators 9 were arranged in a line on the same plane.

【0008】(実施例3)図3は超音波発振子の多数枚
化による超音波出力(強度)のアップと効率の比較結果
である。多数枚化するに従い、超音波出力(強度)の向
上が頭打ちになり、効率が下がる。さらに、効率の下が
った条件では超音波振動子9への入力電流の上昇がみら
れ、場合によっては過負荷により破損することになる。
一方、超音波振動子9の枚数が2枚、かつスリット状出
口部分3で焦点が合う配置を行うことにより、超音波振
動子9への入力電流の上昇を低減し、超音波振動子の破
損を防ぐことが可能となった。すべての実施例で超音波
発振器1の台数を特に定めていないが、1台の発振器で
2枚超音波振動子9を駆動する、2枚の超音波振動子を
各々別の超音波発振器で駆動する、いずれの方法を用い
ても構わない。
(Embodiment 3) FIG. 3 shows a comparison between efficiency and efficiency of ultrasonic output by increasing the number of ultrasonic oscillators. As the number of sheets increases, the improvement in ultrasonic output (intensity) reaches a plateau, and the efficiency decreases. Further, under the condition that the efficiency is lowered, the input current to the ultrasonic vibrator 9 increases, and in some cases, the ultrasonic vibrator 9 is damaged by overload.
On the other hand, by arranging two ultrasonic vibrators 9 and focusing on the slit-shaped exit portion 3, an increase in the input current to the ultrasonic vibrator 9 is reduced, and the ultrasonic vibrator is damaged. It became possible to prevent. Although the number of the ultrasonic oscillators 1 is not particularly defined in all the embodiments, one ultrasonic oscillator 9 is driven by one oscillator. Two ultrasonic oscillators are driven by different ultrasonic oscillators. , Any of these methods may be used.

【0009】(実施例4)図4は本発明の一実施例に係
る超音波洗浄機の側面断面図である。図4の左部分をA
方向から見た拡大図が図4の円内である。B寸法をスリ
ット長辺、C寸法をスリット短辺を示す。図5はスリッ
ト短辺の距離(C寸法)と超音波出力(強度)との関係
の調査結果である。グラフが示すようにスリット短辺を
2mm未満にすると、スリット状出口部分3から出る超音
波出力(強度)が激減するためスリット短辺を2mm以上
に設定した。
(Embodiment 4) FIG. 4 is a side sectional view of an ultrasonic cleaner according to an embodiment of the present invention. A in the left part of FIG.
The enlarged view seen from the direction is within the circle in FIG. The dimension B indicates the long side of the slit, and the dimension C indicates the short side of the slit. FIG. 5 shows the results of an investigation on the relationship between the distance (C dimension) of the short side of the slit and the ultrasonic output (intensity). As shown in the graph, when the short side of the slit is less than 2 mm, the ultrasonic output (intensity) emitted from the slit-shaped outlet portion 3 is drastically reduced. Therefore, the short side of the slit is set to 2 mm or more.

【0010】(実施例5)図6は本発明の一実施例に係
る超音波洗浄機の側面断面図である。超音波振動子9か
らスリット状出口部分3までの距離をD寸法とし、超音
波集束ホーン4のスリット状出口部分3でなす角をEと
する。発振周波数が500kHz〜1.5MHzにおい
て、D寸法が超音波出力(強度)に及ぼす影響を調査し
た。図7はD寸法と超音波出力(強度)との関係の調査
結果である。調査の結果、D寸法を80〜220mmにす
ることで高く安定な超音波出力を得ることが可能となっ
た。図8は超音波集束ホーンのスリット状出口部分でな
す角Eと超音波出力(強度)との関係の調査結果であ
る。超音波集束ホーン4のスリット状出口部分3でなす
角Eが35°を超えると超音波出力(強度)が減少し、
超音波振動子9への入力電流が増大し、超音波発振子9
を破損する可能性が生じた。しかし、超音波集束ホーン
4のスリット状出口部分3でなす角Eを35°以下にす
ることで超音波振動子9への入力電流の増大を防ぎ、超
音波振動子9の破損を防ぐことが可能となる。
(Embodiment 5) FIG. 6 is a side sectional view of an ultrasonic cleaner according to an embodiment of the present invention. The distance from the ultrasonic vibrator 9 to the slit-shaped outlet portion 3 is D, and the angle formed by the slit-shaped outlet portion 3 of the ultrasonic focusing horn 4 is E. At an oscillation frequency of 500 kHz to 1.5 MHz, the influence of the D dimension on the ultrasonic output (strength) was investigated. FIG. 7 shows the results of an investigation on the relationship between the D dimension and the ultrasonic output (intensity). As a result of the investigation, it was possible to obtain a high and stable ultrasonic output by setting the D dimension to 80 to 220 mm. FIG. 8 shows the results of an investigation on the relationship between the angle E formed at the slit-shaped exit portion of the ultrasonic focusing horn and the ultrasonic output (intensity). When the angle E formed by the slit-shaped exit portion 3 of the ultrasonic focusing horn 4 exceeds 35 °, the ultrasonic output (intensity) decreases,
The input current to the ultrasonic oscillator 9 increases, and the ultrasonic oscillator 9
Could be damaged. However, by setting the angle E formed by the slit-shaped exit portion 3 of the ultrasonic focusing horn 4 to 35 ° or less, it is possible to prevent the input current to the ultrasonic vibrator 9 from increasing and to prevent the ultrasonic vibrator 9 from being damaged. It becomes possible.

【0011】(実施例6)図9は本発明の一実施例に係
る超音波洗浄機の構成図である。超音波発振器1、超音
波振動子ケース2、超音波集束ホーン4内に洗浄液を供
給する洗浄液供給配管10から構成された超音波洗浄機
を水槽6内に設置した使用例である。本実施例では高周
波超音波により発生する直進流に洗浄液供給配管10か
らの水流が加わったものである。これによって、被洗浄
物8から脱離した微粒子、異物を取り去る効果が付与さ
れることになり、より再付着が防止され洗浄性の向上を
図れる。
(Embodiment 6) FIG. 9 is a configuration diagram of an ultrasonic cleaner according to an embodiment of the present invention. This is an example of use in which an ultrasonic cleaning machine including an ultrasonic oscillator 1, an ultrasonic transducer case 2, and a cleaning liquid supply pipe 10 for supplying a cleaning liquid into an ultrasonic focusing horn 4 is installed in a water tank 6. In this embodiment, a water flow from the cleaning liquid supply pipe 10 is added to a straight flow generated by high-frequency ultrasonic waves. As a result, an effect of removing fine particles and foreign matter detached from the object to be cleaned 8 is imparted, so that re-adhesion is further prevented and cleaning performance is improved.

【0012】(実施例7)図9の実施例では洗浄液供給
配管10が超音波集束ホーン4の上方に配置し、洗浄液
を上方から供給しているが図10本発明の一実施例に係
る超音波洗浄機の構成図にあるように、洗浄液供給配管
10を超音波集束ホーン4の下方に配置し、洗浄液を下
方から供給しても構わない。
(Embodiment 7) In the embodiment of FIG. 9, the cleaning liquid supply pipe 10 is disposed above the ultrasonic focusing horn 4 to supply the cleaning liquid from above. As shown in the configuration diagram of the ultrasonic cleaner, the cleaning liquid supply pipe 10 may be disposed below the ultrasonic focusing horn 4 and the cleaning liquid may be supplied from below.

【0013】(実施例8)図11は本発明の一実施例に
係る超音波洗浄機の構成図である。超音波発振器1、超
音波発振子ケース2、超音波集束ホーン4および超音波
集束ホーン内に洗浄液を供給する洗浄液供給配管10か
ら構成される。本実施例では超音波洗浄機の機能部を水
槽の外に取り出したケースである。洗浄液供給配管10
に洗浄液が供給し、スリット状出口部分3から吐出され
る洗浄液の超音波シャワー12に超音波を伝播させ被洗
浄物8の洗浄を可能とした。図9の構成よりも除去した
微粒子による再汚染低減を可能とした。むろん、洗浄液
供給配管10を超音波集束ホーン4の下方に配置し、洗
浄液を下方から供給することは可能である。
(Embodiment 8) FIG. 11 is a block diagram of an ultrasonic cleaner according to an embodiment of the present invention. An ultrasonic oscillator 1, an ultrasonic oscillator case 2, an ultrasonic focusing horn 4, and a cleaning liquid supply pipe 10 for supplying a cleaning liquid into the ultrasonic focusing horn. This embodiment is a case where the functional unit of the ultrasonic cleaner is taken out of the water tank. Cleaning liquid supply pipe 10
The cleaning liquid is supplied to the cleaning liquid, and the ultrasonic wave is transmitted to the ultrasonic shower 12 of the cleaning liquid discharged from the slit-shaped outlet portion 3, thereby enabling the cleaning of the object 8 to be cleaned. It is possible to reduce the re-contamination by the removed fine particles as compared with the configuration of FIG. Of course, it is possible to arrange the cleaning liquid supply pipe 10 below the ultrasonic focusing horn 4 and supply the cleaning liquid from below.

【0014】(実施例9)図12は本発明の一実施例に
係る超音波洗浄機の側方断面図である。本実施例では超
音波集束ホーン4に接続した洗浄液供給配管10の方向
に関して、洗浄液が供給されたとき洗浄液の水流11が
超音波発振子9の表面に沿って流れる向きに洗浄液供給
配管10を配置したものである。本発明の超音波洗浄機
を長時間発振させると洗浄液の種類によっては脱気によ
る多量の気泡が超音波発振子9面の中心から同心円状に
付着し、超音波出力(強度)が下がり、これが原因で微
粒子の除去する性能が著しく低下する現象が見られる。
図12の実施例は、超音波発振子9面への気泡付着を防
止し、微粒子の除去する性能が著しく低下する現象を防
ぐことが可能となる。
Embodiment 9 FIG. 12 is a side sectional view of an ultrasonic cleaner according to an embodiment of the present invention. In the present embodiment, with respect to the direction of the cleaning liquid supply pipe 10 connected to the ultrasonic focusing horn 4, the cleaning liquid supply pipe 10 is arranged so that the water flow 11 of the cleaning liquid flows along the surface of the ultrasonic oscillator 9 when the cleaning liquid is supplied. It was done. When the ultrasonic cleaner of the present invention is oscillated for a long time, a large amount of air bubbles due to deaeration adhere concentrically from the center of the ultrasonic oscillator 9 depending on the type of the cleaning liquid, and the ultrasonic output (strength) decreases. There is a phenomenon that the performance of removing fine particles is significantly reduced due to the cause.
In the embodiment shown in FIG. 12, it is possible to prevent air bubbles from adhering to the surface of the ultrasonic oscillator 9 and to prevent a phenomenon in which the performance of removing fine particles is significantly reduced.

【0015】(実施例10)図13は本発明の一実施例
に係る超音波洗浄装置の構成図である。2組の超音波洗
浄機を向かい合わせに設置して、超音波シャワー12間
に板状の被洗浄物8を通過させることで被洗浄物8の両
面が同時に洗浄できるようにした。これによって、洗浄
スループットの向上を可能とした。また、被洗浄物8を
2組の超音波洗浄機の間に保持し、被洗浄物8を板面と
同一平面内で回転することで、さらに効率的な洗浄が可
能となる。
(Embodiment 10) FIG. 13 is a configuration diagram of an ultrasonic cleaning apparatus according to an embodiment of the present invention. Two sets of ultrasonic cleaners were installed facing each other, and the plate-like object 8 was passed between the ultrasonic showers 12 so that both surfaces of the object 8 could be cleaned at the same time. This has made it possible to improve the cleaning throughput. Further, by holding the object to be cleaned 8 between two sets of ultrasonic cleaners and rotating the object to be cleaned 8 in the same plane as the plate surface, more efficient cleaning becomes possible.

【0016】(実施例11)図14は本発明の実施例に
係る超音波洗浄機における超音波出力(強度)と洗浄効
果との関係を示す。本例に示されるように、超音波洗浄
における洗浄性能は超音波出力(強度)に依存する。本
発明では超音波出力(強度)のアップを可能にしたこと
で従来除去できなかった微粒子の洗浄が可能となり、超
音波洗浄機の洗浄性能を飛躍的に向上することができ
た。
(Embodiment 11) FIG. 14 shows the relationship between the ultrasonic output (strength) and the cleaning effect in an ultrasonic cleaner according to an embodiment of the present invention. As shown in this example, the cleaning performance in the ultrasonic cleaning depends on the ultrasonic output (intensity). In the present invention, since the ultrasonic output (strength) can be increased, it is possible to clean fine particles which could not be removed conventionally, and the cleaning performance of the ultrasonic cleaning machine can be greatly improved.

【0017】[0017]

【発明の効果】本発明の洗浄機あるいは洗浄装置を使用
することによって、磁気ディスク、半導体ウェハ、液晶
などに代表される電子部品の基板表面の高清浄化が行え
る。その結果、製品の歩留まり、信頼性を大きく向上す
ることができる。また、間接的な効果として、高周波超
音波洗浄の電子部品産業への普及を促進することができ
る。
By using the washing machine or the washing apparatus of the present invention, the surface of a substrate of an electronic component such as a magnetic disk, a semiconductor wafer, and a liquid crystal can be highly purified. As a result, product yield and reliability can be greatly improved. Further, as an indirect effect, the spread of high-frequency ultrasonic cleaning to the electronic component industry can be promoted.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の一実施例に係る超音波洗浄機の構成図FIG. 1 is a configuration diagram of an ultrasonic cleaning machine according to an embodiment of the present invention.

【図2】本発明の一実施例に係る超音波発振子ケースの
側面断面図
FIG. 2 is a side sectional view of an ultrasonic oscillator case according to one embodiment of the present invention.

【図3】超音波発振子の多数枚化による超音波出力(強
度)のアップと効率の比較結果
FIG. 3 shows a comparison of efficiency and efficiency of ultrasonic output by increasing the number of ultrasonic oscillators.

【図4】本発明の一実施例に係る超音波洗浄機の側面断
面図
FIG. 4 is a side sectional view of an ultrasonic cleaner according to one embodiment of the present invention.

【図5】スリット短辺の距離(C寸法)と超音波出力
(強度)との関係
FIG. 5 shows a relationship between a distance (C dimension) of a short side of a slit and an ultrasonic output (intensity).

【図6】本発明の一実施例に係る超音波洗浄機の側面断
面図
FIG. 6 is a side sectional view of an ultrasonic cleaner according to an embodiment of the present invention.

【図7】D寸法と超音波出力(強度)との関係の検討結
FIG. 7 is an examination result of a relationship between a D dimension and an ultrasonic output (strength).

【図8】超音波集束ホーンのスリット状出口部分でなす
角Eと超音波出力(強度)との関係の検討結果
FIG. 8 is a result of studying a relationship between an angle E formed at a slit-shaped exit portion of an ultrasonic focusing horn and an ultrasonic output (strength).

【図9】本発明の一実施例に係る超音波洗浄機の構成図FIG. 9 is a configuration diagram of an ultrasonic cleaning machine according to one embodiment of the present invention.

【図10】本発明の一実施例に係る超音波洗浄機の構成
FIG. 10 is a configuration diagram of an ultrasonic cleaner according to an embodiment of the present invention.

【図11】本発明の一実施例に係る超音波洗浄機の構成
FIG. 11 is a configuration diagram of an ultrasonic cleaner according to an embodiment of the present invention.

【図12】本発明の一実施例に係る超音波洗浄機の側面
断面図
FIG. 12 is a side sectional view of an ultrasonic cleaner according to an embodiment of the present invention.

【図13】本発明の一実施例に係る超音波洗浄機の構成
FIG. 13 is a configuration diagram of an ultrasonic cleaning machine according to an embodiment of the present invention.

【図14】本発明の超音波洗浄機におけるUS出力(強
度)と洗浄効果との関係
FIG. 14 shows the relationship between the US output (strength) and the cleaning effect in the ultrasonic cleaner of the present invention.

【符号の説明】[Explanation of symbols]

1…超音波発振器、 2…超音波発振子ケース、3…
スリット状出口部分、4…超音波集束ホーン、5…ケー
ブル、6…水槽、7a…洗浄液(水槽内)、7b…洗浄
液(超音波集束ホーン内)、8…被洗浄物、9…超音波
発振子、10…洗浄液供給配管、10a…洗浄液の供給
方向、11…洗浄液の水流、12…超音波シャワー。
1. Ultrasonic oscillator, 2. Ultrasonic oscillator case, 3.
Slit-shaped outlet, 4 ... Ultrasonic focusing horn, 5 ... Cable, 6 ... Water tank, 7a ... Washing liquid (in the water tank), 7b ... Washing liquid (in the ultrasonic focusing horn), 8 ... Washed object, 9 ... Ultrasonic oscillation Numeral 10: Cleaning liquid supply pipe, 10a: Cleaning liquid supply direction, 11: Water flow of cleaning liquid, 12: Ultrasonic shower.

───────────────────────────────────────────────────── フロントページの続き (72)発明者 渡辺 正博 神奈川県小田原市国府津2880番地 株式会 社日立製作所ストレージシステム事業部内 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Masahiro Watanabe 2880 Kozu, Odawara-shi, Kanagawa Storage Systems Division, Hitachi, Ltd.

Claims (9)

【特許請求の範囲】[Claims] 【請求項1】少なくとも超音波発振器と超音波振動子と
洗浄液で満たされた超音波集束ホーンとから構成される
超音波洗浄機において、発振周波数が500kHz以上
であり、超音波振動子が2枚から構成され、2枚の振動
子が超音波集束ホーンのスリット状出口部分で焦点が合
うように配置されたことを特徴とした超音波洗浄機。
1. An ultrasonic cleaning machine comprising at least an ultrasonic oscillator, an ultrasonic vibrator and an ultrasonic focusing horn filled with a cleaning liquid, having an oscillation frequency of 500 kHz or more and two ultrasonic vibrators. Wherein the two vibrators are arranged so as to be focused at the slit-shaped exit portion of the ultrasonic focusing horn.
【請求項2】請求項1記載の洗浄機において、超音波集
束ホーンのスリット状出口部分のスリット短辺側の寸法
が2mm以上であることを特徴とした超音波洗浄機。
2. The ultrasonic cleaner according to claim 1, wherein the slit-side exit portion of the ultrasonic focusing horn has a dimension on the short side of the slit of 2 mm or more.
【請求項3】請求項1記載の洗浄機において、発振周波
数が500kHz〜1.5MHzであり、超音波集束ホ
ーンの集束距離(焦点距離)が80〜200mmであるこ
とを特徴とした超音波洗浄機。
3. An ultrasonic cleaning apparatus according to claim 1, wherein the oscillation frequency is 500 kHz to 1.5 MHz, and the focusing distance (focal length) of the ultrasonic focusing horn is 80 to 200 mm. Machine.
【請求項4】請求項1記載の洗浄機において、超音波集
束ホーンのスリット状出口部分の先端角度が35°以下
であることを特徴とした超音波洗浄機。
4. The ultrasonic cleaner according to claim 1, wherein a tip angle of a slit-shaped outlet of the ultrasonic focusing horn is 35 ° or less.
【請求項5】請求項1〜4記載の洗浄機において、超音
波集束ホーンに洗浄液を常時供給する配管が接続され、
超音波集束ホーンの出口部分から吐出される洗浄液の流
れに超音波を乗せることを特徴とした超音波洗浄機。
5. A cleaning machine according to claim 1, wherein a pipe for constantly supplying a cleaning liquid to the ultrasonic focusing horn is connected,
An ultrasonic cleaner characterized by applying ultrasonic waves to a flow of a cleaning liquid discharged from an outlet of an ultrasonic focusing horn.
【請求項6】請求項5記載の洗浄機において、超音波集
束ホーンに接続された配管の方向が超音波振動子の表面
に向かっており、供給される洗浄液で超音波振動子の表
面が洗われる位置関係にあることを特徴とした超音波洗
浄機。
6. The cleaning machine according to claim 5, wherein the direction of the pipe connected to the ultrasonic focusing horn is directed toward the surface of the ultrasonic vibrator, and the surface of the ultrasonic vibrator is cleaned with the supplied cleaning liquid. Ultrasonic cleaning machine characterized by its positional relationship.
【請求項7】請求項1〜6記載の洗浄機において、2組
の洗浄機の超音波集束ホーンを向かいあわせの位置に設
置し、板状の被洗浄物を2組の洗浄機の超音波集束ホー
ンの間を通過させることで前記被洗浄物の両面を同時に
洗浄できることを特徴とした洗浄装置。
7. The cleaning machine according to claim 1, wherein the ultrasonic focusing horns of the two sets of cleaning machines are installed at opposite positions, and the plate-shaped objects to be cleaned are ultrasonically controlled by the two sets of cleaning machines. A cleaning apparatus characterized in that both sides of the object to be cleaned can be simultaneously cleaned by passing between the focusing horns.
【請求項8】請求項7記載の被洗浄物が、磁気ディスク
基板、半導体ウェハあるいは液晶基板であることを特徴
とした洗浄装置。
8. A cleaning apparatus according to claim 7, wherein the object to be cleaned is a magnetic disk substrate, a semiconductor wafer or a liquid crystal substrate.
【請求項9】請求項1〜6記載の超音波洗浄機あるいは
請求項7〜8記載の洗浄装置を使用して製造することを
特徴とした磁気ディスク、半導体、液晶製品。
9. A magnetic disk, semiconductor, or liquid crystal product manufactured by using the ultrasonic cleaner according to claim 1 or the cleaning apparatus according to claim 7.
JP18626397A 1997-07-11 1997-07-11 Ultrasonic cleaning machine Pending JPH1128432A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18626397A JPH1128432A (en) 1997-07-11 1997-07-11 Ultrasonic cleaning machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18626397A JPH1128432A (en) 1997-07-11 1997-07-11 Ultrasonic cleaning machine

Publications (1)

Publication Number Publication Date
JPH1128432A true JPH1128432A (en) 1999-02-02

Family

ID=16185230

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18626397A Pending JPH1128432A (en) 1997-07-11 1997-07-11 Ultrasonic cleaning machine

Country Status (1)

Country Link
JP (1) JPH1128432A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000028578A3 (en) * 1998-11-11 2000-08-03 Applied Materials Inc Improved megasonic cleaner
WO2006040993A1 (en) * 2004-10-12 2006-04-20 Hitachi Plant Engineering & Construction Co., Ltd. Ultrasonic cleaner
JPWO2015056602A1 (en) * 2013-10-16 2017-03-09 日本電気硝子株式会社 GLASS FILM LAMINATE MANUFACTURING METHOD, GLASS FILM LAMINATE, ELECTRONIC DEVICE MANUFACTURING METHOD

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000028578A3 (en) * 1998-11-11 2000-08-03 Applied Materials Inc Improved megasonic cleaner
US6311702B1 (en) 1998-11-11 2001-11-06 Applied Materials, Inc. Megasonic cleaner
WO2006040993A1 (en) * 2004-10-12 2006-04-20 Hitachi Plant Engineering & Construction Co., Ltd. Ultrasonic cleaner
JP2006110418A (en) * 2004-10-12 2006-04-27 Univ Of Tokyo Ultrasonic cleaning device
KR100925121B1 (en) 2004-10-12 2009-11-04 가부시키가이샤 히다찌 플랜트 테크놀로지 Ultrasonic cleaner
JPWO2015056602A1 (en) * 2013-10-16 2017-03-09 日本電気硝子株式会社 GLASS FILM LAMINATE MANUFACTURING METHOD, GLASS FILM LAMINATE, ELECTRONIC DEVICE MANUFACTURING METHOD
US10246374B2 (en) 2013-10-16 2019-04-02 Nippon Electric Glass Co. Ltd. Method for manufacturing glass film laminate, glass film laminate, and method for manufacturing electronic device

Similar Documents

Publication Publication Date Title
US9901962B2 (en) Ultrasonic cleaning apparatus
WO2006040993A1 (en) Ultrasonic cleaner
KR101581073B1 (en) Method of particle contaminant removal
US6085764A (en) Cleaning apparatus and method
US7104268B2 (en) Megasonic cleaning system with buffered cavitation method
US5927308A (en) Megasonic cleaning system
CN102641869A (en) Wafer cleaning device and cleaning method
JP2900788B2 (en) Single wafer processing equipment
US5203798A (en) Cleaning apparatus for substrate
JP3323385B2 (en) Substrate cleaning apparatus and substrate cleaning method
JP2875513B2 (en) Semiconductor material processing method and apparatus
JPH1128432A (en) Ultrasonic cleaning machine
JPH0234923A (en) Ultrasonic cleaner
JPH049670A (en) Analyzing apparatus
JP4144201B2 (en) Wet cleaning processing equipment
CN202638797U (en) Chip cleaning device
JP2005085978A (en) Single-wafer type cleaning method and cleaning device
JPH06106144A (en) Ultrasonic cleaning method and ultrasonic cleaning device
JPS59142885A (en) Ultrasonic treating method and apparatus
JPH0581314B2 (en)
KR19980065775A (en) Multi Oscillation Ultrasonic Cleaner
JP2772167B2 (en) Ultrasonic cleaning nozzle device
JP2007027241A (en) Ultrasonic washing apparatus
JPH04213826A (en) Wafer washing unit for manufacture of semiconductor
JPH09199464A (en) Ultrasonic cleaning equipment