JPH11330167A - Tape carrier package - Google Patents

Abstract

(57) [Problem] To provide a tape carrier package in which the strength against external force is dramatically improved by reinforcing the tape carrier with a simple configuration. A tape carrier package (9) in which a resin (8) is filled in a gap between an LSI chip disposed in a rectangular device hole (2) provided in the center of a tape carrier (1) and the device hole (2), wherein the rectangular device hole is provided. A concave notch 14 is provided in advance in a part of the square 2 so that a resin bank 15 is formed in the notch 14 when the resin is filled.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a tape carrier package used for a driver LSI for driving a liquid crystal display.

[0002]

2. Description of the Related Art With the recent increase in the definition of a liquid crystal display, a tape carrier package has been generally used as a package for a driver LSI for driving a liquid crystal display. This will be described with reference to FIG.

FIG. 3 is a perspective view showing a conventional tape carrier package, and FIGS. 3 (a), 3 (b) and 3 (c) show a manufacturing process thereof. In FIG. 3, reference numeral 1 denotes a tape carrier, which is provided with a device hole 2, an output wiring 3, an input wiring 4, and an input terminal slit 5. 6 is LSI
It is a chip, on which input / output pads 7 are provided. The device hole 2 is a rectangular LSI chip 6
It is a rectangle that is slightly larger than that of the tape carrier, and is obtained by cutting a tape carrier into a shape in which the square is rounded.

[0004] In the manufacture, first, FIG.
As shown in FIG. 3, the tape carrier 1 is set on the LSI chip 6, and as shown in FIG. 3B, the output wiring 3 and the input wiring 4 of the tape carrier are connected to the input / output pads of the corresponding LSI chip. Connect to 7. Next, as shown in FIG. 3C, the resin 8 is inserted into the gap between the LSI chip and the device hole.
To complete the tape carrier package 9.
Reference numeral 10 denotes an input-side mounting electrode, and reference numeral 11 denotes an output-side mounting electrode.

FIG. 4 is a perspective view showing a state in which a conventional tape carrier package is mounted on a liquid crystal display. The tape carrier package 9 completed through the above-described manufacturing process is mounted upside down from the state described in FIG. Is done. In FIG. 4, reference numeral 16 denotes a liquid crystal panel, and 12 denotes a terminal portion of the liquid crystal panel, from which ITO electrodes are drawn. 1
3 is a printed wiring board. The input-side mounting electrodes 10 of the tape carrier package 9 are connected to corresponding lands on the printed wiring board 13 by soldering or anisotropic conductive adhesive, and the output-side mounting electrodes 11 are connected to the terminal portions 12 by anisotropic conductive bonding. The connection is completed by the agent and the mounting is completed.

[0006]

However, in such a configuration, when an external force is applied to the mounted tape carrier package from an oblique direction as shown by an arrow X in FIG. 4, the resin is separated from the tape carrier. In addition, problems such as cracking of the resin, disconnection of the terminals of the input-side mounting electrode 10, and the like often occur.

An object of the present invention is to solve the above-mentioned conventional problems, and an object of the present invention is to provide a tape carrier package in which the strength against external force is remarkably improved by reinforcing the tape carrier with a simple structure. And

[0008]

According to the tape carrier package of the present invention, a concave notch is provided in advance in a part of a rectangular device hole provided in the center of the tape carrier.
When the resin is filled, a resin bank is formed in the notch.

According to the present invention, the concave notch is also filled with the resin in the manufacturing process, and the strength against the external force applied obliquely is remarkably improved.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. The same parts as those of the conventional one are denoted by the same reference numerals, and detailed description thereof will be omitted.

FIG. 1 is a perspective view showing a configuration of an embodiment of a tape carrier package of the present invention, and FIG. 2 is a perspective view showing a mounting state of a tape carrier package of the present invention on a liquid crystal display. is there. In FIG. 1, a device hole 2, an output wiring 3, an input wiring 4, an input terminal slit 5 are provided on a tape carrier 1.
The device hole 2 is the same as that of the conventional device, but the device hole 2 is a rectangle with a rounded square. On the other hand, in the embodiment according to the present invention, the input terminal The feature is that a concave notch 14 is provided at two corners on the side.

In the tape carrier 1 provided with the concave notches 14 in advance as described above, the resin is filled into the concave notches 14 during the manufacturing process, and the resin bank 15 is formed. In the state where the tape carrier package 9 is mounted on the liquid crystal display as shown in FIG. 2, even if an external force is applied to the tape carrier package 9 in an oblique direction as indicated by an arrow X in FIG. Peeling of the resin from the tape carrier 1 which was a problem,
Problems such as cracking of the resin and disconnection of the terminals of the input-side mounting electrode 10 are eliminated.

As described above, according to this embodiment, the strength of the tape carrier package can be significantly improved by the resin bank formed by providing the concave notch in the device hole of the tape carrier in advance. it can.

[0014]

As described above, according to the present invention, a concave notch is provided in advance in a device hole of a tape carrier, and when the resin is filled, the strength of the tape carrier package is increased by a resin bank formed in the notch. Has an advantageous effect that can be dramatically improved.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a configuration of a tape carrier package according to an embodiment of the present invention.

FIG. 2 is a perspective view showing a tape carrier package according to an embodiment of the present invention mounted on a liquid crystal display.

FIG. 3 is a perspective view showing a conventional tape carrier package.

FIG. 4 is a perspective view showing a state in which a conventional tape carrier package is mounted on a liquid crystal display.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Tape carrier 2 Device hole 3 Output side wiring 4 Input side wiring 5 Input terminal slit 6 LSI chip 7 Input / output pad 8 Resin 9 Tape carrier package 10 Input side mounting electrode 11 Output side mounting electrode 12 Terminal part of liquid crystal panel 13 Printed wiring 14 Notch 15 Resin bank 16 Liquid crystal panel

Claims (1)

[Claims] 1. A tape carrier package in which a resin is filled in a gap between an LSI chip disposed in a rectangular device hole provided in the center of a tape carrier and the device hole, and a part of a rectangle of the rectangular device hole. A tape carrier package, wherein a concave notch is provided in advance, and a resin bank is formed in the notch when the resin is filled.