JPH11307588A - Bonding tool and bonding device for electronic components - Google Patents

Abstract

An object of the present invention is to provide a bonding tool and a bonding apparatus for an electronic component capable of uniformly transmitting symmetrical ultrasonic vibration to an electronic component and obtaining stable bonding quality. SOLUTION: In a bonding apparatus for an electronic component, an electronic component is held on a bonding tool by vacuum suction, and the electronic component is pressed against a surface to be compressed by applying vibration while being pressed against the surface to be compressed. Inner holes 16a and 16b formed inside for sucking electronic components
Are arranged substantially symmetrically in each of the XYZ directions about the holding portion 15f. As a result, unevenness of the mass distribution of the bonding tool can be reduced, symmetrical vibration can be transmitted uniformly to the electronic component, and stable bonding without variation can be performed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component bonding tool and a bonding apparatus for bonding an electronic component to a surface to be compressed such as a substrate.

[0002]

2. Description of the Related Art A method using ultrasonic pressure welding is known as a method of joining an electronic component such as a bumped electronic component to a surface to be compressed such as a substrate. In this method, ultrasonic vibration is applied while pressing the bumps of the electronic component against the substrate, and the bonding surfaces are rubbed against each other for bonding. Prior to bonding, an electronic component is mounted at a predetermined position on a substrate. For efficiency, it is common to perform this mounting operation and the above-described bonding operation continuously in the same process and in the same apparatus. For this reason, the above-mentioned bonding tool which is also used as a suction tool for holding an electronic component by vacuum suction has been widely used. As a result, the bonding tool is provided with a suction hole, a suction hole for vacuum suction, and the like.

[0003]

However, in order to perform good bonding using ultrasonic pressure welding, uniform ultrasonic vibration is applied to the electronic component while the electronic component is uniformly pressed against the surface to be compressed without inclination. Need to communicate to parts. For this purpose, it is necessary that the holding unit for holding and pressing the electronic component is maintained in a good parallelism so that the electronic component can be pressed in a good posture, and the holding unit for pressing the electronic component uniformly from the bonding tool, that is, the electronic component, Vibration substantially symmetrical with respect to the center of the electronic component needs to be transmitted to the electronic component. The vibration is transmitted from the ultrasonic vibrator mounted on the horn of the bonding tool to the electronic component via the horn.

However, since the inner hole formed inside the bonding tool, such as the above-described suction hole for vacuum suction of the electronic component, is provided only in a specific portion of the bonding tool, the symmetry of the mass distribution of the bonding tool is reduced. Spoil. As a result, when the vibration transmitted from the ultrasonic transducer is transmitted to the electronic component via the horn of the bonding tool, asymmetric vibration due to the above-described asymmetry of the mass distribution is induced.

However, in the conventional electronic component bonding tool, the influence of an inner hole such as a suction hole on the symmetry of vibration of the bonding tool when the vacuum suction function is provided is not particularly considered. As a result, in the conventional bonding apparatus, there is a problem that the asymmetric vibration causes a variation in bonding quality at the time of bonding.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a bonding tool and a bonding apparatus for an electronic component capable of uniformly transmitting symmetrical ultrasonic vibrations to the electronic component and obtaining stable bonding quality.

[0007]

According to a first aspect of the present invention, there is provided a bonding tool for an electronic component, wherein the electronic component is held by vacuum suction, and vibration is applied while pressing the electronic component against the surface to be compressed. A bonding tool for an electronic component to be crimped, comprising: a horn vibrating by a vibrator; a holding portion for an electronic component formed at a position corresponding to an antinode of a standing wave of vibration of the horn; A first hole formed substantially symmetrically in each of the XYZ directions around the holding portion along a direction, and a second hole having one end open to the holding portion and the other end communicating with the first hole. A hole and a third hole having one end open to the outer surface of the horn other than the holding portion and the other end communicating with the first hole, and a pipe connected to a suction device is connected to the third hole. .

According to a second aspect of the present invention, in the electronic component bonding tool according to the first aspect, the third hole is located at a position corresponding to a node of a standing wave of vibration of the horn. As if it had been formed.

According to a third aspect of the present invention, there is provided the electronic component bonding tool according to the first aspect, wherein the tip of the second hole has the tip with respect to the longitudinal axis of the horn. It reached to the projection provided symmetrically with the part.

According to a fourth aspect of the present invention, in the electronic component bonding tool, the second hole is formed from a large-diameter hole formed symmetrically with the holding portion and formed from a projecting portion side, and from the holding portion side. The small diameter hole is formed by drilling, and the small diameter hole is drilled after drilling the large diameter hole in the part processing step.

According to a fifth aspect of the present invention, there is provided an electronic component bonding apparatus for holding an electronic component on a bonding tool by vacuum suction, applying vibration to the electronic component while pressing the electronic component against the surface, and pressing the electronic component onto the surface. A component bonding apparatus, comprising: an elevating member that moves up and down with respect to a surface to be pressed, a bonding tool fixed to the elevating member, wherein the bonding tool vibrates by a vibrator; A holding portion of the electronic component formed at a position corresponding to the antinode of the standing wave of the vibration, and a symmetrically formed inside the horn along the longitudinal direction in the XYZ directions around the holding portion along the longitudinal direction. A first hole, a second hole having one end opened to the holding portion and the other end communicating with the first hole, and a first hole opened at an outer surface of the horn other than the holding portion and the other end connected to the first hole. Communicating with the hole A third hole that was to connect a pipe connected to a suction device in the third hole.

According to the present invention, the first holes for sucking electronic components formed inside the bonding tool are formed in the XYZ directions around the holding portion along the longitudinal direction of the bonding tool. By forming approximately symmetric,
Nonuniformity of the mass distribution of the bonding tool can be reduced, and symmetrical vibration can be transmitted uniformly to the electronic component.

[0013]

Next, embodiments of the present invention will be described with reference to the drawings. 1 is a front view of an electronic component bonding apparatus according to an embodiment of the present invention, FIG. 2 is a perspective view of a bonding tool of the electronic component, and FIG. 3A is a front view of a bonding tool of the electronic component. 3B is a plan view of a bonding tool of the electronic component, and FIG. 4 is a partial cross-sectional view of the bonding tool of the electronic component.

First, the overall structure of an electronic component bonding apparatus will be described with reference to FIG. Reference numeral 1 denotes a support frame, on the front surface of which a first lifting plate 2 and a second lifting plate 3 are provided so as to be able to move up and down. A cylinder 4 is mounted on the first lifting plate 2, and its rod 5 is connected to the second lifting plate 3. The bonding head 10 is mounted on the second lifting plate 3. On the upper surface of the support frame 1, a Z-axis motor 6 is provided. The Z-axis motor 6 has a vertical feed screw 7
To rotate. The feed screw 7 is screwed into a nut 8 provided on the back surface of the first lifting plate 2. Therefore, when the Z-axis motor 6 is driven and the feed screw 7 is rotated, the nut 8 moves up and down along the feed screw 7, and the first lifting plate 2 and the second lifting plate 3
Also move up and down.

In FIG. 1, a substrate 32 as a surface to be pressed is
Is placed on the substrate holder 34 and the substrate holder 34
Are placed on the table 35. The table 35 is a movable table, and horizontally moves the substrate 32 in the X direction and the Y direction to position the substrate 32 at a predetermined position.

Reference numeral 42 denotes a camera, which is a uniaxial table 43
It is attached to. Reference numeral 44 denotes a lens barrel extending forward from the camera 42. The camera 42 is moved forward along the one-axis table 43, and the tip of the lens barrel 44 is positioned between the electronic component 30 and the substrate 32 held by suction on the lower surface of the bonding tool 14 as shown by a chain line. Electronic parts 3
0 and the position of the substrate 32 are observed by the camera 42. Then, a relative displacement between the electronic component 30 and the substrate 32 is detected based on the observation result. The detected misalignment is stored in table 3
5 is driven to move the board 32 horizontally in the X direction or the Y direction, whereby the electronic component 30 and the board 3 are corrected.
2 is performed.

In FIG. 1, reference numeral 50 denotes a main control unit which controls the Z-axis motor 6 via a motor drive unit 51, controls the table 35 via a table control unit 52, and recognizes via a recognition unit 53 Connected to the camera 42. Further, the cylinder 4 is connected to the main control unit 50 via a load control unit 54, and the protrusion output of the rod 5 of the cylinder 4, that is, the pressing load for pressing the electronic component 30 against the substrate 32 by the bonding tool 14 is controlled.

A holder 12 is connected to the lower end of the main body 11 of the bonding head 10. A block 13 is mounted on the holder 12 as a lifting member.
Is fixed to the bonding tool 14. Less than,
The block 13 and the bonding tool 14 will be described with reference to FIGS.

As shown in FIG. 2, the bonding tool 1
The fourth horn 15 is an elongated rod-like body, and mounting seats 15 a are provided integrally with the horn 15 on four sides of the horn 15 at equal distances from the center of the horn 15. The bonding tool 14 is fixed to the lower surface of the block 13 by a mounting seat 15a. That is, the mounting seat 15
a is a fixing portion for fixing the horn 15.

A holding portion 15e, which projects downward and holds the electronic component 30 by vacuum suction, is provided on the lower surface at the center of the bonding tool 14. The lower surface of the holding portion 15e has a suction surface 15f for electronic component suction. Has become. Here, an inner hole for vacuum suction formed inside the horn 15 will be described with reference to FIGS. 3 (a) and 3 (b). As shown in FIG. 3A, the inside of the horn 15 is substantially symmetric about the holding portion 15 e along the longitudinal direction of the horn 15.
6a (first hole) is formed. The position of the inner hole 16a is set in the horn 15 so as to be symmetrical in each of the X, Y, and Z directions.

The inner hole 16a is formed by drilling from the side where the vibrator 17 is mounted. At the time of drilling, the tip of the drill does not penetrate the end face of the horn 15 on the opposite side of the vibrator 17, and An opening P on the left end face of the horn 15 is provided with an embedding plug P for maintaining airtightness. By arranging the inner holes 16a symmetrically in the horn 15 in this manner, the mass distribution of the horn 15 can be made symmetric, and thus the rigidity distribution of the horn 15 can be made symmetric.

The inner hole 16a communicates with an inner hole 16b (a second hole) which is open at one end to the holding portion 15e to form a suction hole. The inner hole 16b is formed at the position of the longitudinal center line of the horn 15 from the suction surface 15f side. At the time of drilling, the tip of the drill has a projection 15g provided symmetrically with the holding portion 15e with respect to the longitudinal axis of the horn 15.
To reach. Thereby, the unevenness of the mass distribution of the horn 15 due to the formation of the inner hole 16b can be minimized.

If it is difficult to drill the holes 16a and 16b from only one side due to the relationship between the drill diameter and the hole depth, the holes are drilled from both sides. 4a, after processing,
As shown in (b), the plug P may be applied to an unnecessary opening created by the boring process. Further, in the process of forming the inner hole 16b, as shown in FIG. 4C, the inner hole 16b may be constituted by a drill hole having two types of diameters, a large diameter hole and a small diameter hole. That is, first, the large-diameter hole 16b-A is drilled from the projection 15g side,
The drill is sent to a position where a predetermined thickness is left in the holding unit 15e.
Next, a small-diameter hole 16b-
The drilling of B is performed. Then, an embedding plug P is applied to the opening on the unnecessary protrusion side. By employing such a processing step, it is possible to easily process a small-diameter hole that is difficult to process.

The inner hole 16a communicates with an inner hole 16c (third hole) having one end opened on the upper surface of the horn 15. The opening of the inner hole 16c on the upper surface of the horn 15 is a suction hole connected to a suction device. As described later, the position where the inner hole 16c is formed is set to be a position corresponding to a node of the standing wave vibration generated in the horn 15.

The protrusion 13 provided on the side surface of the block 13
a is provided with a pipe 18 projecting downward, and the suction pad 19 attached to the lower end of the pipe 18
5 is in contact with the opening of the inner hole 16c on the upper surface. Therefore, the inner hole 16c is connected to the suction device 21 via the pipe 20 which is connected to the protrusion 13a and communicates with the pipe 18 through the inner hole 13b of the protrusion 13a. By driving the suction device 21 to suction air, vacuum suction is performed from the inner hole 16b (FIG. 3B) opened on the suction surface 15f, and the electronic component 30 is suction-held on the suction surface 15f and held. be able to.

A vibrator 17 is mounted on a side end surface of the horn 15. By driving the vibrator 17, longitudinal vibration is applied to the horn 15, and the holding portion 15e vibrates in the horizontal direction. As shown in FIG. 3B, the shape of the horn 15 is changed from the both ends 15b to the central portion 15 via the tapered portion 15c.
The width is sequentially reduced in the direction of d, whereby the amplitude of the ultrasonic vibration is amplified in the path transmitted from the vibrator 17 to the holding portion 15e, and the vibrator 17 is mounted on the holding portion 15e. Vibration with an amplitude greater than the oscillating amplitude is transmitted.

Next, a mode of vibration excited by the vibrator 17 to the horn 15 will be described. As shown in FIG. 3A, the standing wave of the vibration excited by the horn 15 is
The position of the mounting surface of the vibrator 17 and the position of the holding portion 15e located at the center of the horn 15 are the antinodes of the standing wave, and the positions of the mounting seat 15a and the inner hole 16c as the fixing portion for fixing the horn 15 to the block 13 are fixed. It is shaped to be a node of the surf. That is, such a standing wave can be generated in the horn 15 by appropriately setting the shape, dimensions, and mass distribution of each part of the horn 15.

Therefore, the mounting seat 15a, which is a fixed portion,
It is integrally provided at a position corresponding to a node of the standing wave, which is equidistant from the holding portion 15e in a direction corresponding to the antinode of the standing wave of the vibration of the horn 15 toward both ends of the horn 15. . Accordingly, the displacement of the horn 15 due to the longitudinal vibration is minimized at the position of the mounting seat 15a to which the bonding tool 14 is fixed, and the holding portion 15e holding the electronic component 30
At the position, the maximum amplitude is obtained, and the ultrasonic vibration can be used most effectively for bonding the electronic component 30. Further, by integrating the mounting seat 15a with the horn 15, the mounting of the bonding tool 14 to the block 13 (elevating member) can be performed with good workability.

Further, by setting the position of the inner hole 16c to a position corresponding to a node of the standing wave, loss of vibration energy due to propagation of the ultrasonic vibration to the outside via the vacuum suction pipe is reduced. It is possible to reduce the vibration and perform efficient bonding with good vibration utilization efficiency.

This electronic component bonding apparatus is configured as described above, and the operation will be described next. In FIG. 1, the electronic component 30 is held on the suction surface 15 e of the bonding tool 14 by vacuum suction and positioned above the substrate 32. Then, the lens barrel 44 is advanced, the camera 42 obtains images of the electronic component 30 and the substrate 32, and the image data is sent to the recognition unit 53. The main control unit 50 detects a relative displacement between the electronic component 30 and the board 32 from the image data, drives the table 35 in accordance with the detection result, and
2 is moved horizontally to perform position correction.

Next, the Z-axis motor 6 is driven to lower the bonding head 10, and the bumps of the electronic component 30 are
Press At this time, the substrate 32 is heated by a heating means (not shown). Then, the vibrator 17 is
To apply vibration to the electronic component 30. As a result, the pressing surface between the bump 31 and the electrode of the substrate 32 is rubbed by vibration, and the bump 31 is bonded to the electrode of the substrate 32.

At this time, the horn 1 is controlled so that the mass distribution of the horn 14 is as symmetrical as possible with respect to the holding portion 15f.
Since the inner holes in 5 are arranged, the vibration transmitted from horn 14 to electronic component 30 via holding portion 15f is symmetric with respect to the center of electronic component 30. Therefore, the electronic component 30 is uniformly and uniformly bonded to the electrodes of the substrate 32.

[0033]

According to the present invention, an internal hole for sucking electronic components formed inside a bonding tool is formed in XYZ around the holding portion along the longitudinal direction of the bonding tool.
By forming the bonding tool substantially symmetrical in the direction, unevenness of the mass distribution of the bonding tool can be reduced, and symmetrical vibration can be uniformly transmitted to the electronic component, so that uniform bonding without variation can be performed.

[Brief description of the drawings]

FIG. 1 is a front view of an electronic component bonding apparatus according to an embodiment of the present invention.

FIG. 2 is a perspective view of an electronic component bonding tool according to an embodiment of the present invention.

3A is a front view of an electronic component bonding tool according to an embodiment of the present invention; FIG. 3B is a plan view of an electronic component bonding tool according to an embodiment of the present invention;

4A is a partial cross-sectional view of a bonding tool for an electronic component according to an embodiment of the present invention. FIG. 4B is a partial cross-sectional view of a bonding tool for an electronic component according to an embodiment of the present invention. Partial sectional view of an electronic component bonding tool according to one embodiment.

[Explanation of symbols]

 Reference Signs List 10 bonding head 13 block 14 bonding tool 15 horn 15a mounting seat 15e holding portion 15f suction surface 15g protrusion 16a, 16b, 16c inner hole 17 vibrator 19 suction pad 21 suction device 30 electronic component 32 substrate 50 main control portion

Claims (5)

[Claims] An electronic component bonding tool for holding an electronic component by vacuum attraction, applying vibration while pressing the electronic component against a surface to be compressed, and pressing the electronic component against the surface to be compressed.
A horn vibrated by a vibrator, a holding portion of an electronic component formed at a position corresponding to an antinode of a standing wave of vibration of the horn, and a center of the holding portion along the longitudinal direction inside the horn. XYZ first symmetrically formed in each direction
And a second hole having one end open to the holding portion and the other end communicating with the first hole, and one end opening to the outer surface of the horn other than the holding portion, and the other end forming the first hole. An electronic component bonding tool, comprising: a third hole communicating with the first hole; and a pipe connected to a suction device connected to the third hole. 2. The electronic component bonding tool according to claim 1, wherein the third hole is formed at a position corresponding to a node of a standing wave of vibration of the horn. 3. The horn according to claim 2, wherein the tip of the second hole reaches a projection provided symmetrically with the holding portion with respect to a longitudinal axis of the horn. Bonding tool for electronic components. 4. The second hole comprises a large-diameter hole formed symmetrically with the holding portion and formed with a hole from the projection side, and a small-diameter hole formed with a hole from the holding portion side. The electronic component bonding tool according to claim 1, wherein the small diameter hole is drilled after the large diameter hole is drilled in the component processing step. 5. A bonding apparatus for an electronic component, wherein an electronic component is held on a bonding tool by vacuum suction, and the electronic component is pressed against a surface to be compressed by applying vibration while being pressed against the surface to be compressed. A lifting tool that moves up and down with respect to the surface; and a bonding tool fixed to the lifting member. The bonding tool corresponds to a horn that vibrates by a vibrator and an antinode of a standing wave of vibration of the horn. And a holding portion for the electronic component formed at a position corresponding to the center of the holding portion along the longitudinal direction inside the horn.
A first hole formed substantially symmetrically in each of the YZ directions, and a second hole having one end open to the holding portion and the other end communicating with the first hole.
And a third hole having one end opened to the outer surface of the horn other than the holding portion and the other end communicating with the first hole.
An electronic component bonding apparatus, wherein a pipe connected to a suction device is connected to the hole.