JPH11307901A - Electronic device and method for manufacturing the electronic device - Google Patents

Electronic device and method for manufacturing the electronic device

Info

Publication number
JPH11307901A
JPH11307901A JP10729798A JP10729798A JPH11307901A JP H11307901 A JPH11307901 A JP H11307901A JP 10729798 A JP10729798 A JP 10729798A JP 10729798 A JP10729798 A JP 10729798A JP H11307901 A JPH11307901 A JP H11307901A
Authority
JP
Japan
Prior art keywords
frame
terminal
conductive pattern
terminal member
electronic device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP10729798A
Other languages
Japanese (ja)
Inventor
Norio Suzuki
典雄 鈴木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alps Alpine Co Ltd
Original Assignee
Alps Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alps Electric Co Ltd filed Critical Alps Electric Co Ltd
Priority to JP10729798A priority Critical patent/JPH11307901A/en
Publication of JPH11307901A publication Critical patent/JPH11307901A/en
Withdrawn legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)

Abstract

PROBLEM TO BE SOLVED: To prevent a terminal part and a connector from solder peeling by firmly securing a terminal member by a supporting part of the terminal member between a printed board and a frame body in a notch part. SOLUTION: A notch part 1a, a pair of corresponding parts 1b made of both side steps, an equipping chip 1c which is adjacent to this and a convex part 1e of an upper side 1d of the notch part 1a are provided at the lower part of a metallic frame body 1 which opens up and down. A conductive pattern 3 is formed on the lower surface of a printed board 2 having a projecting part 2a and a hole 2b and several electric parts which are connected with the conductive pattern 3 are provided on the upper and lower surfaces. A supporting part 4a made of synthetic resin insulating material is provided at a terminal member 4 and an L type metallic terminal part 4b which is buried and is equipped with the supporting part is provided. The supporting part 4a is mounted on the upper surface of the printed board 2, the terminal part 4b is inserted through the hole 2b and the terminal part 4b is soldered with the conductive pattern. The projecting part 2a is made to locate at the notch part 1a of the frame body 1 and an equipping chip 1c is folded by contacting with a pair of corresponding parts 1b from the lower part and is equipped with the frame body 1 which put the printed board 2 between.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、テレビジョンチュ
ーナ等に使用して好適な電子機器に関する。
The present invention relates to an electronic apparatus suitable for use in a television tuner or the like.

【0002】[0002]

【従来の技術】従来の電子機器を図4〜図6に基づいて
説明すると、金属板からなり、上下が開放されたロ形の
枠体21は、下部に設けられた切り欠き部21aと、切
り欠き部21aの両側に設けられた段部からなる一対の
当て部21bと、一対の当て部21bに隣接して設けら
れた取付片21cとを有している。また、プリント基板
22は、突部22aと、孔22bを有し、更に、プリン
ト基板22の下面に導電パターン23が形成され、この
プリント基板22の上下面には、導電パターン23に接
続された種々の電気部品(図示せず)が配設されてい
る。
2. Description of the Related Art A conventional electronic device will be described with reference to FIGS. 4 to 6. A rectangular frame 21 made of a metal plate and having an open top and bottom is provided with a notch 21a provided at a lower portion, It has a pair of abutting portions 21b formed of step portions provided on both sides of the notch portion 21a, and a mounting piece 21c provided adjacent to the pair of abutting portions 21b. The printed board 22 has a protrusion 22a and a hole 22b. Further, a conductive pattern 23 is formed on the lower surface of the printed board 22, and the upper and lower surfaces of the printed board 22 are connected to the conductive pattern 23. Various electrical components (not shown) are provided.

【0003】そして、このプリント基板22は、突部2
2aを枠体21の切り欠き部21aに位置させた状態
で、枠体21の下部から枠体21内に収納すると共に、
突部22aを枠体21の一対の当て部21bに当接した
状態で、取付片21cを折り曲げて、当て部21bと取
付片21cとでプリント基板22を挟持して、プリント
基板22を枠体21に取り付けている。
[0003] The printed circuit board 22 is
In a state where 2a is positioned in the cutout portion 21a of the frame 21, the lower portion of the frame 21 is stored in the frame 21 from below, and
With the protrusion 22a in contact with the pair of abutting portions 21b of the frame 21, the mounting piece 21c is bent, and the printed board 22 is sandwiched between the abutting portion 21b and the mounting piece 21c, and the printed board 22 is 21.

【0004】また、端子部材24は、合成樹脂の絶縁材
からなる支持部24aと、この支持部24aに埋設して
取り付けられた金属の端子部24bとを有し、この端子
部材24は、支持部24aをプリント基板22の上面に
載置すると共に、端子部24bをプリント基板22の孔
22bに挿通し、端子部24bが導電パターン23に半
田付けされている。そして、端子部材24がプリント基
板22に取り付いた状態では、支持部24aが切り欠き
部21a内に位置すると共に、支持部24aと切り欠き
部21aの上辺21dとの間には、隙間が設けられてい
る。そして、このような電子機器は、テレビションセッ
ト内に組み込まれ、端子部24bにコネクタ(図示せ
ず)を接続して使用されるようになっている。
The terminal member 24 has a support portion 24a made of a synthetic resin insulating material and a metal terminal portion 24b buried and attached to the support portion 24a. The part 24 a is placed on the upper surface of the printed board 22, and the terminal part 24 b is inserted into the hole 22 b of the printed board 22, and the terminal part 24 b is soldered to the conductive pattern 23. When the terminal member 24 is attached to the printed circuit board 22, the support portion 24a is located within the cutout portion 21a, and a gap is provided between the support portion 24a and the upper side 21d of the cutout portion 21a. ing. Such an electronic device is incorporated in a television set, and is used by connecting a connector (not shown) to the terminal portion 24b.

【0005】そして、このような電子機器の製造方法
は、先ず、プリント基板22の上面に各種の電気部品
(図示せず)、及び、端子部材24の支持部24aを載
置した状態で、このプリント基板22をディップ半田付
け装置に搬送して、電気部品を導電パターン23に半田
付けすると共に、端子部材24の端子部24bを導電パ
ターン23に半田付けする。次に、支持部24aに切り
欠き部21aを合わせた状態で、枠体21をプリント基
板22に組み合わせ、しかる後、取付片21cを折り曲
げて、プリント基板22と枠体21とを取り付けて、そ
の製造が完了する。そして、このような製造方法におい
ては、端子部材24をプリント基板22に半田付けする
工程において、プリント基板22の移動時の振動、或い
は端子部24bの重みによって、端子部材24は、図6
において、線Sで示すように傾いた状態となるものであ
った。
[0005] In such a method of manufacturing an electronic device, first, various electric components (not shown) and a support portion 24 a of the terminal member 24 are placed on the upper surface of the printed circuit board 22. The printed circuit board 22 is transported to a dip soldering apparatus, and the electric component is soldered to the conductive pattern 23 and the terminal portions 24b of the terminal members 24 are soldered to the conductive pattern 23. Next, the frame 21 is combined with the printed circuit board 22 in a state where the notch 21a is aligned with the support portion 24a. Thereafter, the mounting piece 21c is bent, and the printed circuit board 22 and the frame 21 are attached. Manufacturing is completed. In such a manufacturing method, in the step of soldering the terminal member 24 to the printed board 22, the terminal member 24 is moved to the position shown in FIG.
In the above, the state was inclined as shown by the line S.

【0006】[0006]

【発明が解決しようとする課題】従来の電子機器は、プ
リント基板22上に載置された端子部材24の支持部2
4aと枠体21の切り欠き部21aの上辺21dとの間
に隙間があるため、端子部材24の支持が弱く、このた
め、コネクタを端子部24bに接続するとき、端子部2
4aに強い外力がかかると、半田付け部が剥がれるとい
う問題がある。また、その製造においては、端子部材2
4をプリント基板22に半田付けする工程において、プ
リント基板22の移動時の振動、或いは端子部24bの
重みによって、端子部材24は、線Sで示すように傾い
た状態となり、端子部材24の取付が正確に行えず、し
かも、傾いた状態になると、コネクタとの接続ができな
いという問題がある。
In a conventional electronic device, a support portion 2 of a terminal member 24 mounted on a printed circuit board 22 is provided.
4a and the upper side 21d of the notch 21a of the frame 21, there is a gap, so that the support of the terminal member 24 is weak. Therefore, when the connector is connected to the terminal 24b, the terminal 2
When a strong external force is applied to 4a, there is a problem that the soldered portion is peeled off. In the manufacture, the terminal member 2
In the step of soldering the printed circuit board 4 to the printed circuit board 22, the terminal member 24 is inclined as shown by the line S due to the vibration during the movement of the printed circuit board 22 or the weight of the terminal portion 24b. However, there is a problem that the connection with the connector cannot be performed when the tilting state is not achieved.

【0007】[0007]

【課題を解決するための手段】上記課題を解決するため
の第1の解決手段として、金属からなり、切り欠き部を
有する枠体と、該枠体に取り付けられ、導電パターンを
有するプリント基板と、該プリント基板に取り付けられ
た端子部材とを備え、前記端子部材は、金属の端子部が
絶縁材からなる支持部に取り付けられて構成され、前記
端子部材の前記端子部が前記導電パターンに半田付けさ
れると共に、前記端子部材の前記支持部が前記切り欠き
部内において、前記プリント基板と前記枠体との間で挟
持された構成とした。また、第2の解決手段として、前
記枠体と前記支持部の対向する側において、前記枠体、
又は前記支持部の少なくとも一方に凸部を設け、該凸部
において前記枠体と前記支持部とが当接して、前記支持
部が前記プリント基板と前記枠体との間で挟持された構
成とした。
Means for Solving the Problems As a first means for solving the above problems, a frame made of metal and having a notch, a printed board attached to the frame and having a conductive pattern, are provided. A terminal member attached to the printed circuit board, wherein the terminal member is configured such that a metal terminal portion is attached to a support portion made of an insulating material, and the terminal portion of the terminal member is soldered to the conductive pattern. And the support portion of the terminal member is sandwiched between the printed circuit board and the frame within the cutout portion. Further, as a second solution, the frame body and the supporting body are provided on opposite sides of the frame body,
Or a configuration in which a projection is provided on at least one of the support portions, and the frame and the support are in contact with each other at the projection, and the support is sandwiched between the printed circuit board and the frame. did.

【0008】また、第3の解決手段として、端子部材
は、絶縁材の支持部に金属の端子部を取り付けて構成さ
れ、前記支持部が導電パターンを有するプリント基板に
載置されると共に、前記支持部が金属からなる枠体に設
けた切り欠き部内に位置させて、前記プリント基板と前
記枠体とを結合して、前記支持部を前記プリント基板と
前記枠体とで挟持した状態で、前記端子部と前記導電パ
ターンとを半田付けした製造方法とした。また、第4の
解決手段として、前記枠体と前記支持部の対向する側に
おいて、前記枠体、又は前記支持部の少なくとも一方に
凸部を設け、該凸部において前記枠体と前記支持部とが
当接して、前記支持部が前記プリント基板と前記枠体と
の間で挟持された状態で、前記端子部と前記導電パター
ンとを半田付けした製造方法とした。
As a third solution, the terminal member is constituted by attaching a metal terminal portion to a support portion of an insulating material, and the support portion is mounted on a printed circuit board having a conductive pattern. The support portion is located in a notch provided in the frame made of metal, and the printed board and the frame are combined, and the support is sandwiched between the printed board and the frame, The terminal portion and the conductive pattern are soldered. Further, as a fourth solution, a convex portion is provided on at least one of the frame and the support portion on a side opposite to the frame and the support portion, and the frame and the support portion are provided at the convex portion. And the terminal portion and the conductive pattern are soldered in a state where the supporting portion is held between the printed circuit board and the frame body.

【0009】[0009]

【発明の実施の形態】本発明の電子機器、並びに電子機
器の製造方法を図1〜図3に基づいて説明すると、図1
は本発明の電子機器の平面図、図2は本発明の電子機器
の要部の拡大側面図、図3は本発明の電子機器の要部の
拡大断面図である。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An electronic device according to the present invention and a method for manufacturing the electronic device will be described with reference to FIGS.
FIG. 2 is a plan view of the electronic device of the present invention, FIG. 2 is an enlarged side view of a main part of the electronic device of the present invention, and FIG.

【0010】本発明の電子機器の構成を図1〜図3に基
づいて説明すると、金属板からなり、上下が開放された
ロ形の枠体1は、下部に設けられた切り欠き部1aと、
切り欠き部1aの両側に設けられた段部からなる一対の
当て部1bと、一対の当て部1bに隣接して設けられた
取付片1cと、切り欠き部1aの上辺1dに設けられた
凸部1eとを有している。また、プリント基板2は、突
部2aと、孔2bを有し、更に、プリント基板2の下面
には導電パターン3が形成され、このプリント基板2の
上下面には、導電パターン3に接続された種々の電気部
品(図示せず)が配設されている。
The structure of an electronic device according to the present invention will be described with reference to FIGS. 1 to 3. A rectangular frame 1 made of a metal plate and having an open top and bottom is provided with a cutout 1a provided at a lower portion. ,
A pair of abutting portions 1b formed of step portions provided on both sides of the notch portion 1a, a mounting piece 1c provided adjacent to the pair of abutting portions 1b, and a protrusion provided on an upper side 1d of the notch portion 1a. 1e. The printed circuit board 2 has a projection 2a and a hole 2b. Further, a conductive pattern 3 is formed on the lower surface of the printed circuit board 2, and the upper and lower surfaces of the printed circuit board 2 are connected to the conductive pattern 3. Various electric components (not shown) are provided.

【0011】また、端子部材4は、合成樹脂の絶縁材か
らなる支持部4aと、この支持部4aに埋設して取り付
けられた金属のL字型の端子部4bとを有し、この端子
部材4は、支持部4aをプリント基板2の上面に載置す
ると共に、端子部4bをプリント基板2の孔2bに挿通
し、端子部4bが導電パターン3に半田付けされてい
る。そして、端子部材4を取り付けたプリント基板2
は、突部2aを枠体1の切り欠き部1aに位置させた状
態で、枠体1の下部から枠体1内に収納すると共に、突
部2aを枠体1の一対の当て部1bに当接した状態で、
取付片1cを折り曲げて、当て部1bと取付片1cとで
プリント基板2を挟持して、プリント基板2を枠体1に
取り付けている。
The terminal member 4 has a support portion 4a made of a synthetic resin insulating material, and a metal L-shaped terminal portion 4b embedded and attached to the support portion 4a. In 4, the support portion 4 a is placed on the upper surface of the printed board 2, and the terminal portion 4 b is inserted into the hole 2 b of the printed board 2, and the terminal portion 4 b is soldered to the conductive pattern 3. Then, the printed circuit board 2 to which the terminal member 4 is attached
Is stored in the frame 1 from the lower part of the frame 1 with the projection 2a positioned at the notch 1a of the frame 1, and the projection 2a is inserted into the pair of contact portions 1b of the frame 1. In the state of contact
The printed circuit board 2 is mounted on the frame 1 by bending the mounting piece 1c and sandwiching the printed circuit board 2 between the contact portion 1b and the mounting piece 1c.

【0012】この時、端子部材24の支持部4aの上面
には、枠体1の凸部1eが当接すると共に、支持部4a
の下面がプリント基板2に当接して、支持部4aは、枠
体1とプリント基板2とで挟持された状態となってい
る。そして、このような電子機器は、テレビションセッ
ト内に組み込まれ、端子部4bにコネクタ(図示せず)
を接続して使用されるようになっている。
At this time, the projection 1e of the frame 1 contacts the upper surface of the support portion 4a of the terminal member 24, and the support portion 4a
Is in contact with the printed circuit board 2 so that the support portion 4a is sandwiched between the frame 1 and the printed circuit board 2. Then, such an electronic device is incorporated in a television set, and a connector (not shown) is connected to the terminal portion 4b.
To be used.

【0013】そして、このような電子機器の製造方法
は、先ず、プリント基板2の上面に各種の電気部品(図
示せず)、及び、端子部材4の支持部4aを載置する。
次に、枠体1の切り欠き部1aを、プリント基板2の突
部2a、及び端子部材4の支持部4aに位置させた状態
で、枠体1をプリント基板2に組み合わせる。この時、
枠体1の凸部1eが端子部材4の支持部4aの上面に当
接した状態となる。次に、枠体1の取付片1cを折り曲
げて、枠体1とプリント基板2を結合する。 この時、
端子部材4の支持部4aが枠体1の突部1eとプリント
基板2とで挟持された状態となる。次に、この状態で、
プリント基板2、及び枠体1をディップ半田付け装置に
搬送して、電気部品を導電パターン3に半田付けすると
共に、端子部材4の端子部4bを導電パターン3に半田
付けすると、その製造が完了する。そして、このような
製造方法においては、端子部材4が枠体1とプリント基
板2とで挟持された状態で半田付けされるため、プリン
ト基板2に対して端子部材4は、傾くことなく正常な状
態で取りけられる。
In such a method of manufacturing an electronic device, first, various electric components (not shown) and a supporting portion 4 a of the terminal member 4 are mounted on the upper surface of the printed circuit board 2.
Next, the frame 1 is combined with the printed circuit board 2 with the notch 1a of the frame 1 positioned on the protrusion 2a of the printed circuit board 2 and the support 4a of the terminal member 4. At this time,
The projection 1e of the frame 1 comes into contact with the upper surface of the support 4a of the terminal member 4. Next, the mounting piece 1c of the frame 1 is bent, and the frame 1 and the printed circuit board 2 are joined. At this time,
The support portion 4a of the terminal member 4 is sandwiched between the protrusion 1e of the frame 1 and the printed circuit board 2. Next, in this state,
The printed circuit board 2 and the frame 1 are conveyed to a dip soldering apparatus, and the electric components are soldered to the conductive pattern 3 and the terminal portions 4b of the terminal members 4 are soldered to the conductive pattern 3, whereby the manufacture is completed. I do. In such a manufacturing method, the terminal member 4 is soldered in a state of being sandwiched between the frame 1 and the printed board 2. Can be taken in state.

【0014】なお、枠体1に設けられた凸部1eは、1
個、或いは複数個でも良く、また、凸部1eを枠体に設
ける代わりに、端子部材4の支持部4aに突条の凸部を
設けて、この凸部を枠体1の上辺1dに当接させるよう
にしても良い。
The projection 1e provided on the frame 1 has
Alternatively, a plurality of protrusions may be provided, and instead of providing the protrusion 1e on the frame, a protrusion of a ridge is provided on the support portion 4a of the terminal member 4, and this protrusion is applied to the upper side 1d of the frame 1. You may make it contact.

【0015】[0015]

【発明の効果】本発明の電子機器は、端子部材4の支持
部4aを枠体1の切り欠き部1a内に位置させて、支持
部4aを枠体1とプリント基板2とで挟持するようにし
たため、端子部材4の取付が強固となり、端子部4bへ
のコネクタの取付、取り外しにおいても半田付けが剥が
れることが無く、長寿命の電子機器を提供できる。ま
た、凸部1eを設けて、凸部1eにより枠体1と端子部
材4とを当接させるようにしたため、簡単な構成で当接
の確実なものが得られると共に、端子部材4の保持がよ
り確実な電子機器を提供できる。
According to the electronic apparatus of the present invention, the support portion 4a of the terminal member 4 is positioned within the cutout portion 1a of the frame 1, and the support portion 4a is sandwiched between the frame 1 and the printed circuit board 2. Therefore, the attachment of the terminal member 4 becomes strong, and the soldering does not come off even when the connector is attached to or detached from the terminal portion 4b, and a long-life electronic device can be provided. In addition, since the protrusion 1e is provided and the frame 1 and the terminal member 4 are brought into contact with each other by the protrusion 1e, a reliable contact can be obtained with a simple configuration, and the holding of the terminal member 4 can be achieved. A more reliable electronic device can be provided.

【0016】また、端子部材4の支持部4aが枠体1と
プリント基板2とで挟持された状態で、端子部4bを導
電パターン3に半田付けするため、端子部材4がプリン
ト基板2に対して傾いた状態で取り付けられることが無
く、従って、コネクタを確実に端子部4bに接続できる
電子機器を提供できる。また、凸部1eを設けて、凸部
1eにより枠体1と端子部材4とを当接させた状態で、
端子部4bを導電パターン3に半田付けするため、端子
部材4の保持がより確実な電子機器を提供できる。
In a state where the support portion 4a of the terminal member 4 is sandwiched between the frame 1 and the printed board 2, the terminal portion 4b is soldered to the conductive pattern 3. Thus, an electronic device that can be securely connected to the terminal portion 4b can be provided. Further, in a state where the protrusion 1e is provided and the frame 1 and the terminal member 4 are in contact with each other by the protrusion 1e,
Since the terminal portion 4b is soldered to the conductive pattern 3, it is possible to provide an electronic device in which the terminal member 4 is more reliably held.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の電子機器の平面図。FIG. 1 is a plan view of an electronic device of the invention.

【図2】本発明の電子機器の要部の拡大側面図。FIG. 2 is an enlarged side view of a main part of the electronic device of the present invention.

【図3】本発明の電子機器の要部の拡大断面図。FIG. 3 is an enlarged cross-sectional view of a main part of the electronic device of the present invention.

【図4】従来の電子機器の平面図。FIG. 4 is a plan view of a conventional electronic device.

【図5】従来の電子機器の要部の拡大側面図。FIG. 5 is an enlarged side view of a main part of a conventional electronic device.

【図6】従来の電子機器の要部の拡大断面図。FIG. 6 is an enlarged sectional view of a main part of a conventional electronic device.

【符号の説明】[Explanation of symbols]

1 枠体 1a 切り欠き部 1b 当て部 1c 取付片 1d 上辺 1e 凸部 2 プリント基板 2a 突部 2b 孔 3 導電パターン 4 端子部材 4a 支持部 4b 端子部 DESCRIPTION OF SYMBOLS 1 Frame 1a Notch 1b Contact part 1c Mounting piece 1d Upper side 1e Convex part 2 Printed circuit board 2a Projection 2b Hole 3 Conductive pattern 4 Terminal member 4a Support part 4b Terminal part

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】 金属からなり、切り欠き部を有する枠体
と、該枠体に取り付けられ、導電パターンを有するプリ
ント基板と、該プリント基板に取り付けられた端子部材
とを備え、前記端子部材は、金属の端子部が絶縁材から
なる支持部に取り付けられて構成され、前記端子部材の
前記端子部が前記導電パターンに半田付けされると共
に、前記端子部材の前記支持部が前記切り欠き部内にお
いて、前記プリント基板と前記枠体との間で挟持された
ことを特徴とする電子機器。
1. A frame made of metal and having a notch, a printed board attached to the frame and having a conductive pattern, and a terminal member attached to the printed board, the terminal member comprising: A terminal portion of a metal is attached to a support portion made of an insulating material, the terminal portion of the terminal member is soldered to the conductive pattern, and the support portion of the terminal member is in the cutout portion. An electronic device sandwiched between the printed circuit board and the frame.
【請求項2】 前記枠体と前記支持部の対向する側にお
いて、前記枠体、又は前記支持部の少なくとも一方に凸
部を設け、該凸部において前記枠体と前記支持部とが当
接して、前記支持部が前記プリント基板と前記枠体との
間で挟持されたことを特徴とする請求項1記載の電子機
器。
2. A projecting portion is provided on at least one of the frame and the supporting portion on a side opposite to the frame and the supporting portion, and the frame and the supporting portion abut on the projecting portion. The electronic device according to claim 1, wherein the support portion is sandwiched between the printed board and the frame.
【請求項3】 端子部材は、絶縁材の支持部に金属の端
子部を取り付けて構成され、前記支持部が導電パターン
を有するプリント基板に載置されると共に、前記支持部
が金属からなる枠体に設けた切り欠き部内に位置させ
て、前記プリント基板と前記枠体とを結合して、前記支
持部を前記プリント基板と前記枠体とで挟持した状態
で、前記端子部と前記導電パターンとを半田付けしたこ
とを特徴とする電子機器の製造方法。
3. The terminal member is configured by attaching a metal terminal portion to a support portion of an insulating material, and the support portion is mounted on a printed circuit board having a conductive pattern, and the support portion is formed of a metal frame. The terminal portion and the conductive pattern in a state where the printed circuit board and the frame are coupled to each other and the support portion is sandwiched between the printed circuit board and the frame while being positioned in a notch provided in the body. And a method of manufacturing an electronic device, comprising:
【請求項4】 前記枠体と前記支持部の対向する側にお
いて、前記枠体、又は前記支持部の少なくとも一方に凸
部を設け、該凸部において前記枠体と前記支持部とが当
接して、前記支持部が前記プリント基板と前記枠体との
間で挟持された状態で、前記端子部と前記導電パターン
とを半田付けしたことを特徴とする請求項3記載の電子
機器の製造方法。
4. A projection is provided on at least one of the frame and the support on the side opposite to the frame and the support, and the frame and the support abut on the projection. 4. The method for manufacturing an electronic device according to claim 3, wherein the terminal portion and the conductive pattern are soldered in a state where the support portion is sandwiched between the printed board and the frame. .
JP10729798A 1998-04-17 1998-04-17 Electronic device and method for manufacturing the electronic device Withdrawn JPH11307901A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10729798A JPH11307901A (en) 1998-04-17 1998-04-17 Electronic device and method for manufacturing the electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10729798A JPH11307901A (en) 1998-04-17 1998-04-17 Electronic device and method for manufacturing the electronic device

Publications (1)

Publication Number Publication Date
JPH11307901A true JPH11307901A (en) 1999-11-05

Family

ID=14455537

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10729798A Withdrawn JPH11307901A (en) 1998-04-17 1998-04-17 Electronic device and method for manufacturing the electronic device

Country Status (1)

Country Link
JP (1) JPH11307901A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012098831A1 (en) * 2011-01-21 2012-07-26 パナソニック株式会社 Fixing member

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012098831A1 (en) * 2011-01-21 2012-07-26 パナソニック株式会社 Fixing member

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Effective date: 20050705