JPH11297658A - Substrate treatment method and apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate treatment method and its apparatus for preventing a defect in drying effectively and eliminating a particle or a water mark on a face of a wafer. SOLUTION: A cassette 1 with a semiconductor wafer (W) cleaned finally in a treatment container is made slanted down by about 2<0> at its left side while the cassette 1 is held by a holding part 52 of a carrying mechanism 14. At the other hand, the cassette 1 is made slanted down by about 2<0> at its right side while the cassette 1 is held by a supporting part 26 of a drying unit 4. When the cassette 1 is rotated during delivery from the holding part 52 of the carrying mechanism 14 to the supporting part 26 of the drying unit 4, the posture of the semiconductor wafer (W), in which the main face of the wafer (W) is slanted to a first direction with respect to a vertical direction, is turned to the different posture, in which the main face is slanted to a second direction reverse to the first direction.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a substrate processing apparatus and a substrate processing method for processing a substrate such as a semiconductor wafer, a glass substrate for a liquid crystal display panel, or a mask substrate for a semiconductor manufacturing apparatus.

[0002]

2. Description of the Related Art In such a substrate processing apparatus, a plurality of substrates accommodated in a substrate accommodating container called a cassette or a carrier are combined with the substrate accommodating container.
By immersing in a plurality of processing liquids stored in a plurality of processing liquid tanks storing different processing liquids, a plurality of substrates were collectively immersed in the processing liquids and stored in the substrate storage container. A plurality of substrates are transported to a drying section together with the substrate storage container, and the processing liquid attached to the substrates is dried.

Here, in the substrate storage container, each substrate is stored in an upright state while being held in a holding groove formed in the substrate storage container.

[0004]

In such a conventional substrate processing apparatus, a droplet of the processing liquid sometimes remains due to a capillary phenomenon at a contact portion between the surface of the holding groove of the substrate storage container and the surface of the substrate. . When such a droplet of the processing liquid remains on the surface of the substrate, poor drying of the substrate occurs, particles are generated on the surface of the substrate, and an oxide film that is called a watermark is generated.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and a substrate processing apparatus and a substrate capable of effectively preventing poor drying of a substrate and preventing generation of particles and watermarks on the surface of the substrate. It is an object to provide a processing method.

[0006]

According to a first aspect of the present invention, there is provided a process for immersing a plurality of substrates, each of which is stored in a plurality of holding grooves of a substrate storage container in an upright state, in a processing solution for processing. A liquid tank, a drying unit for drying the substrate processed in the processing liquid tank, and a transfer mechanism for transferring the substrate storage container storing the plurality of substrates from the processing liquid tank to the drying unit. In the substrate processing apparatus having the transfer mechanism, the transfer mechanism tilts the substrate storage container so that a main surface of each substrate stored in the substrate storage container is inclined in a first direction with respect to a vertical direction. The drying unit has a main surface of each substrate stored in the substrate storage container, the main surface of which is held in the first direction with respect to a vertical direction.
A supporting portion for supporting the substrate storage container in a state in which the substrate storage container is inclined in a direction opposite to the holding direction by the holding portion so as to be in a posture inclined in a second direction opposite to the direction. And

According to a second aspect of the present invention, a plurality of substrates housed in a plurality of holding grooves of a substrate storage container in a standing state together with the substrate storage container in the processing liquid stored in the processing liquid tank. By immersion, the immersion processing step of treating the plurality of substrates with a processing liquid, and the plurality of substrates housed in a plurality of holding grooves of the substrate storage container in an upright state, together with the substrate storage container. In a substrate processing method having a transporting step of transporting to a drying position in a drying unit, and a drying step of drying a plurality of substrates stored in an upright state in a plurality of holding grooves of a substrate storage container at the drying position, respectively. In the transporting step, each of the substrates stored in the substrate storage container is moved from a first posture in which a main surface thereof is inclined in a first direction with respect to a vertical direction, and the main surface of the substrate is the first position with respect to the vertical direction. 1 direction and Such that the second posture inclined in a second direction opposite to said rotating about an axis horizontally oriented the substrate storage container.

[0008]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a plan view showing an outline of a substrate processing apparatus according to the present invention.

In this substrate processing apparatus, a semiconductor wafer W serving as a substrate stored in a cassette 1 serving as a substrate storage container is transferred to a plurality of processing liquid tanks 3a, 3b, 3c, 3d, 3e.
3f, 3g, 3h, and 3i (these are collectively referred to as a “treatment liquid tank 3”), which are sequentially processed and transported to the drying unit 4 for drying. A plurality of processing liquid tanks 3, a drying unit 4, an unloading unit 5,
A plurality of transport mechanisms 11, 12, 13, 14, 15 are provided. In FIG. 1, the transport mechanisms 11, 12, 1
With respect to 3, 14, and 15, only the movement range is schematically indicated by arrows.

The loading section 2 is for loading the cassette 1 containing a plurality of semiconductor wafers W into the substrate processing apparatus. The semiconductor wafer W is transferred to the cassette 1 by a transfer mechanism (not shown) from a transfer-only cassette transferred by a not-shown cassette transfer device.

The plurality of processing liquid tanks 3 store processing liquids such as different chemical liquids or pure water, and immerse the semiconductor wafers W stored in the cassette 1 together with the cassette 1 in the processing liquid. And for immersing a plurality of semiconductor wafers W collectively.

The drying section 4 arranges the semiconductor wafer W immersed in the processing liquid tank 3 together with the cassette 1 in a vapor of IPA (iso-propyl alcohol), and deposits the semiconductor wafer W on the surface of the semiconductor wafer W. The semiconductor wafer W is dried by replacing a processing liquid such as water with IPA.

The configuration of the drying unit 4 will be described later in detail.

The unloading section 5 is for unloading the cassette 1 containing the processed semiconductor wafers W from the substrate processing apparatus. The semiconductor wafer W in the cassette 1 is transferred to a transfer cassette by a transfer mechanism (not shown) of the semiconductor wafer W, and the transfer cassette is transferred to the next step by a cassette transfer device (not shown). .

Transport mechanisms 11, 12, 13, 14, 15
Is for transporting the cassette 1 in which a plurality of semiconductor wafers W are stored among the above-described loading section 2, the plurality of processing liquid tanks 3, the drying section 4, and the unloading section 5. Here, the transfer mechanism 11 transfers the cassette 1 containing a plurality of semiconductor wafers W into the loading unit 2 and the processing liquid tanks 3a, 3b, 3c.
Transport between The transport mechanism 12 transfers the cassette 1 containing the plurality of semiconductor wafers W into the processing liquid tanks 3c and 3c.
It is transported between d, 3e and 3f. The transport mechanism 13
Is a cassette 1 in which a plurality of semiconductor wafers W are stored.
Is transported between the processing liquid tanks 3f, 3g, and 3h. Also,
The transport mechanism 14 transports the cassette 1 containing a plurality of semiconductor wafers W between the processing liquid tanks 3h, 3i and the drying unit 4. Further, the transport mechanism 15 transports the cassette 1 containing a plurality of semiconductor wafers W between the drying unit 4 and the unloading unit 5.

The transport mechanisms 11, 12, 1
The configuration of the transport mechanism 14 among 3, 14, and 15 will be described later in detail.

Next, the configuration of the cassette 1 for accommodating the plurality of semiconductor wafers W described above will be described. FIG. 2 is a front view of the cassette 1 for storing a plurality of semiconductor wafers W, FIG. 3 is a side view thereof, and FIG. 4 is a partially enlarged view showing a storage state of the semiconductor wafers W in the cassette 1.

The cassette 1 is capable of storing, for example, about 50 semiconductor wafers W in an upright state.
Then, each semiconductor wafer W enters the upper holding groove 6 and the lower holding groove 7 respectively formed on the inner wall of the cassette 1, and the semiconductor wafer W is supported by the upper holding groove 6 and the lower holding groove 7. It has become.

The widths of the upper holding groove 6 and the lower holding groove 7 are larger than the thickness of the semiconductor wafer W. For this reason, each semiconductor wafer W has two positions in FIG. 4 in which the main surface of each semiconductor wafer W is tilted in the first direction with respect to the vertical direction as shown by a solid line in FIG. The main surface of each semiconductor wafer W indicated by a chain line can take a posture inclined with respect to the vertical direction in a second direction opposite to the first direction. In FIG. 4, the tilted state of the semiconductor wafer W is exaggerated.

Next, the drying section 4 which is a characteristic part of the present invention is described.
The configuration of the transport mechanism 14 will be described. FIG. 5 is a side view showing the drying unit 4 and the transport mechanism 14, and FIG. 6 is an enlarged view showing a main part thereof.

As described above, the drying unit 4 arranges the semiconductor wafer W immersed in the processing liquid tank 3 in the preceding stage together with the cassette 1 in the vapor of IPA (iso-propyl alcohol), and The semiconductor wafer W is dried by replacing the processing liquid such as pure water attached to the surface of the wafer W with IPA.

The drying unit 4 has a liquid I
A storage tank 22 for storing PA 21 and I
A supply pipe 29 for supplying PA, and a pair of support members 2
3, 25 and a connecting member 2 for connecting these support members
And a tray 28 for collecting droplets dropped from the cassette 1 containing a plurality of semiconductor wafers W and having a support portion 26 composed of the semiconductor wafer W and a conduit 27 connected to the drain.
Is disposed so as to surround the upper opening of the storage tank 22,
A cooling pipe 31 through which cooling water flows, and a liquid receiving section 32 for collecting droplets dropped from the cooling pipe 31.
And an elevating mechanism 33 for elevating and lowering the support portion 26.

In the drying section 4, the IPA generated from the liquid IPA 21 stored at the bottom of the storage tank 22 is generated.
The A vapor rises toward the upper opening of the storage tank 22. However, the IPA vapor is cooled by the cooling pipe 31 disposed so as to surround the upper opening of the storage tank 22, and is prevented from rising above the cooling pipe 31. Therefore, the storage tank 22 can be filled with the IPA vapor, and the IPA vapor can be prevented from diffusing from the drying unit 4 to the outside.

The pair of support members 23 and 25 of the support portion 26 support the cassette 1 by contacting the lower surface of the cassette 1. In a state where the cassette 1 is supported by the support portion 26 having the pair of support members 23 and 25, the cassette 1
The shape of the support members 23 and 25 is determined such that the right side in FIGS. 5 and 6 is inclined by, for example, about 2 degrees with respect to the horizontal direction.

The lifting mechanism 33 includes a ball screw 3 which is rotated by driving a motor 34 fixed to the apparatus main body.
5, an elevating member 37 having a nut 36 screwed with the ball screw 35, the elevating member 37 and the support 26
And a connecting member 38 for connecting the two. For this reason, the support portion 26 moves up and down between the position indicated by the solid line and the position indicated by the two-dot chain line in FIG.

On the other hand, as described above, the transport mechanism 14
The cassette 1 containing a plurality of semiconductor wafers W is transported between the processing liquid tanks 3h and 3i and the drying unit 4.

The transport mechanism 14 holds the cassette 1 by engaging with two sets (four in total) of flanges 8 (see FIGS. 2 and 3) formed on both right and left sides of the cassette 1. Holding part 52 provided with a set (four in total) of holding rings 51
And a moving unit 54 having a shaft 53 for swingably supporting the holding unit 52, and a motor 56 connected to the moving unit 54 via a ball screw 55 to drive the moving unit 54 up and down. Therefore, the moving unit 54 moves up and down together with the holding unit 52 between the position indicated by the solid line and the position indicated by the two-dot chain line in FIGS.

Each holding ring 5 in the holding portion 52
The lower end of 1 is inclined, for example, by about 2 degrees with respect to the horizontal plane. For this reason, the cassette 1 in which the flange 8 engages with the lower end of the holding ring 51 is, for example, about two degrees in the horizontal direction in FIGS. The left side will be inclined so as to descend.

The transport mechanism 14 includes a bracket 5
It is suspended via a rail 58 connected to a support member 59 fixed to the apparatus main body via the. For this reason, the transport mechanism 14 reciprocates in the left-right direction (the direction perpendicular to the plane of FIG. 5) indicated by the arrow 14 in FIG.

Next, an operation of processing the semiconductor wafer W by the substrate processing apparatus having the above-described configuration will be described.

The semiconductor wafer W to be processed is placed in the introduction section while being housed in the cassette 1. And
The semiconductor wafer W is transferred to transfer mechanisms 11, 12, 13, 1
4, a plurality of processing liquid tanks 3a, 3b, 3c, 3d, 3e, 3f, each storing a processing liquid such as a different chemical liquid or pure water.
It is sequentially conveyed to 3g and 3h, and is immersed. And
The semiconductor wafer W is immersed in pure water and finally cleaned in the processing liquid tank 3i.

The cassette 1 containing the semiconductor wafer W that has been finally cleaned in the processing liquid tank 3i is held by the holding section 52 of the transfer mechanism 14 and is pulled up from the pure water stored in the processing liquid tank 3i, and the pure water is stored in the processing liquid tank 3i. The water is drained. At this time, as described above, the lower end of each holding ring 51 of the holding portion 52 is inclined, for example, by about 2 degrees with respect to the horizontal plane. For this reason, the cassette 1 in which the flange 8 engages with the lower end of the holding ring 51 is inclined by, for example, about 2 degrees with respect to the horizontal direction when held in the holding portion 52.

At this time, as described above, the upper holding groove 6
Since the groove width of the lower holding groove 7 is larger than the thickness of the semiconductor wafer W, each semiconductor wafer W stored in the cassette 1 is in a solid line in FIG. Each semiconductor wafer W indicated by
Is inclined in the first direction with respect to the vertical direction. In this state, droplets of pure water remain at the contact portion between the surface of the semiconductor wafer W and the portion where the upper holding groove 6 of the cassette 1 is formed due to the capillary phenomenon.

Next, as shown by a two-dot line in FIGS. 5 and 6, the transport mechanism 14 moves to a position where the holding section 52 is disposed above the drying section 4.

Subsequently, the holding section 52 of the transport mechanism 14 is lowered to the position shown by the solid line in FIGS. At this time, as shown in FIG. 6, the cassette 1 held by the holding portion 52 is inclined such that the left side thereof is lowered by, for example, about 2 degrees with respect to the horizontal direction.
Only the one bottom side of the cassette 1 held by the abutment contacts the one support member 23 of the support part 26 in the drying part 4. In this state, as shown by a solid line in FIG. 6, the other bottom of the cassette 1 held by the holding unit 52 is the other supporting member 2 of the supporting unit 26 in the drying unit 4.
5 is not yet in contact.

In this state, the holding unit 5 of the transport mechanism 14 is further moved.
When the cassette 2 is further lowered, the other bottom side of the cassette 1 held by the holding section 52 also contacts the other support member 25 of the support section 26. Thereby, the cassette 1
From the holding section 52 of the transport mechanism 14 to the support section 2 of the drying section 4
6 has been passed. When the transfer is completed, the holding mechanism 52 swings around the shaft 53 and retreats from a position where the holding mechanism 52 can engage with the flange 8 of the cassette 1. As it rises to the position shown by the two-dot line,
Starts descending together with the cassette 1.

At this time, as described above, in a state where the cassette 1 is supported by the support portion 26, the cassette 1 is lowered by, for example, about two degrees with respect to the horizontal direction, and the right side thereof in FIGS. The shape of the support members 23 and 25 is determined so that the support members 23 and 25 are inclined so as to be inclined. Therefore, in a state where the cassette 1 is transferred from the holding section 52 of the transport mechanism 14 to the support section 26 of the drying section 4 and descends, the cassette 1 rotates about an axis directed in the horizontal direction, and two points in FIG. As shown by the dashed line, the right side is inclined by, for example, about 2 degrees with respect to the horizontal direction.

In FIG. 6, the cassette 1 being lowered along with the support 26 is shown by a two-dot chain line.

With the rotation of the cassette 1, each semiconductor wafer W is moved from the posture in which the main surface of each semiconductor wafer W is tilted in the first direction with respect to the vertical direction in FIG. The main surface of each semiconductor wafer W indicated by the dotted line is in a posture inclined in a second direction opposite to the first direction. With the change of the attitude of the semiconductor wafer W, the pure water droplet remaining by the capillary action at the contact portion between the surface of the semiconductor wafer W and the portion where the upper holding groove 6 of the cassette 1 is formed is reduced by its own weight. As a result, the semiconductor wafer W falls from above the semiconductor wafer W and is collected by the tray 28.

The supporting section 26 of the drying section 4 descends to the position shown by the two-dot line in FIG. 5 while supporting the cassette 1. As a result, the semiconductor wafer W stored in the cassette 1 comes into contact with the vapor of the IPA filling the storage tank 22 of the drying unit 4, and this IPA condenses on the surface of the semiconductor wafer W, thereby causing the surface of the semiconductor wafer W to condense. The pure water remaining slightly is replaced with IPA.

At this time, no drop of pure water remains between the semiconductor wafer W and the portion where the upper holding groove 6 of the cassette 1 is formed due to the change in the attitude of the semiconductor wafer W described above. Therefore, no particles are generated on the surface of the semiconductor wafer W, and no oxide film called a watermark is generated.

In this state, after a certain period of time has elapsed and the replacement of the pure water slightly remaining on the surface of the semiconductor wafer W with the IPA has been completed, the support portion 26 is moved to the position shown by the solid line in FIGS. To raise. Thereby, the IPA condensed on the upper surface of the semiconductor wafer W evaporates quickly, and the semiconductor wafer W dries quickly.

The cassette 1 containing the dried semiconductor wafers W is transferred from the support section 26 of the drying section 4 to the transfer mechanism 15 having the same configuration as the transfer mechanism 14, and is transferred to the transfer section 5.
Transported to Then, the semiconductor wafer W in the cassette 1
Is transferred to a transfer cassette by a transfer mechanism (not shown) of the semiconductor wafer W, and the transfer cassette is
It is transported toward the next process by a cassette transport device (not shown).

As described above, in this substrate processing apparatus, the cassette 1 containing the semiconductor wafers W is transported by the transfer mechanism 1
When the semiconductor wafer W stored in the cassette 1 is transferred from the holding section 52 of the drying section 4 to the supporting section 26 of the drying section 4, the main surface of the semiconductor wafer W is inclined in the first direction with respect to the vertical direction. From the posture, the main surface thereof becomes a second posture inclined in a second direction opposite to the first direction with respect to the vertical direction,
Since the cassette 1 is configured to rotate about an axis oriented in the horizontal direction, it is possible to prevent pure water droplets from remaining at a contact portion between the surface of the semiconductor wafer W and the surface of the cassette 1. For this reason, it is possible to effectively prevent the generation of an oxide film called particles and watermarks due to poor drying of the semiconductor wafer W.

In the above-described embodiment, when the cassette 1 is rotated when the cassette 1 is transferred from the holding section 52 of the transport mechanism 14 to the support section 26 of the drying section 4, each semiconductor wafer W is moved to the first position. Although the posture inclined in the first direction is changed to the posture inclined in the second direction, the present invention is not limited to such an embodiment.

For example, instead of the transport mechanism 14 described above,
As shown in FIG. 7, a transport mechanism 114 that can swing the holding unit 52 about a shaft 115 that faces in the horizontal direction together with the shaft 53 is used, and the transport mechanism 114 is transporting the cassette 1. Then, the cassette 1 is rotated to change each semiconductor wafer W from the posture inclined in the first direction to the posture inclined in the second direction.
May be transferred to the support section 26 of the drying section 4 in the posture as it is.

Further, as in the above-described embodiment, the attitude of supporting the cassette 1 by the support section 26 of the drying section 4 and the attitude of holding the cassette 1 by the holding section 52 of the transport mechanism 14 are different. Instead of rotating the cassette 1, the cassette 1 may be rotated only by the transport mechanism. In this case, a transfer mechanism 114 as shown in FIG. 7 is used, and while the cassette 1 is being transferred by the transfer mechanism 114, the cassette 1 is once rotated to move each semiconductor wafer W in the first direction. After changing from the inclined posture to the posture inclined in the second direction, the cassette 1 is again rotated in the reverse direction so that each semiconductor wafer W is moved from the posture inclined in the second direction to the posture inclined in the first direction. After returning, the supporting part 26 of the drying part 4
It may be configured to be delivered to

In the above embodiment, the inclination angle of the cassette 1 with respect to the horizontal plane when the cassette 1 containing the plurality of semiconductor wafers W is held by the holding section 52 of the transfer section 14 and the cassette 1 Supporting part 2 of drying part 5
The angle of inclination of the cassette 1 with respect to the horizontal plane in the state of being supported on 6 is set to about 2 degrees, but is not limited to this angle.
When the cassette 1 is held by the holding unit 52, the main surface of each semiconductor wafer W stored in the cassette 1 is inclined in the first direction with respect to the vertical direction.
When the semiconductor wafer W is supported on the support portion 26, the main surface of each semiconductor wafer W stored in the cassette 1 is inclined in a second direction opposite to the first direction with respect to the vertical direction. Any angle can be taken.

In the above-described embodiment, the semiconductor wafer W is placed together with the cassette 1 in the vapor of IPA (iso-propyl alcohol).
An alcohol vapor replacement type drying unit 4 for drying the semiconductor wafer W by replacing the processing liquid such as pure water attached to the surface of the semiconductor wafer with the IPA is used. It is also possible to use a drying unit having another configuration, such as a reduced-pressure drying unit for drying under a reduced-pressure atmosphere.

Further, in the above-described embodiment, the case where the present invention is applied to a substrate processing apparatus for processing a semiconductor wafer W has been described. However, a glass substrate for a liquid crystal display panel, a mask substrate for a semiconductor manufacturing apparatus, or the like may be used. The present invention can also be applied to a substrate processing apparatus that processes another substrate.

[0051]

According to the first aspect of the present invention, the transport mechanism is configured so that the main surface of each substrate stored in the substrate storage container is inclined in the first direction with respect to the vertical direction. And a holding unit for holding the substrate storage container in an inclined state, and the drying unit is configured such that the main surface of each substrate stored in the substrate storage container has a second direction opposite to the first direction with respect to the vertical direction. The support groove supports the substrate storage container in a state in which the substrate storage container is tilted in a direction opposite to the holding direction of the transfer mechanism so that the substrate storage container is tilted in the direction of. It is possible to prevent the droplet of the processing liquid from remaining at the contact portion between the substrate and the surface of the substrate due to the capillary phenomenon. For this reason, it is possible to prevent the generation of particles and watermarks on the surface of the substrate due to poor drying of the substrate.

According to the second aspect of the present invention, in the transporting step of transporting a plurality of substrates together with the substrate storage container to the drying position in the drying section, each of the substrates stored in the substrate storage container has a main surface. From a first posture inclined in a first direction with respect to the vertical direction, a main surface thereof becomes a second posture inclined in a second direction opposite to the first direction with respect to the vertical direction, Since the substrate storage container is rotated about an axis oriented in the horizontal direction, it is possible to prevent the processing liquid droplets from remaining on the contact portion between the holding groove surface of the substrate storage container and the surface of the substrate due to a capillary phenomenon. it can. For this reason, it is possible to prevent the generation of particles and watermarks on the surface of the substrate due to poor drying of the substrate.

[Brief description of the drawings]

FIG. 1 is a plan view showing an outline of a substrate processing apparatus according to the present invention.

FIG. 2 is a front view of the cassette 1. FIG.

FIG. 3 is a side view of the cassette 1. FIG.

FIG. 4 is a partially enlarged view showing a state where semiconductor wafers W are stored in a cassette 1.

FIG. 5 is a side view showing the drying unit 4 and the transport mechanism 14.

FIG. 6 is an enlarged view showing a main part of a drying unit 4 and a transport mechanism 14.

FIG. 7 is a side view showing a transport mechanism 114 according to another embodiment.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Cassette 2 Carry-in part 3 Processing liquid tank 4 Drying part 5 Carry-out part 6 Upper holding groove 7 Lower holding groove 8 Flange part 14 Transport mechanism 21 IPA 26 Support part 52 Holding part 114 Transport mechanism W Semiconductor wafer

Claims (2)

[Claims] 1. A processing liquid tank for immersing a plurality of substrates, each of which is stored in a plurality of holding grooves of a substrate storage container in an upright state, in a processing liquid, for processing, and a substrate processed in the processing liquid tank. A drying unit for drying, and a transport mechanism that transports the substrate storage container that houses the plurality of substrates from the processing liquid tank to the drying unit. A holding unit that holds the substrate storage container in an inclined state such that a main surface of each substrate stored in the substrate storage container is in a posture inclined in a first direction with respect to a vertical direction, The drying unit removes the substrate storage container so that a main surface of each substrate stored in the substrate storage container is inclined with respect to a vertical direction in a second direction opposite to the first direction. Opposite to the holding direction by the holding unit The substrate processing apparatus characterized by having a support portion for supporting in a state of being inclined to the direction. 2. A method according to claim 1, wherein the plurality of substrates housed in a plurality of holding grooves of the substrate storage container are immersed in a processing liquid stored in a processing liquid tank together with the substrate storage container. An immersion treatment step of treating a plurality of substrates with a processing liquid; and transporting the plurality of substrates housed in a plurality of holding grooves of the substrate storage container in an upright state to a drying position in a drying unit together with the substrate storage container. And a drying step of drying a plurality of substrates stored in a plurality of holding grooves of the substrate storage container in an upright state at the drying position, wherein the transporting step comprises: Each substrate accommodated in the substrate accommodating container has a main surface opposite to the first direction with respect to the vertical direction from the first posture in which the main surface is inclined in the first direction with respect to the vertical direction. In the second direction of As a second posture in which obliquely, a substrate processing method characterized by rotating about an axis oriented in the horizontal direction the substrate storage container.