JPH11330690A - Board mounting method, board mounting structure, semiconductor device, and mounting board - Google Patents

Abstract

(57) [Summary] [PROBLEMS] To provide a mounting method and a mounting structure of a substrate capable of reliably connecting all of a plurality of terminals of two substrates arranged in parallel. SOLUTION: A bad lead 10 composed of a plate-like member made of a metal having good electric conductivity and having a tip portion alternately opened in a region inside the solder ball 12 at an outermost periphery and an area inside the solder ball is provided on the back side of the substrate. After the semiconductor devices 20 arranged in an array are placed on a mounting substrate having solder ball electrode pads 32 and bad lead electrode pads 34,
The reflow process is performed in a state where the bad lead 10 is bent by applying a uniform load.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

TECHNICAL FIELD The present invention relates to a method for mounting a substrate,
The present invention relates to a mounting structure of a substrate, a semiconductor device, and a mounting substrate.

[0002]

2. Description of the Related Art As shown in FIGS. 20 and 21, a conventional semiconductor device 40 having a BGA (Ball Grid Array) structure has a plurality of wirings 19 (see FIG. 23) provided from the front surface to the rear surface of the substrate. Substrate 14
A semiconductor element 16 electrically connected to each wiring 19 (see FIG. 23) by a gold wire 18 or the like on the substrate surface side;
A package 13 formed of a resin or the like that protects the semiconductor element 16 and the gold wire 18 and a connection point of the gold wire 18 from the external environment, and a substrate provided on the back side of the substrate 14 along four sides of the substrate 14 in an array. The wiring 19 on the back side (FIG. 18)
And a plurality of solder balls 12 electrically connected to each other.

[0003] As shown in FIG.
4 through hole 2 formed in resin material 15 as the main material
2 and a conductive material such as gold patterned on the surface of the substrate so as to be connected to the wiring in the through hole 22. The part other than the contact area with the solder resist 12 is covered with the solder resist 17.

[0004] Further, the semiconductor device 4 having the above-described configuration is used.
24, the solder ball electrode pads 32 are provided at locations corresponding to the solder balls 12, respectively, as shown in FIG. Wirings 36 for electrically connecting to components are formed.

The semiconductor device 40 is mounted on the mounting substrate 60 by positioning the semiconductor device 40 so that the solder balls 12 of the semiconductor device 40 are mounted on the solder ball electrode pads 32 of the mounting substrate 30. After mounting on the substrate 60, the solder balls 12 are melted by performing a reflow process.

[0006]

However, in the above-described semiconductor device having the BGA structure, the height of a plurality of solder balls provided on the back surface of the substrate from the back surface of the substrate varies. Therefore, when the semiconductor device is mounted on the mounting substrate, the semiconductor substrate is inclined, or some of the solder balls and the electrode pads are not accurately connected, resulting in poor connection.

Also, it is difficult to make all the solder balls exactly the same height, and it is not possible to eliminate the variation in height from the back surface of the substrate. The inspection has to be performed, which is troublesome.

Furthermore, when checking the connection state of the solder ball, it is difficult to check whether the solder ball and the electrode pad are well connected because the connection portion is hidden. In particular, there is a problem that it is difficult to confirm the solder ball near the center of the semiconductor device from the side surface side, and it is hardly possible to confirm it. For this reason, even if there is a defective connection portion, there is a large possibility that the defective connection portion will be overlooked, and there is a problem that a defective product is shipped.

Further, the wiring formed on the semiconductor device or the mounting substrate must be provided so as not to come into contact with other solder balls or electrode pads, and the size of the solder balls and the electrode pads themselves is limited. This hinders an improvement in wiring density and an increase in mounting density.

In view of the above, the present invention ensures that a plurality of terminals of two boards arranged in parallel, such as a board and a mounting board of a semiconductor device, and a printed wiring board and a printed wiring board, are securely connected to each other. A first object is to provide a method for mounting a board that can be connected. It is a second object of the present invention to provide a method for mounting a substrate which can accurately connect a semiconductor device to a mounting substrate.

Furthermore, it is an object of the present invention to provide a mounting structure in which terminals of two substrates arranged in parallel, such as a substrate and a mounting substrate of a semiconductor device, and a printed wiring substrate and a printed wiring substrate, are surely connected to each other. This is the third purpose.

It is a fourth object of the present invention to provide a semiconductor device having high connection accuracy to a mounting substrate. further,
A fifth object is to provide a mounting board on which a semiconductor device can be mounted with high connection accuracy.

[0013]

According to a first aspect of the present invention, there is provided a method of mounting a board, comprising: providing one of the boards with a projecting terminal having elasticity; The present invention is characterized in that the terminal having the elasticity is bent and fixed to the terminal.

That is, since the elastic projecting terminal is used as a terminal for electrically connecting the substrate to the substrate, when the substrate and the substrate are electrically connected and fixed in that state, other projecting terminals are used. The protruding terminals that are taller than the protruding terminals are bent excessively by that amount and become the same height as the other protruding terminals. Can be reliably connected. Therefore, it is possible to reliably connect all of the plurality of terminals of the two substrates.

Further, in order to achieve the first object,
According to a second aspect of the present invention, in the method for mounting a substrate according to the first aspect, a solder bump is further provided on at least one of the one substrate and the other substrate, and the reflow is performed with the protruding terminals bent. Thus, the solder bump is melted to fix the one substrate and the other substrate.

That is, according to the second aspect of the present invention, since the two substrates are fixed by soldering, no special equipment for fixing is required. In addition, if the position of the solder terminal is set to be easily confirmed, the connection state of the solder can be easily confirmed.

According to a third aspect of the present invention, in the method of mounting a substrate according to the first aspect, the protruding terminal flexes the one substrate and the other substrate. It is characterized in that it is fixed by a fixing jig which is held within a certain distance.

That is, since the position between the substrates is fixed by the fixing jig, the distance between the substrates can be adjusted relatively easily. Therefore, no matter what the size of the protruding terminal, or the thickness of the substrate, the substrate can always be held at an appropriate distance between the substrates. They can be fixed to each other, and highly accurate connection can be realized.

Furthermore, since solder for fixing the substrate to the substrate is not required, problems caused by reflow processing such as deformation of the substrate or breakage of the package due to reflow processing for melting the solder of the substrate are prevented. be able to.

According to a fourth aspect of the present invention, there is provided a method of mounting a substrate according to any one of the first to third aspects, wherein the one of the first and second terminals is bent in a state where the protruding terminals are bent. This substrate and the other substrate are fixed by a fixing jig. As a result, the semiconductor device can be mounted on the mounting board with high accuracy, and thus the occurrence of defective products due to poor connection can be suppressed.

Further, in order to achieve the third object, the mounting structure of the substrate according to the fifth aspect of the present invention is characterized in that the substrate mounting structure is fixed to one of two substrates arranged substantially in parallel and has a plurality of elastic members. And a fixing means for fixing the one substrate and the other substrate in a state in which the protruding terminal contacts the terminal of the other substrate and is bent.

The fixing means according to the fifth aspect of the present invention may be any fixing means which fixes one substrate and the other substrate in a state where the protruding terminals are bent. As such a fixing means, for example, solder which is bonded to both the one substrate and the other substrate to fix the arrangement of the one substrate and the other substrate, or sandwiches the one substrate and the other substrate And a fixing jig such as a clamp mechanism for fixing the arrangement of one substrate and the other substrate.

In the case of using the former solder, no special equipment is required for fixing the substrates to each other, so that there is an advantage that the cost for manufacturing equipment can be reduced. In the case of using the latter fixing jig or the like, the bent state of the protruding terminal between the substrates can be optimally maintained. Further, since the bending state of the protruding terminals between the substrates can be adjusted so as to be optimal, there is an advantage that the accuracy of the electrical connection between the substrates is improved.

In order to achieve the fourth object, a sixth aspect of the present invention is the substrate mounting structure according to the fifth aspect, wherein the two substrates are a substrate of a semiconductor device and a mounting substrate. And As a result, it is possible to reduce a connection failure caused by mounting the semiconductor device on a product on which the semiconductor device is mounted.

In order to achieve the fifth object,
A semiconductor device according to a seventh aspect of the present invention includes a plurality of elastic projecting terminals that are connected to electrode portions of a circuit formed on a substrate of the semiconductor device.

That is, since the protruding terminals, which are external terminals of the semiconductor device, are individually bent in accordance with the positions of the terminals of the other members to be connected, all the terminals can be connected well. . That is, even if the heights of the plurality of protruding terminals provided on the semiconductor device are not all the same with high accuracy, each protruding terminal bends in accordance with the distance to the corresponding connection target, thereby realizing high-precision connection. it can.

According to a sixth aspect of the present invention, a mounting board according to the present invention is provided with a plurality of elastic projecting terminals which are connected to electrode portions of a circuit formed on the mounting board. I have.

Thus, since the protruding terminals, which are external terminals of the semiconductor device, are individually bent in accordance with the positions of the terminals of the other members to be connected, all the terminals can be connected well. is there. That is, even if the heights of the plurality of projecting terminals provided on the mounting substrate are not all the same with high accuracy, each projecting terminal bends in accordance with the position of the corresponding connection target terminal, so that high-precision connection is achieved. realizable.

[0029]

FIG. 1 is a block diagram showing an embodiment of the present invention.
19 will be described with reference to FIG.

(First Embodiment) A first embodiment will be described with reference to FIGS. First, as shown in FIGS. 1 and 2, in the first embodiment, a bad lead 10 which is a protruding terminal is provided as an external terminal of a semiconductor device. The semiconductor device 20 includes a substrate 14 provided with a plurality of independent wirings 19 (see FIG. 3) connected from the front surface to the back surface.
The adhesive 25 (FIG. 3) is formed on the die pad provided on the substrate 14.
(See FIG. 3), and its own electrode portion (not shown) is bonded to individual wirings 19 (see FIG. 3) of the substrate 14 by gold wires 18, respectively. A package 13 formed of a resin or the like protected from an external environment; a solder ball 12 as a first external terminal connected to a wiring 19 (see FIG. 3) of the substrate 14 on the back surface side of the substrate 14; And a bad lead 10 which is a second external terminal connected on the back side of the substrate.

As shown in FIG. 2, the solder balls 12 and the bad leads 10 are arranged in an array on the back side of the substrate of the semiconductor device 20. The solder balls 12 are provided only on the outermost periphery, and electrically connect the semiconductor device 20 to the mounting board 30 and connect the semiconductor device 20 to the mounting board 30.
(See FIGS. 5 and 6).
The bad lead 10 is provided in a region inside the solder ball, and as shown in FIG. 4, is formed of a plate-like member made of a metal having good electric conductivity and having alternately opened distal ends. And the mounting board 30 (FIGS. 5 and 6)
(See Reference).

As shown in FIG. 3, the bad lead 10 is
It is inserted into a bad lead fixing hole 14 a provided in the substrate 14 and fixed to the semiconductor device 20. The bad lead fixing hole 14a is formed in the solder resist 1 on the surface layer of the substrate 14.
7 is formed to a depth reaching the resin material 15 which is the main material of the substrate 14, penetrating through the wiring 7 in the lower layer of the solder resist 17. Therefore, the bad lead fixing hole 14a
When the bad lead 10 is inserted into the
Is in contact with the wiring 19, so that the bad lead 10 and the wiring 19 are electrically connected.

The height k from the substrate surface when the bad lead 10 is inserted into the bad lead fixing hole 14a.
Is slightly higher than the height h of the solder ball 12 from the substrate surface described above. In addition, the bad lead 10
Since the space occupied by the solder balls 12 is smaller, more solder balls 12 can be arranged as external terminals. Therefore, a larger number of wirings can be provided than in the conventional art, and high-density wiring is possible.

The wiring 19 provided on the substrate 14
4 through hole 2 formed in resin material 15 as the main material
A conductive material such as gold or copper embedded in the substrate 2 and a conductive material such as gold or copper patterned on the front and back surfaces of the substrate 14 so as to be connected to the conductive material in the through hole 22. The entire surface of the substrate is covered with the solder resist 17 except for a bonding position with the gold wire 18 on the surface of the substrate.

As shown in FIG. 5, on the mounting board 30 in the first embodiment, a circular solder ball electrode pad 32 similar to the conventional one is provided in a region connected to the solder ball 12. In a region to be connected to the bad lead 10, a rectangular bad lead electrode pad 34 having a size slightly larger than that when the leading end of the bad lead 10 is completely opened.
Is provided. Bad lead electrode pad 34
Since the dimensions are much smaller than the solder ball electrode pads 32, it is possible to realize a high-density wiring by narrowing the distance j between the wirings 36 as compared with the related art.

A method of mounting the semiconductor device 20 having the above configuration on the mounting board 30 having the above configuration will be described below with reference to FIG.

First, as shown in FIG. 6A, the solder balls 12 of the semiconductor device 20 are arranged above the solder ball electrode pads 32 provided on the mounting substrate 30, and The lead 10 is mounted on the mounting substrate 30
Are positioned above the bad lead electrode pads 34 provided at the positions.

Next, the semiconductor device 20 is lowered and mounted on the mounting substrate 30. At this time, as shown in FIG. 6B, the semiconductor device 20 is supported by the pad lead 10 which is the second external terminal in contact with the electrode pad 34 for the pad lead, and the solder ball 12 which is the first external terminal. Are floating in the air without contacting the solder ball electrode pads 32.

Further, as shown in FIG. 6C, a flat weight 50 is placed on the semiconductor device 20 placed on the mounting substrate 30 until the solder balls 12 and the solder ball electrode pads 32 contact each other. Apply a uniform load. At this time, since the bad lead 10 is pressed against the bad lead electrode pad 34, the tip bends and the height k (see FIG. 3) from the substrate surface becomes the height h (see FIG. 3) of the solder ball 12 from the substrate surface. ). Therefore, bad lead 10
Even if there is some variation in the height k from the substrate surface, all the bad leads 10 are pressed against the bad lead electrode pads 34 of the mounting substrate and become the same as the height h of the solder balls 12 from the substrate surface. The tip bends until all the pads 10 are securely connected to the pad pads 3
4 will be in contact.

The semiconductor device 20 mounted on the mounting substrate 30 is subjected to a reflow process under a uniform load until the solder balls 12 and the solder ball electrode pads 32 come into contact with each other. Thereby, as shown in FIG. 6D, the solder ball 12 is melted and joined to the solder ball electrode pad 32, and the semiconductor device 20 is fixed on the mounting board 30. At this time, the bad lead 10 is fixed to the bad lead electrode pad 34 of the mounting substrate 30 in a state where the tip is bent and in contact with the pad. Therefore, electrical connection between all the external terminals 10 and 12 of the semiconductor device 20 and the electrodes 32 and 34 of the mounting board 30 can be reliably performed.

(Second Embodiment) A second embodiment will be described with reference to FIGS. First, as shown in FIGS. 7A and 7B, in the second embodiment, a solder ball electrode pad 32 composed of a flat pad and a pad lead 10 are provided as electrodes of a mounting board 31. It has a configuration.

The solder ball electrode pads 32 and the bad leads 10 are arranged in an array on the surface side of the mounting board 31. The solder ball electrode pad 32 is provided only on the outermost periphery. The bad lead 10 is provided in a region inside the solder ball, and as described with reference to FIG. 4 of the above-described first embodiment, a plate made of a metal having good electric conductivity and having alternately opened distal ends. The semiconductor device 20 is electrically connected to the mounting substrate 30 (see FIG. 10).

As shown in FIG. 7B, the bad lead 1
0 is a bad lead fixing hole 3 provided on the mounting board 31.
1a is fixed to the mounting board 31. Bad lead fixing hole 31a is provided with wiring 3 on the surface of mounting substrate 31.
6, the bad lead 10 inserted into the bad lead fixing hole 31a is electrically connected to the wiring 36 of the mounting board 31.

The height k from the surface of the mounting substrate when the bad lead 10 is inserted into the bad lead fixing hole 31a is slightly smaller than the height h of the solder ball 12 described later from the surface of the semiconductor device 21 to the substrate. Have been higher. Further, since the space occupied by the bad lead 10 is smaller than that of the solder ball electrode pad 32, the pad lead 10 can be arranged more than the case where the solder ball electrode pad 32 is arranged as the electrode of the wiring 36. Therefore, a larger number of wirings 36 can be provided than in the related art, and the density of the wirings 36 on the mounting board 31 can be increased.

The semiconductor device 21 according to the second embodiment
As shown in FIGS. 8 and 9, the semiconductor device includes solder balls 12 and pad electrodes 34 for bad leads arranged in an array as external terminals. The solder ball 12 is provided only on the outermost periphery, and electrically connects the semiconductor device 21 to the mounting board 31 and connects the semiconductor device 21 to the mounting board 3.
1 (see FIG. 7). The bad lead electrode pad 34 is provided on the above-described mounting board 31 at a position inside the solder ball 12.
And electrically connects the semiconductor device 21 and the mounting board 31 to each other. Since the other configuration is the same as that of the first embodiment, the same reference numerals are given and the description is omitted.

A method for mounting the semiconductor device 21 having the above configuration on the mounting board 31 having the above configuration will be described below with reference to FIG.

First, as shown in FIG. 10A, the solder balls 12 of the semiconductor device 21 are arranged above the solder ball electrode pads 32 provided on the mounting board 31, and the pads of the mounting board 31 The lead 10 is a semiconductor device 2
Positioning is performed so as to be arranged above the pad electrode for bad lead 34 provided in 1.

Next, the semiconductor device 21 is lowered and mounted on the mounting board 31. At this time, as shown in FIG. 10B, the semiconductor device 21 is supported by the bad leads 10 provided on the mounting substrate 31, and the solder balls 12 do not contact the solder ball electrode pads 32 of the mounting substrate 31. It is floating in the air.

Further, as shown in FIG. 10C, a flat weight 50 is placed on the semiconductor device 21 placed on the mounting substrate 31 until the solder balls 12 and the solder ball electrode pads 32 come into contact with each other. Apply a uniform load. At this time, since the bad lead 10 is pressed against the bad lead electrode pad 34, the tip is bent and the height k from the substrate surface is increased.
(See FIG. 7) is the height h of the solder ball 12 from the substrate surface.
(See FIG. 8). Therefore, even if there is some variation in the height k of the pad 10 from the surface of the board, all the pads 10 are pressed against the electrode pads 34 for the pad of the mounting board and the height of the solder ball 12 from the surface of the board is reduced. Since the tip bends until it becomes the same as h, all the bad leads 10 surely come into contact with the bad lead electrode pads 34.

The semiconductor device 21 mounted on the mounting substrate 31 is subjected to a reflow process under a uniform load until the solder balls 12 and the solder ball electrode pads 32 come into contact with each other. As a result, as shown in FIG. 10D, the solder balls 12 are melted and joined to the solder ball electrode pads 32, and the semiconductor device 20 is fixed on the mounting board 31.
At this time, the bad lead 10 is fixed to the bad lead electrode pad 34 of the semiconductor device 21 in a state where the tip is bent and in contact therewith.

Therefore, all the solder balls 12 of the semiconductor device 21 and the electrode pads for bad leads 34 can be electrically connected to the electrode pads 32 for solder balls of the mounting substrate 31 and the bad leads 10 reliably.

Further, the first embodiment described above and the second embodiment
In the embodiment of the present invention, all the external terminals at positions where it is difficult to inspect the bonding state are formed as the bad leads 10, and the solder balls are provided at positions where the inspection of the bonding state is easy. There is little risk of overlooking the location, and shipping of defective products can be minimized.

The first embodiment described above and the second embodiment
In the embodiment, the case where the solder balls are provided on the entire outermost periphery is described. However, it is not necessary to provide the solder balls on the entire outermost periphery. May be partially provided.

Further, in the present invention, the semiconductor device is fixed to the mounting substrate in the first and second embodiments, and the solder ball used as a terminal for making an electrical connection is mounted on the semiconductor device. Terminals (fixing means) that are merely fixed to the substrate may be used.

(Third Embodiment) A third embodiment will be described with reference to FIGS. First, FIG. 11 and FIG.
As shown in FIG. 2, in the third embodiment, the semiconductor device 23
All of the external terminals are provided with a bad lead 10 made of a plate-like member made of a metal having good electric conductivity and having alternately opened distal end portions.

The bad leads 10 are arranged in an array on the back side of the substrate of the semiconductor device 23, as shown in FIG. In addition, as shown in FIG.
0 is fixed to the semiconductor device 23 by being inserted into a bad lead fixing hole 14 a provided in the substrate 14 of the semiconductor device 23. The bad lead fixing hole 14a is
3 is electrically connected to the wiring 19 provided on the substrate 14 of the semiconductor device 23. Therefore, the bad lead 10 inserted into the bad lead fixing hole 14a is electrically connected to the wiring 19 provided on the substrate 14 of the semiconductor device 23. Will be done.

Further, the mounting substrate 3 in the third embodiment
In FIG. 3, as shown in FIG. 14, a rectangular lead electrode pad 34 having a size slightly larger than that when the tip of the bad lead 10 is completely opened is provided. The electrode pad 34 for the bad lead is the electrode pad 3 for the solder ball.
Since the dimension is much smaller than 2, the interval j between the wirings 36 can be made narrower than in the related art to realize high-density wiring.

The other structure is the same as that of the above-described first and second embodiments, so that the same reference numerals are given and the description is omitted.

A method of mounting the semiconductor device 23 having the above configuration on the mounting board 33 having the above configuration will be described below with reference to FIG.

First, as shown in FIG. 15A, alignment is performed such that all the bad leads 10 of the semiconductor device 23 are arranged above the bad lead electrode pads 34 provided on the mounting substrate 33. .

Next, the semiconductor device 23 is lowered and mounted on the mounting board 33. At this time, as shown in FIG. 15B, the semiconductor device 23 is supported by the bad lead 10 in contact with the bad lead electrode pad 34 of the mounting board 33, and the bad lead 10 in contact with the bad lead electrode pad 34 is provided. The bad lead 10, which is slightly shorter in length, is floating.

Further, as shown in FIG. 15C, a flat weight 50 is placed on the semiconductor device 23 until all the bad leads 10 are in contact with the bad lead electrode pads 34, and a uniform load is applied. At this time, since the bad lead 10 is pressed against the bad lead electrode pad 34,
The tips bend and the heights of all the bad leads 10 from the substrate surface become equal. Therefore, even if there is some variation in the height of the bad lead 10 from the surface of the board, all the bad leads 10 are pressed against the bad lead electrode pads 34 of the mounting board and surely come into contact with the bad lead electrode pads 34. It will be.

Thereafter, as shown in FIG. 15D, the arrangement of the mounting substrate 33 and the semiconductor device 23 is fixed by the minute clamps 52a and 52b, and then the weight 50 is removed, and the mounting of the semiconductor device is completed. At this time, the bad lead 10 tries to return to the original size by the reaction force, but is pressed down by the clamp, and is fixed with the tip bent. Accordingly, electrical connection of all the bad leads 10 of the semiconductor device 23 to the bad lead electrode pads 34 of the mounting board 33 can be reliably performed.

As a clamp for fixing the arrangement of the semiconductor device 23 and the mounting substrate 33, other than the configuration shown in FIG. 15, one having an adjuster mechanism or another configuration may be used.

(Fourth Embodiment) A fourth embodiment will be described with reference to FIGS. First, as shown in FIG. 16, in the fourth embodiment, as all the electrodes of the mounting substrate 35, the bad lead 10 made of a plate-shaped member made of a metal having good electric conductivity and having alternately opened tip portions is used. It is configured to be provided.

The bad leads 10 are arranged in an array on the front side of the mounting board 35 as shown in FIG. As shown in FIG. 16B, the bad lead 10 is inserted into a bad lead fixing hole 35 a provided in the mounting board 35 and fixed to the mounting board 35. Since the bad lead fixing hole 35a is electrically connected to the wiring 36 provided on the mounting substrate 35, the bad lead 10 inserted into the bad lead fixing hole 35a is electrically connected to the wiring 36 provided on the mounting substrate 35. Will be connected.

Further, as shown in FIGS. 17 and 18, the semiconductor device 24 according to the fourth embodiment has all the external terminals of the semiconductor device 24 as compared with when the tip of the pad lead 10 is completely opened. A rectangular pad electrode pad 34 having a slightly larger dimension is provided. In addition,
Other configurations are the same as those of the first embodiment and the second embodiment described above, and thus the same reference numerals are given and the description is omitted.

That is, the fourth embodiment is an application example of the above-described third embodiment. In the third embodiment, when the semiconductor device 23 is mounted on the mounting board 33, In the fourth embodiment, when the semiconductor device 24 is mounted on the mounting board 34, the bad lead 10 provided on the mounting board 34 This is a structure that supports the semiconductor device 23. The other configuration is the same as that of the third embodiment, and the description is omitted. Also, the mounting method is the same as that of the above-described third embodiment, and the description is omitted.

In the third and fourth embodiments, since the semiconductor devices 23 and 24 are fixed to the mounting boards 33 and 34 by clamps, the mounting boards are not reflowed for melting the solder balls 12. The possibility of deformation can be eliminated. Therefore, for example, a package formed on a substrate is partially stressed and cracks are generated, the semiconductor element is exposed, the gold wire sealed in the package is deformed, and in the worst case, the wire is broken. Can be prevented from occurring due to the deformation of the substrate.

In the third and fourth embodiments, in particular, the semiconductor devices 23 and 24 and the mounting substrate 33
Since the electrical connection with 34 is made by contact, there is also an advantage that rework is easy. Of course, the rework is easier in the first embodiment and the second embodiment as compared with the related art.

In the first to fourth embodiments, the pad leads 10 having elasticity at the tips are formed as the protruding terminals by using a plate-like member made of a metal having good electrical conductivity and having alternately opened tips. Although it is configured, the present invention is not limited to such a configuration, and for example, the configuration shown in FIGS. 19A and 19B can also be used.

Further, the bad lead 10 which is used as the protruding terminal in the first to fourth embodiments is used.
Is a configuration having elasticity only at the tip, but may be a configuration having elasticity over the entire protruding terminal, such as a spring member made of a conductive material.

In the first to fourth embodiments, a load is applied to the semiconductor device by weight after placing the semiconductor device on the mounting board, and the bad lead 1
Although the flexure of zero is ensured, when the semiconductor device has a weight sufficient to flex the bad lead 10, it is not necessary to apply a load due to the weight.

In the first to fourth embodiments, even if a natural oxide film or the like is formed on the surface of the bad lead 10 or the surface of the bad lead electrode 34, the semiconductor device is mounted. Sometimes, the tip of the bad lead 10 is pressed by the bad lead electrode 34 to scrape the natural oxide film on the bent surface, so that there is an advantage that the conductivity can be improved.

In the first to fourth embodiments, the case where the semiconductor device is mounted on the mounting board has been described. However, the mounting board on which the semiconductor device and other electronic components are mounted is printed wiring. The present invention can be applied to a case where the present invention is connected to another substrate such as a plate.

[0076]

As described above, according to the first to third aspects of the present invention, it is possible to achieve an effect that all the terminals of the two substrates arranged in parallel can be reliably connected to each other. According to the fourth aspect of the present invention, the effect that the semiconductor device can be accurately connected to the mounting substrate is achieved.

Further, according to the fifth aspect of the present invention, it is possible to provide a mounting structure in which the terminals of the two substrates arranged in parallel can be reliably connected to each other. Further, according to the invention of claim 6, it is possible to provide an effect that it is possible to provide a mounting structure of a semiconductor device accurately connected to a mounting substrate.

According to the seventh aspect of the invention, it is possible to provide an effect that a semiconductor device having a high connection accuracy to a mounting substrate can be provided. According to the invention of claim 8, a mounting substrate on which the semiconductor device can be mounted with high connection accuracy can be provided.
Achieve the effect.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view schematically showing a semiconductor device according to a first embodiment of the present invention.

FIG. 2 is a bottom view schematically showing the semiconductor device according to the first embodiment of the present invention.

FIG. 3 is a partial sectional view showing a schematic structure of the semiconductor device shown in FIG. 1;

FIG. 4 is a perspective view showing a schematic configuration of a bad lead provided in the semiconductor device of the first embodiment.

FIG. 5 is a partial top view schematically showing a mounting board according to the first embodiment of the present invention.

6 is a process chart showing a method of mounting the semiconductor device shown in FIG. 1 on the mounting board shown in FIG. 5;

FIG. 7A is a partial top view schematically showing a mounting board according to a second embodiment of the present invention, and FIG.
It is an AA diagram in (a).

FIG. 8 is a partial cross-sectional view illustrating a schematic structure of a semiconductor device according to a second embodiment of the present invention.

FIG. 9 is a bottom view schematically showing a semiconductor device according to a second embodiment of the present invention.

10 is a process chart showing a method of mounting the semiconductor device shown in FIG. 8 on the mounting board shown in FIG. 7;

FIG. 11 is a cross-sectional view schematically showing a semiconductor device according to a third embodiment of the present invention.

FIG. 12 is a bottom view schematically showing a semiconductor device according to a third embodiment of the present invention.

FIG. 13 is a partial cross-sectional view showing a schematic structure of the semiconductor device shown in FIG. 11;

FIG. 14 is a partial top view schematically showing a mounting board according to a third embodiment of the present invention.

15 is a process chart showing a method of mounting the semiconductor device shown in FIG. 11 on the mounting board shown in FIG. 14;

FIG. 16A is a partial top view schematically showing a mounting board according to a fourth embodiment of the present invention, and FIG. 16B is a BB diagram in FIG. 16A.

FIG. 17 is a partial cross-sectional view illustrating a schematic structure of a semiconductor device according to a fourth embodiment of the present invention.

FIG. 18 is a bottom view schematically showing a semiconductor device according to a fourth embodiment of the present invention.

19A is a perspective view showing a second configuration example of the bad lead 10, and FIG. 19B is a perspective view showing a third configuration example of the bad lead 10. FIG.

FIG. 20 is a cross sectional view schematically showing a conventional semiconductor device.

FIG. 21 is a bottom view schematically showing a conventional semiconductor device.

FIG. 22 is a partial cross-sectional view showing a schematic structure of the conventional semiconductor device shown in FIG.

FIG. 23 is a partial top view schematically showing a conventional mounting board.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Bad lead 12 Solder ball 13 Package 14 Substrate 14a Bad lead fixing hole 15 Resin material 16 Semiconductor element 17 Solder resist 18 Gold wire 19, 36 Wiring 20 Semiconductor device 22 Through hole 25 Adhesive 30 Mounting substrate 32 Solder ball electrode pad 34 Electrode pad for bad lead

Claims (8)

[Claims] 1. A method of mounting a substrate, comprising: providing a resilient projecting terminal on one substrate, and fixing the resilient projecting terminal to a terminal of the other substrate in a bent state. 2. A solder bump is further provided on at least one of the one substrate and the other substrate, and the solder bump is melted by reflowing in a state in which the protruding terminal is bent so that the solder bump is melted. The method according to claim 1, wherein the other substrate is fixed. 3. The method according to claim 1, wherein the one substrate and the other substrate are fixed by a fixing jig in a state where the protruding terminals are bent. 4. The semiconductor device according to claim 1, wherein the one substrate is one of a substrate and a mounting substrate of the semiconductor device, and the other substrate is one of the substrate and the mounting substrate of the semiconductor device. 4. The method for mounting a substrate according to any one of items 3 to 3. 5. A plurality of projecting terminals fixed to one of two substrates arranged substantially in parallel and having elasticity, wherein the projecting terminals contact terminals of the other substrate and are bent. And a fixing means for fixing the one substrate and the other substrate in a bent state. 6. The mounting structure according to claim 5, wherein said two substrates are a substrate of a semiconductor device and a mounting substrate. 7. A semiconductor device having a plurality of elastic projecting terminals connected to electrode portions of a circuit formed on a substrate of the semiconductor device. 8. A mounting board provided with a plurality of elastic protruding terminals connected to an electrode portion of a circuit formed on the mounting board.