JPH11320393A5 - - Google Patents
Info
- Publication number
- JPH11320393A5 JPH11320393A5 JP1998122220A JP12222098A JPH11320393A5 JP H11320393 A5 JPH11320393 A5 JP H11320393A5 JP 1998122220 A JP1998122220 A JP 1998122220A JP 12222098 A JP12222098 A JP 12222098A JP H11320393 A5 JPH11320393 A5 JP H11320393A5
- Authority
- JP
- Japan
- Prior art keywords
- supports
- rotates
- mechanism comprises
- adjusting mechanism
- rotary table
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12222098A JP3995796B2 (ja) | 1998-05-01 | 1998-05-01 | ウェーハの貼付方法及びその装置 |
| US09/299,448 US6367529B1 (en) | 1998-05-01 | 1999-04-26 | Method of adhering wafers and wafer adhering device |
| US09/947,848 US20020005240A1 (en) | 1998-05-01 | 2001-09-06 | Method of adhering wafers and wafer adhering device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12222098A JP3995796B2 (ja) | 1998-05-01 | 1998-05-01 | ウェーハの貼付方法及びその装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPH11320393A JPH11320393A (ja) | 1999-11-24 |
| JPH11320393A5 true JPH11320393A5 (mo) | 2005-09-29 |
| JP3995796B2 JP3995796B2 (ja) | 2007-10-24 |
Family
ID=14830533
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12222098A Expired - Fee Related JP3995796B2 (ja) | 1998-05-01 | 1998-05-01 | ウェーハの貼付方法及びその装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3995796B2 (mo) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4663133B2 (ja) | 2001-01-09 | 2011-03-30 | 不二越機械工業株式会社 | ウェーハの貼付方法及びその装置 |
| JP3978780B2 (ja) * | 2002-08-09 | 2007-09-19 | 信越半導体株式会社 | ウエーハの研磨方法及び装置 |
| JP2005051055A (ja) * | 2003-07-29 | 2005-02-24 | Tokyo Electron Ltd | 貼合せ方法および貼合せ装置 |
| JP2009289882A (ja) * | 2008-05-28 | 2009-12-10 | Kyocera Corp | キャリアプレートおよびこれを用いた研磨装置 |
-
1998
- 1998-05-01 JP JP12222098A patent/JP3995796B2/ja not_active Expired - Fee Related
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