JPH11320393A5 - - Google Patents

Info

Publication number
JPH11320393A5
JPH11320393A5 JP1998122220A JP12222098A JPH11320393A5 JP H11320393 A5 JPH11320393 A5 JP H11320393A5 JP 1998122220 A JP1998122220 A JP 1998122220A JP 12222098 A JP12222098 A JP 12222098A JP H11320393 A5 JPH11320393 A5 JP H11320393A5
Authority
JP
Japan
Prior art keywords
supports
rotates
mechanism comprises
adjusting mechanism
rotary table
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1998122220A
Other languages
English (en)
Japanese (ja)
Other versions
JPH11320393A (ja
JP3995796B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP12222098A priority Critical patent/JP3995796B2/ja
Priority claimed from JP12222098A external-priority patent/JP3995796B2/ja
Priority to US09/299,448 priority patent/US6367529B1/en
Publication of JPH11320393A publication Critical patent/JPH11320393A/ja
Priority to US09/947,848 priority patent/US20020005240A1/en
Publication of JPH11320393A5 publication Critical patent/JPH11320393A5/ja
Application granted granted Critical
Publication of JP3995796B2 publication Critical patent/JP3995796B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP12222098A 1998-05-01 1998-05-01 ウェーハの貼付方法及びその装置 Expired - Fee Related JP3995796B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP12222098A JP3995796B2 (ja) 1998-05-01 1998-05-01 ウェーハの貼付方法及びその装置
US09/299,448 US6367529B1 (en) 1998-05-01 1999-04-26 Method of adhering wafers and wafer adhering device
US09/947,848 US20020005240A1 (en) 1998-05-01 2001-09-06 Method of adhering wafers and wafer adhering device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12222098A JP3995796B2 (ja) 1998-05-01 1998-05-01 ウェーハの貼付方法及びその装置

Publications (3)

Publication Number Publication Date
JPH11320393A JPH11320393A (ja) 1999-11-24
JPH11320393A5 true JPH11320393A5 (th) 2005-09-29
JP3995796B2 JP3995796B2 (ja) 2007-10-24

Family

ID=14830533

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12222098A Expired - Fee Related JP3995796B2 (ja) 1998-05-01 1998-05-01 ウェーハの貼付方法及びその装置

Country Status (1)

Country Link
JP (1) JP3995796B2 (th)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4663133B2 (ja) 2001-01-09 2011-03-30 不二越機械工業株式会社 ウェーハの貼付方法及びその装置
JP3978780B2 (ja) * 2002-08-09 2007-09-19 信越半導体株式会社 ウエーハの研磨方法及び装置
JP2005051055A (ja) * 2003-07-29 2005-02-24 Tokyo Electron Ltd 貼合せ方法および貼合せ装置
JP2009289882A (ja) * 2008-05-28 2009-12-10 Kyocera Corp キャリアプレートおよびこれを用いた研磨装置

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