JPH11307580A - Semiconductor chip suction tool and semiconductor device manufacturing method using the tool - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce variations of pressurizing of bump electrodes, and improve reliability of flip chip connection by forming a protrusion having a form almost corresponding to arrangement of a plurality of bump electrodes, on the bottom surface of a tool, and using it in such a manner that the protrusion is positioned on the back of a semiconductor chip almost corresponding to the arrangement of bump electrodes. SOLUTION: A protruding part 3 having a form almost corresponding to surrounding arrangement of a plurality of bump electrodes 7 formed on the surface of a chip 5 is formed on the bottom surface of a tool 1 for chucking a chip. The tool 1 is so used that the protruding part 3 is positioned on the back of the chip 5 almost corresponding to the bump electrodes 7. The area of a chip chucking surface is determined by the protrusion 3 and reduced., As a result, when undulation is generated on the bottom surface of the tool, its influence can be almost ignored. Provability that unnecessary foreign matter such as dust exists between the protrusion 3 and the chip 5 is decreased. As a result, an effective pressuring force can be applied only to the bump electrodes, and variations of pressurizing can be reduced.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a tool for adsorbing a semiconductor chip and a method for manufacturing a semiconductor device using the tool. The present invention relates to a tool for semiconductor chip suction for flip-chip connection on a substrate and a method for manufacturing a semiconductor device using the tool.

[0002]

2. Description of the Related Art LSIs such as memories and microprocessors
As one method of manufacturing a semiconductor device including a (large-scale integrated circuit), a flip-chip connection method is known.
In the flip chip connection method, a semiconductor chip (hereinafter, also simply referred to as a chip) diced from a semiconductor wafer manufactured through various process steps is connected to a wiring board face down with an electrode formation surface facing down ( Bonding). According to this flip-chip connection method, connection of a chip having a large number of electrodes is simplified, and unnecessary parasitic capacitance and inductance are not formed due to the absence of bonding wires, so that high-frequency characteristics are improved. There are advantages.

[0003] In the case of performing such flip chip connection, a chip suction tool is conventionally used. The chip suction tool suctions the chips housed in a tray or the like from the back surface by vacuum force and transfers the chips onto the wiring board, and then presses the chips from the back surface and connects the chips to the wiring board.
The electrode on the surface of the chip used for such flip-chip connection is composed of a ball-shaped bump electrode made of gold, copper, solder or the like formed on a pad electrode of aluminum or the like in order to facilitate connection. ing.

[0004] For example, Japanese Patent Application Laid-Open No. 5-144874 discloses a method of manufacturing a semiconductor device by such flip-chip connection. According to the publication, as shown in FIG. 15, a back surface of a chip 52 having a solder bump electrode 51 formed on the surface is suctioned by a chip suction tool 53 utilizing a vacuum suction force as shown by an arrow, and a wiring board 54 is formed. It is described that, after being transferred upward, the chip 52 is pressed from the back side by a chip suction tool 53 to melt the solder bump electrode 51 and connect it to the electrode 55 on the wiring board 54.

[0005]

However, in the conventional chip suction tool described in the above-mentioned publication, the entire bottom surface facing the back surface of the chip is a chip suction surface. Therefore, there is a problem that the pressure of the bump electrode varies. For this reason, the connection of the bump electrodes is not performed well, and the reliability of the flip chip connection is reduced.

For example, as shown in FIG. 16, when a swell 56 is generated on the chip suction surface of the chip suction tool for some reason, the swell 56 is transmitted to the chip 52 through the entire chip suction surface. For this reason, an unnecessary weight is applied to the chip 52 and the chip 52 is deformed, so that the pressing of the chip is not performed uniformly.
Also, as shown in FIG. 17, when an unnecessary foreign matter 57 such as dust is present between the chip suction surface and the back surface of the chip 52, unnecessary foreign matter 57 Similar drawbacks arise because of the added weight.

Further, even when the processing accuracy of the chip suction surface is low and the flatness is lacking, the adhesion between the chip suction surface and the back surface of the chip is deteriorated, so that the pressing of the chip is performed uniformly. No cause. To eliminate this cause, it is only necessary to apply a finishing process to the entire chip suction surface. However, the finishing process for the entire chip suction surface is troublesome and is not easy.

[0008] If the pressure of the chip is not uniform, the pressure of the bump electrodes varies. As a result, in the flip-chip connection, in the method of performing connection on the wiring substrate only by crushing the bump electrode without melting it, the crush amount of the bump electrode varies, so that the connection is not performed well. Also, in the connection method of holding the chip and the wiring board with an adhesive while simply keeping the bump electrode in contact with the wiring board without being crushed, the contact force of the bump electrode varies because the bonding force varies. As in the case, the connection is not made well.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and in performing flip-chip connection, it is possible to reduce the variation in pressurization of the bump electrodes by applying an effective pressing force only to the bump electrodes. An object of the present invention is to provide a tool for sucking a semiconductor chip and a method for manufacturing a semiconductor device using the tool.

[0010]

According to a first aspect of the present invention, there is provided a semiconductor device having a plurality of bump electrodes formed on a front surface thereof, and the semiconductor chip having a plurality of bump electrodes formed thereon is flip-chip connected to a wiring substrate. The present invention relates to a semiconductor chip sucking tool for providing a protrusion having a shape substantially corresponding to the arrangement of the plurality of bump electrodes on a bottom surface and positioning the protrusion on the back surface of the semiconductor chip substantially corresponding to the arrangement. It is characterized by being used as follows.

According to a second aspect of the present invention, there is provided the semiconductor chip suction tool according to the first aspect, wherein the protrusion completely surrounds a periphery of a suction hole formed at a substantially central position of the bottom surface. It is characterized by being provided.

According to a third aspect of the present invention, there is provided the semiconductor chip suction tool according to the first aspect, wherein the protrusion does not completely surround the periphery of the suction hole. An endless projection that is lower than the height of the portion is provided.

According to a fourth aspect of the present invention, there is provided the semiconductor chip suction tool according to the first, second or third aspect, wherein the height of the protrusion is 50 to 150% of the thickness of the semiconductor chip. It is characterized by having.

According to a fifth aspect of the present invention, there is provided the tool for suctioning a semiconductor chip according to any one of the first to fourth aspects, wherein the width of the projection is 200 to 40 times the diameter of the bump electrode.
It is characterized by having a value of 0%.

According to a sixth aspect of the present invention, there is provided the semiconductor chip suction tool according to the third, fourth or fifth aspect, wherein the height of the endless projection is 50 to 90% of the height of the projection. It is characterized by having a value.

According to a seventh aspect of the present invention, there is provided the tool for sucking a semiconductor chip according to any one of the first to sixth aspects, wherein an outer circumference of the bottom surface is set smaller than that of the semiconductor chip. It is characterized by having.

The invention according to claim 8 relates to a method for manufacturing a semiconductor device using the tool for sucking semiconductor chips according to claim 1, and relates to a method for manufacturing a semiconductor chip having a plurality of bump electrodes formed on a surface thereof. Using a semiconductor chip suction tool in which a projection having a shape substantially corresponding to the arrangement of the bump electrodes is provided on the bottom surface, the projection is positioned on the back surface of the semiconductor chip substantially corresponding to the arrangement. A tool positioning step, a semiconductor chip transfer step of sucking the semiconductor chip by the semiconductor chip suction tool and transferring the semiconductor chip onto a wiring board; and a bump electrode of the semiconductor chip by the semiconductor chip suction tool by the semiconductor chip suction tool. And a flip-chip connection step of pressing the semiconductor chip from the back surface after contacting the upper conductor portion.

According to a ninth aspect of the present invention, there is provided a method for manufacturing a semiconductor device using the tool for sucking a semiconductor chip according to the eighth aspect of the present invention. It is characterized in that it is heated by a chip suction tool.

[0019]

Embodiments of the present invention will be described below with reference to the drawings. The description will be specifically made using an embodiment. FIG. 1 shows a semiconductor chip suction tool according to a first embodiment of the present invention. FIG. 1 (a) is a bottom view, and FIG. 1 (b) is AA in FIG. 1 (a). FIG. 2 shows a semiconductor chip to which the semiconductor chip suction tool of this example is applied, wherein FIG. 2 (a) is a bottom view and FIG. 2 (b) is a figure (a).
FIG. 3 is a sectional view taken along the line BB in FIG. As shown in FIG. 1, a semiconductor chip (hereinafter also referred to as a chip) suction tool 1 of this example is made of a material having excellent hardness and relatively excellent thermal conductivity, such as ceramics and metals. A plurality of bump electrodes 7 each having a horizontal cross-section and having a bottom surface 2 formed on a surface 6 of a square chip 5 along four sides of the chip 5 as shown in FIG. A projection 3 having a shape substantially corresponding to the surrounding arrangement (region surrounded by a broken line) 10 is provided. The chip suction tool 1 is used so that when the chip 5 is sucked, the protrusion 3 is positioned on the back surface 8 of the chip 5 substantially corresponding to the arrangement 10 of the bump electrodes 7.

The projection 3 is provided endlessly so as to completely surround the suction hole 4 formed substantially at the center of the bottom surface 2. As a result, the bottom surface 2 of the chip suction tool 1 faces the back surface 8 of the chip 5, and the protrusion 3
Is in contact with the back surface 8 of the chip 5 to prevent vacuum leakage when the chip 5 is sucked. Although not shown, the suction holes 4 are connected to a vacuum source. Similarly, a heater is provided at the base of the chip suction tool 1 so that the chip 5 can be heated when the chip 5 is sucked.

The chip 5 to which the chip suction tool 1 is applied has a thickness of 250 to 350 μm, and the bump electrode 7 on the surface 6 of the chip 5 is made of, for example, gold.
It has a diameter of 0 μm and a height of 40-70 μm.
The bump electrode 7 is formed by using, for example, a wire bonding technique using a gold wire.

Projection 3 on bottom surface 2 of tool 1 for chip suction
Has a value of 50 to 150% of the thickness of the chip 5, and the width W of the protrusion 3 is 2% of the diameter of the bump electrode 7.
It has a value of 00-400%. Height H of the projection 3
By setting the width W to the above-mentioned value, when the back surface 8 of the chip 5 is suctioned by the chip suction tool 1 and pressed, effective pressing can be performed without deforming the chip 5. become able to.

In particular, by setting the width W of the projection 3 to the above-mentioned value, even if the unavoidable misalignment occurs when the chip 5 is attracted, the projection 3 has a width of about 100 μm or more from the outer shape of the bump electrode 7. It is possible to have a width, so that an effective pressing force can be reliably applied only to the bump electrode 7. In other words, when the chip 5 is attracted, a positional deviation within approximately ± 50 μm is unavoidable due to mechanical accuracy.
, The positioning state substantially corresponding to the arrangement of the bump electrodes 7 can be maintained.

The outer shape of the bottom surface 2 of the chip suction tool 1 is formed smaller than that of the chip 5. Thus, when the chip 5 is sucked by the chip sucking tool 1, the operation of positioning the protrusion 3 on the back surface 8 of the chip 5 substantially corresponding to the array 10 of the bump electrodes 7 is easily performed. ing. Further, in the method of using an adhesive for flip chip connection, it is possible to avoid an influence on the chip suction tool 1 when the adhesive flows around the chip 5 to the back surface via the side surface.

Next, a method of manufacturing a semiconductor device using the chip suction tool 1 of this embodiment will be described in the order of steps with reference to FIGS. First, as shown in FIG. 3, using a chip 5 having a plurality of bump electrodes 7 formed on a surface 6 and a chip suction tool 1, the projections 3 of the chip 5 substantially corresponding to the arrangement 10 of the bump electrodes 7. Is positioned on the back surface 8. This positioning operation can be performed by using a method that is performed when normal flip-chip connection is performed.

Next, the back surface 8 of the chip 5 is suctioned by the chip suction tool 1 utilizing a vacuum suction force as shown by an arrow, and is transferred onto the wiring board 9. The upper conductor (pad wiring) 11 is made to face and contact. Subsequently, pressure is applied from the back surface 8 of the chip 5 by the chip suction tool 1, and at the same time, the chip 5 is heated to 300 to 400 ° C. by a heater (not shown).

As a result, as shown in FIG. 4, the bump electrodes 7 are crushed and connected to the conductors 11 on the wiring board 9 to manufacture a semiconductor device in which the chip 5 is flip-chip connected. When connecting the bump electrodes 7 described above, the chip suction tool 1 has the protrusions 3 positioned on the back surface 8 of the chip 5 substantially corresponding to the arrangement 10 of the bump electrodes 7. Pressure works. For this reason, the bump electrode 7 is uniformly pressed, and the variation in the pressure is reduced. Therefore, the variation in the amount of crushing of the bump electrode 7 is also reduced, so that the bump electrode 7 is satisfactorily connected to the conductor 11.

Next, with reference to FIGS. 5 and 6, a method for manufacturing another semiconductor device using the chip suction tool 1 of this embodiment will be described in the order of steps. First, as shown in FIG. 5, a wiring board 9 is prepared in which an adhesive 12 made of, for example, epoxy resin is applied to a region covering the conductor portion 11 in advance.
As in FIG. 3, the chip 5 is attached to the chip suction tool 1.
Then, the bump electrodes 7 are opposed to the conductors 11 on the wiring board 9 after being transferred onto the wiring board 9.

Next, when the back surface 8 of the chip 5 is pressurized by the chip suction tool 1 and the chip 5 is heated to approximately 200 ° C. by a heater (not shown), the adhesive 12 is softened and spreads around the periphery. The bump electrode 7 comes into contact with the conductor 11. At this time, even if the adhesive goes around to the back surface via the side surface of the chip 5, the outer shape of the bottom surface 2 of the chip suction tool 1 is formed smaller than that of the chip 5, The effects can be avoided.

Next, when the heating is stopped, the adhesive 12 is naturally cooled and solidified. Therefore, as shown in FIG. 6, the space between the chip 5 and the wiring board 9 is held by the adhesive 12. Thus, a semiconductor device in which the chip 5 is flip-chip connected is manufactured. Also in this case, when the bump electrodes 7 are connected, the tip suction tool 1 is positioned on the back surface 8 of the chip 5 substantially corresponding to the arrangement 10 of the bump electrodes 7, and thus is similar to the above-described case. Effective pressing force acts only on the bump electrode 7. Therefore, variation in the pressure applied to the bump electrodes 7 is reduced, so that the bump electrodes 7 are satisfactorily connected to the conductors 11.

As described above, according to the configuration of this example, the bottom surface 2 of the chip suction tool 1 substantially corresponds to the surrounding array 10 of the plurality of bump electrodes 7 formed on the surface 6 of the chip 5. Since the projections 3 having a shape are provided so that the projections 3 are positioned on the back surface 8 of the chip 5 substantially corresponding to the arrangement 10 of the bump electrodes 7, the pressing force effective only for the bump electrodes 7 is used. , The variation in pressurization of the bump electrode 7 can be reduced. Therefore, the connection of the bump electrodes 7 is performed well, and the reliability of flip chip connection can be improved.

That is, the area of the chip suction surface is
Therefore, even if the swell occurs on the bottom surface 2 of the chip suction tool 1, the influence thereof can be almost ignored. Further, the probability that unnecessary foreign matter such as dust is present between the protrusion 3 and the chip 5 is reduced. In addition, since the finishing process need only be performed on the projection 3 having a small area, the processing is facilitated.

Second Embodiment FIG. 7 shows a chip suction tool according to a second embodiment of the present invention. FIG. 7 (a) is a bottom view, and FIG. 7 (b) is a C of FIG. 8A and 8B show a chip to which the chip suction tool of this example is applied, FIG. 8A is a bottom view, and FIG. 8B is a view of FIG. It is DD sectional drawing. The configuration of the chip suction tool of the second embodiment is significantly different from that of the first embodiment described above in that the projections are provided in a shape substantially corresponding to the double-enclosed arrangement of the bump electrodes. Is a point. That is, FIG.
As shown in FIG. 8, the protrusion 13 of the chip suction tool 15 of this example is attached to the surface 6 of the chip 5 shown in FIG.
Are formed in a shape substantially corresponding to the double surrounding array 16 of the plurality of bump electrodes 14 formed along the four sides of.

In order to perform flip-chip connection of the chip 5 using the chip suction tool 15 of this example, the surface 6
After the chip 5 on which a plurality of bump electrodes 14 are formed, the protrusion 13 is positioned on the back surface 8 of the chip 5 substantially corresponding to the arrangement 16 of the bump electrodes 14 and sucked by the chip suction tool 15. What is necessary is just to transfer to the wiring board 9 and to pressurize it similarly to the case of 1st Example. Other than this, it is substantially the same as the first embodiment described above. Therefore, in FIGS. 7 and 8, each part corresponding to the components in FIGS. 1 and 2 is denoted by the same reference numeral, and description thereof is omitted.

As described above, according to the configuration of this example, the protrusion 13 is used so as to be positioned on the back surface 8 of the same chip 5 substantially corresponding to the arrangement 16 of the bump electrodes 14. Since a large pressing force is applied, substantially the same effects as described in the first embodiment can be obtained.

Third Embodiment FIG. 9 shows a chip suction tool according to a third embodiment of the present invention. FIG. 9A is a bottom view, and FIG. FIG. 10 shows a chip to which the chip suction tool of this example is applied, wherein FIG. 10 (a) is a bottom view and FIG. 10 (b) is a view of FIG. It is FF arrow sectional drawing. The configuration of the chip suction tool of the third embodiment is greatly different from that of the first embodiment in that the projections are provided in a shape substantially corresponding to the parallel row arrangement of the bump electrodes. is there. That is, as shown in FIG. 9, the protrusion 1 of the chip suction tool 17 of this example is used.
8 and 19 are a plurality of bump electrodes 20 formed on the surface 6 of the chip 5 shown in FIG.
Are provided in a shape substantially corresponding to the parallel-row arrays 21 and 22.

Here, since the projections 18 and 19 do not completely surround the periphery of the suction hole 4, vacuum leakage occurs when the chip 5 is suctioned. Therefore, in order to suppress the vacuum leakage as much as possible, for example, a ring-shaped endless projection 23 is provided at the edge of the suction hole 4. It is desirable that the height of the endless projection 23 is close to the height of the projections 18 and 19, but this height is 50 to 90 of that of the projections 18 and 19 due to processing accuracy. % Value.

In order to carry out the flip chip connection of the chip 5 using the chip suction tool 17 of this example, the surface 6
The chip 5 on which a plurality of bump electrodes 20 are formed is positioned on the back surface 8 of the chip 5 by the chip suction tool 17 so that the projections 18 and 19 respectively correspond to the arrangements 21 and 22 of the bump electrodes 20 respectively. After that, it may be transferred onto the wiring board 9 and pressurized in substantially the same manner as in the first embodiment.

As described above, according to the structure of this embodiment, the bumps 18 and 19 are used so as to be positioned on the back surface 8 of the chip 5 substantially corresponding to the arrangements 21 and 22 of the bump electrodes 20. Since an effective pressurizing force is applied only to the surface 20, substantially the same effects as described in the first embodiment can be obtained.

Fourth Embodiment FIG. 11 shows a chip suction tool according to a fourth embodiment of the present invention. FIG. 11 (a) is a bottom view, and FIG. 11 (b) is G in FIG. FIG. 12 shows a chip to which the same tool for suctioning a chip of this example is applied, FIG. 12 (a) is a bottom view, and FIG. 12 (b) is H in FIG. FIG. The configuration of the chip suction tool of the fourth embodiment is significantly different from that of the first embodiment in that the projections are provided in a shape substantially corresponding to the staggered arrangement of the bump electrodes. is there. That is, as shown in FIG. 11, the projections 25 to 29 of the chip suction tool 24 of this example are arranged in a staggered array of a plurality of bump electrodes 30 formed on the surface 6 of the chip 5 shown in FIG. 31-3
5 are provided. An endless projection 36 is provided at the edge of the suction hole 4.

In order to carry out the flip chip connection of the chip 5 by using the chip suction tool 24 of this example, the surface 6
The chip 5 on which a plurality of bump electrodes 30 are formed is positioned on the rear surface 8 of the chip 5 by using the chip suction tool 24 so that the protrusions 25 to 29 respectively substantially correspond to the arrangements 31 to 35 of the bump electrodes 30. After that, it may be transferred onto the wiring board 9 and pressurized in substantially the same manner as in the first embodiment.

As described above, according to the configuration of this embodiment, the bumps 25 to 29 are used so as to be positioned on the back surface 8 of the chip 5 substantially corresponding to the arrangements 31 to 35 of the bump electrodes 30. Since an effective pressurizing force is applied only to 30, substantially the same effects as described in the first embodiment can be obtained.

Fifth Embodiment FIGS. 13A and 13B show a chip suction tool according to a fifth embodiment of the present invention. FIG. 13A is a bottom view, and FIG. FIG. 14 shows a chip to which the chip suction tool of this example is applied, FIG. 14 (a) is a bottom view, and FIG. 14 (b) is a view of FIG. It is JJ arrow sectional drawing. The configuration of the chip suction tool of the fifth embodiment is significantly different from that of the first embodiment in that the protrusions are provided in a shape substantially corresponding to the arrangement of the bump electrodes in one row. . That is, as shown in FIG. 13, the protrusion 3 of the chip suction tool 37 of this example is used.
8 is formed on the surface 6 of the chip 5 shown in FIG.
The bump electrodes 40 are provided in a shape substantially corresponding to the one-row array 41. In addition, since the bump electrodes 40 are provided in only one row, the bumps may be tilted when the chip 5 is sucked. Is provided with a reinforcing projection 39. The height and width of the reinforcing projection 39 are selected in substantially the same manner as the projection 38. In the case of this example, since the projection 38 and the reinforcing projection 39 are provided in contact with the suction hole 4, the endless projection is unnecessary.

In order to perform flip-chip connection of the chip 5 by using the chip suction tool 37 of this example, the surface 6
After the chip 5 on which a plurality of bump electrodes 40 are formed, the protrusion 38 is positioned on the back surface 8 of the chip 5 substantially corresponding to the arrangement 41 of the bump electrodes 40 and sucked by the chip suction tool 37. What is necessary is just to transfer to the wiring board 9 and to pressurize it similarly to the case of 1st Example. In this case, since the protrusion 38 is combined with the reinforcing protrusion 39, the chip 5 is stably sucked.

As described above, according to the configuration of this example, the protrusions 38 are used so as to be positioned on the back surface 8 of the chip 5 substantially corresponding to the arrangement 41 of the bump electrodes 40, so that only the bump electrodes 40 are effective. Since a large pressing force is applied, substantially the same effects as described in the first embodiment can be obtained.

Although the embodiment of the present invention has been described in detail with reference to the drawings, the specific configuration is not limited to this embodiment, and there may be changes in the design without departing from the gist of the present invention. Is also included in the present invention. For example, the values of the height and width of the protrusion, the thickness of the chip, the diameter and height of the bump electrode, etc. are merely examples, and can be changed according to the purpose, application, and the like. Further, the material of the bump electrode is not limited to gold, and a material having excellent conductivity such as copper and solder can be selected. When a low-melting-point material such as solder is used as the bump electrode, the chip can be crushed only by pressing, so that it is not always necessary to heat the chip when pressing the chip. Further, the present invention can also be applied to a method of completely melting a bump electrode and performing flip chip connection.

[0047]

As described above, according to the semiconductor chip suction tool and apparatus of the present invention and the method for manufacturing a semiconductor device using the tool, the bottom surface of the chip suction tool is formed on the surface of the chip. A projection having a shape substantially corresponding to the arrangement of the plurality of bump electrodes provided is provided, and the projection is used so as to be positioned on the back surface of the same chip substantially corresponding to the arrangement of the bump electrodes. Only the effective pressing force acts, so that the variation in the pressing of the bump electrodes can be reduced. Therefore, the connection of the bump electrodes is performed satisfactorily, so that the reliability of the flip chip connection can be improved.

[Brief description of the drawings]

FIG. 1 shows a semiconductor chip suction tool according to a first embodiment of the present invention, wherein (a) is a bottom view and (b) is A in (a).
It is sectional drawing in the -A arrow direction.

2A and 2B show a semiconductor chip to which the semiconductor chip suction tool is applied, wherein FIG. 2A is a bottom view and FIG.
FIG.

FIG. 3 is a process diagram showing a method of manufacturing a semiconductor device using the semiconductor chip suction tool in the order of processes.

FIG. 4 is a process chart showing a method of manufacturing a semiconductor device using the semiconductor chip suction tool in the order of steps.

FIG. 5 is a process diagram showing a method of manufacturing another semiconductor device using the semiconductor chip suction tool in the order of processes.

FIG. 6 is a process chart showing a method of manufacturing another semiconductor device using the semiconductor chip suction tool in the order of steps.

FIGS. 7A and 7B show a semiconductor chip suction tool according to a second embodiment of the present invention, wherein FIG. 7A is a bottom view and FIG.
It is sectional drawing in the -C arrow direction.

8A and 8B show a semiconductor chip to which the semiconductor chip suction tool is applied, wherein FIG. 8A is a bottom view and FIG.
FIG.

FIGS. 9A and 9B show a semiconductor chip suction tool according to a third embodiment of the present invention, wherein FIG. 9A is a bottom view and FIG.
It is an E sectional view taken on the arrow.

10A and 10B show a semiconductor chip to which the semiconductor chip suction tool is applied, wherein FIG. 10A is a bottom view, and FIG. 10B is a cross-sectional view taken along line FF of FIG.

11A and 11B show a semiconductor chip suction tool according to a fourth embodiment of the present invention, wherein FIG. 11A is a bottom view and FIG. 11B is a sectional view taken along line GG of FIG.

12A and 12B show a semiconductor chip to which the semiconductor chip suction tool is applied, wherein FIG. 12A is a bottom view and FIG. 12B is a cross-sectional view taken along line HH of FIG.

13A and 13B show a semiconductor chip suction tool according to a fifth embodiment of the present invention, wherein FIG. 13A is a bottom view and FIG. 13B is a cross-sectional view taken along line II of FIG.

14A and 14B show a semiconductor chip to which the semiconductor chip suction tool is applied, wherein FIG. 14A is a bottom view, and FIG. 14B is a cross-sectional view of FIG.

FIG. 15 is a cross-sectional view showing a conventional semiconductor chip suction tool.

FIG. 16 is a cross-sectional view for explaining a problem of the semiconductor chip suction tool.

FIG. 17 is a cross-sectional view explaining a problem of the semiconductor chip suction tool.

[Explanation of symbols]

1, 15, 17, 24, 37 Tool for sucking semiconductor chips 2 Bottom surface 3, 13, 18, 19, 25, 26, 27, 28, 2
9, 38 Projection 4 Adsorption hole 5 Semiconductor chip 6 Surface of semiconductor chip 7, 14, 20, 30, 40 Bump electrode 8 Backside of semiconductor chip 9 Wiring board 10, 16, 21, 22, 31, 32, 33, 34 , 3
5, 41 Arrangement of bump electrodes 11 Conductor 12 Adhesive 23, 36 Endless projection 39 Reinforcement projection

Claims (9)

[Claims] 1. A semiconductor chip suction tool for sucking a semiconductor chip having a plurality of bump electrodes formed on a front surface from a back surface and connecting the semiconductor chip to a wiring board by flip-chip bonding. A tool for suctioning a semiconductor chip, wherein a projection having a substantially equivalent shape is provided on a bottom surface, and the projection is used to be positioned on a back surface of the semiconductor chip substantially corresponding to the arrangement. 2. The tool for suctioning a semiconductor chip according to claim 1, wherein the projection is provided so as to completely surround a suction hole formed at a substantially central position of the bottom surface. . 3. A structure in which the protrusion does not completely surround the periphery of the suction hole, wherein an endless protrusion lower than the height of the protrusion is provided at an edge of the suction hole. The tool for suctioning a semiconductor chip according to claim 1. 4. The tool according to claim 1, wherein the height of the projection has a value of 50 to 150% of the thickness of the semiconductor chip. . 5. The semiconductor chip attracting device according to claim 1, wherein the width of the protrusion has a value of 200 to 400% of the diameter of the bump electrode. tool. 6. The semiconductor chip according to claim 3, wherein the height of the endless projection has a value of 50 to 90% of the height of the projection. Tool for suction. 7. The tool according to claim 1, wherein an outer periphery of the bottom surface is set smaller than that of the semiconductor chip. 8. A method for manufacturing a semiconductor device using the tool for suctioning a semiconductor chip according to claim 1, wherein the bump electrodes are arranged substantially in a semiconductor chip having a plurality of bump electrodes formed on a surface thereof. A semiconductor chip suction tool positioning step of positioning the protrusion on the back surface of the semiconductor chip substantially corresponding to the array, using a semiconductor chip suction tool provided with a projection having a corresponding shape on the bottom surface; A semiconductor chip transfer step of sucking a chip by the semiconductor chip suction tool and transferring the chip onto a wiring board; and bringing the bump electrode of the semiconductor chip into contact with a conductor on the wiring board by the semiconductor chip suction tool. And a flip-chip connection step of pressing the semiconductor chip from the back surface after the contact. 9. The method for manufacturing a semiconductor device according to claim 8, wherein in the flip chip connecting step, the semiconductor chip is heated by the semiconductor chip suction tool. Production method.