JPH11315385A5 - - Google Patents

Info

Publication number
JPH11315385A5
JPH11315385A5 JP1998136152A JP13615298A JPH11315385A5 JP H11315385 A5 JPH11315385 A5 JP H11315385A5 JP 1998136152 A JP1998136152 A JP 1998136152A JP 13615298 A JP13615298 A JP 13615298A JP H11315385 A5 JPH11315385 A5 JP H11315385A5
Authority
JP
Japan
Prior art keywords
plating
plating solution
substrate
film
solution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1998136152A
Other languages
English (en)
Japanese (ja)
Other versions
JPH11315385A (ja
JP3836252B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP13615298A external-priority patent/JP3836252B2/ja
Priority to JP13615298A priority Critical patent/JP3836252B2/ja
Priority to PCT/JP1999/002271 priority patent/WO1999057342A1/ja
Priority to KR1020007011820A priority patent/KR100654413B1/ko
Priority to US09/674,179 priority patent/US6517894B1/en
Priority to EP99917206A priority patent/EP1091024A4/de
Priority to TW091111928A priority patent/TWI250223B/zh
Priority to TW088106895A priority patent/TW530099B/zh
Publication of JPH11315385A publication Critical patent/JPH11315385A/ja
Priority to US10/017,384 priority patent/US6908534B2/en
Priority to US11/008,098 priority patent/US20050098439A1/en
Publication of JPH11315385A5 publication Critical patent/JPH11315385A5/ja
Publication of JP3836252B2 publication Critical patent/JP3836252B2/ja
Application granted granted Critical
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP13615298A 1998-04-30 1998-04-30 基板のめっき方法 Expired - Fee Related JP3836252B2 (ja)

Priority Applications (9)

Application Number Priority Date Filing Date Title
JP13615298A JP3836252B2 (ja) 1998-04-30 1998-04-30 基板のめっき方法
PCT/JP1999/002271 WO1999057342A1 (en) 1998-04-30 1999-04-28 Method and device for plating substrate
KR1020007011820A KR100654413B1 (ko) 1998-04-30 1999-04-28 기판의 도금방법
US09/674,179 US6517894B1 (en) 1998-04-30 1999-04-28 Method for plating a first layer on a substrate and a second layer on the first layer
EP99917206A EP1091024A4 (de) 1998-04-30 1999-04-28 Verfahren und vorrichtung zum beschichten von substraten
TW088106895A TW530099B (en) 1998-04-30 1999-04-29 Electroplating method of a semiconductor substrate
TW091111928A TWI250223B (en) 1998-04-30 1999-04-29 Apparatus for electroplating a semiconductor substrate
US10/017,384 US6908534B2 (en) 1998-04-30 2001-12-18 Substrate plating method and apparatus
US11/008,098 US20050098439A1 (en) 1998-04-30 2004-12-10 Substrate plating method and apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13615298A JP3836252B2 (ja) 1998-04-30 1998-04-30 基板のめっき方法

Publications (3)

Publication Number Publication Date
JPH11315385A JPH11315385A (ja) 1999-11-16
JPH11315385A5 true JPH11315385A5 (de) 2005-01-06
JP3836252B2 JP3836252B2 (ja) 2006-10-25

Family

ID=15168537

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13615298A Expired - Fee Related JP3836252B2 (ja) 1998-04-30 1998-04-30 基板のめっき方法

Country Status (1)

Country Link
JP (1) JP3836252B2 (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3187011B2 (ja) 1998-08-31 2001-07-11 日本電気株式会社 半導体装置の製造方法
EP1111096A3 (de) * 1999-12-15 2004-02-11 Shipley Company LLC Reparaturverfahren einer Keimschicht
KR100800531B1 (ko) * 2000-06-30 2008-02-04 가부시키가이샤 에바라 세이사꾸쇼 구리 도금액, 도금 방법 및 도금 장치
JP5683765B2 (ja) * 2001-09-04 2015-03-11 クゥアルコム・インコーポレイテッドＱｕａｌｃｏｍｍ Ｉｎｃｏｒｐｏｒａｔｅｄ 集積回路チップ及びその形成方法
JP2003213489A (ja) * 2002-01-15 2003-07-30 Learonal Japan Inc ビアフィリング方法
KR100559041B1 (ko) * 2002-07-11 2006-03-10 매그나칩 반도체 유한회사 반도체 소자의 구리 배선 형성 방법
JP6350062B2 (ja) * 2013-10-09 2018-07-04 日立化成株式会社 多層配線基板の製造方法
JP6350064B2 (ja) * 2013-10-09 2018-07-04 日立化成株式会社 多層配線基板の製造方法
JP6327463B2 (ja) * 2013-10-09 2018-05-23 日立化成株式会社 多層配線基板の製造方法
JP6868361B2 (ja) * 2016-09-27 2021-05-12 セーレン株式会社 アルミニウム支持体付き多孔金属箔の製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04187793A (ja) * 1990-11-20 1992-07-06 Fujitsu Ltd 半導体装置及びその製造方法
JPH0550775A (ja) * 1991-08-28 1993-03-02 Toppan Printing Co Ltd 凹版印刷用基材及びその製造方法
JPH07283219A (ja) * 1994-04-13 1995-10-27 Sanyo Electric Co Ltd 半導体装置および半導体装置の製造方法および半導体装 置の製造装置

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